[go: up one dir, main page]

TWI474353B - Capacitor package structure using smt - Google Patents

Capacitor package structure using smt

Info

Publication number
TWI474353B
TWI474353B TW98127505A TW98127505A TWI474353B TW I474353 B TWI474353 B TW I474353B TW 98127505 A TW98127505 A TW 98127505A TW 98127505 A TW98127505 A TW 98127505A TW I474353 B TWI474353 B TW I474353B
Authority
TW
Taiwan
Prior art keywords
smt
package structure
capacitor package
capacitor
package
Prior art date
Application number
TW98127505A
Other languages
Chinese (zh)
Other versions
TW201106399A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98127505A priority Critical patent/TWI474353B/en
Publication of TW201106399A publication Critical patent/TW201106399A/en
Application granted granted Critical
Publication of TWI474353B publication Critical patent/TWI474353B/en

Links

TW98127505A 2009-08-14 2009-08-14 Capacitor package structure using smt TWI474353B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98127505A TWI474353B (en) 2009-08-14 2009-08-14 Capacitor package structure using smt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98127505A TWI474353B (en) 2009-08-14 2009-08-14 Capacitor package structure using smt

Publications (2)

Publication Number Publication Date
TW201106399A TW201106399A (en) 2011-02-16
TWI474353B true TWI474353B (en) 2015-02-21

Family

ID=44814327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98127505A TWI474353B (en) 2009-08-14 2009-08-14 Capacitor package structure using smt

Country Status (1)

Country Link
TW (1) TWI474353B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612541B (en) * 2015-06-17 2018-01-21 冠亞智財股份有限公司 Package structure of supercapacitor
CN115249582A (en) * 2021-04-27 2022-10-28 华为技术有限公司 A package component, capacitor and electrical equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020079494A1 (en) * 2000-12-14 2002-06-27 Kim Hye-Dong Organic EL device and method for manufacturing the same
US6977807B2 (en) * 2003-09-02 2005-12-20 Nec Tokin Corporation Laminated solid electrolytic capacitor and laminated transmission line device increased in element laminating number without deterioration of elements
US7206193B2 (en) * 2004-10-27 2007-04-17 Nec Tokin Corporation Surface-mount capacitor and method of producing the same
US7312979B2 (en) * 2006-01-23 2007-12-25 Fujitsu Media Devices Limited Stacked solid electrolytic capacitor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020079494A1 (en) * 2000-12-14 2002-06-27 Kim Hye-Dong Organic EL device and method for manufacturing the same
US6977807B2 (en) * 2003-09-02 2005-12-20 Nec Tokin Corporation Laminated solid electrolytic capacitor and laminated transmission line device increased in element laminating number without deterioration of elements
US7206193B2 (en) * 2004-10-27 2007-04-17 Nec Tokin Corporation Surface-mount capacitor and method of producing the same
US7312979B2 (en) * 2006-01-23 2007-12-25 Fujitsu Media Devices Limited Stacked solid electrolytic capacitor

Also Published As

Publication number Publication date
TW201106399A (en) 2011-02-16

Similar Documents

Publication Publication Date Title
GB2485693B (en) Interdigitated vertical parallel capacitor
TWI373109B (en) Package structure
GB0911823D0 (en) Packaging
EP2443235A4 (en) ß-GLUCOSIDASE VARIANTS
PL2281757T3 (en) Packaging
EP2524763A4 (en) Solder paste
EP2379423A4 (en) Package assembly
PL2429920T3 (en) Packaging
TWI474353B (en) Capacitor package structure using smt
EP2420457A4 (en) Package
TWI347913B (en) Packaging structure
GB0915762D0 (en) Packaging
GB0901846D0 (en) Improved packaging
TWI371403B (en) Packaging structure
TWM372841U (en) Package structure
TWI339636B (en) Package structure
GB0912733D0 (en) Suction standoff cap
PH32009000454S1 (en) Package
GB0812100D0 (en) Capacitor
TWM369933U (en) Porcelain package structure
TWM371708U (en) Package case
TWM371704U (en) Package case
TWM371702U (en) Package case
TWM370660U (en) Packing turning-knob structure
AU329320S (en) Lead

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees