TWI487060B - Light-emitting diode (led) wafer picker - Google Patents

Description

LED wafer positioning device

The present invention relates to an LED wafer positioning device, and more particularly to an LED wafer positioning device for non-contact adsorption of LED wafers by using air for transferring LED wafers.

In general, a hexagonal wafer is used for manufacturing a light emitting diode (LED), and a picker for picking up a wafer is used in order to transfer such an LED wafer.

Existing LED wafer positioning devices fix a wafer by drawing in a certain vacuum by drawing in air. However, in this type of adsorption, since the wafer is in direct contact with the adsorption plate, the foreign matter adhering to the adsorption plate may contaminate the surface of the wafer or damage the wafer.

In order to solve the above problem, a non-contact type LED wafer positioning device that does not contact the wafer surface by the Bernoulli principle is used. The existing non-contact LED wafer positioning device rapidly moves the compressed air along the streamlined discharge surface, so that the LED wafer is adsorbed from the discharge surface at a certain distance.

1 is a cross-sectional view of a conventional LED wafer positioning device, and FIG. 2 is a bottom view of a conventional LED wafer positioning device, and FIG. 3 is a view showing an operation example of a conventional LED wafer positioning device.

As shown in FIGS. 1 to 3, the conventional non-contact LED wafer positioning device includes a positioning device main body 110 and a guide member 120.

The positioning device main body 110 has a configuration in which the upper air is supplied and the lower portion is discharged. In this case, the air discharged downward is discharged to both sides along the discharge surface 111 which is provided in a streamlined manner at the lower end of the positioning device 110.

The guiding member 120 is disposed at a lower portion of the discharge surface 111 to guide the air It is possible to move along the release surface 111. The guide member 120 is provided with a plurality of fine holes 121 penetrating vertically.

Thereby, the high-pressure compressed air supplied from the upper portion of the positioning device main body 110 rapidly moves along the discharge surface 111 formed in a streamlined shape, and the central portion of the discharge surface 111 temporarily forms a vacuum state. Therefore, when the negative pressure in the upper direction occurs in the lower portion of the positioning device main body 111, the LED wafer 199 located at the lower portion of the positioning device main body 110 is adsorbed by the fine holes 121 provided in the guide member 120.

However, such a conventional LED wafer positioning device has a problem that the suction force of the suction LED wafer 199 is lowered due to the fine holes 121 provided in the guide member 120.

In addition, when the LED wafer 199 is adsorbed, the upper surface of the LED wafer 199 may come into contact with the guiding member 120. When the upper surface of the LED wafer 199 is contacted, various foreign substances may be adhered to cause inferiority. .

In order to solve the conventional problems as described above, in the present invention, an LED wafer positioning device capable of performing a safe adsorption is provided in which the suction force is enhanced without worrying that the upper surface of the LED wafer is contacted.

An LED wafer positioning device according to the present invention includes a positioning device body and a guiding member. The positioning device body adsorbs the lower LED wafer according to the discharge of the air provided in the upper portion along the discharge surface formed by the streamline type; the guide member is disposed at a lower portion of the discharge surface to allow air to move along the discharge surface. Wherein, the LED wafer positioning device is characterized by comprising a single central hole and a supporting unit. a single central hole is provided in a central unit of the guiding member, located in a portion corresponding to the emitting surface; the supporting unit is configured to protrude integrally into a lower portion of the guiding member to support the LED wafer .

In this case, the support unit is provided with an inclined cone dial such that the downward the diameter, the larger the diameter.

Further, the positioning device body is provided with a diameter for the center hole Insert the sensor's sensor hole into the range.

Further, according to another aspect of the invention, the LED wafer positioning apparatus includes the positioning device main body and the guide member. The positioning device body adsorbs the lower LED wafer according to the discharge of the air provided in the upper portion along the discharge surface formed by the streamline type; the guide member is disposed at a lower portion of the discharge surface to allow air to move along the discharge surface. Wherein, the LED wafer positioning device is characterized by comprising a single central hole and a supporting unit. A single central hole is provided in the central unit of the guide member in a portion corresponding to the discharge surface; the support unit is provided to extend integrally to the side of the guide member to support the LED wafer.

In this case, the support unit is provided with an inclined cone dial such that the downward the diameter, the larger the diameter.

Furthermore, the guide member is characterized by being integrally connected to the positioning device body.

According to the LED wafer positioning apparatus of the present invention, since the center hole is provided on the guide member to enhance the suction force, it is a very useful invention which can easily adsorb the LED wafer which is relatively distant.

Further, according to the LED wafer positioning apparatus of the present invention, since the support unit is provided on the guide member and the cone dial is provided on the support unit to prevent the upper surface of the LED wafer from contacting the guide member, the contamination due to foreign matter can be reduced. The inferior problem that arises.

Further, the LED wafer positioning device according to the present invention is a very useful invention in which the guide members are integrated to reduce the cost and reduce the number of parts as a whole, and the maintenance is easier with a simple structure.

Hereinafter, the technical configuration of the LED wafer positioning device will be described in detail based on the drawings of the present invention.

4 is a cross section of an LED wafer positioning device in accordance with an embodiment of the present invention. FIG. 5 is a bottom view of an LED wafer positioning apparatus according to an embodiment of the present invention, and FIG. 6 is a view showing an operation example of the LED wafer positioning apparatus according to an embodiment of the present invention, and Figure 7 is a cross-sectional view showing an enlarged support unit of an LED wafer positioning device in accordance with one embodiment of the present invention.

As shown in FIGS. 4 to 7, the LED wafer positioning device includes a positioning device main body 10 and a guide member 20.

The positioning device main body 10 adsorbs the lower LED wafer 99 in accordance with the discharge of the air supplied from the upper portion to the both sides along the discharge surface 11 formed in a streamlined manner. That is, the introduction unit 12 for supplying high-pressure compressed air is provided at the upper portion of the positioning device main body 10 and can be connected to a hose or a tube or the like.

The guide member 20 is provided at a lower portion of the discharge surface 11 to guide the movement of air along the discharge surface 11.

The discharge surface 11 provided at the lower portion of the positioning device main body 10 has a cross section formed in a streamlined shape. The compressed air supplied from the introduction unit 12 is discharged to the lower portion of the positioning device main body 10, and the discharged compressed air is rapidly moved along the streamlined discharge surface 11 while temporarily forming a vacuum in the central unit of the positioning device main body 10.

As described above, the vacuum state formed at the center of the lower portion of the positioning device main body 10 causes the LED wafer 99 located at the lower portion of the positioning device main body 10 to generate a negative pressure in the upward direction, that is, in the direction toward the positioning device main body 10 side.

In this case, a central opening 25 is provided in the central unit of the guide member 20. The center hole 25 is located in a portion corresponding to the discharge surface 11. That is, the diameter of the center hole 25 is provided so as not to exceed a portion corresponding to the discharge surface 11. When used for a positioning device that can adsorb a 50 mm LED wafer, it is preferable that the central hole 25 has a diameter of 40 mm.

As described above, since the single center hole 25 is provided in the center of the guide member 20, it is possible to increase the adsorption force of two or more parts than the structure including the plurality of fine holes. Therefore, it can be easily adsorbed from the lower portion of the guide member 20 by 5 mm to 10 mm. Isolated LED wafers.

In this case, the compressed air discharged to the lower portion of the positioning device 10 and moved along the discharge surface 11 is again discharged upward. The reason is that when the compressed air moves down toward the side of the LED wafer 99, the foreign matter around it is dissipated, and the foreign matter adheres to the LED wafer 99, which causes a problem of inferiority.

At the same time, a support unit 30 is provided at a lower portion of the guide member 20. The support unit 30 is equipped to protrude in a downward direction toward the lower direction of the guide member 20 to integrally support the LED wafer 99.

As shown in the figure, the support unit 30 may be formed to have a single shape having a circumferential shape with reference to the center of the guide member 20, or may be prepared along the circumferential direction of the LED wafer 99, corresponding to the size of the LED wafer 99. Multiple, supporting LED wafers 99 at multiple fulcrums

In this case, the lower end of the support unit 30 is provided with a slanted taper 31 so that the downward the diameter, the larger the diameter.

Therefore, as shown in FIG. 7, the upper surface of the LED wafer 99 is not in contact with the guiding member 20 by the contact of the LED wafer 99 with the bevel dial 31. Therefore, the upper surface of the LED wafer 99 does not occur due to foreign matter. Inferior problems such as scratches caused by adhesion.

Furthermore, the positioning device body 10 can be provided with a sensor aperture 15 for inserting a sensor within the diameter of the central aperture 25.

Further, the guide member 20 may be integrated with the positioning device body 10. Therefore, the number of parts of the positioning device as a whole can be reduced, the mechanism can be simplified, and the maintenance can be performed more easily, thereby reducing the manufacturing cost.

In summary, the LED wafer positioning device has a central hole 25 provided at the center of the guide member 20 to double the suction force, and a support unit 30 having a taper 31 is provided at the lower portion of the guide member 20 to prevent the LED crystal. The upper surface of the circle is in contact.

The LED wafer positioning device as described above, since the support unit 30 is prepared to protrude toward the lower portion of the member 20, it is used for a relative position of about 2 feet (50 mm). It is very advantageous when it comes to smaller LED wafers.

8 is a cross-sectional view of an LED wafer positioning apparatus according to another embodiment of the present invention, and FIG. 9 is a bottom view of the LED wafer positioning apparatus according to another embodiment of the present invention, and FIG. 10 is a view A diagram showing an operation example of an LED wafer positioning apparatus according to another embodiment of the present invention, and FIG. 11 is an enlarged cross-sectional view showing a supporting unit of the LED wafer positioning apparatus according to another embodiment of the present invention.

As shown in FIGS. 8 to 11, an LED wafer positioning apparatus according to another embodiment of the present invention includes a positioning device main body 310 and a guide member 320.

The positioning device main body 310 adsorbs the lower LED wafer 399 according to the discharge of the air supplied from the upper portion to the both sides along the discharge surface 311 formed in a streamlined shape. That is, the introduction unit 312 equipped with the compressed air for supplying high pressure at the upper portion of the positioning device main body 310 may be connected to a hose or a tube or the like.

The guide member 320 is provided at a lower portion of the discharge surface 311 to guide the movement of air along the discharge surface 311.

A discharge surface 311 provided at a lower portion of the positioning device main body 310 has a cross section formed in a streamlined shape. The compressed air supplied from the introduction unit 312 is discharged to the lower portion of the positioning device main body 310, and the discharged compressed air is rapidly moved along the streamlined discharge surface 311 while temporarily forming a vacuum at the central unit of the positioning device main body 310.

As described above, the vacuum state formed at the center of the lower portion of the positioning device main body 310 causes the LED wafer 399 located at the lower portion of the positioning device main body 310 to generate a negative pressure in the upward direction, that is, in the direction toward the positioning device main body 310 side.

In this case, a single central hole 325 is provided in the central unit of the guide member 320. The center hole 325 is located in a portion corresponding to the discharge surface 311. That is, the diameter of the center hole 325 is provided so as not to exceed a portion corresponding to the discharge surface 311. When used for a positioning device that can adsorb a 150 mm LED wafer, it is preferable that the central hole 325 has a diameter of 40 mm to 60 mm; more preferably, the central hole 325 has a diameter of 40 mm.

As described above, since the single center hole 325 is provided in the center of the guide member 320, the adsorption force of two or more parts can be improved compared with the structure which has a plurality of pores. Therefore, the LED wafer isolated from 5 mm to 10 mm from the lower portion of the guide member 320 can be easily adsorbed.

In this case, the compressed air discharged to the lower portion of the positioning device 310 and moved along the discharge surface 311 is again discharged upward. The reason is that when the compressed air moves down toward the side of the LED wafer 399, foreign matter in the surrounding area is dissipated, and the foreign matter adheres to the LED wafer 399, causing a problem of inferiority.

At the same time, a support unit 330 is provided on a side surface of the guide member 320. The support unit 330 is provided to protrude integrally to the side surface direction of the guide member 320 to support the LED wafer 399.

As shown, the support unit 330 can correspond to the size of the LED wafer 399, and is prepared as a single one having a circumferential shape with reference to the center of the guide member 320, as shown, along the LED wafer 399. The circumferential direction is prepared in plurality, and the LED wafer 399 is supported at a plurality of fulcrums. Although the support unit 330 is shown in four positions in the drawing, the number may be appropriately selected corresponding to the size of the LED wafer.

In this case, the lower end of the support unit 30 is provided with a slanted taper 331 such that the downward the diameter, the larger the diameter. In this case, the support unit 330 may be constituted by the level extension unit 333 and the bending unit 334. The level extending unit 333 is prepared to extend integrally from the guiding member 320 in the side direction, and the bending unit 334 is prepared to be bent from the level extending unit 333 in the downward direction, and the taper 331 is prepared at the bending unit 334. Inside.

Therefore, as shown in FIG. 11, the upper surface of the LED wafer 399 is not in contact with the guiding member 320 by the contact of the LED wafer 399 with the tapered dial 331. Therefore, the upper surface of the LED wafer 399 does not occur due to foreign matter. Inferior problems such as scratches caused by adhesion.

Additionally, the positioning device body 310 can be provided with a sensor aperture 315 for inserting a sensor within the diameter of the central aperture 325.

Further, the guiding member 320 may be integrated with the positioning device body 310. Therefore, the number of parts of the positioning device as a whole can be reduced, the mechanism can be simplified, and the maintenance can be performed more easily, thereby reducing the manufacturing cost. In this case, the guide member 320 is provided with a bolt hole 329 for connection with the positioning device main body 310.

In summary, the LED wafer positioning device is provided with a central hole 325 at the center of the guiding member 320 to double the suction force, and a supporting unit 330 having a tapered dial 331 is provided at the lower portion of the guiding member 320 to prevent the LED crystal. The upper surface of the circle is in contact.

The LED wafer positioning device as described above is advantageous in that it is used for a relatively large-sized LED wafer of about 6 feet (150 mm) since the support unit 330 is prepared to protrude toward the lower portion of the guiding member 320. of.

Here, the LED wafer positioning apparatus of the present invention has been described with reference to the embodiments shown in the drawings, but the present invention is not limited to the embodiments, and anyone having ordinary knowledge in the field to which the present invention pertains can be described herein. Various modifications and variations are made. The scope of the invention is, therefore, not limited by the scope of the claims

10‧‧‧ device body

11‧‧‧ release

12‧‧‧Introduction unit

15‧‧‧Sensor hole

20‧‧‧Guide parts

25‧‧‧Central hole

30‧‧‧Support unit

31‧‧‧ cone dial

99‧‧‧LED wafer

110‧‧‧ positioning device body

111‧‧‧ release face

120‧‧‧Guide parts

121‧‧‧Pore

199‧‧‧LED wafer

310‧‧‧ positioning device body

311‧‧‧ release

312‧‧‧Introduction unit

320‧‧‧Guide parts

325‧‧‧Central hole

329‧‧‧Bolt holes

330‧‧‧Support unit

331‧‧‧ cone dial

333‧‧‧Level extension unit

334‧‧‧Bending unit

399‧‧‧LED wafer

1 is a cross-sectional view of a conventional LED wafer positioning device.

2 is a bottom view of a conventional LED wafer positioning device.

3 is a diagram showing an operation example of a conventional LED wafer positioning device.

4 is a cross-sectional view of an LED wafer positioning device in accordance with an embodiment of the present invention.

Figure 5 is a bottom plan view of an LED wafer positioning device in accordance with one embodiment of the present invention.

FIG. 6 is a diagram showing an operation example of an LED wafer positioning device according to an embodiment of the present invention.

Figure 7 is a diagram of an LED wafer positioning device in accordance with one embodiment of the present invention. An enlarged sectional view of the struts.

Figure 8 is a cross-sectional view of an LED wafer positioning apparatus in accordance with another embodiment of the present invention.

9 is a bottom plan view of an LED wafer positioning device in accordance with another embodiment of the present invention.

FIG. 10 is a diagram showing an operation example of an LED wafer positioning device according to another embodiment of the present invention.

Figure 11 is a cross-sectional view showing an enlarged support unit of an LED wafer positioning device in accordance with another embodiment of the present invention.

110‧‧‧ positioning device body

111‧‧‧ release face

120‧‧‧Guide parts

121‧‧‧Pore

Claims (4)

An LED wafer positioning device comprising: a positioning device body (10) for adsorbing a lower LED wafer (99) according to air discharged from an upper portion along a discharge surface (11) formed by a streamlined shape; and a guiding member (20) disposed at a lower portion of the emitting surface (11) to enable air to move along the emitting surface (11), wherein the LED wafer positioning device is characterized by comprising: a single central hole (25), which is provided in a central unit of the guide member (20), located in a portion corresponding to the discharge surface (11); and a support unit (30) equipped to the guide member ( The lower direction of 20) protrudes integrally to support the LED wafer (99); wherein the lower end of the supporting unit (30) is provided with a slanted taper (31), so that the downward the diameter, the larger the diameter . The LED wafer positioning device of claim 1, wherein the positioning device body (10) is provided with a sensor for inserting a sensor within a diameter range of the central hole (25) Hole (15). An LED wafer positioning device comprising: a positioning device body (310) for adsorbing a lower LED wafer (399) according to air discharged from an upper portion along a discharge surface (311) formed by a streamlined shape; and a guiding member (320) disposed at a lower portion of the emitting surface (311) to enable air to move along the emitting surface (311), wherein the LED wafer positioning device is characterized by comprising: a single central hole (325), which is provided in a central unit of the guide member (320), located in a portion corresponding to the discharge surface (311); and a support unit (330) equipped to the guide member ( The lateral direction of 320) extends integrally to support the LED wafer (399); Wherein, the supporting unit (330) is provided with a slanted taper (331) such that the diameter is larger as it goes downward. The LED wafer positioning device of claim 3, wherein the guiding member (320) is integrally coupled to the positioning device body (310).