TWI481086B - Cooling device for electronic components - Google Patents

Description

Heat sink for electronic components

The present invention relates to a heat dissipating structure for a heat-generating electronic component, and more particularly to a heat dissipating device for integrating a thermoelectric cooling element with a heat-generating electronic component.

All electronic components will produce a natural phenomenon of heat generation, and this heating phenomenon may cause the life of the component and its original performance to be affected. Therefore, the solution to this heating phenomenon is greatly emerged, especially in the thermal energy of the component heating. For the sake of utilization, it has also become the subject of research and development personnel.

For example, LEDs are widely used in daily life because of their environmental protection, energy saving, small size, high efficiency, and long service life. Such as LCD backlight, mobile phone backlight, horn light, car lights, street lights, art lighting, building lighting, and stage lighting control, home lighting. With the development of LED industry and the increase of user demand, LED is gradually developing towards high power, high brightness and high efficiency. However, it also faces the fact that a large amount of heat generated by high-power LED cannot be effectively eliminated, resulting in high LED interface temperature. The problem of reducing or even extinguishing the LED brightness. Since only about 15~20% of the input power of the LED is converted into light, and nearly 80~85% of the electrical energy is converted into thermal energy, if the thermal energy generated by the LED is not exported, the temperature of the LED interface will be too high, resulting in LED surrounding materials such as Fluorescent powder, encapsulant and other deterioration, affecting LED luminous efficiency, stability and service life, so how to effectively manage LED products is a very important issue.

At present, the heat dissipating device of the electronic component is mainly designed by adding a heat sink (Heat Sink) or a heat pipe after the heat dissipation substrate (aluminum oxide or aluminum nitride substrate), but the heat dissipation effect of the design is limited, in order to increase the heat dissipation capability thereof. The surface area of the fins must be increased, so that the electronic components are extremely bulky, and since the heat sinks are mostly exposed to the air for heat dissipation, the design of the heat sink directly affects the appearance of the original electronic component products, so the design of the heat sink is not only heat dissipation. Efficiency is the primary consideration, and its weight, volume, appearance, convenience, applicability and the reuse of energy released by itself are extremely important factors to be overcome.

For this reason, the applicant has the method of overcoming the poor heat dissipation effect, and considers the appearance, volume, weight and other factors, and can convert the heat energy generated by the component into the reusable Energy, in turn, invented the case "a heat sink for electronic components" to improve the lack of the above-mentioned conventional means.

The main object of the present invention is to provide a heat dissipating device for cooling a heat-generating electronic component, which effectively solves the heat dissipation problem encountered in the operation of the conventional electronic component, and can prolong its service life, reduce the weight, reduce the volume, and achieve a beautiful appearance design. .

Another object of the present invention is to convert the temperature difference into thermal energy that can be utilized by utilizing the thermal energy generated by the electronic component during operation, and store the battery as a backup energy source.

To achieve the foregoing objective, the present invention provides a heat dissipating device for an electronic component, comprising: a first substrate having a first surface and a second surface, and having a metallization circuit therein; at least one electronic component, configured The first surface of the first substrate is coupled to the metallization circuit; a thermoelectric element disposed on the second surface of the first substrate to conduct heat energy generated by the at least one electronic component; and a first Two substrates, The third surface and the fourth surface are coupled to the thermoelectric element, wherein the first substrate and the second substrate are both insulating ceramic materials, and are selected from the group consisting of One of the following groups: alumina and aluminum nitride.

According to the above concept, the heat dissipating device further includes a storage battery for storing electric energy of the thermoelectric effect of the heat dissipating device due to a difference in thermal temperature between the first substrate and the second substrate.

According to the above concept, the at least one electronic component is selected from the group consisting of LEDs, CPUs, and focusing solar devices.

According to the above concept, the thermoelectric element includes: a first conductive layer, comprising a plurality of first electrodes, the first conductive layer is disposed on the second surface of the first substrate; and a second conductive layer includes a plurality of a second electrode, the second conductive layer is disposed on the third surface of the second substrate; and a plurality of N-type semiconductors and a plurality of P-type semiconductors, wherein the plurality of N-type semiconductors and the plurality of P-types The semiconductors are disposed in a staggered manner between the plurality of first electrodes and the plurality of second electrodes, and coupled to the plurality of first electrodes and the plurality of second electrodes to form a current loop.

According to the above concept, the first surface of the first substrate is a uniform cold surface.

According to the above concept, the first surface of the first substrate is a uniform hot surface.

Therefore, the performance of the present invention is capable of combining a thermoelectrically cooled wafer with an electronic component, replacing the heat dissipation method of the conventional heat dissipation substrate and the heat dissipation fin, and utilizing the thermal temperature difference between the upper and lower ends of the refrigerant wafer, not only efficiently The heat removal generated by the operation of the electronic components can further utilize the electric energy generated by the thermal temperature difference effect generated at the upper and lower ends of the cooled wafer, and has many advantages such as environmental protection, lightness, compactness, longevity, reliability and convenience, and meets market demands. .

The present invention will be fully understood from the following description of the embodiments, and the skilled person in the art can be practiced by the present invention. However, the implementation of the present invention is not limited by the following embodiments.

Referring to Figure 1, there is shown a schematic configuration of a preferred embodiment of the present invention. The present invention utilizes a thermal temperature difference phenomenon of a cooled wafer to be applied to a heat dissipating device of a heat-generating electronic component. In this embodiment, an LED component is used to transfer a large amount of heat generated when the LED die emits light to the cooling wafer. To reduce the LED temperature. And this design has been proven to greatly reduce the overall volume and weight of the LED.

The heat dissipating device of the embodiment includes: a first substrate (11) having a first surface (111) and a second surface (112), and is internally provided with a metallization circuit; at least one electronic component (14 15) In the embodiment, the at least one electronic component uses a light emitting diode (LED), and includes an LED chip (14) and an LED lens (15) disposed on the first substrate (11). a surface (111) coupled to the metallization circuit; a thermoelectric element (13) disposed on the second surface (112) of the first substrate (11) to conduct the at least one electronic component (14 15) the generated thermal energy; and a second substrate (12) having a third surface (121) and a fourth surface (122), the third surface (121) of the second substrate (12) being coupled to The thermoelectric element (13), wherein the first substrate (11) and the second substrate (12) are both insulating ceramic materials, and are all selected from the group consisting of alumina and aluminum nitride.

The thermoelectric element (13) includes: a first conductive layer, comprising a plurality of first electrodes (131), the first conductive layer is disposed on the second surface (112) of the first substrate (11); a second conductive layer includes a plurality of second electrodes (132) disposed on the third surface (121) of the second substrate (12); and a plurality of An N-type semiconductor (134) and a plurality of P-type semiconductors (133), wherein the plurality of N-type semiconductors (134) and the plurality of P-type semiconductors (133) are arranged in a staggered manner on the plurality of first electrodes (131) is coupled between the plurality of second electrodes (132) and the plurality of first electrodes (131) and the plurality of second electrodes (132) to form a current loop.

The technical idea of this embodiment is to use a thermoelectric cooling chip (Bi ₂ -Te ₃ ) to utilize the principle of thermoelectric effect to connect semiconductor components (133, 134), conductors (131, 132) and ceramics. a heat dissipating device formed by combining materials (11, 12), when current is input to the heat dissipating device, heat is absorbed by the heat dissipating device from one end (N→P heat absorption, cold end, such as the third surface of the first substrate (11) (121) end) is transferred to the other end (P→N heat release, hot end, such as the fourth surface (122) end of the second substrate (12)), forming a temperature difference between the two sides of the heat sink Phenomenon, when the input current is larger, the temperature difference generated at both ends is also larger. The maximum temperature difference of the current best manufactured product can reach 74 °C.

The heat dissipation device further includes a battery (17) for storing the heat dissipation device due to the first substrate (11) and the second substrate (12) because the temperature difference is larger, and the electric energy generated by the thermoelectric effect is larger. The thermal temperature difference produces the electrical energy of the thermoelectric effect.

Referring to Figure 2, there is shown a cross-sectional perspective view of a preferred embodiment of the present invention. As can be seen from the figure, the outer layer of the heat sink (21) is a dielectric substrate (22) coated on the upper and lower outer layers, and a plurality of N-type semiconductors (25) are coated by two layers of conductors (23). a P-type semiconductor (24), wherein the plurality of N-type semiconductors (25) and the plurality of P-type semiconductors (24) are arranged in a staggered manner between the two-layer semiconductors (23), and The upper layer electrode formed by the two-layer semiconductor (23) is connected to form a current loop. Thus, by controlling the direction of the current applied to the heat sink (21), The upper end of the heat sink (21) is formed with a cold end, and the lower end thereof is formed with a hot end for conducting heat energy.

Please refer to Fig. 3, which shows a schematic view of the finished product of the present invention. It can be seen from the figure that the size of the finished product of the heat dissipating device (31) of the present invention is equivalent to a ten-eco coin (30), and each heat dissipating device comprises a positive pin (32) and a negative pin (33) for Connect to the power supply (16) shown in Figure 1.

In summary, the heat sink of the present invention not only has high heat dissipation efficiency, but also indirectly prolongs the life of the component, and has a small size, light weight, long life, high reliability, environmental protection (no use of refrigerant), and easy maintenance. The characteristics of energy reuse and the like are therefore very suitable as heat sinks for electronic components, and have extremely high market demand value.

The above-described embodiments are merely illustrative of the principles of the preferred embodiments of the invention and their advantages, and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the embodiments described above without departing from the spirit and scope of the invention.

11‧‧‧First substrate

111‧‧‧ first surface

112‧‧‧ second surface

12‧‧‧second substrate

121‧‧‧ third surface

122‧‧‧ fourth surface

13‧‧‧Thermal components

131‧‧‧First electrode

132‧‧‧second electrode

133‧‧‧P-type semiconductor

134‧‧‧N type semiconductor

14‧‧‧Light Emitting Diode Wafer

15‧‧‧Light Emitting Lens

16‧‧‧Power supply

17‧‧‧Battery

21‧‧‧ Heat sink

22‧‧‧Dielectric substrate

23‧‧‧Conductors

24‧‧‧P-type semiconductor

25‧‧‧N-type semiconductor

26‧‧‧ positive pin

27‧‧‧Negative pin

30‧‧‧10 dollar coin

31‧‧‧ Heat sink

32‧‧‧ positive pin

33‧‧‧native pin

Fig. 1 is a schematic view showing the construction of a preferred embodiment of the present invention.

Figure 2 is a cross-sectional perspective view showing a preferred embodiment of the present invention.

Figure 3: This shows a schematic representation of the finished product of the invention.

11‧‧‧First substrate

111‧‧‧ first surface

112‧‧‧ second surface

12‧‧‧second substrate

121‧‧‧ third surface

122‧‧‧ fourth surface

13‧‧‧Thermal components

131‧‧‧First electrode

132‧‧‧second electrode

133‧‧‧P-type semiconductor

134‧‧‧N type semiconductor

14‧‧‧Light Emitting Diode Wafer

15‧‧‧Light Emitting Lens

16‧‧‧Power supply

17‧‧‧Battery

Claims (5)

A heat dissipating device for an electronic component, comprising: a first substrate having a first surface and a second surface, and having a metallization circuit therein; at least one electronic component disposed on the first substrate a surface coupled to the metallization circuit; a thermoelectric element disposed on the second surface of the first substrate to conduct thermal energy generated by the at least one electronic component; a second substrate having a third surface and a fourth surface, the third surface of the second substrate is coupled to the thermoelectric element, wherein the first substrate and the second substrate are both insulating ceramic materials, and are selected from one of the following groups: Alumina and aluminum nitride; and a battery for storing the electrical energy of the heat sink due to the thermoelectric effect of the thermal difference between the first substrate and the second substrate. The heat sink of claim 1, wherein the at least one electronic component is selected from the group consisting of: an LED, a CPU, and a focusing solar device. The heat dissipating device of claim 1, wherein the thermoelectric element comprises: a first conductive layer comprising a plurality of first electrodes, wherein the first conductive layer is disposed on the second surface of the first substrate a second conductive layer comprising a plurality of second electrodes, the second conductive layer being disposed on the third surface of the second substrate; a plurality of N-type semiconductors and a plurality of P-type semiconductors, wherein the plurality of N-type semiconductors and the plurality of P-type semiconductors are arranged in a staggered manner between the plurality of first electrodes and the plurality of second electrodes, And coupling the plurality of first electrodes to the plurality of second electrodes to form a current loop. The heat dissipating device of claim 1, wherein the first surface of the first substrate is a uniform cold surface. The heat dissipating device of claim 1, wherein the first surface of the first substrate is a uniform hot surface.