TWI483977B - Inorganic fine particle dispersion paste - Google Patents
Inorganic fine particle dispersion paste Download PDFInfo
- Publication number
- TWI483977B TWI483977B TW099125839A TW99125839A TWI483977B TW I483977 B TWI483977 B TW I483977B TW 099125839 A TW099125839 A TW 099125839A TW 99125839 A TW99125839 A TW 99125839A TW I483977 B TWI483977 B TW I483977B
- Authority
- TW
- Taiwan
- Prior art keywords
- inorganic fine
- fine particle
- paste
- group
- meth
- Prior art date
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- 239000010419 fine particle Substances 0.000 title claims description 62
- 239000006185 dispersion Substances 0.000 title claims description 21
- 150000002894 organic compounds Chemical class 0.000 claims description 45
- 229920000178 Acrylic resin Polymers 0.000 claims description 35
- 239000004925 Acrylic resin Substances 0.000 claims description 35
- 239000011521 glass Substances 0.000 claims description 31
- 239000003960 organic solvent Substances 0.000 claims description 30
- 239000000178 monomer Substances 0.000 claims description 28
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 22
- 239000011354 acetal resin Substances 0.000 claims description 21
- 229920006324 polyoxymethylene Polymers 0.000 claims description 21
- 229920002554 vinyl polymer Polymers 0.000 claims description 21
- 239000001856 Ethyl cellulose Substances 0.000 claims description 19
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 19
- 238000009835 boiling Methods 0.000 claims description 19
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 19
- 229920001249 ethyl cellulose Polymers 0.000 claims description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 18
- 239000007787 solid Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 10
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims description 6
- 239000012634 fragment Substances 0.000 claims description 5
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 claims description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 3
- XRVCFZPJAHWYTB-UHFFFAOYSA-N prenderol Chemical compound CCC(CC)(CO)CO XRVCFZPJAHWYTB-UHFFFAOYSA-N 0.000 claims description 3
- 229950006800 prenderol Drugs 0.000 claims description 3
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 claims description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 2
- 229960000541 cetyl alcohol Drugs 0.000 claims description 2
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 claims description 2
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 claims description 2
- OILXMJHPFNGGTO-UHFFFAOYSA-N (22E)-(24xi)-24-methylcholesta-5,22-dien-3beta-ol Natural products C1C=C2CC(O)CCC2(C)C2C1C1CCC(C(C)C=CC(C)C(C)C)C1(C)CC2 OILXMJHPFNGGTO-UHFFFAOYSA-N 0.000 claims 1
- OQMZNAMGEHIHNN-UHFFFAOYSA-N 7-Dehydrostigmasterol Natural products C1C(O)CCC2(C)C(CCC3(C(C(C)C=CC(CC)C(C)C)CCC33)C)C3=CC=C21 OQMZNAMGEHIHNN-UHFFFAOYSA-N 0.000 claims 1
- HZYXFRGVBOPPNZ-UHFFFAOYSA-N UNPD88870 Natural products C1C=C2CC(O)CCC2(C)C2C1C1CCC(C(C)=CCC(CC)C(C)C)C1(C)CC2 HZYXFRGVBOPPNZ-UHFFFAOYSA-N 0.000 claims 1
- LGJMUZUPVCAVPU-UHFFFAOYSA-N beta-Sitostanol Natural products C1CC2CC(O)CCC2(C)C2C1C1CCC(C(C)CCC(CC)C(C)C)C1(C)CC2 LGJMUZUPVCAVPU-UHFFFAOYSA-N 0.000 claims 1
- 235000013372 meat Nutrition 0.000 claims 1
- HCXVJBMSMIARIN-PHZDYDNGSA-N stigmasterol Chemical compound C1C=C2C[C@@H](O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)/C=C/[C@@H](CC)C(C)C)[C@@]1(C)CC2 HCXVJBMSMIARIN-PHZDYDNGSA-N 0.000 claims 1
- 229940032091 stigmasterol Drugs 0.000 claims 1
- BFDNMXAIBMJLBB-UHFFFAOYSA-N stigmasterol Natural products CCC(C=CC(C)C1CCCC2C3CC=C4CC(O)CCC4(C)C3CCC12C)C(C)C BFDNMXAIBMJLBB-UHFFFAOYSA-N 0.000 claims 1
- 235000016831 stigmasterol Nutrition 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 68
- 238000006116 polymerization reaction Methods 0.000 description 39
- 239000010410 layer Substances 0.000 description 38
- 238000001035 drying Methods 0.000 description 31
- 239000000243 solution Substances 0.000 description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 24
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 24
- 239000000843 powder Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 18
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 18
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 18
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 17
- 239000003505 polymerization initiator Substances 0.000 description 17
- 238000007639 printing Methods 0.000 description 16
- 238000007650 screen-printing Methods 0.000 description 16
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 15
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 15
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 14
- 229910004298 SiO 2 Inorganic materials 0.000 description 13
- 238000006359 acetalization reaction Methods 0.000 description 13
- 229920002451 polyvinyl alcohol Polymers 0.000 description 12
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 102100026735 Coagulation factor VIII Human genes 0.000 description 11
- 101000911390 Homo sapiens Coagulation factor VIII Proteins 0.000 description 11
- 239000004372 Polyvinyl alcohol Substances 0.000 description 11
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical group NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 10
- 125000003277 amino group Chemical group 0.000 description 10
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- -1 2-ethylhexyl Chemical group 0.000 description 9
- 239000004793 Polystyrene Substances 0.000 description 9
- 229920002223 polystyrene Polymers 0.000 description 9
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 238000007664 blowing Methods 0.000 description 7
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000005979 thermal decomposition reaction Methods 0.000 description 6
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 238000001354 calcination Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000012295 chemical reaction liquid Substances 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004711 α-olefin Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 150000001299 aldehydes Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011859 microparticle Substances 0.000 description 4
- 239000002736 nonionic surfactant Substances 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 238000007127 saponification reaction Methods 0.000 description 4
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000001431 2-methylbenzaldehyde Substances 0.000 description 3
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 229910007472 ZnO—B2O3—SiO2 Inorganic materials 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- RSPCKAHMRANGJZ-UHFFFAOYSA-N thiohydroxylamine Chemical group SN RSPCKAHMRANGJZ-UHFFFAOYSA-N 0.000 description 3
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 3
- 229920001567 vinyl ester resin Polymers 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 239000010883 coal ash Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 2
- 238000009775 high-speed stirring Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 238000010551 living anionic polymerization reaction Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229940043348 myristyl alcohol Drugs 0.000 description 2
- WVFLGSMUPMVNTQ-UHFFFAOYSA-N n-(2-hydroxyethyl)-2-[[1-(2-hydroxyethylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCO WVFLGSMUPMVNTQ-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BTFQKIATRPGRBS-UHFFFAOYSA-N o-tolualdehyde Chemical compound CC1=CC=CC=C1C=O BTFQKIATRPGRBS-UHFFFAOYSA-N 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- FXLOVSHXALFLKQ-UHFFFAOYSA-N p-tolualdehyde Chemical compound CC1=CC=C(C=O)C=C1 FXLOVSHXALFLKQ-UHFFFAOYSA-N 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- DEUGOISHWHDTIR-UHFFFAOYSA-N (1-hydroxy-5,5-dimethylhexyl) 2-methylpropanoate Chemical compound C(C(C)C)(=O)OC(CCCC(C)(C)C)O DEUGOISHWHDTIR-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- VWNAITWBRLKIIS-UHFFFAOYSA-N 1-sulfanylpropane-1,1-diol Chemical compound CCC(O)(O)S VWNAITWBRLKIIS-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- HBNHCGDYYBMKJN-UHFFFAOYSA-N 2-(4-methylcyclohexyl)propan-2-yl acetate Chemical compound CC1CCC(C(C)(C)OC(C)=O)CC1 HBNHCGDYYBMKJN-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- MPNXSZJPSVBLHP-UHFFFAOYSA-N 2-chloro-n-phenylpyridine-3-carboxamide Chemical compound ClC1=NC=CC=C1C(=O)NC1=CC=CC=C1 MPNXSZJPSVBLHP-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- LGYNIFWIKSEESD-UHFFFAOYSA-N 2-ethylhexanal Chemical compound CCCCC(CC)C=O LGYNIFWIKSEESD-UHFFFAOYSA-N 0.000 description 1
- SZNYYWIUQFZLLT-UHFFFAOYSA-N 2-methyl-1-(2-methylpropoxy)propane Chemical compound CC(C)COCC(C)C SZNYYWIUQFZLLT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RKOOOVKGLHCLTP-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.OCC(O)CO RKOOOVKGLHCLTP-UHFFFAOYSA-N 0.000 description 1
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 1
- IQVAERDLDAZARL-UHFFFAOYSA-N 2-phenylpropanal Chemical compound O=CC(C)C1=CC=CC=C1 IQVAERDLDAZARL-UHFFFAOYSA-N 0.000 description 1
- BPBDZXFJDMJLIB-UHFFFAOYSA-N 2-phenylpropane-1,3-diol Chemical compound OCC(CO)C1=CC=CC=C1 BPBDZXFJDMJLIB-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910003870 O—Li Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- INLLPKCGLOXCIV-UHFFFAOYSA-N bromoethene Chemical compound BrC=C INLLPKCGLOXCIV-UHFFFAOYSA-N 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 125000003739 carbamimidoyl group Chemical group C(N)(=N)* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- DRVWBEJJZZTIGJ-UHFFFAOYSA-N cerium(3+);oxygen(2-) Chemical class [O-2].[O-2].[O-2].[Ce+3].[Ce+3] DRVWBEJJZZTIGJ-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- KVFDZFBHBWTVID-UHFFFAOYSA-N cyclohexanecarbaldehyde Chemical compound O=CC1CCCCC1 KVFDZFBHBWTVID-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- GFJVXXWOPWLRNU-UHFFFAOYSA-N ethenyl formate Chemical compound C=COC=O GFJVXXWOPWLRNU-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical group C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- FXHGMKSSBGDXIY-UHFFFAOYSA-N heptanal Chemical compound CCCCCCC=O FXHGMKSSBGDXIY-UHFFFAOYSA-N 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- LRDFRRGEGBBSRN-UHFFFAOYSA-N isobutyronitrile Chemical group CC(C)C#N LRDFRRGEGBBSRN-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- OVWYEQOVUDKZNU-UHFFFAOYSA-N m-tolualdehyde Chemical compound CC1=CC=CC(C=O)=C1 OVWYEQOVUDKZNU-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- YQCIWBXEVYWRCW-UHFFFAOYSA-N methane;sulfane Chemical compound C.S YQCIWBXEVYWRCW-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- PKIYFBICNICNGJ-UHFFFAOYSA-N monooctyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(O)=O PKIYFBICNICNGJ-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- SQYNKIJPMDEDEG-UHFFFAOYSA-N paraldehyde Chemical compound CC1OC(C)OC(C)O1 SQYNKIJPMDEDEG-UHFFFAOYSA-N 0.000 description 1
- 229960003868 paraldehyde Drugs 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- IAHIMVFWYADCJJ-UHFFFAOYSA-N prop-1-enylcyclohexane Chemical compound CC=CC1CCCCC1 IAHIMVFWYADCJJ-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- KOUKXHPPRFNWPP-UHFFFAOYSA-N pyrazine-2,5-dicarboxylic acid;hydrate Chemical compound O.OC(=O)C1=CN=C(C(O)=O)C=N1 KOUKXHPPRFNWPP-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052917 strontium silicate Inorganic materials 0.000 description 1
- QSQXISIULMTHLV-UHFFFAOYSA-N strontium;dioxido(oxo)silane Chemical compound [Sr+2].[O-][Si]([O-])=O QSQXISIULMTHLV-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F120/10—Esters
- C08F120/12—Esters of monohydric alcohols or phenols
- C08F120/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F120/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/08—Cellulose derivatives
- C08L1/26—Cellulose ethers
- C08L1/28—Alkyl ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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Description
本發明係關於一種可形成表面平滑性優異之燒結層之無機微粒子分散糊。The present invention relates to an inorganic fine particle-dispersed paste which can form a sintered layer excellent in surface smoothness.
近年來,為了獲得各種形狀之燒結體,而一直利用將導電性粉末、陶瓷粉末等無機微粒子分散於黏合樹脂中而成之無機微粒子分散糊。尤其是作為無機微粒子而將螢光體分散於黏合樹脂中而成之螢光體糊、或分散低熔點玻璃而成之玻璃糊被應用於電漿顯示面板等,且近年來需求不斷高漲。In recent years, in order to obtain a sintered body of various shapes, an inorganic fine particle-dispersed paste obtained by dispersing inorganic fine particles such as conductive powder or ceramic powder in a binder resin has been used. In particular, a phosphor paste obtained by dispersing a phosphor in an adhesive resin as an inorganic fine particle or a glass paste in which a low-melting glass is dispersed is applied to a plasma display panel or the like, and demand has been increasing in recent years.
又,將鈦酸鋇或氧化鋁作為無機微粒子分散於黏合樹脂中而成之陶瓷糊係成形為生片,用於積層型之電子零件,例如積層陶瓷電容器。Further, a ceramic paste obtained by dispersing barium titanate or aluminum oxide as an inorganic fine particle in a binder resin is molded into a green sheet, and is used for a laminated electronic component such as a laminated ceramic capacitor.
進而,太陽電池板之背面電極通常係藉由以網版印刷等來塗佈分散有鋁粉之糊並加以乾燥,然後進行煅燒而形成。Further, the back electrode of the solar cell panel is usually formed by coating a paste in which aluminum powder is dispersed by screen printing or the like, drying it, and then calcining it.
例如,電漿顯示面板之介電質層係藉由如下方式而形成:於玻璃基板上印刷玻璃糊後,利用在爐內循環排氣之送風烘箱乾燥溶劑,繼而利用高溫之烘箱進行脫脂、煅燒。作為用以形成介電質層之玻璃糊,例如專利文獻1中揭示有一種介電質層用組成物、及藉由將該介電質層用組成物塗佈於支持體上然後加以乾燥而獲得之生片,上述介電質層用組成物係電漿顯示面板之介電質層用組成物,並且含有至少含玻璃成分之玻璃料、分散劑、熱解黏合劑及溶劑,上述分散劑為聚羧酸系高分子化合物。For example, the dielectric layer of the plasma display panel is formed by printing a glass paste on a glass substrate, drying the solvent in a blown oven circulated in the furnace, and then degreasing and calcining using a high temperature oven. . As a glass paste for forming a dielectric layer, for example, Patent Document 1 discloses a composition for a dielectric layer, and the composition for a dielectric layer is applied onto a support and then dried. The obtained green sheet, the composition for the dielectric layer is a composition for a dielectric layer of a plasma display panel, and contains a glass frit containing at least a glass component, a dispersant, a pyrolysis binder, and a solvent, and the dispersant It is a polycarboxylic acid type polymer compound.
專利文獻1中揭示,於該文獻所揭示之介電質層用組成物中,玻璃料之分散狀態有效地提昇。Patent Document 1 discloses that in the composition for a dielectric layer disclosed in the document, the dispersion state of the glass frit is effectively improved.
為了形成均勻之燒結層,使燒結層之特性不產生偏差,如上所述之無機微粒子之分散性之改善十分重要。然而,燒結層由於係經由無機微粒子分散糊之印刷、乾燥、脫脂、煅燒步驟方可形成,因此僅改善糊狀態之均勻性、即無機微粒子之分散性難以充分確保最終形成之燒結層之均勻性。In order to form a uniform sintered layer, the characteristics of the sintered layer are not deviated, and the improvement of the dispersibility of the inorganic fine particles as described above is important. However, since the sintered layer can be formed by the printing, drying, degreasing, and calcining steps of the inorganic fine particle dispersion paste, it is difficult to sufficiently improve the uniformity of the paste state, that is, the dispersibility of the inorganic fine particles, to sufficiently ensure the uniformity of the finally formed sintered layer. .
又,亦研究如專利文獻1所揭示之生片般,將無機微粒子分散糊預先加工成片狀,使用所得之生片從而形成均勻之燒結層,但使用生片之情況下,存在生片對基板之密接性不充分之問題。Further, as in the green sheet disclosed in Patent Document 1, the inorganic fine particle-dispersed paste was previously processed into a sheet shape, and the obtained green sheet was used to form a uniform sintered layer. However, in the case of using a green sheet, there was a green sheet pair. The problem of insufficient adhesion of the substrate.
專利文獻1:日本特開2004-002164號公報Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-002164
本發明之目的在於提供一種可形成表面平滑性優異之燒結層之無機微粒子分散糊。An object of the present invention is to provide an inorganic fine particle-dispersed paste which can form a sintered layer excellent in surface smoothness.
本發明係一種無機微粒子分散糊,其含有:選自由乙基纖維素、(甲基)丙烯酸樹脂及聚乙烯縮醛樹脂所組成之群中的至少一種、有機化合物、無機微粒子以及有機溶劑;並且上述有機化合物具有1個以上之羥基,且於常溫下為固體,沸點低於300℃。The present invention is an inorganic fine particle-dispersed paste comprising: at least one selected from the group consisting of ethyl cellulose, (meth)acrylic resin, and polyvinyl acetal resin, an organic compound, inorganic fine particles, and an organic solvent; The organic compound has one or more hydroxyl groups and is solid at normal temperature and has a boiling point of less than 300 °C.
以下對本發明加以詳述。The invention is described in detail below.
通常,用以形成燒結層之無機微粒子分散糊中係使用高沸點溶劑以確保印刷性。進而,為了高效率地乾燥高沸點溶劑而使生產性提昇,於印刷後之乾燥步驟中一直使用送風烘箱。本發明人等發現,烘箱內之送風會導致無機微粒子分散糊之塗佈層產生表面粗糙,結果燒結層之表面平滑性下降,燒結層之性能惡化。Usually, a high boiling point solvent is used in the inorganic fine particle dispersion paste for forming a sintered layer to ensure printability. Further, in order to efficiently dry the high-boiling solvent to improve the productivity, the air blowing oven is used in the drying step after printing. The present inventors have found that the air blow in the oven causes surface roughness of the coating layer of the inorganic fine particle-dispersed paste, and as a result, the surface smoothness of the sintered layer is lowered, and the performance of the sintered layer is deteriorated.
本發明人等發現,除了選自由乙基纖維素、(甲基)丙烯酸樹脂及聚乙烯縮醛樹脂所組成之群中的至少一種、無機微粒子以及有機溶劑以外,進而含有具有1個以上之羥基,且於常溫下為固體,沸點低於300℃之有機化合物的無機微粒子分散糊於印刷後之乾燥步驟中可良好地乾燥,並且於烘箱中乾燥時,可抑制因在烘箱內受到送風所導致之表面粗糙,而且亦不會產生因樹脂交聯所致之結皮現象而均勻地乾燥。進而,本發明人等發現,使用該無機微粒子分散糊而形成之燒結層之表面平滑性優異,從而完成了本發明。The present inventors have found that at least one selected from the group consisting of ethyl cellulose, (meth)acrylic resin, and polyvinyl acetal resin, inorganic fine particles, and an organic solvent further contain one or more hydroxyl groups. And the inorganic fine particle dispersion paste which is solid at normal temperature and the organic compound having a boiling point lower than 300 ° C can be well dried in the drying step after printing, and can be inhibited from being blown in the oven when dried in an oven. The surface is rough and does not cause uniform drying due to skinning caused by cross-linking of the resin. Furthermore, the present inventors have found that the sintered layer formed using the inorganic fine particle-dispersed paste has excellent surface smoothness, and completed the present invention.
本發明之無機微粒子分散糊含有選自由乙基纖維素、(甲基)丙烯酸樹脂及聚乙烯縮醛樹脂所組成之群中的至少一種。The inorganic fine particle-dispersed paste of the present invention contains at least one selected from the group consisting of ethyl cellulose, (meth)acrylic resin, and polyvinyl acetal resin.
上述乙基纖維素並無特別限定,只要根據所得之無機微粒子分散糊之印刷方法、目標燒結層之厚度等而適當選擇等級即可。其中,於進行網版印刷之情形時,通常以具有觸變性之乙基纖維素為佳,故較佳為STD 45、STD100等之等級之乙基纖維素。又,於要獲得較厚之燒結層之情形時,需要提高無機微粒子分散糊中之無機微粒子之組成比,無機微粒子分散糊之黏度容易變高,故較佳為STD4、STD10等低黏度規格之等級之乙基纖維素。The ethyl cellulose is not particularly limited, and may be appropriately selected depending on the printing method of the obtained inorganic fine particle-dispersed paste, the thickness of the target sintered layer, and the like. Among them, in the case of screen printing, ethyl cellulose having thixotropic properties is usually preferred, and ethyl cellulose grades such as STD 45 and STD 100 are preferred. Further, in the case where a thick sintered layer is to be obtained, it is necessary to increase the composition ratio of the inorganic fine particles in the inorganic fine particle-dispersed paste, and the viscosity of the inorganic fine particle-dispersed paste is liable to become high, so that it is preferably a low-viscosity specification such as STD4 or STD10. Grade ethyl cellulose.
上述(甲基)丙烯酸樹脂只要可於350~400℃左右之低溫下分解,則並無特別限定,較佳為由選自由下述化合物所組成之群中之至少一種所構成的聚合物,即:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸正硬脂酯、(甲基)丙烯酸苄酯及具有聚氧伸烷基結構之(甲基)丙烯酸系單體。此處,例如(甲基)丙烯酸酯係指丙烯酸酯或甲基丙烯酸酯。The (meth)acrylic resin is not particularly limited as long as it can be decomposed at a low temperature of about 350 to 400 ° C, and is preferably a polymer composed of at least one selected from the group consisting of the following compounds, that is, : (methyl) methacrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl (meth) acrylate, (meth) acrylate Butyl ester, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isobornyl (meth)acrylate, n-stearyl (meth)acrylate, benzyl (meth)acrylate An ester and a (meth)acrylic monomer having a polyoxyalkylene structure. Here, for example, (meth) acrylate means acrylate or methacrylate.
其中,較佳為玻璃轉移溫度(Tg)較高之聚甲基丙烯酸甲酯(甲基丙烯酸酯之聚合物,Tg為105℃),其原因在於以較少之樹脂量便可獲得較高黏度。而且,聚甲基丙烯酸酯之低溫脫脂性亦優異。進而,由於本發明之無機微粒子分散糊含有後述之有機化合物,故(甲基)丙烯酸樹脂較佳為含有來源於甲基丙烯酸丁酯或甲基丙烯酸異丁酯之成分的聚合物。Among them, polymethyl methacrylate (polymer of methacrylate having a Tg of 105 ° C) having a high glass transition temperature (Tg) is preferred because a higher viscosity can be obtained with a smaller amount of resin. . Moreover, polymethacrylate is also excellent in low-temperature degreasing property. Further, since the inorganic fine particle-dispersed paste of the present invention contains an organic compound described later, the (meth)acrylic resin is preferably a polymer containing a component derived from butyl methacrylate or isobutyl methacrylate.
又,上述(甲基)丙烯酸樹脂亦可含有由具有極性基之單體所構成之片段。Further, the (meth)acrylic resin may further contain a fragment composed of a monomer having a polar group.
作為上述具有極性基之單體,例如可列舉:甲基丙烯酸-2-羥基乙酯、甲基丙烯酸羥基丙酯、甲基丙烯酸、甲基丙烯酸縮水甘油酯、甘油單甲基丙烯酸酯等。Examples of the monomer having a polar group include 2-hydroxyethyl methacrylate, hydroxypropyl methacrylate, methacrylic acid, glycidyl methacrylate, and glycerin monomethacrylate.
於含有來源於上述具有極性基之單體的片段之情形時,來源於上述具有極性基之單體的片段之含量較佳為20重量%以下。In the case of containing a fragment derived from the above-mentioned monomer having a polar group, the content of the fragment derived from the monomer having a polar group is preferably 20% by weight or less.
若來源於上述具有極性基之單體的片段之含量超過20重量%,則有時會損及低溫下之熱分解性,或附著於無機微粒子上之煤灰增多,或者燒結體之殘留碳增多。上述含量更佳為10重量份以下。When the content of the fragment derived from the monomer having a polar group exceeds 20% by weight, the thermal decomposition property at a low temperature may be impaired, or the amount of coal ash adhering to the inorganic fine particles may increase, or the residual carbon of the sintered body may increase. . The above content is more preferably 10 parts by weight or less.
上述(甲基)丙烯酸樹脂較佳為於分子末端具有親水性官能基。上述親水性官能基並無特別限定,較佳為羰基、胺基、醯胺基類。The above (meth)acrylic resin preferably has a hydrophilic functional group at the molecular terminal. The hydrophilic functional group is not particularly limited, and is preferably a carbonyl group, an amine group or a guanamine group.
通常,於使用在(甲基)丙烯酸系單體之酯取代基上導入有羰基、胺基、醯胺基等相互作用性較高之官能基的(甲基)丙烯酸樹脂之情形時,於無機微粒子分散糊之煅燒步驟中,該(甲基)丙烯酸樹脂之解聚合受到阻礙而導致熱分解結束溫度提高,熱分解性嚴重惡化。In general, when a (meth)acrylic resin having a functional group having a high interaction such as a carbonyl group, an amine group or a guanamine group is introduced onto an ester substituent of a (meth)acrylic monomer, the inorganic In the calcination step of the fine particle-dispersed paste, the depolymerization of the (meth)acrylic resin is hindered, and the thermal decomposition end temperature is increased, and the thermal decomposition property is seriously deteriorated.
相對於此,使用於分子末端具有羰基、胺基、醯胺基等之(甲基)丙烯酸樹脂之情形時,該(甲基)丙烯酸樹脂之解聚合不會受到阻礙,而幾乎不會影響熱分解結束溫度。又,由於玻璃粉末等無機微粒子與羰基、胺基、醯胺基等之相互作用性較高,故而使用於分子末端具有羰基、胺基、醯胺基等之(甲基)丙烯酸樹脂之情形時,形成該(甲基)丙烯酸樹脂之一個分子末端吸附於無機微粒子表面,另一個分子末端朝有機溶劑側延伸之形態,可防止無機微粒子再凝聚,使分散穩定性提昇。On the other hand, when it is used in the case of a (meth)acrylic resin having a carbonyl group, an amine group, a guanamine group or the like at the molecular terminal, the depolymerization of the (meth)acrylic resin is not hindered, and the heat is hardly affected. Decompose the end temperature. In addition, since inorganic microparticles such as glass powder have high interaction with a carbonyl group, an amine group, a guanamine group, etc., when it is used for a (meth)acrylic resin having a carbonyl group, an amine group or a guanamine group at the molecular terminal. The molecular end of the (meth)acrylic resin is adsorbed on the surface of the inorganic fine particles, and the other molecular end is extended toward the organic solvent side, thereby preventing the inorganic fine particles from re-agglomerating and improving the dispersion stability.
上述(甲基)丙烯酸樹脂之由聚苯乙烯換算所得之重量平均分子量並無特別限定,較佳下限為5000,較佳上限為500000。若上述重量平均分子量小於5000,則有時所得之無機微粒子分散糊無法獲得充分之黏度,網版印刷性變差,而且,有時於印刷後之乾燥步驟中,因在烘箱內受到送風所導致之表面粗糙增大,由此燒結層之表面平滑性下降。若上述重量平均分子量超過500000,則所得之無機微粒子分散糊之黏著力變得過高,有時產生拉絲,導致網版印刷性變差。上述重量平均分子量之較佳上限為100000,更佳上限為50000。尤其是若上述(甲基)丙烯酸樹脂之由聚苯乙烯換算所得之重量平均分子量為10000~50000,則網版印刷時可獲得清晰之圖像,故而較佳。The weight average molecular weight of the (meth)acrylic resin converted from polystyrene is not particularly limited, and a preferred lower limit is 5,000, and a preferred upper limit is 500,000. When the weight average molecular weight is less than 5,000, the obtained inorganic fine particle-dispersed paste may not have sufficient viscosity, and the screen printing property may be deteriorated, and in some cases, in the drying step after printing, air may be blown in the oven. The surface roughness is increased, whereby the surface smoothness of the sintered layer is lowered. When the weight average molecular weight exceeds 500,000, the adhesion of the obtained inorganic fine particle-dispersed paste becomes too high, and wire drawing may occur, resulting in deterioration of screen printing property. A preferred upper limit of the above weight average molecular weight is 100,000, and a more preferred upper limit is 50,000. In particular, when the weight average molecular weight of the (meth)acrylic resin derived from polystyrene is 10,000 to 50,000, a clear image can be obtained at the time of screen printing, which is preferable.
再者,由聚苯乙烯換算所得之重量平均分子量可藉由使用例如Column LF-804(昭和電工公司製造)作為管柱進行GPC(gel permeation chromatography,凝膠滲透層析)測定而獲得。In addition, the weight average molecular weight obtained by the polystyrene conversion can be obtained by GPC (gel permeation chromatography) measurement using, for example, Column LF-804 (manufactured by Showa Denko Co., Ltd.) as a column.
製作上述(甲基)丙烯酸樹脂之方法並無特別限定,例如可列舉:於具有羰基、胺基、醯胺基等之聚合起始劑之存在下,利用自由基聚合法、活性自由基聚合法、引發轉移終止劑聚合法、陰離子聚合法、活性陰離子聚合法等先前公知之方法使上述(甲基)丙烯酸系單體進行共聚合之方法;或者,於具有羰基、胺基、醯胺基等之鏈轉移劑之存在下,利用自由基聚合法、活性自由基聚合法、引發轉移終止劑聚合法、陰離子聚合法、活性陰離子聚合法等先前公知之方法使上述(甲基)丙烯酸系單體進行共聚合之方法等。該等方法可單獨使用,亦可併用兩種以上。The method for producing the above (meth)acrylic resin is not particularly limited, and examples thereof include a radical polymerization method and a living radical polymerization method in the presence of a polymerization initiator having a carbonyl group, an amine group or a guanamine group. a method of copolymerizing the above (meth)acrylic monomer by a conventionally known method such as a transfer terminator polymerization method, an anionic polymerization method, or an living anionic polymerization method; or a carbonyl group, an amine group, a guanamine group, or the like In the presence of a chain transfer agent, the above (meth)acrylic monomer is obtained by a conventionally known method such as a radical polymerization method, a living radical polymerization method, an initiating transfer terminator polymerization method, an anionic polymerization method, or a living anionic polymerization method. A method of performing copolymerization or the like. These methods may be used singly or in combination of two or more.
於上述製作(甲基)丙烯酸樹脂之方法中,藉由使用具有羰基、胺基、醯胺基等之聚合起始劑作為自由基聚合起始劑,可於更多之分子末端導入羰基、胺基、醯胺基等。再者,例如可藉由13 C-NMR來確認係僅於上述(甲基)丙烯酸樹脂之分子末端導入有羰基、胺基、醯胺基等。In the above method for producing a (meth)acrylic resin, a carbonyl group or an amine can be introduced at a more molecular end by using a polymerization initiator having a carbonyl group, an amine group, a guanamine group or the like as a radical polymerization initiator. Base, amidino group and the like. Further, for example, it can be confirmed by 13 C-NMR that a carbonyl group, an amine group, a guanamine group or the like is introduced only at the molecular terminal of the above (meth)acrylic resin.
上述聚乙烯縮醛樹脂只要與後述有機溶劑之相容性優異,則並無特別限定,較佳為藉由將皂化度為80莫耳%以上之聚乙烯醇樹脂縮醛化所得,且聚合度為1000~4000,縮醛化度為60~80莫耳%之聚乙烯縮醛樹脂。The polyvinyl acetal resin is not particularly limited as long as it has excellent compatibility with an organic solvent to be described later, and is preferably obtained by acetalizing a polyvinyl alcohol resin having a degree of saponification of 80 mol% or more, and a degree of polymerization. A polyvinyl acetal resin having a degree of acetalization of from 60 to 80 mol%, from 1,000 to 4,000.
上述聚乙烯醇之皂化度較佳為80莫耳%以上。若上述皂化度小於80莫耳%,則聚乙烯醇於水中之溶解性變差,故變得難以進行縮醛化反應,另外,若羥基量較少,則有時縮醛化反應本身變得困難。The degree of saponification of the above polyvinyl alcohol is preferably 80 mol% or more. When the degree of saponification is less than 80 mol%, the solubility of polyvinyl alcohol in water is deteriorated, so that it is difficult to carry out the acetalization reaction, and if the amount of the hydroxyl group is small, the acetalization reaction itself may become difficult.
上述聚乙烯醇之聚合度較佳為1000~4000。The degree of polymerization of the above polyvinyl alcohol is preferably from 1,000 to 4,000.
若上述聚合度小於1000,則例如於用作陶瓷生片之材料之情形時,有時強度變得不充分。若上述聚合度超過4000,則有時於水中之溶解性下降,或水溶液之黏度變高,難以進行縮醛化。而且,若溶液黏度變得過高則塗佈性下降。When the degree of polymerization is less than 1,000, for example, when it is used as a material for a ceramic green sheet, the strength may become insufficient. When the degree of polymerization exceeds 4,000, the solubility in water may decrease, or the viscosity of the aqueous solution may become high, and acetalization may be difficult. Moreover, if the viscosity of the solution becomes too high, the coatability is lowered.
再者,上述聚乙烯縮醛之聚合度係使用作為合成時之原料的聚乙烯醇之聚合度。又,於混合兩種以上之聚乙烯醇之情形時,係使用其等之聚合度之平均值。Further, the degree of polymerization of the polyvinyl acetal is a degree of polymerization of polyvinyl alcohol which is a raw material at the time of synthesis. Further, in the case of mixing two or more kinds of polyvinyl alcohols, the average value of the polymerization degrees thereof is used.
上述聚乙烯醇係藉由將乙烯酯之聚合物皂化而獲得。The above polyvinyl alcohol is obtained by saponifying a polymer of a vinyl ester.
作為上述乙烯酯,可列舉甲酸乙烯酯、乙酸乙烯酯、丙酸乙烯酯、三甲基乙酸乙烯酯等,就經濟性方面而言,較佳為乙酸乙烯酯。Examples of the vinyl ester include vinyl formate, vinyl acetate, vinyl propionate, and trimethyl vinyl acetate. From the viewpoint of economy, vinyl acetate is preferred.
又,上述聚乙烯醇較佳為於主鏈上含有α-烯烴。Further, the polyvinyl alcohol preferably contains an α-olefin in the main chain.
聚乙烯縮醛樹脂之氫鍵結力由於上述α-烯烴之存在而減弱,故可使黏度之經時穩定性提昇,或可使網版印刷性提昇。The hydrogen bonding force of the polyvinyl acetal resin is weakened by the presence of the above α-olefin, so that the stability of the viscosity can be improved over time, or the screen printing property can be improved.
作為上述α-烯烴,例如可列舉:甲烯、乙烯、丙烯、異丙烯、丁烯、異丁烯、戊烯、己烯、環己烯、環己基乙烯、環己基丙烯等,特佳為乙烯。Examples of the α-olefin include, for example, methylene, ethylene, propylene, isopropylene, butylene, isobutylene, pentene, hexene, cyclohexene, cyclohexylethylene, and cyclohexylpropene.
作為上述α-烯烴之含量,較理想為1~20莫耳%。The content of the above α-olefin is preferably from 1 to 20 mol%.
若上述α-烯烴之含量小於1莫耳%,則所得之聚乙烯縮醛樹脂之特性與未經改質之聚乙烯縮醛樹脂相比無任何改變,若超過20莫耳%,則有時聚乙烯醇於水中之溶解性下降,故變得難以進行縮醛化反應,或者所形成之聚乙烯縮醛樹脂之疏水性變得過強,因而於有機溶劑中之溶解性下降。If the content of the above α-olefin is less than 1 mol%, the properties of the obtained polyvinyl acetal resin are not changed as compared with the unmodified polyethylene acetal resin, and if it exceeds 20 mol%, sometimes Since the solubility of polyvinyl alcohol in water is lowered, it becomes difficult to carry out an acetalization reaction, or the hydrophobicity of the formed polyvinyl acetal resin becomes too strong, and solubility in an organic solvent falls.
上述聚乙烯醇亦可於不損及本發明之效果之範圍內共聚合有其他乙烯性不飽和單體。The above polyvinyl alcohol may also be copolymerized with other ethylenically unsaturated monomers within a range that does not impair the effects of the present invention.
作為此種乙烯性不飽和單體,例如可列舉:丙烯酸、甲基丙烯酸、鄰苯二甲酸(酐)、順丁烯二酸(酐)、衣康酸(酐)、丙烯腈、甲基丙烯腈、丙烯醯胺、甲基丙烯醯胺、(3-丙烯醯胺-3-二甲基丙基)三甲基氯化銨、丙烯醯胺-2-甲基丙磺酸及其鈉鹽、乙基乙烯基醚、丁基乙烯基醚、N-乙烯基吡咯啶酮、氯乙烯、溴乙烯、氟乙烯、偏二氯乙烯、偏二氟乙烯、四氟乙烯、乙烯基磺酸鈉、烯丙基磺酸鈉等。Examples of such an ethylenically unsaturated monomer include acrylic acid, methacrylic acid, phthalic acid (anhydride), maleic acid (anhydride), itaconic acid (anhydride), acrylonitrile, and methacryl. Nitrile, acrylamide, methacrylamide, (3-propenylamine-3-dimethylpropyl)trimethylammonium chloride, acrylamide-2-methylpropanesulfonic acid and sodium salt thereof, Ethyl vinyl ether, butyl vinyl ether, N-vinyl pyrrolidone, vinyl chloride, vinyl bromide, vinyl fluoride, vinylidene chloride, vinylidene fluoride, tetrafluoroethylene, sodium vinyl sulfonate, olefin Sodium propyl sulfonate and the like.
又,亦可使用藉由在硫代乙酸、巰基丙酸等硫醇化合物之存在下,使乙酸乙烯酯等乙烯酯系單體與乙烯進行共聚合,並將其皂化而獲得之末端改質聚乙烯醇。Further, it is also possible to use a terminal modified polycondensation obtained by copolymerizing a vinyl ester monomer such as vinyl acetate with ethylene in the presence of a thiol compound such as thioacetic acid or mercaptopropionic acid, and saponifying it. Vinyl alcohol.
上述反應中所使用之醛並無特別限定,例如可列舉:甲醛(包括三聚甲醛)、乙醛(包括三聚乙醛)、丙醛、丁醛、戊醛、己醛、庚醛、2-乙基己醛、環己醛、糠醛、乙二醛、戊二醛、苯甲醛、2-甲基苯甲醛、3-甲基苯甲醛、4-甲基苯甲醛、對羥基醛、間羥基醛、苯基乙醛、苯基丙醛等。The aldehyde to be used in the above reaction is not particularly limited, and examples thereof include formaldehyde (including trioxane), acetaldehyde (including paraldehyde), propionaldehyde, butyraldehyde, valeraldehyde, hexanal, heptaldehyde, and 2 -ethylhexanal, cyclohexanal, furfural, glyoxal, glutaraldehyde, benzaldehyde, 2-methylbenzaldehyde, 3-methylbenzaldehyde, 4-methylbenzaldehyde, p-hydroxyaldehyde, m-hydroxyl Aldehyde, phenylacetaldehyde, phenylpropanal, and the like.
該些醛可單獨使用亦可併用兩種以上,適合的是使用乙醛及/或丁醛。These aldehydes may be used singly or in combination of two or more kinds, and it is suitable to use acetaldehyde and/or butyraldehyde.
上述聚乙烯縮醛樹脂可藉由如下方式而獲得:以溫水將聚乙烯醇樹脂溶解後,於酸觸媒之存在下以達到規定之縮醛化度的方式添加醛並使其反應後,進行水洗、中和、乾燥。The polyvinyl acetal resin can be obtained by dissolving a polyvinyl alcohol resin in warm water and then adding an aldehyde to a predetermined degree of acetalization in the presence of an acid catalyst, and then reacting the aldehyde. Wash, neutralize, and dry.
作為上述酸觸媒,並無特別規定,有機酸、無機酸均可使用,例如可列舉:乙酸、對甲苯磺酸、硝酸、硫酸、鹽酸等。The acid catalyst is not particularly limited, and any of an organic acid and an inorganic acid may be used. Examples thereof include acetic acid, p-toluenesulfonic acid, nitric acid, sulfuric acid, and hydrochloric acid.
又,作為中和所用之鹼,例如可列舉:氫氧化鈉、氫氧化鉀、氨、乙酸鈉、碳酸鈉、碳酸氫鈉、碳酸鉀等。Further, examples of the base to be used for the neutralization include sodium hydroxide, potassium hydroxide, ammonia, sodium acetate, sodium carbonate, sodium hydrogencarbonate, and potassium carbonate.
本發明中所用之聚乙烯縮醛樹脂之縮醛化度較佳為60~80莫耳%。若上述縮醛化度小於60莫耳%,則有時聚乙烯縮醛樹脂之氫鍵結性變得過強而無法獲得充分之網版印刷性。The degree of acetalization of the polyvinyl acetal resin used in the present invention is preferably from 60 to 80 mol%. When the degree of acetalization is less than 60 mol%, the hydrogen bonding property of the polyvinyl acetal resin may become too strong, and sufficient screen printing properties may not be obtained.
另一方面,上述縮醛化度超過80莫耳%之聚乙烯縮醛樹脂通常於工業上難以製造。(根據P. J. Flory之理論計算,最大縮醛化度較佳為81.6莫耳%。J. Am,Chem. Soc.,61,1518(1939))On the other hand, the above polyvinyl acetal resin having a degree of acetalization of more than 80 mol% is generally industrially difficult to manufacture. (The maximum degree of acetalization is preferably 81.6 mol% according to the theory of P. J. Flory. J. Am, Chem. Soc., 61, 1518 (1939))
本發明之無機微粒子分散糊中的上述選自由乙基纖維素、(甲基)丙烯酸樹脂及聚乙烯縮醛樹脂所組成之群中的至少一種之含量並無特別限定,較佳下限為5重量%,較佳上限為25重量%。若上述選自由乙基纖維素、(甲基)丙烯酸樹脂及聚乙烯縮醛樹脂所組成之群中的至少一種之含量小於5重量%,則有時所得之無機微粒子分散糊無法獲得充分之黏度,網版印刷性變差,而且,有時於印刷後之乾燥步驟中,因在烘箱內受到送風所導致之表面粗糙增大,由此燒結層之表面平滑性下降。若上述含量超過25重量%,則有時所得之無機微粒子分散糊之黏度、黏著力變得過高,網版印刷性變差。The content of at least one selected from the group consisting of ethyl cellulose, (meth)acrylic resin, and polyvinyl acetal resin in the inorganic fine particle-dispersed paste of the present invention is not particularly limited, and a preferred lower limit is 5 weights. %, a preferred upper limit is 25% by weight. When the content of at least one selected from the group consisting of ethyl cellulose, (meth)acrylic resin, and polyvinyl acetal resin is less than 5% by weight, the obtained inorganic fine particle-dispersed paste may not obtain sufficient viscosity. The screen printing property is deteriorated, and in some cases, in the drying step after printing, the surface roughness due to the air blowing in the oven is increased, whereby the surface smoothness of the sintered layer is lowered. When the content is more than 25% by weight, the viscosity and adhesion of the obtained inorganic fine particle-dispersed paste may become too high, and the screen printing property may be deteriorated.
本發明之無機微粒子分散糊含有具有1個以上之羥基,且於常溫下為固體,沸點低於300℃之有機化合物。The inorganic fine particle-dispersed paste of the present invention contains an organic compound having one or more hydroxyl groups and being solid at normal temperature and having a boiling point of lower than 300 °C.
上述有機化合物於常溫下為固體。藉由使上述有機化合物在常溫下為固體,所得之無機微粒子分散糊於印刷後之乾燥步驟中因在烘箱內受到送風所導致之表面粗糙可得到抑制,燒結層之表面平滑性優異。The above organic compound is a solid at normal temperature. By making the organic compound solid at normal temperature, the obtained inorganic fine particle-dispersed paste can be suppressed from being roughened by air blowing in an oven in the drying step after printing, and the surface smoothness of the sintered layer is excellent.
再者,雖上述有機化合物於常溫下為固體,但可藉由溶解於後述之有機溶劑中而獲得糊狀之無機微粒子分散糊。In addition, the organic compound is solid at normal temperature, but can be obtained by dissolving in an organic solvent to be described later to obtain a paste-like inorganic fine particle-dispersed paste.
再者,上述有機化合物與後述之有機溶劑為不同物質。Further, the above organic compound is different from the organic solvent described later.
藉由添加上述具有1個以上之羥基,且於常溫下為固體,沸點低於300℃之有機化合物而乾燥性提昇之機制可考慮如下。The mechanism for improving the drying property by adding the above-described organic compound having one or more hydroxyl groups and being solid at normal temperature and having a boiling point of lower than 300 ° C can be considered as follows.
添加至無機微粒子分散糊中之無機微粒子之表面為極性非常高之狀態,而具有吸引高極性之官能基的作用。於通常之不在無機微粒子分散糊中添加具有高極性之官能基的有機材料之情形時,溶劑中微粒子彼此凝聚而產生沈澱。The surface of the inorganic fine particles added to the inorganic fine particle-dispersed paste has a very high polarity and has a function of attracting a highly polar functional group. In the case where an organic material having a functional group having a high polarity is not normally added to the inorganic fine particle-dispersed paste, the fine particles in the solvent aggregate with each other to cause precipitation.
因此,若添加具有1個以上之羥基,且於常溫下為固體,沸點低於300℃之有機化合物,則該有機化合物於無機微粒子分散糊中與有機溶劑混合而形成為液狀,故而可優先吸附於無機微粒子之表面,而形成在乾燥條件下於無機微粒子之周圍可蒸發之層。Therefore, when an organic compound having one or more hydroxyl groups and having a solid at normal temperature and having a boiling point of less than 300 ° C is added, the organic compound is mixed with an organic solvent in an inorganic fine particle-dispersing paste to form a liquid, and thus it is preferred Adsorbed on the surface of the inorganic fine particles to form a layer which can be evaporated around the inorganic fine particles under dry conditions.
另一方面,由於選自由乙基纖維素、(甲基)丙烯酸樹脂及聚乙烯縮醛樹脂所組成之群中的至少一種黏合樹脂為高分子量之聚合物,故而藉由於乾燥條件下有機溶劑自無機微粒子分散糊表面逐漸乾燥,表面發生結皮,形成較薄之樹脂層。On the other hand, since at least one binder resin selected from the group consisting of ethyl cellulose, (meth)acrylic resin, and polyvinyl acetal resin is a high molecular weight polymer, the organic solvent is used under dry conditions. The surface of the inorganic fine particle-dispersed paste is gradually dried, and the surface is crusted to form a thin resin layer.
此種與乾燥相伴而形成之表面樹脂層非常不均勻,且依存於乾燥條件,若在送風條件下之強乾燥條件下則會形成更不均勻之層。因此,存在於結皮之樹脂層下的有機溶劑難以蒸發,而容易於塗膜表面產生凹凸。Such a surface resin layer formed in association with drying is very uneven, and depending on the drying conditions, a more uneven layer is formed under strong drying conditions under air blowing conditions. Therefore, the organic solvent existing under the resin layer of the crust is difficult to evaporate, and it is easy to cause irregularities on the surface of the coating film.
相對於此,於無機微粒子之表面形成層的上述有機化合物於乾燥條件下蒸發,而形成使內部之有機溶劑蒸發的窗口。因此,可減少因樹脂結皮所致的有機溶劑之乾燥不均。進而,即便於乾燥不充分之情形時,亦由於該有機化合物在常溫下為固體,故不易作為塑化劑而發揮作用,從而容易維持平滑性。On the other hand, the organic compound which forms a layer on the surface of the inorganic fine particles is evaporated under dry conditions to form a window for evaporating the internal organic solvent. Therefore, drying unevenness of the organic solvent due to resin crust can be reduced. Further, even when the drying is insufficient, the organic compound is solid at normal temperature, so that it does not easily function as a plasticizer, and it is easy to maintain smoothness.
上述有機化合物之沸點低於300℃。若上述有機化合物之沸點為300℃以上,則所得之無機微粒子分散糊於印刷後之乾燥步驟中之乾燥性下降,燒結層之表面平滑性下降。上述有機化合物較佳為沸點低於280℃,更佳為低於260℃。The above organic compound has a boiling point of less than 300 °C. When the boiling point of the organic compound is 300 ° C or more, the drying property of the obtained inorganic fine particle-dispersed paste in the drying step after printing is lowered, and the surface smoothness of the sintered layer is lowered. The above organic compound preferably has a boiling point of less than 280 ° C, more preferably less than 260 ° C.
又,上述有機化合物之沸點之下限並無特別限定,較佳為沸點為160℃以上。若上述有機化合物之沸點低於160℃,則所得之無機微粒子分散糊容易在印刷過程中乾燥,於用於長時間之連續印刷之情形時有時會發生不良狀況。再者,上述沸點係指常壓下之沸點。Further, the lower limit of the boiling point of the above organic compound is not particularly limited, but the boiling point is preferably 160 ° C or higher. When the boiling point of the above organic compound is less than 160 ° C, the obtained inorganic fine particle-dispersed paste is easily dried during the printing process, and may cause a problem in the case of continuous printing for a long period of time. Further, the above boiling point means the boiling point at normal pressure.
上述有機化合物具有1個以上之羥基。藉由具有1個以上之上述羥基,可提高所得之無機微粒子分散糊之儲存穩定性,又,藉由羥基與樹脂及有機溶劑之相互作用,可提高無機微粒子分散糊之黏度,從而可獲得適合於網版印刷等之黏度。The above organic compound has one or more hydroxyl groups. By having one or more of the above hydroxyl groups, the storage stability of the obtained inorganic fine particle-dispersed paste can be improved, and the viscosity of the inorganic fine particle-dispersed paste can be improved by the interaction of the hydroxyl group with the resin and the organic solvent, thereby obtaining a suitable viscosity. Viscosity in screen printing, etc.
上述有機化合物只要具有1個以上之羥基,且於常溫下為固體,沸點低於300℃則並無特別限定,較佳為由碳數為5以上且小於20之脂肪鏈構成之醇系有機化合物。The organic compound is not particularly limited as long as it has one or more hydroxyl groups and is solid at normal temperature, and has a boiling point of less than 300 ° C. It is preferably an alcohol-based organic compound composed of an aliphatic chain having a carbon number of 5 or more and less than 20. .
上述醇系有機化合物並無特別限定,例如可列舉:1,6-己二醇、1,8-辛二醇、1,10-癸二醇、肉豆蔻醇、鯨蠟醇、2,2-二甲基-1,3-丙二醇、2,2-二乙基-1,3-丙二醇、2-丁基-2-乙基-1,3-丙二醇、三羥甲基丙烷、季戊四醇等。The alcohol-based organic compound is not particularly limited, and examples thereof include 1,6-hexanediol, 1,8-octanediol, 1,10-decanediol, myristyl alcohol, cetyl alcohol, and 2,2- Dimethyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, trimethylolpropane, pentaerythritol, and the like.
其中,羥基相對於碳數之比例較高的2,2-二甲基-1,3-丙二醇、2,2-二乙基-1,3-丙二醇、2-丁基-2-乙基-1,3-丙二醇由於沸點為200℃左右,軟化點為120℃以上,故可適合地用作網版印刷中所使用之無機微粒子分散糊。Among them, 2,2-dimethyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-, which have a higher ratio of hydroxyl groups to carbon numbers Since 1,3-propanediol has a boiling point of about 200 ° C and a softening point of 120 ° C or more, it can be suitably used as an inorganic fine particle-dispersed paste used in screen printing.
本發明之無機微粒子分散糊中的上述有機化合物之含量並無特別限定,較佳下限為1重量%,較佳上限為30重量%。若上述有機化合物之含量小於1重量%,則有時所得之無機微粒子分散糊於印刷後之乾燥步驟中乾燥性下降,或因在烘箱內受到送風所導致之表面粗糙增大,或者產生因樹脂交聯所致之結皮現象,由此燒結層之表面平滑性下降。若上述有機化合物之含量超過30重量%,則有時所得之無機微粒子分散糊之儲存穩定性變差。The content of the above organic compound in the inorganic fine particle-dispersed paste of the present invention is not particularly limited, and a preferred lower limit is 1% by weight, and a preferred upper limit is 30% by weight. When the content of the above organic compound is less than 1% by weight, the obtained inorganic fine particle-dispersed paste may have a decrease in drying property in a drying step after printing, or an increase in surface roughness due to air blowing in an oven, or a resin due to a resin. The skinning phenomenon caused by crosslinking causes the surface smoothness of the sintered layer to decrease. When the content of the above organic compound exceeds 30% by weight, the storage stability of the obtained inorganic fine particle-dispersed paste may be deteriorated.
本發明之無機微粒子分散糊含有有機溶劑。The inorganic fine particle-dispersed paste of the present invention contains an organic solvent.
上述有機溶劑並無特別限定,例如可列舉:乙二醇乙醚、乙二醇單丁醚、乙二醇單乙醚乙酸酯、二乙二醇單乙醚、二乙二醇單甲醚、二乙二醇單異丁醚、三甲基戊二醇單異丁酸酯、丁基卡必醇、丁基卡必醇乙酸酯、Texanol、異佛爾酮、乳酸丁酯、鄰苯二甲酸二辛酯、己二酸二辛酯、苄醇、苯基丙二醇、甲酚、松脂醇、松脂醇乙酸酯、二氫松脂醇、二氫松脂醇乙酸酯、丙酮、甲基乙基酮、甲醇、乙醇、正丙醇、異丙醇、正丁醇、甲苯、二甲苯等。該等有機溶劑可單獨使用,亦可併用兩種以上。The organic solvent is not particularly limited, and examples thereof include ethylene glycol diethyl ether, ethylene glycol monobutyl ether, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, and diethyl ether. Glycol monoisobutyl ether, trimethyl pentanediol monoisobutyrate, butyl carbitol, butyl carbitol acetate, Texanol, isophorone, butyl lactate, phthalic acid Octyl ester, dioctyl adipate, benzyl alcohol, phenylpropanediol, cresol, rosinol, rosinol acetate, dihydroterpineol, dihydroterpineol acetate, acetone, methyl ethyl ketone, Methanol, ethanol, n-propanol, isopropanol, n-butanol, toluene, xylene, and the like. These organic solvents may be used singly or in combination of two or more.
本發明之無機微粒子分散糊中的上述有機溶劑之含量並無特別限定,較佳下限為10重量%,較佳上限為60重量%。若上述有機溶劑之含量小於10重量%,則有時所得之無機微粒子分散糊之黏度、黏著力變得過高而網版印刷性變差。若上述有機溶劑之含量超過60重量%,則有時所得之無機微粒子分散糊無法獲得充分之黏度而網版印刷性變差,又,有時於印刷後之乾燥步驟中乾燥性下降,或因在烘箱內受到送風所導致之表面粗糙增大,由此燒結層之表面平滑性下降。The content of the above organic solvent in the inorganic fine particle-dispersed paste of the present invention is not particularly limited, and a preferred lower limit is 10% by weight, and a preferred upper limit is 60% by weight. When the content of the organic solvent is less than 10% by weight, the viscosity and adhesive force of the obtained inorganic fine particle-dispersed paste may become too high, and the screen printing property may be deteriorated. When the content of the organic solvent exceeds 60% by weight, the obtained inorganic fine particle-dispersed paste may not have sufficient viscosity, and the screen printing property may be deteriorated, and the drying property may be lowered in the drying step after printing, or The surface roughness caused by the air supply in the oven is increased, whereby the surface smoothness of the sintered layer is lowered.
再者,於對本發明之無機微粒子分散糊進行煅燒之情形時,較佳為於已將上述有機溶劑或有機化合物乾燥之狀態下進行煅燒。若上述有機溶劑或有機化合物未充分乾燥而於有機溶劑或有機化合物殘留於內部之狀態下進行煅燒,則黏合樹脂熱分解所生成之煤灰容易吸附於微粒子表面,故而與完全乾燥之情形相比較,有時碳殘渣容易增多。In the case where the inorganic fine particle-dispersed paste of the present invention is calcined, it is preferred to carry out calcination in a state where the organic solvent or the organic compound has been dried. When the organic solvent or the organic compound is not sufficiently dried and is calcined in an organic solvent or an organic compound, the coal ash generated by thermal decomposition of the binder resin is easily adsorbed on the surface of the fine particles, so that it is compared with the case of completely drying. Sometimes carbon residue is likely to increase.
本發明之無機微粒子分散糊含有無機微粒子。The inorganic fine particle-dispersed paste of the present invention contains inorganic fine particles.
上述無機微粒子並無特別限定,例如可列舉:玻璃粉末、陶瓷粉末、螢光體微粒子、矽氧化物等、金屬微粒子、金屬氧化物微粒子等。The inorganic fine particles are not particularly limited, and examples thereof include glass powder, ceramic powder, phosphor fine particles, cerium oxide, metal fine particles, and metal oxide fine particles.
上述玻璃粉末並無特別限定,例如可列舉:氧化鉍玻璃、矽酸鹽玻璃、鉛玻璃、鋅玻璃、硼玻璃等之玻璃粉末,或CaO-Al2 O3 -SiO2 系、MgO-Al2 O3 -SiO2 系、LiO2 -Al2 O3 -SiO2 系等各種矽氧化物之玻璃粉末等。The glass powder is not particularly limited, and examples thereof include glass powders such as cerium oxide glass, strontium silicate glass, lead glass, zinc glass, and borosilicate, or CaO-Al 2 O 3 —SiO 2 system, and MgO-Al 2 . A glass powder of various cerium oxides such as O 3 -SiO 2 -based or LiO 2 -Al 2 O 3 -SiO 2 -based.
又,作為上述玻璃粉末,亦可使用:PbO-B2 O3 -SiO2 混合物、BaO-ZnO-B2 O3 -SiO2 混合物、ZnO-Bi2 O3 -B2 O3 -SiO2 混合物、Bi2 O3 -B2 O3 -BaO-CuO混合物、Bi2 O3 -ZnO-B2 O3 -Al2 O3 -SrO混合物、ZnO-Bi2 O3 -B2 O3 混合物、Bi2 O3 -SiO2 混合物、P2 O5 -Na2 O-CaO-BaO-Al2 O3 -B2 O3 混合物、P2 O5 -SnO混合物、P2 O5 -SnO-B2 O3 混合物、P2 O5 -SnO-SiO2 混合物、CuO-P2 O5 -RO混合物、SiO2 -B2 O3 -ZnO-Na2 O-Li2 O-NaF-V2 O5 混合物、P2 O5 -ZnO-SnO-R2 O-RO混合物、B2 O3 -SiO2 -ZnO混合物、B2 O3 -SiO2 -Al2 O3 -ZrO2 混合物、SiO2 -B2 O3 -ZnO-R2 O-RO混合物、SiO2 -B2 O3 -Al2 O3 -RO-R2 O混合物、SrO-ZnO-P2 O5 混合物、SrO-ZnO-P2 O5 混合物、BaO-ZnO-B2 O3 -SiO2 混合物等之玻璃粉末。再者,R為選自由Zn、Ba、Ca、Mg、Sr、Sn、Ni、Fe及Mn所組成之群中的元素。Further, as the glass powder, a PbO-B 2 O 3 -SiO 2 mixture, a BaO-ZnO-B 2 O 3 -SiO 2 mixture, and a ZnO-Bi 2 O 3 -B 2 O 3 -SiO 2 mixture may also be used. , Bi 2 O 3 -B 2 O 3 -BaO-CuO mixture, Bi 2 O 3 -ZnO-B 2 O 3 -Al 2 O 3 -SrO mixture, ZnO-Bi 2 O 3 -B 2 O 3 mixture, Bi 2 O 3 -SiO 2 mixture, P 2 O 5 -Na 2 O-CaO-BaO-Al 2 O 3 -B 2 O 3 mixture, P 2 O 5 -SnO mixture, P 2 O 5 -SnO-B 2 O 3 mixture, P 2 O 5 -SnO-SiO 2 mixture, CuO-P 2 O 5 -RO mixture, SiO 2 -B 2 O 3 -ZnO-Na 2 O-Li 2 O-NaF-V 2 O 5 mixture, P 2 O 5 -ZnO-SnO-R 2 O-RO mixture, B 2 O 3 -SiO 2 -ZnO mixture, B 2 O 3 -SiO 2 -Al 2 O 3 -ZrO 2 mixture, SiO 2 -B 2 O 3 -ZnO-R 2 O-RO mixture, SiO 2 -B 2 O 3 -Al 2 O 3 -RO-R 2 O mixture, SrO-ZnO-P 2 O 5 mixture, SrO-ZnO-P 2 O 5 mixture A glass powder such as a BaO-ZnO-B 2 O 3 -SiO 2 mixture. Further, R is an element selected from the group consisting of Zn, Ba, Ca, Mg, Sr, Sn, Ni, Fe, and Mn.
特佳為PbO-B2 O3 -SiO2 混合物之玻璃粉末、或者不含鉛之BaO-ZnO-B2 O3 -SiO2 混合物或ZnO-Bi2 O3 -B2 O3 -SiO2 混合物等之無鉛玻璃粉末。Particularly preferred is a glass powder of a PbO-B 2 O 3 -SiO 2 mixture, or a lead-free BaO-ZnO-B 2 O 3 -SiO 2 mixture or a ZnO-Bi 2 O 3 -B 2 O 3 -SiO 2 mixture Lead-free glass powder.
上述陶瓷粉末並無特別限定,例如可列舉:氧化鋁、氧化鋯、氧化鈦、鈦酸鋇、氮氧化鋁、氮化矽、氮化硼等。The ceramic powder is not particularly limited, and examples thereof include alumina, zirconia, titania, barium titanate, aluminum oxynitride, tantalum nitride, and boron nitride.
又,亦可適合地使用透明電極材料中所使用之奈米ITO(Indium Tin Oxide,氧化銦錫)或色素增感太陽電池中所使用之奈米氧化鈦等。Further, nano ITO (Indium Tin Oxide) used in a transparent electrode material or nano titanium oxide used in a dye-sensitized solar cell can be suitably used.
上述螢光體微粒子並無特別限定,例如可列舉:BaMgAl10 O17 :Eu、Zn2 SiO4 :Mn、(Y,Gd)BO3 :Eu等。The phosphor fine particles are not particularly limited, and examples thereof include BaMgAl 10 O 17 :Eu, Zn 2 SiO 4 :Mn, and (Y,Gd)BO 3 :Eu.
上述金屬微粒子並無特別限定,例如可列舉由鎳、鈀、鉑、金、銀、鋁、鎢或該等之合金等所構成之粉末等。The metal fine particles are not particularly limited, and examples thereof include powders composed of nickel, palladium, platinum, gold, silver, aluminum, tungsten, or the like.
又,亦可適合地使用與羧基、胺基、醯胺基等之吸附特性良好而容易被氧化之銅或鐵等金屬。該等金屬粉末可單獨使用,亦可併用兩種以上。Further, a metal such as copper or iron which is excellent in adsorption characteristics such as a carboxyl group, an amine group or a guanamine group and which is easily oxidized can be suitably used. These metal powders may be used singly or in combination of two or more.
本發明之無機微粒子分散糊中的上述無機微粒子之含量並無特別限定,較佳下限為20重量%,較佳上限為90重量%。若上述無機微粒子之含量小於20重量%,則有時所得之無機微粒子分散糊無法獲得充分之黏度,網版印刷性變差,又,有時於印刷後之乾燥步驟中因在烘箱內受到送風所導致之表面粗糙增大,由此燒結層之表面平滑性下降。若上述無機微粒子之含量超過90重量%,則有時所得之無機微粒子分散糊之黏度變得過高,網版印刷性變差。The content of the inorganic fine particles in the inorganic fine particle-dispersed paste of the present invention is not particularly limited, and a preferred lower limit is 20% by weight, and a preferred upper limit is 90% by weight. When the content of the inorganic fine particles is less than 20% by weight, the obtained inorganic fine particle-dispersed paste may not have sufficient viscosity, and the screen printing property may be deteriorated, and in some cases, it may be blown in the oven in the drying step after printing. The resulting surface roughness is increased, whereby the surface smoothness of the sintered layer is lowered. When the content of the inorganic fine particles exceeds 90% by weight, the viscosity of the obtained inorganic fine particle-dispersed paste may become too high, and the screen printing property may be deteriorated.
為了使上述有機化合物與其他材料之相容性穩定,本發明之無機微粒子分散糊較佳為含有界面活性劑。上述界面活性劑並無特別限定,較佳為非離子系界面活性劑。In order to stabilize the compatibility of the above organic compound with other materials, the inorganic fine particle-dispersed paste of the present invention preferably contains a surfactant. The surfactant is not particularly limited, and is preferably a nonionic surfactant.
本發明之無機微粒子分散糊中的上述非離子系界面活性劑之含量並無特別限定,較佳上限為5重量%。雖然上述非離子系界面活性劑之熱分解性良好,但若其含量超過5重量%,則有時無機微粒子分散糊之熱分解性下降。The content of the nonionic surfactant in the inorganic fine particle dispersion paste of the present invention is not particularly limited, and a preferred upper limit is 5% by weight. Although the thermal decomposition property of the nonionic surfactant is good, when the content exceeds 5% by weight, the thermal decomposition property of the inorganic fine particle dispersion paste may be lowered.
製作本發明之無機微粒子分散糊之方法並無特別限定,可列舉先前公知之攪拌方法,具體而言,例如可列舉:利用三輥研磨機等,對上述選自由乙基纖維素、(甲基)丙烯酸樹脂及聚乙烯縮醛樹脂所組成之群中的至少一種,上述有機化合物,上述有機溶劑,上述無機微粒子及視需要添加之其他成分進行攪拌之方法等。The method for producing the inorganic fine particle-dispersed paste of the present invention is not particularly limited, and a conventionally known stirring method can be used. Specifically, for example, a three-roll mill or the like is selected from the group consisting of ethyl cellulose and (methyl). And at least one of the group consisting of an acrylic resin and a polyvinyl acetal resin, the organic compound, the organic solvent, the inorganic fine particles and other components added as needed, and the like.
本發明之無機微粒子分散糊於印刷後之乾燥步驟中可良好地乾燥,並且因在烘箱內受到送風所導致之表面粗糙得到抑制,而且可防止乾燥時之結皮現象之不良影響,故可形成表面平滑性優異之燒結層。因此,例如適合用作使用玻璃粉末作為無機微粒子時之玻璃糊、使用陶瓷粉末作為無機微粒子時之陶瓷糊、使用鋁等金屬或導電性粉末作為無機微粒子時之導電糊。The inorganic fine particle-dispersed paste of the present invention can be well dried in the drying step after printing, and the surface roughness caused by the air supply in the oven is suppressed, and the adverse effect of the skinning phenomenon during drying can be prevented, so that it can be formed. A sintered layer excellent in surface smoothness. For this reason, for example, it is suitably used as a glass paste when glass powder is used as the inorganic fine particles, a ceramic paste when ceramic powder is used as the inorganic fine particles, or a conductive paste when a metal such as aluminum or a conductive powder is used as the inorganic fine particles.
其中,使用玻璃粉末作為無機微粒子時之玻璃糊適合用於形成電漿顯示面板之介電質層等。使用此種玻璃糊而製造之玻璃介電體亦為本發明之一。Among them, the glass paste when glass powder is used as the inorganic fine particles is suitable for forming a dielectric layer of a plasma display panel or the like. A glass dielectric manufactured using such a glass paste is also one of the inventions.
進而,本發明之無機微粒子分散糊具有可防止乾燥時之結皮現象,且可迅速乾燥之特徵。因此,亦可適合地用於若使用先前之樹脂糊則乾燥時會流動而難以維持形狀之構件。再者,如此般無法維持形狀之狀態亦稱為「塌陷」。Further, the inorganic fine particle-dispersed paste of the present invention has a feature of preventing skinning during drying and drying quickly. Therefore, it can also be suitably used for a member which flows when it is dried when the resin paste is used, and it is difficult to maintain the shape. Moreover, the state in which the shape cannot be maintained in this way is also called "collapse".
例如,於使用先前之樹脂糊來製造電漿顯示器之背面板中的單元內之螢光體、或太陽電池單元之表面電極等時,乾燥時產生塌陷而導致於印刷後無法維持高度,但藉由使用本發明之無機微粒子分散糊,在乾燥過程中可於產生塌陷而流動得高度較低之前將有機溶劑去除,因而本發明之無機微粒子分散糊亦可適合地用作平板顯示器之材料。For example, when a phosphor in a unit in a back panel of a plasma display or a surface electrode of a solar cell unit is manufactured using a conventional resin paste, collapse occurs during drying, and the height cannot be maintained after printing, but The inorganic fine particle-dispersed paste of the present invention can also be suitably used as a material for a flat panel display by using the inorganic fine particle-dispersed paste of the present invention to remove the organic solvent before the flow is lowered to a low level during the drying process.
使用本發明之無機微粒子分散糊而製造之平板顯示器亦為本發明之一。A flat panel display manufactured by using the inorganic fine particle dispersion paste of the present invention is also one of the inventions.
根據本發明,可提供一種能夠形成表面平滑性優異之燒結層之無機微粒子分散糊。According to the present invention, it is possible to provide an inorganic fine particle-dispersed paste capable of forming a sintered layer excellent in surface smoothness.
以下揭示實施例來對本發明加以更詳細之說明,但本發明並非僅限定於該等實施例。The invention is further illustrated by the following examples, but the invention is not limited to the examples.
(聚合例1)(polymerization example 1)
於具備攪拌機、冷凝器、溫度計、油浴及氮氣導入口之2 L可分離式燒瓶中,將甲基丙烯酸異丁酯(IBMA)100重量份、及作為有機溶劑之Texanol 100重量份混合,而獲得單體混合液。In a 2 L separable flask equipped with a stirrer, a condenser, a thermometer, an oil bath, and a nitrogen gas inlet, 100 parts by weight of isobutyl methacrylate (IBMA) and 100 parts by weight of Texanol as an organic solvent were mixed. A monomer mixture is obtained.
使用氮氣使所得之單體混合液起泡20分鐘,藉此將溶氧去除,然後以氮氣對可分離式燒瓶體系內進行置換,一邊攪拌一邊升溫直至油槽達到130℃為止。添加將作為聚合起始劑之2,2'-偶氮雙[2-甲基-N-(2-羥基乙基)丙醯胺]分散於Texanol中而成之溶液。又,於聚合過程中數次添加含有聚合起始劑之Texanol溶液,合計添加相對於單體100重量份而為1.5重量份之聚合起始劑。The obtained monomer mixture was bubbled with nitrogen for 20 minutes to remove dissolved oxygen, and then the inside of the separable flask system was replaced with nitrogen, and the temperature was raised while stirring until the oil bath reached 130 °C. A solution obtained by dispersing 2,2'-azobis[2-methyl-N-(2-hydroxyethyl)propanamide] as a polymerization initiator in Texanol was added. Further, a Texanol solution containing a polymerization initiator was added several times during the polymerization, and a total of 1.5 parts by weight of a polymerization initiator was added to 100 parts by weight of the monomer.
自聚合開始起經過7小時後,將反應液冷卻至室溫而使聚合結束。藉此獲得於分子末端具有醯胺基之(甲基)丙烯酸樹脂(Poly(IBMA))之Texanol溶液。After 7 hours from the start of the polymerization, the reaction liquid was cooled to room temperature to complete the polymerization. Thus, a Texanol solution of a (meth)acrylic resin (Poly (IBMA)) having a mercaptoamine group at the molecular end was obtained.
對於所得之聚合物,使用Column LF-804(昭和電工公司製造)作為管柱進行凝膠滲透層析法分析,結果由聚苯乙烯換算所得之重量平均分子量為4萬。The obtained polymer was analyzed by gel permeation chromatography using Column LF-804 (manufactured by Showa Denko Co., Ltd.) as a column, and the weight average molecular weight converted from polystyrene was 40,000.
(聚合例2)(polymerization example 2)
於具備攪拌機、冷凝器、溫度計、油浴及氮氣導入口之2 L可分離式燒瓶中,將甲基丙烯酸丁酯與甲基丙烯酸甲酯之1:1混合液(BMA/MMA)100重量份、及作為有機溶劑之Texanol 100重量份混合,而獲得單體混合液。100 parts by weight of a 1:1 mixture of butyl methacrylate and methyl methacrylate (BMA/MMA) in a 2 L separable flask equipped with a stirrer, condenser, thermometer, oil bath and nitrogen inlet. And 100 parts by weight of Texanol as an organic solvent were mixed to obtain a monomer mixture.
使用氮氣使所得之單體混合液起泡20分鐘,藉此將溶氧去除,然後以氮氣對可分離式燒瓶體系內進行置換,一邊攪拌一邊升溫直至油槽達到130℃為止。添加將作為聚合起始劑之2,2'-偶氮雙[2-甲基-N-(2-羥基乙基)丙醯胺]分散於Texanol中而成之溶液。又,於聚合過程中數次添加含有聚合起始劑之Texanol溶液,合計添加相對於單體100重量份而為1.5重量份之聚合起始劑。The obtained monomer mixture was bubbled with nitrogen for 20 minutes to remove dissolved oxygen, and then the inside of the separable flask system was replaced with nitrogen, and the temperature was raised while stirring until the oil bath reached 130 °C. A solution obtained by dispersing 2,2'-azobis[2-methyl-N-(2-hydroxyethyl)propanamide] as a polymerization initiator in Texanol was added. Further, a Texanol solution containing a polymerization initiator was added several times during the polymerization, and a total of 1.5 parts by weight of a polymerization initiator was added to 100 parts by weight of the monomer.
自聚合開始起經過7小時後,將反應液冷卻至室溫而使聚合結束。藉此獲得於分子末端具有醯胺基之(甲基)丙烯酸樹脂(Poly(BMA/MMA))之Texanol溶液。After 7 hours from the start of the polymerization, the reaction liquid was cooled to room temperature to complete the polymerization. Thus, a Texanol solution of a (meth)acrylic resin (Poly (BMA/MMA)) having a mercaptoamine group at the molecular end was obtained.
對於所得之聚合物,使用Column LF-804(昭和電工公司製造)作為管柱進行凝膠滲透層析法分析,結果由聚苯乙烯換算所得之重量平均分子量為4萬。The obtained polymer was analyzed by gel permeation chromatography using Column LF-804 (manufactured by Showa Denko Co., Ltd.) as a column, and the weight average molecular weight converted from polystyrene was 40,000.
(聚合例3)(polymerization example 3)
於具備攪拌機、冷凝器、溫度計、油浴及氮氣導入口之2 L可分離式燒瓶中,將甲基丙烯酸丁酯與甲基丙烯酸羥基乙酯之混合液(BMA/HEMA=9/1)100重量份、及作為有機溶劑之松脂醇100重量份混合,而獲得單體混合液。A mixture of butyl methacrylate and hydroxyethyl methacrylate (BMA/HEMA=9/1) 100 in a 2 L separable flask equipped with a stirrer, condenser, thermometer, oil bath and nitrogen inlet. The monomer mixture was obtained by mixing in parts by weight and 100 parts by weight of rosinol as an organic solvent.
使用氮氣使所得之單體混合液起泡20分鐘,藉此將溶氧去除,然後以氮氣對可分離式燒瓶體系內進行置換,一邊攪拌一邊升溫直至油槽達到130℃為止。添加將作為聚合起始劑之偶氮雙異丁腈分散於松脂醇中而成之溶液。又,於聚合過程中數次添加含有聚合起始劑之松脂醇溶液,合計添加相對於單體100重量份而為0.8重量份之聚合起始劑。The obtained monomer mixture was bubbled with nitrogen for 20 minutes to remove dissolved oxygen, and then the inside of the separable flask system was replaced with nitrogen, and the temperature was raised while stirring until the oil bath reached 130 °C. A solution obtained by dispersing azobisisobutyronitrile as a polymerization initiator in rosin alcohol was added. Further, a rosin alcohol solution containing a polymerization initiator was added several times during the polymerization, and a polymerization initiator was added in an amount of 0.8 part by weight based on 100 parts by weight of the monomer.
自聚合開始起經過7小時後,將反應液冷卻至室溫而使聚合結束。獲得具有異丁腈基的(甲基)丙烯酸樹脂(Poly(BMA/HEMA))之松脂醇溶液。After 7 hours from the start of the polymerization, the reaction liquid was cooled to room temperature to complete the polymerization. A rosin alcohol solution of a (meth)acrylic resin (Poly (BMA/HEMA)) having an isobutyronitrile group was obtained.
對於所得之聚合物,使用Column LF-804(昭和電工公司製造)作為管柱進行凝膠滲透層析法分析,結果由聚苯乙烯換算所得之重量平均分子量為14萬。The obtained polymer was analyzed by gel permeation chromatography using Column LF-804 (manufactured by Showa Denko Co., Ltd.) as a column, and the weight average molecular weight obtained by polystyrene conversion was 140,000.
(聚合例4)(polymerization example 4)
於具備攪拌機、冷凝器、溫度計、油浴及氮氣導入口之2 L可分離式燒瓶中,將甲基丙烯酸丁酯與甲基丙烯酸甲酯及甲基丙烯酸羥基乙酯之混合液(BMA/MMA/HEMA=4/4/2)100重量份、及作為有機溶劑的松脂醇100重量份混合,而獲得單體混合液。Mixture of butyl methacrylate with methyl methacrylate and hydroxyethyl methacrylate in a 2 L separable flask equipped with a stirrer, condenser, thermometer, oil bath and nitrogen inlet (BMA/MMA) /HEMA = 4 / 4 / 2) 100 parts by weight and 100 parts by weight of rosin alcohol as an organic solvent were mixed to obtain a monomer mixture.
使用氮氣使所得之單體混合液起泡20分鐘,藉此將溶氧去除,然後以氮氣對可分離式燒瓶體系內進行置換,一邊攪拌一邊升溫直至油槽達到130℃為止。添加將作為聚合起始劑之偶氮雙異丁腈分散於松脂醇中而成之溶液。又,於聚合過程中數次添加含有聚合起始劑之松脂醇溶液,合計添加相對於單體100重量份而為1.5重量份之聚合起始劑。The obtained monomer mixture was bubbled with nitrogen for 20 minutes to remove dissolved oxygen, and then the inside of the separable flask system was replaced with nitrogen, and the temperature was raised while stirring until the oil bath reached 130 °C. A solution obtained by dispersing azobisisobutyronitrile as a polymerization initiator in rosin alcohol was added. Further, a rosin alcohol solution containing a polymerization initiator was added several times during the polymerization, and a total of 1.5 parts by weight of a polymerization initiator was added to 100 parts by weight of the monomer.
自聚合開始起經過7小時後,將反應液冷卻至室溫而使聚合結束。藉此獲得於分子末端具有醯胺基之(甲基)丙烯酸樹脂(Poly(BMA/MMA/HEMA))之松脂醇溶液。對於所得之聚合物,使用Column LF-804(昭和電工公司製造)作為管柱進行凝膠滲透層析法分析,結果由聚苯乙烯換算所得之重量平均分子量為5萬。After 7 hours from the start of the polymerization, the reaction liquid was cooled to room temperature to complete the polymerization. Thereby, a rosin alcohol solution of a (meth)acrylic resin (Poly (BMA/MMA/HEMA)) having a mercaptoamine group at the molecular end was obtained. The obtained polymer was analyzed by gel permeation chromatography using Column LF-804 (manufactured by Showa Denko Co., Ltd.) as a column, and the weight average molecular weight converted from polystyrene was 50,000.
(聚合例5)(polymerization example 5)
於具備攪拌機、冷凝器、溫度計、熱水浴及氮氣導入口之2 L可分離式燒瓶中,將甲基丙烯酸環己酯與甲基丙烯酸甲酯及甲基丙烯酸羥基乙酯之混合液(CHMA/MMA/HEMA=4/5/1)100重量份、作為鏈轉移劑之巰基丙二醇0.2重量份、及作為有機溶劑之松脂醇100重量份混合,而獲得單體混合液。Mixture of cyclohexyl methacrylate with methyl methacrylate and hydroxyethyl methacrylate in a 2 L separable flask equipped with a stirrer, condenser, thermometer, hot water bath and nitrogen inlet (CHMA) /MMA/HEMA=4/5/1) 100 parts by weight, 0.2 parts by weight of mercaptopropanediol as a chain transfer agent, and 100 parts by weight of rosinol as an organic solvent were mixed to obtain a monomer mixture.
使用氮氣使所得之單體混合液起泡20分鐘,藉此將溶氧去除,然後以氮氣對可分離式燒瓶體系內進行置換,一邊攪拌一邊升溫直至熱水槽沸騰為止。添加0.1重量份之作為聚合起始劑之有機氧化物聚合觸媒(Peroyl 355,日油公司製造),並於聚合過程中數次添加聚合起始劑,合計添加相對於單體100重量份而合計為1.5重量份之聚合起始劑。The obtained monomer mixture was bubbled with nitrogen for 20 minutes to remove dissolved oxygen, and then the inside of the separable flask system was replaced with nitrogen, and the mixture was heated while stirring until the hot water tank boiled. 0.1 part by weight of an organic oxide polymerization catalyst (Peroyl 355, manufactured by Nippon Oil Co., Ltd.) as a polymerization initiator was added, and a polymerization initiator was added several times during the polymerization, and a total of 100 parts by weight relative to the monomer was added. The total amount is 1.5 parts by weight of a polymerization initiator.
自聚合開始起經過7小時後,將反應液冷卻至室溫而使聚合結束。藉此獲得於分子末端具有羥基之(甲基)丙烯酸樹脂(Poly(CHMA/MMA/HEMA))之松脂醇溶液。對於所得之聚合物,使用Column LF-804(昭和電工公司製造)作為管柱進行凝膠滲透層析法分析,結果由聚苯乙烯換算所得之重量平均分子量為5萬。After 7 hours from the start of the polymerization, the reaction liquid was cooled to room temperature to complete the polymerization. Thereby, a rosin alcohol solution of a (meth)acrylic resin (Poly(CHMA/MMA/HEMA)) having a hydroxyl group at the molecular end was obtained. The obtained polymer was analyzed by gel permeation chromatography using Column LF-804 (manufactured by Showa Denko Co., Ltd.) as a column, and the weight average molecular weight converted from polystyrene was 50,000.
(聚合例6)(polymerization example 6)
代替聚合例5中之松脂醇而使用Texanol,與聚合例5同樣地獲得於分子末端具有羥基之(甲基)丙烯酸樹脂(Poly(CHMA/MMA/HEMA))之Texanol溶液。對於所得之聚合物,使用Column LF-804(昭和電工公司製造)作為管柱進行凝膠滲透層析法分析,結果由聚苯乙烯換算所得之重量平均分子量為8萬。A Texanol solution of a (meth)acrylic resin (Poly (CHMA/MMA/HEMA)) having a hydroxyl group at the molecular terminal was obtained in the same manner as in Polymerization Example 5 except that Texanol was used instead of the rosin alcohol in the polymerization example 5. The obtained polymer was analyzed by gel permeation chromatography using Column LF-804 (manufactured by Showa Denko Co., Ltd.) as a column, and the weight average molecular weight obtained by polystyrene conversion was 80,000.
(實施例1)(Example 1)
使乙基纖維素STD4溶解於松脂醇中。對該松脂醇溶液,以達到表1所示之組成比的方式添加作為有機化合物之1,6-己二醇,而獲得媒劑組成物。Ethylcellulose STD4 was dissolved in rosinol. To the rosin solution, 1,6-hexanediol as an organic compound was added so as to have a composition ratio shown in Table 1, to obtain a vehicle composition.
對所得之媒劑組成物,以達到表1所示之組成比的方式添加作為非離子系界面活性劑之BL-4.2(Nikko Chemical公司製造)、及作為無機微粒子之平均粒徑為2.0 μm之玻璃微粒子(含有32.5%之SiO2 、20.5%之B2 O3 、18%之ZnO、10%之Al2 O3 、3.5%之BaO、9%之Li2 O、6%之Na2 O及0.5%之SnO2 )後,使用高速攪拌裝置進行充分混練,利用三輥研磨機進行處理直至變均勻為止,而製作無機微粒子分散糊。The obtained vehicle composition was added to BL-4.2 (manufactured by Nikko Chemical Co., Ltd.) as a nonionic surfactant, and the average particle diameter as inorganic fine particles was 2.0 μm so as to achieve the composition ratio shown in Table 1. Glass microparticles (containing 32.5% SiO 2 , 20.5% B 2 O 3 , 18% ZnO, 10% Al 2 O 3 , 3.5% BaO, 9% Li 2 O, 6% Na 2 O and After 0.5% of SnO 2 ), the mixture was thoroughly kneaded by a high-speed stirring device, and treated by a three-roll mill until uniformity was obtained to prepare an inorganic fine particle-dispersed paste.
(實施例2)(Example 2)
代替乙基纖維素STD4而使用乙基纖維素STD45,使用肉豆蔻醇代替1,6-己二醇作為有機化合物,且變更為表1所示之組成比,除此以外,與實施例1同樣地製作無機微粒子分散糊。In the same manner as in Example 1, except that ethyl cellulose STD45 was used instead of ethyl cellulose STD45, and myristyl alcohol was used as the organic compound instead of 1,6-hexanediol, and the composition ratio shown in Table 1 was changed. An inorganic fine particle dispersion paste was prepared.
(實施例3)(Example 3)
代替乙基纖維素STD4之松脂醇溶液而使用聚合例1中獲得之(甲基)丙烯酸樹脂(Poly(IBMA))之Texanol溶液,且變更為表1所示之組成比,除此以外,與實施例1同樣地製作無機微粒子分散糊。A Texanol solution of (meth)acrylic resin (Poly (IBMA)) obtained in Polymerization Example 1 was used instead of the rosin alcohol solution of ethyl cellulose STD4, and was changed to the composition ratio shown in Table 1, and In the same manner as in Example 1, an inorganic fine particle-dispersed paste was produced.
(實施例4)(Example 4)
代替乙基纖維素STD4之松脂醇溶液而使用聚合例2中獲得之(甲基)丙烯酸樹脂(Poly(BMA/MMA))之Texanol溶液,且變更為表1所示之組成比,除此以外,與實施例1同樣地製作無機微粒子分散糊。A Texanol solution of (meth)acrylic resin (Poly (BMA/MMA)) obtained in Polymerization Example 2 was used instead of the rosin alcohol solution of ethyl cellulose STD4, and was changed to the composition ratio shown in Table 1, except In the same manner as in Example 1, an inorganic fine particle-dispersed paste was produced.
(實施例5)(Example 5)
(聚乙烯縮醛樹脂之合成)(Synthesis of Polyvinyl Acetal Resin)
將聚合度為1700、皂化度為98莫耳%之聚乙烯醇193 g添加至純水2900 g中,於90℃之溫度下攪拌約2小時而使其溶解。193 g of polyvinyl alcohol having a degree of polymerization of 1700 and a degree of saponification of 98 mol% was added to 2900 g of pure water, and the mixture was stirred at a temperature of 90 ° C for about 2 hours to be dissolved.
將該溶液冷卻至40℃,於其中添加濃度為35重量%之鹽酸20 g及正丁醛145 g,將液溫下降至15℃,並保持該溫度而進行縮醛化反應,使反應產物析出。The solution was cooled to 40 ° C, 20 g of hydrochloric acid having a concentration of 35% by weight and 145 g of n-butyraldehyde were added thereto, and the temperature of the liquid was lowered to 15 ° C, and the temperature was maintained to carry out an acetalization reaction to precipitate a reaction product. .
其後,使液溫為40℃並保持3小時而使反應結束,藉由常規方法經過中和、水洗及乾燥,而獲得聚乙烯縮醛樹脂之白色粉末。Thereafter, the liquid temperature was adjusted to 40 ° C for 3 hours to complete the reaction, and the mixture was neutralized, washed with water and dried by a usual method to obtain a white powder of a polyvinyl acetal resin.
使所得之聚乙烯縮醛樹脂溶解於DMSO-d6 (二甲基亞碸)中,使用13 C-NMR(核磁共振光譜)測定縮醛化度,結果縮醛化度為78莫耳%。The obtained polyvinyl acetal resin was dissolved in DMSO-d 6 (dimethylammonium), and the degree of acetalization was measured by 13 C-NMR (nuclear magnetic resonance spectroscopy), and the degree of acetalization was 78 mol%.
將所得之聚乙烯縮丁醛樹脂5重量份添加至甲苯22重量份與乙醇11重量份之混合溶劑中,攪拌溶解,進而以達到表1所記載之組成比的方式添加作為塑化劑之鄰苯二甲酸二丁酯2重量份、作為有機化合物之2,2-二甲基-1,3-丙二醇,攪拌溶解。於所得之樹脂溶液中添加作為陶瓷粉末之鈦酸鋇(堺化學工業公司製造之「BT-01(平均粒徑為0.3 μm)」)50重量份,利用球磨機混合48小時而製作無機微粒子分散糊組成物。5 parts by weight of the obtained polyvinyl butyral resin was added to a mixed solvent of 22 parts by weight of toluene and 11 parts by weight of ethanol, and the mixture was stirred and dissolved, and further added as a plasticizer so as to have a composition ratio as shown in Table 1. 2 parts by weight of dibutyl phthalate and 2,2-dimethyl-1,3-propanediol as an organic compound were stirred and dissolved. To the obtained resin solution, 50 parts by weight of barium titanate ("BT-01 (average particle diameter: 0.3 μm)"), which is a ceramic powder, was added and mixed by a ball mill for 48 hours to prepare an inorganic fine particle dispersion paste. Composition.
(實施例6)(Example 6)
對聚合例3中所得之(甲基)丙烯酸樹脂(Poly(BMA/HEMA))之松脂醇溶液,以達到表1所記載之組成比的方式添加松脂醇,使其溶解。於其中以達到表1所記載之組成比的方式進一步添加作為有機化合物之2,2-二甲基-1,3-丙二醇,利用高速分散機使其分散。The rosin alcohol solution of the (meth)acrylic resin (Poly (BMA/HEMA)) obtained in the polymerization example 3 was added to rosin alcohol so as to have a composition ratio shown in Table 1, and dissolved. Further, 2,2-dimethyl-1,3-propanediol as an organic compound was further added so as to have a composition ratio as shown in Table 1, and the mixture was dispersed by a high-speed disperser.
進而,以達到表1所記載之組成比的方式添加作為導電性微粒子之鋁微粒子(平均粒徑為5 μm)、及可實現煅燒穿通(fire through)之低熔點玻璃微粒子(平均粒徑為1 μm),使用高速攪拌裝置充分混練後,一邊注意不將鋁微粒子壓成扁平狀一邊利用三輥研磨機進行處理,製備導電性微粒子分散糊。Further, aluminum fine particles (average particle diameter: 5 μm) as conductive fine particles and low-melting glass fine particles (which have an average particle diameter of 1) capable of achieving fire through are added so as to have a composition ratio as shown in Table 1. After the kneading was carried out by a high-speed stirring apparatus, the aluminum microparticles were treated with a three-roll mill while not being flattened to prepare a conductive fine particle-dispersed paste.
(實施例7)(Example 7)
使用使乙基纖維素STD4溶解於松脂醇中而成之溶液、及聚合例4中所得之(甲基)丙烯酸樹脂(Poly(BMA/MMA/HEMA))之松脂醇溶液,且變更為表1所記載之組成比,除此以外,與實施例1同樣地製作無機微粒子分散糊。A solution obtained by dissolving ethyl cellulose STD4 in rosin alcohol and a rosin alcohol solution of (meth)acrylic resin (Poly (BMA/MMA/HEMA)) obtained in Polymerization Example 4 were used and changed to Table 1. An inorganic fine particle-dispersed paste was produced in the same manner as in Example 1 except for the composition ratio described above.
(實施例8)(Example 8)
使用聚合例5中所得之(甲基)丙烯酸樹脂(Poly(CHMA/MMA/HEMA))之松脂醇溶液、松香化合物(KR85,荒川化學公司製造)、作為無機微粒子之PDP(Plasma display panel,電漿顯示面板)用綠色螢光體(Zn2 SiO4 :Mn,日亞化學公司製造),且變更為表1所記載之組成比,除此以外,與實施例1同樣地製作無機微粒子分散糊。A rosin alcohol solution (Poly(CHMA/MMA/HEMA)) obtained in the polymerization example 5, a rosin compound (KR85, manufactured by Arakawa Chemical Co., Ltd.), and a PDP (Plasma display panel) as inorganic fine particles were used. In the slurry display panel, an inorganic fine particle dispersion paste was produced in the same manner as in Example 1 except that the composition ratio shown in Table 1 was changed to a green phosphor (Zn 2 SiO 4 : Mn, manufactured by Nichia Chemical Co., Ltd.). .
(實施例9)(Example 9)
使用聚合例6中所得之(甲基)丙烯酸樹脂(Poly(CHMA/MMA/HEMA))之Texanol溶液、乙基纖維素(STD7)、及作為無機微粒子之銀粉(粒徑為2 μm,昭榮化學公司製造),且變更為表1所記載之組成比,除此以外,與實施例1同樣地製作無機微粒子分散糊。The (meth)acrylic resin (Poly(CHMA/MMA/HEMA)) obtained in the polymerization example 6 was used in a Texanol solution, ethyl cellulose (STD7), and silver powder as inorganic fine particles (particle size was 2 μm, Zhaorong). An inorganic fine particle-dispersed paste was produced in the same manner as in Example 1 except that the composition ratio described in Table 1 was changed.
(比較例1)(Comparative Example 1)
不使用作為有機化合物之1,6-己二醇,且變更為表1所示之組成比,除此以外,與實施例1同樣地製作無機微粒子分散糊。An inorganic fine particle-dispersed paste was produced in the same manner as in Example 1 except that 1,6-hexanediol was used as the organic compound, and the composition ratio shown in Table 1 was changed.
(比較例2)(Comparative Example 2)
不使用作為有機化合物之1,6-己二醇,且變更為表1所示之組成比,除此以外,與實施例3同樣地製作無機微粒子分散糊。An inorganic fine particle-dispersed paste was produced in the same manner as in Example 3 except that 1,6-hexanediol was used as the organic compound, and the composition ratio shown in Table 1 was changed.
(比較例3)(Comparative Example 3)
不使用作為有機化合物之2,2-二甲基-1,3-丙二醇,且變更為表1所示之組成比,除此以外,與實施例6同樣地製作無機微粒子分散糊。An inorganic fine particle-dispersed paste was produced in the same manner as in Example 6 except that 2,2-dimethyl-1,3-propanediol was used as the organic compound, and the composition ratio shown in Table 1 was changed.
(比較例4)(Comparative Example 4)
代替作為有機化合物之2,2-二甲基-1,3-丙二醇,而使用具有羥基,於常溫下為固體但沸點為300℃以上之季戊四醇,除此以外,與實施例6同樣地製作無機微粒子分散糊。An inorganic substance was produced in the same manner as in Example 6 except that 2,2-dimethyl-1,3-propanediol was used as the organic compound, and a pentaerythritol having a hydroxyl group at a normal temperature and having a boiling point of 300 ° C or higher was used. The microparticles disperse the paste.
(比較例5)(Comparative Example 5)
代替作為有機化合物之2,2-二甲基-1,3-丙二醇,而使用具有羥基,於常溫下為液體之2-甲基-1,3-丙二醇,除此以外,與實施例6同樣地製作無機微粒子分散糊。In the same manner as in Example 6, except that 2,2-dimethyl-1,3-propanediol as an organic compound was used, and 2-methyl-1,3-propanediol having a hydroxyl group and being a liquid at normal temperature was used. An inorganic fine particle dispersion paste was prepared.
(比較例6)(Comparative Example 6)
代替作為有機化合物之2,2-二甲基-1,3-丙二醇,而使用具有羥基,於常溫下為液體之2-甲基-1,3-丙二醇,除此以外,與實施例8同樣地製作無機微粒子分散糊。In the same manner as in Example 8, except that 2,2-dimethyl-1,3-propanediol as an organic compound was used, and 2-methyl-1,3-propanediol having a hydroxyl group and being a liquid at normal temperature was used. An inorganic fine particle dispersion paste was prepared.
(比較例7)(Comparative Example 7)
代替作為有機化合物之2,2-二甲基-1,3-丙二醇,而使用具有羥基,於常溫下為液體之2-甲基-1,3-丙二醇,除此以外,與實施例9同樣地製作無機微粒子分散糊。In the same manner as in Example 9, except that 2,2-dimethyl-1,3-propanediol as an organic compound was used, and 2-methyl-1,3-propanediol having a hydroxyl group and being liquid at normal temperature was used. An inorganic fine particle dispersion paste was prepared.
〈評價〉<Evaluation>
對實施例及比較例中獲得之無機微粒子分散糊進行以下評價。結果示於表2中。The inorganic fine particle-dispersed paste obtained in the examples and the comparative examples was subjected to the following evaluation. The results are shown in Table 2.
(1)燒結性(1) Sinterability
使用設定為5密耳之敷料器,將無機微粒子分散糊塗佈於玻璃基板上,於150℃之送風烘箱中乾燥30分鐘後,於500℃之電爐中煅燒30分鐘。對所得之燒結層藉由碳硫分析裝置(堀場製作所公司製造)測定殘留碳(ppm),又,目視確認煅燒顏色。當殘留碳為150 ppm以下時將燒結性評價為「○」,殘留碳超過150 ppm時將燒結性評價為「×」。The inorganic fine particle dispersion paste was applied onto a glass substrate using an applicator set at 5 mils, dried in a blowing oven at 150 ° C for 30 minutes, and then calcined in an electric furnace at 500 ° C for 30 minutes. The obtained sintered layer was measured for residual carbon (ppm) by a carbon-sulfur analyzer (manufactured by Horiba, Ltd.), and the calcined color was visually confirmed. The sinterability was evaluated as "○" when the residual carbon was 150 ppm or less, and the sinterability was evaluated as "x" when the residual carbon exceeded 150 ppm.
(2)表面平滑性(2) Surface smoothness
使用設定為5密耳之敷料器,將無機微粒子分散糊塗佈於玻璃基板上,於150℃之送風烘箱中乾燥30分鐘。對所得之無機微粒子分散糊塗佈層,利用依據JIS B 0601之方法測定表面之中心線平均粗糙度(Ra),當Ra為1.0 μm以下時將表面平滑性評價為「○」,超過1.0 μm時將表面平滑性評價為「×」。測定中使用觸針式粗糙度計(東京精密公司製造,Surfcom 1400D)。The inorganic fine particle dispersion paste was applied onto a glass substrate using an applicator set to 5 mils, and dried in a blowing oven at 150 ° C for 30 minutes. The obtained inorganic fine particle-dispersed paste coating layer was measured for the center line average roughness (Ra) of the surface according to JIS B 0601, and when Ra was 1.0 μm or less, the surface smoothness was evaluated as "○", and when it exceeded 1.0 μm The surface smoothness was evaluated as "x". A stylus type roughness meter (manufactured by Tokyo Precision Co., Ltd., Surfcom 1400D) was used for the measurement.
再者,比較例2中所得之無機微粒子分散糊之黏度較高,塗佈該無機微粒子分散糊而獲得之塗佈層可見膜厚起伏變動。Further, the viscosity of the inorganic fine particle-dispersed paste obtained in Comparative Example 2 was high, and the coating layer obtained by applying the inorganic fine particle-dispersed paste showed a fluctuation in film thickness.
(3)不塌陷乾燥性(3) does not collapse dryness
使用乳劑厚度為20 μm、不鏽鋼絲網#300、乳劑之開口部之線寬為100 μm、間隔為300 μm之條紋狀網版印刷版,將實施例8、9及比較例6、7中獲得之無機微粒子分散糊印刷於玻璃基板上,於設定為120℃之送風式烘箱中乾燥20分鐘。然後,使用雷射顯微鏡評價印刷形狀之高度。A stripe screen printing plate having an emulsion thickness of 20 μm, a stainless steel mesh #300, an opening of the emulsion having a line width of 100 μm and a spacing of 300 μm was obtained in Examples 8, 9 and Comparative Examples 6 and 7. The inorganic fine particle dispersion paste was printed on a glass substrate and dried in a forced air oven set at 120 ° C for 20 minutes. Then, the height of the printed shape was evaluated using a laser microscope.
將乾燥後之印刷形狀之高度為10 μm以上之情形評價為「○」,將於乾燥過程中塌陷而印刷形狀之高度變成小於10 μm之高度的情形評價為「×」。When the height of the printed shape after drying was 10 μm or more, it was evaluated as “○”, and the case where the height of the printed shape was reduced to a height of less than 10 μm during the drying process was evaluated as “×”.
根據本發明,可提供一種能夠形成表面平滑性優異之燒結層之無機微粒子分散糊。According to the present invention, it is possible to provide an inorganic fine particle-dispersed paste capable of forming a sintered layer excellent in surface smoothness.
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| TWI548722B (en) * | 2011-12-01 | 2016-09-11 | 蕭一修 | Photo-luminance coating, glass and applications thereof |
| JP2013237603A (en) * | 2012-04-19 | 2013-11-28 | Central Glass Co Ltd | Glass paste |
| JP6251001B2 (en) * | 2013-04-15 | 2017-12-20 | 積水化学工業株式会社 | Resin composition |
| CN104356690A (en) * | 2014-09-28 | 2015-02-18 | 安徽省温禾木业有限公司 | Modified calcium carbonate with flame-retardant effect and preparation method thereof |
| CN104312212A (en) * | 2014-09-28 | 2015-01-28 | 安徽盛佳彩印包装有限公司 | Corrosion-resistant modified calcium carbonate with good comprehensive properties and preparation method of modified calcium carbonate |
| CN104387800A (en) * | 2014-09-28 | 2015-03-04 | 安徽省温禾木业有限公司 | Environmental-friendly modified calcium carbonate with delicate fragrance and preparation method thereof |
| CN104327550A (en) * | 2014-09-28 | 2015-02-04 | 安徽盛佳彩印包装有限公司 | Electrical-conductive modified calcium carbonate and preparation method thereof |
| JP6091014B2 (en) * | 2014-11-07 | 2017-03-08 | 楠本化成株式会社 | Method of forming a pattern by screen printing |
| WO2017014295A1 (en) * | 2015-07-22 | 2017-01-26 | 昭栄化学工業株式会社 | Binder resin for inorganic particle-dispersed pastes and inorganic particle-dispersed paste |
| JP2017048061A (en) * | 2015-08-31 | 2017-03-09 | 日本電気硝子株式会社 | Glass paste composition and method for producing film formation glass member |
| KR102172643B1 (en) * | 2017-07-25 | 2020-11-02 | 한국세라믹기술원 | Paste composition for forming cooktop deco layer and manufacturing method of cooktop deco layer using the composition |
| KR102753596B1 (en) * | 2018-08-30 | 2025-01-10 | 세키스이가가쿠 고교가부시키가이샤 | Vehicle composition for inorganic fine particle dispersion, inorganic fine particle-dispersed slurry composition and method for producing inorganic fine particle-dispersed sheet |
| CN114049986B (en) * | 2021-12-28 | 2022-04-19 | 西安宏星电子浆料科技股份有限公司 | Lead-free and bismuth-free dielectric slurry |
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| WO2000042622A1 (en) * | 1999-01-14 | 2000-07-20 | Soken Chemical & Engineering Co., Ltd. | Resin composition for dielectric layer formation and film for dielectric layer formation |
| JP4166360B2 (en) * | 1999-03-25 | 2008-10-15 | 株式会社デンソー | Dielectric paste and multilayer substrate |
| JP3928558B2 (en) * | 2002-01-30 | 2007-06-13 | 株式会社村田製作所 | Conductive paste |
| JP2004002164A (en) | 2002-04-08 | 2004-01-08 | Lintec Corp | Composition for dielectric layer and green sheet of plasma display panel, and member for plasma display |
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| JP2005353514A (en) * | 2004-06-14 | 2005-12-22 | Matsushita Electric Ind Co Ltd | Method for manufacturing plasma display panel |
| EP1865026B1 (en) * | 2005-03-31 | 2012-01-11 | Sekisui Chemical Co., Ltd. | Binder resin composition and inorganic fine particle-dispersed paste composition |
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| JP2008084922A (en) * | 2006-09-26 | 2008-04-10 | Kyocera Corp | Manufacturing method of ceramic substrate |
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