TWI461634B - Light-emitting apparatus - Google Patents

Description

Illuminating device

The present invention relates to a lighting device, and more particularly to a lighting device that reduces the operating temperature of a light source.

With the increasing emphasis on environmental protection and energy conservation, light-emitting devices with light-emitting diodes (LEDs) have gradually replaced traditional light bulbs. However, the light-emitting diodes are usually arranged in a plurality of pieces, so how to effectively dissipate heat is a major issue.

Referring to Figure 1, a cross-sectional schematic view of a conventional illumination device is shown. The light emitting device 1 includes a light emitting diode (LED) component 10, a substrate 12, a container 16, and a cooling water 14. The substrate 12 is a package substrate and has a first surface 121 and a second surface 122. The light emitting diode element 10 is located on the first surface 121 of the substrate 12. The second surface 122 of the substrate 12 is located on the container 16. The cooling water 14 flows in the container 16 to remove the heat generated by the light-emitting diode element 10 from emitting light.

The disadvantages of the conventional light-emitting device 1 are as follows. The heat of the LED component 10 passes through the substrate 12 and the sidewall of the container 16 before entering the cooling water 14 and is carried away by the cooling water 14. Since the substrate 12 and the container 16 are generally not good conductors of heat, the heat of the LED component 10 cannot be quickly transmitted to the cooling water 14, resulting in low heat dissipation efficiency of the conventional illumination device 1. . In other words, the thermal resistance of the prior art is too large.

The invention provides a light emitting device comprising at least one light source, at least one a substrate, at least one base, at least one heat pipe, and a coolant. The substrate has at least one hole. The light source is located on the substrate, and the hole is open to a surface of the substrate and is opposite to the light source. The base has a uniform through hole, the through hole is through the base, the substrate is adjacent to the base, and the hole is connected to the through hole. The heat pipe is adjacent to the base and has a heat pipe opening that communicates with the through hole. The coolant is located in the hole, and the heat generated by the light source is absorbed to form an evaporation gas to flow in the heat pipe.

Thereby, the operating temperature of the light source can be effectively reduced.

Referring to FIG. 2, a perspective view of an embodiment of a light-emitting device of the present invention is shown. Referring to FIG. 3, a partial cross-sectional view of FIG. 2 is shown. The illuminating device 2 includes at least one light source 20, at least one substrate 22, at least one base 24, at least one heat pipe 26, a coolant 28, an engaging element 30, and at least one fixing seat 32.

In the embodiment, the light source 20 is a light emitting diode (LED) component, and includes a plurality of crystal grains 201 and an adhesive material 202 on the substrate 22 .

In this embodiment, the substrate 22 is a metal-based printed circuit board (MCPCB) having a first surface 221, a second surface 222, and at least one hole 223. The light source 20 is located on the first surface 221 of the substrate 22, that is, the die 201 is attached to the first surface 221, and is electrically connected to the first surface 221 by using a plurality of wires 203. The glue material 202 covers the crystal grains 201 and the wires 203.

The location of the aperture 223 is relative to the source 20. In this embodiment, the hole 223 is open to the second surface 222 of the substrate 22 and the first surface 221, that is, the hole 223 extends through the substrate 22, so that the coolant 28 enters the hole 223. The dies 201 of the light source 20 can be contacted to directly remove the heat generated by the luminescence of the dies 201 of the light source 20. However, in other embodiments, the hole 223 is only open to the second surface 222 of the substrate 22, that is, the hole 223 is a blind hole. Preferably, the upper end of the hole 223 has an upper opening 224 which is open to the second surface 222 of the substrate 22 and which has a tapered shape. In the present embodiment, the substrate 22 has nine holes 223 arranged in a matrix of 3 ^* 3; however, in other embodiments, the substrate 22 may have only one hole 223. More specifically, each of the plurality of crystals 201 is associated with each of the holes 223, and how many of the holes 201 are there.

The base 24 has a first end 241, a second end 242 and a consistent through hole 243. The through hole 243 extends through the base 24 and opens to the first end 241 and the second end 242 respectively. In this embodiment, the through hole 243 has a first opening 2431 and a second opening 2432 at the first end 241 and the second end 242, respectively, and the cross-sectional area of the first opening 2431 is smaller than the second The cross-sectional area of the opening 2432 is such that the through hole 243 is tapered.

The substrate 22 is adjacent to the first end 241 of the base 24 , and the cross-sectional area of the first opening 2431 covers the holes 223 such that the holes 223 communicate with the through holes 243 . In this embodiment, the bonding component 30 is disposed between the substrate 22 and the base 24 for bonding the substrate 22 and the base 24, and the bonding component 30 is a cold soldering flux and a ceramic cold soldering filler. Or blending Encapsulation glue for light powder. In addition to the function of joining, the engaging element 30 also functions as a seal to prevent the coolant 28 from oozing out.

The heat pipe 26 is adjacent to the second end 242 of the base 24 and has a heat pipe opening 261 that communicates with the through hole 243. In the present embodiment, the heat pipe 26 is fixed to the second end 242 of the base 24 by argon welding. The coolant 28 is located in the hole 223, and absorbs the heat generated by the light source 20 to form an evaporation gas to flow in the heat pipe 26. In the present embodiment, the cooling liquid 28 is water, methanol, ethanol, ammonia, acetone or any combination thereof. The heat pipe 26 includes an outer casing 262 and a capillary structure 263. The capillary structure 263 is located on the inner side wall of the outer casing 262 to define a hollow receiving space 264. Preferably, the outer casing 262 is made of metal (for example, brass, nickel, stainless steel, tungsten or other alloy), and the capillary structure 263 is a copper mesh, copper powder fired or grooved.

The heat pipe opening 261 is connected to the hollow receiving space 264, so that the vaporizing gas formed by the cooling liquid 28 can flow through the heat pipe opening 261 in the hollow receiving space 264, thereby interposing the outer casing 262 and the outside. The environment forms a heat exchange which eventually condenses into a liquid coolant 28. The condensed liquid cooling liquid 28 is returned to the holes 223 through the through holes 243 of the base 24 via the capillary structure 263, thereby continuously carrying away the heat generated by the light source 20 to emit light. A heat cycle.

The fixing base 32 has a central through hole 321 for receiving the base 24. In this embodiment, the fixing base 32 and the base 24 are made of metal (for example, brass, nickel, stainless steel, tungsten or other alloy), and the fixing base 32 is fixed to the base 24 . However, in other embodiments, the mount 32 and the base 24 are integrally formed.

The operation of the light-emitting device 2 is as follows. When the light source 20 emits heat to generate heat, the cooling liquid 28 located in the hole 223 absorbs the heat of the light source 20 to form an evaporation gas. The vaporizing gas flows through the through hole 243 of the base 24 and flows into the hollow receiving space 264 above the heat pipe 26. Since the upper portion of the heat pipe 26 is in contact with the lower temperature, when the vaporized gas reaches the end, condensation begins to occur, and the heat is transmitted from the outer shell 262 to the lower temperature heat pipe 26 by the vaporized gas. external. At the same time, the evaporating gas will condense into a liquid, and the liquid cooling liquid 28 generated by the condensation flows back to the through hole 243 of the base 24 by the capillary pumping effect of the capillary structure 263, and then enters. These holes 223 are inside. This cycle will continue to improve the heat dissipation. Therefore, the heat resistance between the coolant 28 and the light source 20 in the heat pipe 26 can be removed, so that the heat dissipation effect of the coolant 28 in the heat pipe 26 can be maximized, and the work of the light source 20 can be effectively reduced. The temperature, in turn, extends the useful life of the source 20.

Referring to FIG. 4, a perspective view of another embodiment of a light-emitting device of the present invention is shown. The illuminating device 3 of the present embodiment is substantially the same as the illuminating device 2 of Figs. 1 and 2, wherein the same elements are given the same reference numerals. The difference between the illuminating device 3 of the present embodiment and the illuminating device 2 of FIGS. 1 and 2 is that, in the embodiment, the illuminating device 3 further includes at least one heat dissipating component 33 having a central tube 34 and a plurality of heat dissipating fins. Sheet 36. The central tube 34 is sleeved on the heat pipe 26. Preferably, the central tube 34 is in contact with the heat pipe 26. The heat dissipation fins 36 extend outward from the central tube 34 in a radial manner, and the central tube 34 And the heat dissipation fins 36 are integrally formed.

Please refer to FIG. 5, which shows the relationship between the relative light output and the lifetime of the LED components at different junction temperatures. The junction temperature refers to the temperature of the contact surface of the die 201 with the substrate 22 (ie, the first surface 221). The light output of the light-emitting diode (LED) component decays with time, and the relative light output is the ratio of the light output to the initial light output. In the figure, curve 51 represents the junction temperature of 69 ° C, curve 52 represents the junction temperature of 79 ° C, curve 53 represents the junction temperature of 85 ° C, curve 54 represents the junction temperature of 96 ° C, curve 55 represents the junction temperature of 107 ° C, the curve 56 represents a junction temperature of 115 °C. As shown, in the case of the same relative light output, the lower the junction temperature, the longer the lifetime of the LED component.

The junction temperature of the illuminating device 3 of FIG. 4 can be measured by the experiment to be 51.1 ° C (the experimental conditions are as follows: the cooling liquid 28 is water; the power of the crystal grains 201 is 10 W; the working pressure in the hollow accommodating space 264 It is 64 torr (Torr); room temperature is 21.6 ° C). In addition, if the heat sink fins 36 are laterally blown by the fan, the junction temperature of the light-emitting device 3 can be measured to be 32.8 ° C (the experimental conditions are as follows: the coolant 28 is water; the power of the die 201 is 9.6 W; the working pressure in the hollow accommodating space 264 is 25 Torr; room temperature is 22 ° C). In contrast, the junction temperature measured in the case where the light-emitting diode (LED) elements 10 of the light-emitting device 1 of Fig. 1 are arranged in a 3 ^* 3 matrix is about 70 °C. Therefore, it can be seen that the junction temperature of the light-emitting device 3 is lower than that of the prior art, and it can be reasonably estimated that the service life thereof is also long.

Please refer to FIG. 6 , which shows a three-dimensional embodiment of a light-emitting device of the present invention. schematic diagram. The illuminating device 3a of the present embodiment is substantially the same as the illuminating device 3 of Fig. 4, wherein the same elements are given the same reference numerals. The difference between the light-emitting device 3a of the embodiment and the light-emitting device 3 of FIG. 4 is that the heat-dissipating fins 36 of the heat-dissipating component 33 of the light-emitting device 3 of FIG. 4 have the same width outwardly and a circular appearance on the periphery; On the other hand, in the present embodiment, the width of the heat dissipation fins 36a of the heat dissipating member 33a of the light-emitting device 3a is not completely equal, and a rectangular appearance is formed at the periphery.

Referring to FIG. 7, a schematic diagram of the light-emitting device of FIG. 2 mounted on a carrier plate is shown. The carrier plate 38 has a first surface 381, a second surface 382 and a plurality of openings (not shown) extending through the carrier plate 38. A plurality of illuminating devices 2 (Fig. 2) are fixed (e.g., by screwing) to the second surface 382 of the carrier plate 38 by means of their fixing seats 32, the openings corresponding to the light source 20 of the illuminating device 2 To reveal the light sources 20. In this way, the emitted brightness can be increased, and can be used, for example, as a street light. In the present embodiment, the illuminating devices 2 are arranged in a 3 ^* 3 matrix. However, in other embodiments, the illuminating devices 2 may be arranged in other types as needed.

Please refer to FIG. 8 , which shows a schematic diagram of the light emitting device of FIG. 4 mounted on a carrier plate. In this embodiment, a plurality of light-emitting devices 3 (FIG. 4) are fixed (for example, by screws) to the second surface 382 of the carrier plate 38 by using the fixing base 32, and the carrier plate 38 is equal to The openings are aligned with the light source 20 of the illumination device 3 to reveal the light sources 20. In the present embodiment, the illuminating devices 3 are arranged in a 3 ^* 3 matrix. However, in other embodiments, the illuminating devices 3 may be arranged in other types as needed.

Referring to FIG. 9, a schematic diagram of the light-emitting device of FIG. 6 mounted on a carrier plate is shown. In this embodiment, a plurality of light-emitting devices 3a (FIG. 6) are fixed (for example, by screws) to the second surface 382 of the carrier plate 38 by using the fixing base 32 thereof, and the carrier plate 38 is The openings are aligned with the light source 20 of the illumination device 3a to expose the light sources 20. In the present embodiment, the light-emitting devices 3a are arranged in a 3 ^* 3 matrix. However, in other embodiments, the light-emitting devices 3a may be arranged in other types as needed.

However, the above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims.

1‧‧‧Learning lighting device

2‧‧‧An embodiment of the light-emitting device of the present invention

3‧‧‧Another embodiment of the light-emitting device of the present invention

3a‧‧‧Another embodiment of the illumination device of the invention

10‧‧‧Lighting diode (LED) components

12‧‧‧Substrate

14‧‧‧Cooling water

16‧‧‧ Container

20‧‧‧Light source

22‧‧‧Substrate

24‧‧‧Base

26‧‧‧heat pipe

28‧‧‧ Coolant

30‧‧‧ Engagement components

32‧‧‧ fixed seat

33‧‧‧Heat components

33a‧‧‧Heat components

34‧‧‧Center tube

36‧‧‧Heat fins

36a‧‧‧Solid fins

38‧‧‧Loading board

121‧‧‧The first surface of the substrate

122‧‧‧Second surface of the substrate

201‧‧‧ grain

202‧‧‧ Sealing material

203‧‧‧Wire

221‧‧‧The first surface of the substrate

222‧‧‧Second surface of the substrate

223‧‧‧ hole

224‧‧‧ slotted

241‧‧‧The first end of the base

242‧‧‧The second end of the base

243‧‧‧through holes

261‧‧‧heat pipe opening

262‧‧‧ outer casing

263‧‧‧Capillary structure

264‧‧‧ hollow accommodation space

321‧‧‧ center through hole

381‧‧‧ first surface of the carrier plate

382‧‧‧Second surface of the carrier plate

2431‧‧‧first opening

2432‧‧‧second opening

1 is a schematic cross-sectional view showing a conventional light-emitting device; FIG. 2 is a schematic perspective view showing an embodiment of the light-emitting device of the present invention; FIG. 3 is a partial cross-sectional view showing FIG. 3 is a schematic view showing the relationship between the relative light output and the service life of the light-emitting diode (LED) components at different junction temperatures; FIG. 6 is a perspective view showing another embodiment of the light-emitting device of the present invention. FIG. 7 is a schematic view showing the illuminating device of FIG. 2 assembled on a carrier plate; FIG. 8 is a schematic view showing the illuminating device of FIG. 4 assembled on a carrier plate; and FIG. 9 is a schematic view showing the illuminating device of FIG.

2‧‧‧An embodiment of the light-emitting device of the present invention

20‧‧‧Light source

22‧‧‧Substrate

24‧‧‧Base

26‧‧‧heat pipe

28‧‧‧ Coolant

30‧‧‧ Engagement components

32‧‧‧ fixed seat

201‧‧‧ grain

202‧‧‧ Sealing material

203‧‧‧Wire

221‧‧‧The first surface of the substrate

222‧‧‧Second surface of the substrate

223‧‧‧ hole

224‧‧‧ slotted

241‧‧‧The first end of the base

242‧‧‧The second end of the base

243‧‧‧through holes

261‧‧‧heat pipe opening

262‧‧‧ outer casing

263‧‧‧Capillary structure

264‧‧‧ hollow accommodation space

321‧‧‧ center through hole

2431‧‧‧first opening

2432‧‧‧second opening

Claims (12)

An illuminating device comprising: at least one light source; at least one substrate having at least one hole, the at least one light source being located on the at least one substrate, wherein the at least one hole is open to a surface of the at least one substrate, and relative to the At least one light source; at least one base having a uniform through hole, the through hole extending through the at least one base, the at least one substrate being adjacent to the at least one base, and the at least one hole communicating with the through hole; at least one heat pipe adjacent to The at least one base has a heat pipe opening, the heat pipe opening is connected to the through hole; and a coolant is located in the at least one hole, and the heat of the at least one light source is absorbed to form an evaporation gas at the Flowing inside a heat pipe. The illuminating device of claim 1, wherein the at least one substrate further has a first surface and a second surface, the at least one light source is located on the first surface of the at least one substrate, and the at least one hole is open to the at least one hole a second surface of the substrate; the at least one base further has a first end and a second end, the through holes are respectively open to the first end and the second end, and the at least one substrate is adjacent to the at least one substrate The first end of the base; the at least one heat pipe is adjacent to the second end of the at least one base. The illuminating device of claim 1, wherein the at least one light source is a light emitting diode (LED). The illuminating device of claim 1, wherein the at least one hole is a blind hole. The illuminating device of claim 2, wherein the at least one hole is further open to the The first surface of the at least one substrate is such that the cooling liquid contacts the at least one light source. The illuminating device of claim 1, wherein the cooling liquid is water, methanol, ethanol, ammonia or acetone. The illuminating device of claim 2, wherein the through hole has a first opening and a second opening at the first end and the second end of the at least one base, and the first opening is smaller than the second opening. The illuminating device of claim 1 further comprising an engaging component between the at least one substrate and the at least one base for engaging the at least one substrate and the at least one base, and the engaging component is a fine-filled hole Cold solder, ceramic cold solder or phosphor-filled encapsulant. The illuminating device of claim 1, wherein the at least one heat pipe comprises an outer casing and a capillary structure, the capillary structure being located on an inner side wall of the outer casing to define a hollow accommodating space and the heat pipe opening, so that the boil-off gas The heat pipe opens through the hollow accommodation space, and further exchanges heat with the external environment through the outer casing, and finally condenses into a liquid coolant. The illuminating device of claim 9, wherein the outer casing is made of metal, and the capillary structure is a copper mesh, copper powder burned or grooved. The illuminating device of claim 1, further comprising at least one heat dissipating component having a central tube and a plurality of heat dissipating fins, wherein the central tube is sleeved on the at least one heat pipe, and the heat dissipating fins are The outer tube extends and the central tube and the heat dissipating fins are integrally formed. The illuminating device of claim 1, further comprising at least one fixed seat and one bearing The at least one fixing base has a central through hole for receiving the base, and the at least one fixing seat is fixed on the carrying plate, the carrying plate has at least one opening for exposing the at least one a light source.