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TWI473990B - Surface inspection device - Google Patents

Surface inspection device Download PDF

Info

Publication number
TWI473990B
TWI473990B TW97138814A TW97138814A TWI473990B TW I473990 B TWI473990 B TW I473990B TW 97138814 A TW97138814 A TW 97138814A TW 97138814 A TW97138814 A TW 97138814A TW I473990 B TWI473990 B TW I473990B
Authority
TW
Taiwan
Prior art keywords
polarization state
substrate
inspected
amount
change
Prior art date
Application number
TW97138814A
Other languages
English (en)
Chinese (zh)
Other versions
TW200925587A (en
Inventor
工藤祐司
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW200925587A publication Critical patent/TW200925587A/zh
Application granted granted Critical
Publication of TWI473990B publication Critical patent/TWI473990B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW97138814A 2007-10-12 2008-10-09 Surface inspection device TWI473990B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007267099 2007-10-12

Publications (2)

Publication Number Publication Date
TW200925587A TW200925587A (en) 2009-06-16
TWI473990B true TWI473990B (zh) 2015-02-21

Family

ID=40549148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97138814A TWI473990B (zh) 2007-10-12 2008-10-09 Surface inspection device

Country Status (3)

Country Link
JP (1) JP5370155B2 (fr)
TW (1) TWI473990B (fr)
WO (1) WO2009048003A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011002305A (ja) * 2009-06-17 2011-01-06 Topcon Corp 回路パターンの欠陥検出装置、回路パターンの欠陥検出方法およびプログラム
JP6036680B2 (ja) * 2011-02-25 2016-11-30 株式会社ニコン 検査装置および半導体装置の製造方法
US9720075B2 (en) * 2014-11-21 2017-08-01 Nec Corporation System and method for remote object sensing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200710367A (en) * 2005-03-31 2007-03-16 Dainippon Screen Mfg Unevenness inspecting apparatus and unevenness inspecting method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812148B2 (ja) * 1986-12-29 1996-02-07 日本分光工業株式会社 エリプソメ−タ
JPH01182737A (ja) * 1988-01-14 1989-07-20 Yokogawa Electric Corp 複屈折測定方法
JP3181596B2 (ja) * 1995-08-31 2001-07-03 インフラレッド ファイバー システムス，インク． ハンドヘルド赤外線分光装置
JP4058337B2 (ja) * 2002-12-27 2008-03-05 キヤノン株式会社 複屈折測定装置
JP4455024B2 (ja) * 2002-12-13 2010-04-21 キヤノン株式会社 複屈折測定装置
US7006224B2 (en) * 2002-12-30 2006-02-28 Applied Materials, Israel, Ltd. Method and system for optical inspection of an object
JP4241252B2 (ja) * 2003-07-24 2009-03-18 横河電機株式会社 光ファイバ特性測定装置および光ファイバ特性測定方法
TW200519373A (en) * 2003-10-27 2005-06-16 Nikon Corp Surface inspection device and method
JP2006266817A (ja) * 2005-03-23 2006-10-05 Nikon Corp 表面検査装置
JP4853758B2 (ja) * 2004-06-16 2012-01-11 株式会社ニコン 表面検査装置および表面検査方法
JP2006250839A (ja) * 2005-03-14 2006-09-21 Nikon Corp 表面検査装置
JP2006317314A (ja) * 2005-05-13 2006-11-24 Nikon Corp 欠陥検査装置
JP4205704B2 (ja) * 2005-08-02 2009-01-07 国立大学法人 北海道大学 撮像偏光計測方法
JPWO2007069457A1 (ja) * 2005-12-14 2009-05-21 株式会社ニコン 表面検査装置および表面検査方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200710367A (en) * 2005-03-31 2007-03-16 Dainippon Screen Mfg Unevenness inspecting apparatus and unevenness inspecting method

Also Published As

Publication number Publication date
JP5370155B2 (ja) 2013-12-18
TW200925587A (en) 2009-06-16
WO2009048003A1 (fr) 2009-04-16
JPWO2009048003A1 (ja) 2011-02-17

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