TWI496520B - Substrate manufacturing device - Google Patents
Substrate manufacturing device Download PDFInfo
- Publication number
- TWI496520B TWI496520B TW101133796A TW101133796A TWI496520B TW I496520 B TWI496520 B TW I496520B TW 101133796 A TW101133796 A TW 101133796A TW 101133796 A TW101133796 A TW 101133796A TW I496520 B TWI496520 B TW I496520B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- stage
- peripheral portion
- holding surface
- manufacturing apparatus
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 647
- 238000004519 manufacturing process Methods 0.000 title claims description 97
- 230000007246 mechanism Effects 0.000 claims description 297
- 230000002093 peripheral effect Effects 0.000 claims description 210
- 230000003028 elevating effect Effects 0.000 claims description 95
- 238000003825 pressing Methods 0.000 claims description 87
- 239000000463 material Substances 0.000 claims description 45
- 230000010062 adhesion mechanism Effects 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 15
- 238000013459 approach Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 56
- 238000000034 method Methods 0.000 description 20
- 239000010409 thin film Substances 0.000 description 18
- 238000003384 imaging method Methods 0.000 description 11
- 238000006073 displacement reaction Methods 0.000 description 10
- 239000000696 magnetic material Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000012546 transfer Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 6
- 230000032258 transport Effects 0.000 description 6
- 230000000994 depressogenic effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000010191 image analysis Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011202593 | 2011-09-16 | ||
| JP2012014880 | 2012-01-27 | ||
| JP2012068720 | 2012-03-26 | ||
| JP2012112303 | 2012-05-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201330734A TW201330734A (zh) | 2013-07-16 |
| TWI496520B true TWI496520B (zh) | 2015-08-11 |
Family
ID=47883306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101133796A TWI496520B (zh) | 2011-09-16 | 2012-09-14 | Substrate manufacturing device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2013039080A1 (ja) |
| TW (1) | TWI496520B (ja) |
| WO (1) | WO2013039080A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7166065B2 (ja) * | 2018-03-02 | 2022-11-07 | 株式会社東京精密 | ウエハ搬送保持装置 |
| CN111383979B (zh) * | 2018-12-27 | 2023-03-03 | 上海微电子装备（集团）股份有限公司 | 翘曲片的预对准装置及方法 |
| CN110052369A (zh) * | 2019-05-30 | 2019-07-26 | 创维集团智能装备有限公司 | 一种点胶装置及点胶方法 |
| JP2025148840A (ja) * | 2024-03-26 | 2025-10-08 | 東レエンジニアリング株式会社 | 基板保持装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63197127U (ja) * | 1987-06-06 | 1988-12-19 | ||
| CN1849854A (zh) * | 2003-09-11 | 2006-10-18 | 太阳油墨制造株式会社 | 绝缘图案及其形成方法 |
| JP2007311497A (ja) * | 2006-05-17 | 2007-11-29 | Fuji Mach Mfg Co Ltd | プリント基板保持装置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844791A (ja) * | 1981-09-10 | 1983-03-15 | ソニー株式会社 | 回路基板の位置決め装置 |
| JPS59201736A (ja) * | 1983-04-27 | 1984-11-15 | Toshiba Corp | 基板固定装置 |
| JPS6382943U (ja) * | 1986-11-19 | 1988-05-31 | ||
| JPS63202019A (ja) * | 1987-02-18 | 1988-08-22 | Hitachi Ltd | 光学素子の精度測定装置 |
| JPH01211917A (ja) * | 1988-02-19 | 1989-08-25 | Fujitsu Ltd | ウエハの保持装置 |
| JPH01165166U (ja) * | 1988-04-29 | 1989-11-17 | ||
| JPH02235400A (ja) * | 1989-03-08 | 1990-09-18 | Toshiba Corp | 電子部品装着装置 |
| JPH03282473A (ja) * | 1990-03-30 | 1991-12-12 | Ushio Inc | フィルム露光装置 |
| JPH03128943U (ja) * | 1990-04-09 | 1991-12-25 | ||
| JPH04106914A (ja) * | 1990-08-27 | 1992-04-08 | Toshiba Corp | ウエハ支持装置 |
| JPH05299425A (ja) * | 1992-04-24 | 1993-11-12 | Nec Kansai Ltd | ボールバンプボンダ |
| JPH0818293A (ja) * | 1994-06-28 | 1996-01-19 | Sony Corp | 部品実装のための基板固定機構 |
| JPH08274148A (ja) * | 1995-01-30 | 1996-10-18 | Sony Corp | 基体固定装置及び基体の固定方法 |
| JP3421713B2 (ja) * | 1995-10-31 | 2003-06-30 | 株式会社エヌ・イー・エフ | 押さえ機能付き薄板位置決め装置 |
| JPH09147786A (ja) * | 1995-11-21 | 1997-06-06 | Advanced Display:Kk | 基板保持方法および該方法に用いる基板保持機構 |
| JP2002111294A (ja) * | 2000-10-03 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
| JP4257072B2 (ja) * | 2002-05-21 | 2009-04-22 | Ｔｏｗａ株式会社 | 基板の固定装置及び固定方法 |
| JP2004090107A (ja) * | 2002-08-29 | 2004-03-25 | Uht Corp | ワーク保持装置 |
| JP2006170733A (ja) * | 2004-12-15 | 2006-06-29 | Sharp Corp | 基板位置決め保持方法及び装置 |
| JP4498229B2 (ja) * | 2005-06-22 | 2010-07-07 | キヤノン株式会社 | 回路パターン形成方法、溶液セット |
| JP2007324473A (ja) * | 2006-06-02 | 2007-12-13 | Fujifilm Corp | 基板搬送キャリア |
| JP2009078199A (ja) * | 2007-09-25 | 2009-04-16 | Seiko Epson Corp | 液滴吐出ヘッドの付着物除去方法 |
-
2012
- 2012-09-12 JP JP2013533677A patent/JPWO2013039080A1/ja active Pending
- 2012-09-12 WO PCT/JP2012/073250 patent/WO2013039080A1/ja not_active Ceased
- 2012-09-14 TW TW101133796A patent/TWI496520B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63197127U (ja) * | 1987-06-06 | 1988-12-19 | ||
| CN1849854A (zh) * | 2003-09-11 | 2006-10-18 | 太阳油墨制造株式会社 | 绝缘图案及其形成方法 |
| JP2007311497A (ja) * | 2006-05-17 | 2007-11-29 | Fuji Mach Mfg Co Ltd | プリント基板保持装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201330734A (zh) | 2013-07-16 |
| WO2013039080A1 (ja) | 2013-03-21 |
| JPWO2013039080A1 (ja) | 2015-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |