TWI457578B - Circuit board automated testing apparatus and method using the same - Google Patents

Description

Circuit board automatic testing device and method

The invention relates to a circuit board automatic testing device, in particular to a circuit board automatic testing device and method for fully automating circuit board testing.

The circuit board is the main component in various electronic device products. In order to maintain the yield of the product, the manufacturer of the electronic device performs various tests on the internal circuit board during the assembly process of the electronic device or before leaving the factory to eliminate the circuit board with functional defects and reduce the possibility of occurrence of the problem.

The current test method for the circuit board is to establish a test moving line, and each circuit board performs functional tests of different items in sequence along the test moving line. In order to perform more comprehensive testing, the board must be electrically connected to other corresponding components, such as CPU, memory, hard disk, various input and output modules, etc., and these components require the tester to manually insert the board. Pull out the work. However, manual manual insertion and removal of components will result in an extended test time and a large amount of human resources, which will increase the test cost; while the tester may be slightly inadvertent during the plugging process, it may be a connection to the board or a slot. Damage is caused, and severe cases will cause the board to be scrapped. In addition, many test projects rely on testers to judge their results with human senses, so it is easier to produce false positives, which in turn affects test quality.

Therefore, how to further improve and integrate the board test technology, so that the board test can be fully automated, is a subject worthy of study.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide an automatic board testing apparatus and method for fully automated testing of circuit boards.

In order to achieve the above object, the automatic board testing device of the present invention comprises a carrying platform and a device body. The carrying platform includes at least one sensing member and movably coupled to the device body such that the carrying platform can be moved relative to the device body to a test position within the device body or exposed to a standby position outside the device body. The device body comprises a main control module, an input/output connection module and a probe test module. After the main control module judges that the circuit board has been correctly placed on the carrying platform by at least one sensing component, the control carrying platform moves from the standby position to the test position; and controls the input/output connection module and the probe in the main control module. After the pin test module is electrically connected to the circuit board, power is supplied to the circuit board to perform a test operation.

The circuit board automatic testing method of the present invention is applied to the above integrated circuit board automatic testing device, and the method comprises the following steps: determining whether a circuit board is correctly placed on the carrying platform; if so, moving the carrying platform to the device body Testing the position; moving an input/output connection module to electrically connect at least one corresponding input/output connection interface of the circuit board; moving a probe test module to electrically connect at least one test point of the circuit board; when confirming the input and output After the connection module and the probe test module are electrically connected to the circuit board, power is supplied to the circuit board for a test operation.

In addition, the automatic test method of the circuit board of the present invention further comprises the steps of: interrupting power supply to the circuit board after the test operation is completed; moving the probe test module to disconnect from the electrical connection of at least one test point of the circuit board. a state in which the mobile input/output connection module is disconnected from the electrical connection state of at least one corresponding input/output connection interface of the circuit board; after confirming that the input/output connection module and the probe test module are moved, the mobile carrier platform is moved Exit the device body.

Therefore, the tester only needs to place the circuit board on the carrying platform, and after the judgment is correct, the entire testing operation process can be completed through the automatic board testing technology of the invention, which is tedious and labor-intensive compared to the conventional test design. And the test line of time, which can greatly reduce the test cost and improve the stability and accuracy of the test.

In order to enable the reviewing committee to better understand the technical contents of the present invention, the preferred embodiments are described below.

Please refer to Figure 1 and Figure 2 first. 1 is a structural diagram of an automatic test apparatus 1 for a circuit board of the present invention; and FIG. 2 is a system block diagram of an automatic test apparatus 1 for a circuit board of the present invention. As shown in FIG. 1, the circuit board automatic testing device 1 of the present invention is an all-in-one, that is, the corresponding circuit board can be executed by the board automatic testing device 1 of the present invention separately provided. Most test items simplify test line setup and achieve automated board test results. In an embodiment of the present invention, the automatic board testing device 1 of the present invention is used for testing a motherboard of a portable computer, but can also be applied to testing a circuit board such as a smart phone or other electronic device, and the present invention does not This is limited to this.

As shown in FIG. 1, the automatic board test apparatus 1 of the present invention includes a carrying platform 10 and a device body 20. The bearer platform 10 is used to carry the test to be tested. The circuit board 50 (shown in phantom in the figure) and the carrier platform 10 movably couples the device body 20 such that the carrier platform 10 moves relative to the device body 20. In the state in which the circuit board automatic testing device 1 of the present invention does not perform the circuit board test, the carrier platform 10 is located at a standby position and is exposed outside the device body 20 to facilitate placing the circuit board 50 to be tested; and when the circuit of the present invention is When the board automatic test apparatus 1 is to perform a board test, the carrier platform 10 is driven to move to a test position within the apparatus body 20 to perform a related test operation. In this embodiment, the carrier platform 10 is maintained in a substantially horizontal state regardless of whether it is in the standby position or the test position.

As shown in FIG. 1 and FIG. 2 , the loading platform 10 includes at least one sensing component 11 , and each sensing component 11 is electrically connected to the main control module 21 of the device body 20 , and is sensed by at least one sensing component 11 . As a result, the main control module 21 determines whether the circuit board 50 to be tested has been correctly placed on the carrier platform 10 to determine the subsequent test flow. In an embodiment of the present invention, each of the sensing members 11 can be a pressure sensor or a proximity sensor (such as a photo sensor), and whether the circuit board 50 is placed by being pressed or blocked. To the positioning, but the type of sensing member 11 used is not limited thereto. In addition, components such as stoppers or fixing posts can be provided on the carrying platform 10 for the circuit board 50 to be tested, so that the circuit board 50 to be tested can be more easily placed on the carrying platform 10 in a fixed position.

The device body 20 includes a main control module 21, an input/output connection module 22, a probe test module 23, a heat dissipation module 24, and a plurality of drive modules 25, 25a, 25b. The main control module 21 is electrically connected to each of the foregoing modules in the device body 20 for controlling or connecting the relevant modules during the testing process.

The input/output connection module 22 is configured to fix at least one input/output connection interface. Since the circuit board 50 needs to be electrically connected to other external input/output devices (such as a hard disk, a display, a keyboard, a sound source device, a network component, or a power source) during the board test to test each corresponding input on the circuit board. The input/output connection interface of the external input/output device is fixed to the corresponding interface of the circuit board 50 by the input/output connection module 22, so that the input/output connection interface of the external input/output devices is fixed. After the loading platform 10 is moved to the test position, the input/output connection module 22 can be substantially horizontally moved relative to the loading platform 10 to electrically connect the circuit board by at least one input/output connection interface during the test. Interface; however, the invention is not limited thereto. The position of at least one input/output connection interface fixed by the input/output connection module 22 can be adjusted according to different specifications of the circuit board.

The probe test module 23 is used to test at least one test pad on the circuit board. The probe test module 23 includes at least one probe (not shown). When the probe test module 23 is moved to the test position on the carrying platform 10, the probe test module 23 can be moved substantially vertically relative to the load bearing platform 10 for testing. The at least one test point on the circuit board is electrically connected by at least one probe for performing a corresponding electrical test.

The heat dissipation module 24 is used to provide heat dissipation during board testing. After the heat dissipation module 24 is moved to the test position, the heat dissipation module 24 can be moved substantially vertically with respect to the load bearing platform 10 to directly contact the load bearing platform 10 or the circuit board by the heat dissipation module 24 during the test to facilitate execution. heat radiation. The heat dissipation module 24 can be a water-cooled heat dissipation module, but the invention is not limited thereto.

Each of the driving modules 25 can be respectively disposed corresponding to the carrying platform 10, the input/output connecting module 22, the probe testing module 23, and the heat dissipation module 24, and mainly provides a driving and carrying platform 10, an input/output connection module 22, The probe test module 23 and the heat dissipation module 24 perform the function of moving. Each of the driving modules 25 is configured to correspond to the driving platform 10, the input/output connection module 22, the probe testing module 23, and the heat dissipation module 24 according to the test procedure of the circuit board according to the instruction of the main control module 21. Here, each of the driving modules 25 can use the cylinder as a power source, and the bearing platform 10 or each module is moved in accordance with the corresponding sliding component design, but is not limited to the embodiment.

In addition, in the embodiment, the device body 20 further includes a display module 26, and the main control module 21 can be tested by the display module 26 corresponding to the display circuit board during or after the test for the circuit board. The status or test results so that the tester can distinguish the board from the good.

The device body 20 further includes a plurality of foolproof components 27, and the plurality of foolproof components 27 respectively correspond to the movement path of the loading platform 10, the input/output connection module 22, and the probe test module 23, for example, the movement of the module. The starting point or/and the ending point are electrically connected to the main control module 21. Each of the foolproof components 27 can adopt a switch form, and the signal can be generated to the main control module 21 by the carrier platform 10 or the foregoing module moving to a certain position and then triggering the corresponding anti-dead component 27 to assist the main control module. 21 confirm whether to stop driving the carrier platform 10, the input/output connection module 22 or the probe test module 23 to move.

In this embodiment, the device body 20 further includes a barcode identification module 28 for identifying the label barcode information attached on the circuit board. The label barcode information may include a node address (MAC ID). The related information is processed by the decoding and the like for the barcode recognition module 28 to burn the MAC ID and the like to the circuit board for the circuit board to perform the network function. When testing a circuit board configured with an image capturing module (such as a camera, etc.), first, the image capturing module is aligned with the position of the label barcode information (for example, by pre-adjusting the circuit board on the carrying platform 10) The image recognition module 28 drives the image capture module of the circuit board through the main control module 21 to perform an image capture operation on the label barcode information to obtain an image; Finally, the barcode recognition module 28 recognizes and obtains the MAC ID from the image through the image decoding process, and burns it into the circuit board. The bar code recognition module 28 can further set an optical component (for example, a convex lens) having an imaging magnification effect, and move the optical component between the image capturing module and the tag barcode information before performing the image capturing operation, thereby enlarging the label barcode. Information to improve the recognition of images after capture.

Please refer to FIG. 3, which is a system block diagram of the main control module 21 of the automatic board testing device 1 of the present invention.

As shown in FIG. 2 and FIG. 3, in an embodiment of the present invention, the main control module 21 includes a main control unit 211, a driving control unit 212, a monitoring and alerting unit 213, a detecting and feedback unit 214, and a communication unit 215. The test unit 216 and the like are automated, and the main control unit 211 and the aforementioned units are electrically connected to each other. In an embodiment of the present invention, each of the foregoing units is configured in the form of a chip module or a circuit, but the invention is not limited thereto.

The main control unit 211 can include a microcontroller and a protection circuit thereof, and store logic control actions and operation setting values for performing board test inside the microcontroller to determine and process various control commands; The circuit is placed around the microcontroller to achieve electrostatic protection and prevent electromagnetic interference.

The driving control unit 212 is configured to receive the electrical signals sent from the respective foolproof components 27, and after processing, send the electrical signals to the main control unit 211. The driving control unit 212 also receives the electrical signals sent by the main control unit 211 to notify the corresponding signals. The drive module 25 starts or stops operating.

The monitoring alert unit 213 determines the device test running state through the instant feedback of the motherboard test program, and when the operation generates an abnormality, the monitoring alert unit 213 can send a warning signal to notify the field tester, such as an optical signal or an audio signal.

The detection and feedback unit 214 is configured to confirm the detection and feedback of the power supply status of the circuit board during the test of the circuit board. When the circuit board begins to perform the test operation, the detection and feedback unit 214 detects the power sequence on the circuit board. Once the last power supply is generated, the detection and feedback unit 214 can be detected. The main control unit 211 is notified to drive the circuit board to start up, to ensure that the power supply on the circuit board is normal, and to prevent possible damage of parts. When the circuit board ends the test operation, the detection and feedback unit 214 can notify the main control unit 211 to interrupt the power supply to the circuit board after detecting that the circuit board generates the last interrupt supply, and ensure that the circuit board does not generate an abnormality before the circuit board is closed. Power off to prevent board settings or safety.

The communication unit 215 is configured to electrically connect the main control module 21 and the circuit board, and transmit and receive commands and test results between the main control module 21 and the circuit board by corresponding electrical signal conversion.

The automatic test unit 216 can accept the test command issued by the device body through the communication unit 215, and close or open the electronic switch or the gate circuit through the processing instruction given by the main control unit 211 to implement the analog test.

Please refer to Figure 4 to Figure 6 together. 4 is a schematic diagram of the carrying platform 10 of the automatic board testing device 1 of the present invention in a standby position; FIG. 5 is a schematic diagram of the carrying platform 10 of the automatic board testing device 1 of the present invention at a test position; FIG. 6 is a schematic diagram of the present invention; A schematic diagram of the electrical connection of the input/output connection module 22 of the automatic test device 1 of the circuit board to the circuit board 50. It should be noted that, in order to clearly show the structural design and operation mode of the specific module of the automatic test device 1 of the present invention, only some modules of the automatic test device 1 of the present invention are partially shown in FIG. 4 to FIG. Hereby explain.

As shown in FIG. 4, when the circuit board automatic test apparatus 1 of the present invention does not perform any circuit board test operation, the carrier platform 10 is located at the standby position as shown and at least a portion is exposed outside the apparatus body 20 for testing personnel. Place the board 50 to be tested. When the tester places the circuit board 50 on the carrying platform 10, each sensing component 11 of the carrying platform 10 transmits the sensing signal to the main control module (not shown) for judging whether the circuit board 50 is placed or not. . For example, assume that the carrying platform 10 is provided with three sensing members 11 in accordance with the currently tested circuit board form (as shown by the dotted circle in the figure), when the tester places the circuit board 50 of the same specification and is placed in the correct position, The three sensing members 11 are pressed or shielded by the circuit board 50 to generate corresponding sensing signals. At this time, the main control module can judge that the circuit board 50 has been correctly placed on the carrying platform 10, and then starts to move the bearing. Platform 10. On the other hand, if the specifications of the circuit board 50 do not match or are not correctly placed, only one or two sensing elements 11 may generate corresponding sensing signals. At this time, the main control module determines that the circuit board 50 is not correctly placed on the carrying platform 10. Therefore, subsequent test jobs will not be performed.

As shown in FIG. 4 and FIG. 5, after the main control module determines that the circuit board 50 has been correctly placed on the carrying platform 10, the driving module (not shown) can be notified to drive the carrying platform 10, so that the carrying platform 10 is self-contained. The standby position of FIG. 4 moves to the test position of FIG. 5, and the carrying platform 10 enters the apparatus body 20. When the carrying platform 10 is moved to the test position, the carrying platform 10 triggers the foolproof component 27a disposed on the moving path of the carrying platform 10, and the foolproof component 27a sends a signal to the main control module; the main control module After receiving the signal, the driver module can be notified to stop driving the carrier platform 10, so that the carrier platform 10 is fixed at the test position for subsequent testing operations.

As shown in FIGS. 5 and 6, the input/output connection module 22 is disposed at the periphery of the periphery of the carrier platform 10 at the test position. After confirming that the carrying platform 10 is fixed at the test position, the main control module then notifies the other driving module 25a to drive the input/output connecting module 22, so that the input/output connecting module 22 moves substantially horizontally relative to the carrying platform 10. . Since the position and height of each external device connection interface fixed by the input/output connection module 22 are matched with the corresponding input/output connection interfaces 51 of the circuit board 50, the input/output connection module 22 is substantially parallel to the carrier platform. When the plane moves toward the carrying platform, the corresponding input/output connection interface 51 of the circuit board 50 and the external device connection interfaces fixed by the input/output connection module 22 are electrically connected to each other for testing the circuit board 50. Provide signal or data transfer function. Similarly, when the input / output connection module When moving to the positioning position, the input/output connection module 22 triggers the foolproof component 27b disposed on the moving path of the input/output connection module 22, so that the main control module notifies the driving module to stop driving the input/output connection mode. Group 22 is fixed for subsequent testing.

Please refer to FIG. 7 , which is a schematic diagram of the probe test module 23 and the carrying platform 10 of the automatic board testing device 1 of the present invention. It is to be noted that, in order to clearly show the structural design of the specific module of the automatic test device 1 of the present invention, only a part of the module of the automatic test device 1 of the present invention is partially shown in FIG.

As shown in FIG. 7, the probe test module 23 is disposed above the carrier platform 10 at the test location. The probe test module 23 includes at least one probe 231 and at least one buffer structure 232. The position of the at least one probe 231 corresponds to the position of at least one test point 52 on the circuit board 50. After the carrying platform 10 is moved to the aforementioned test position, the probe test module 23 can move substantially perpendicular to the position of the carrying platform 10 relative to the carrying platform 10 (ie, in the direction of the arrow in the figure), by at least one probe. The pin 231 is electrically connected to at least one test point 52 on the circuit board 50 for performing a corresponding electrical test.

The at least one buffer structure 232 is made of a plastic or elastic material and is disposed at a position corresponding to the tool hole 53 (for example, a screw hole or the like) on the circuit board 50. During the process of the probe test module 23 moving substantially perpendicularly toward the carrying platform 10, each buffer structure 232 abuts the circuit board 50, and on the other hand, the probes 231 of the probe test module 23 are offset to the circuit board. The stress of 50, on the other hand, limits the distance that the probe test module 23 moves substantially perpendicularly toward the load bearing platform 10.

In addition, in one embodiment of the present invention, the carrying platform 10 further includes at least one guiding structure 12, and the probe testing module 23 further includes at least one corresponding guiding structure 233, and each guiding structure 12 of the carrying platform 10 The setting position corresponds to the position of each corresponding guiding structure 233 of the probe testing module 23, and the two structures are matched with each other. For example, each guiding structure 12 of the carrying platform 10 is a perforation, and the probe testing module 23 Each of the corresponding guiding structures 233 is a guiding post, but the invention is not limited thereto. During the movement of the probe test module 23 substantially perpendicular to the load bearing platform 10, the respective guide structures 12 cooperate with the corresponding guide structures 233, so that the probe test module 23 can be stably moved toward the load bearing platform 10.

Please refer to FIG. 8 and FIG. 9 together. 8 is a schematic diagram of the position of the probe test module 23 and the heat dissipation module 24 of the automatic test device 1 of the present invention before testing; FIG. 9 is a probe test module 23 of the automatic test device 1 of the circuit board of the present invention. And the position of the heat dissipation module 24 at the time of testing. It should be noted that, in order to clearly show the operation mode of the specific module of the automatic test device 1 of the present invention, only some modules of the automatic test device 1 of the present invention are partially shown in FIG. 8 and FIG. .

As shown in FIG. 8, the heat dissipation module 24 is disposed below the carrier platform 10 at the test position. The probe test module 23 and the heat dissipation module 24 (shown by thick dashed lines in the figure) are designed by corresponding structures to simultaneously drive the probe test module 23 and the heat dissipation module 24 to move in opposite directions by using the same drive module 25b. . In this embodiment, the driving module 25b is coupled to a base 30, and the base 30 can be moved toward the axial direction L of one of the substantially parallel bearing platforms 10 by driving the driving module 25b. The base 30 includes a plurality of first guiding slots 31 and a plurality of second guiding slots 32 corresponding to the disposed position, and corresponding to the first guiding The groove 31 and the second guide groove 32 are staggered with each other but do not actually intersect to form an X-shaped track as shown in FIG. The probe test module 23 can be slid along each of the first guiding slots 31 by the first roller members 234, and the heat dissipation module 24 can be along the second guiding slots by the second roller members 241. 32 slips.

Therefore, after the carrying platform 10 is moved to the test position, the main control module can notify the driving module 25b to drive the base 30 to move from the position of FIG. 8 to the position of FIG. 9, and the base 30 will be first by each. The guiding slot 31 and the second guiding slot 32 respectively guide the probe test module 23 and the heat dissipation module 24 to move at the same time, and the first roller members 234 of the probe testing module 23 are directed along the first guiding slots 31. The slide test moves the probe test module 23 downward toward the load bearing platform 10 to electrically connect the test points 52 of the circuit board 50 by the probe 231; and the second roller members 241 of the heat dissipation module 24 are along Each of the second guiding slots 32 slides upward, so that the heat dissipation module 24 moves upward toward the carrying platform 10, so that it directly contacts the carrying platform 10 or the circuit board 50 to provide a heat dissipation effect.

Finally, when the main control module confirms that the carrying platform 10 on which the circuit board is placed moves to the test position, the input/output connection module 22 is electrically connected to the corresponding input/output interface of the circuit board 50, and the probe test module 23 After the test points 52 of the circuit board 50 are electrically connected, and the heat dissipation module 24 directly contacts the carrier platform 10 or the circuit board 50, the circuit board 50 can be powered to perform a test operation to obtain a corresponding test result.

By adopting the design of the present invention, instead of setting up a lengthy test moving line to carry out testing of different items on the circuit board, the circuit board can be placed on the carrying platform of the present invention, and the circuit of the integrated design can be utilized. The board automatic test device 1 completes the entire test operation, which not only saves manpower and time cost, but also improves the stability and accuracy of the test.

Please refer to FIG. 10, which is a flow chart of the automatic test method for the circuit board of the present invention. It should be noted that the automatic test method for the circuit board of the present invention is described below by taking the automatic test device 1 of the circuit board shown in FIG. 2 as an example, but the present invention is not limited to the automatic test device 1 for the circuit board, and any other A circuit board automatic test apparatus having a similar architecture can also be applied to the method of the present invention. As shown in FIG. 10, the automatic board test method of the present invention includes steps S1 to S6. The various steps of the method are described in detail below.

Step S1: It is judged whether a circuit board 50 is correctly placed on the carrying platform 10.

After the tester places the circuit board 50 on the carrying platform 10, the main control module 21 can determine whether the circuit board 50 is correctly placed on the carrying platform 10 by using the sensing signals sent by the plurality of sensing components 11. . If yes, proceed to step S2; if not, it means that the tester may place the board or circuit board with different specifications in the wrong position, and the main control module 21 may issue a warning signal to remind the tester to replace the circuit board or re-install it. Place.

Step S2: If the circuit board has been correctly placed on the carrier platform 10, move the load bearing platform 10 to the test position within the device body 20.

After the circuit board is correctly placed on the carrying platform 10, the main control module 21 can notify the driving module 25 of the corresponding carrying platform 10 to start operating, and move the carrying platform 10 from the standby position exposed outside the device body 20 to The test location within the device body 20 for subsequent testing operations.

Step S3: Moving an input/output connection module 22 to electrically connect at least one corresponding input/output connection interface 51 of the circuit board 50.

Once the carrier platform 10 is moved to the test location, preparation for board testing can begin. The main control module 21 can notify the driving module 25a of the corresponding input/output connection module 22 to start operation, and move the input/output connection module 22 along the plane of the substantially parallel bearing platform 10 toward the carrying platform 10 to make the input. The at least one connection interface of the output connection module 22 can be electrically connected to at least one corresponding input/output connection interface of the circuit board 50, so as to perform signal and command transmission through the electrical connection of the interfaces during the test. Power supply, etc.

Step S4: Moving a probe test module 23 to electrically connect at least one test point of the circuit board 50.

After the loading platform 10 is moved to the test position, the main control module 21 can notify the driving module 25b of the corresponding probe testing module 23 to start operation, and the probe testing module 23 located above the carrying platform 10 faces the carrying platform 10 The direction of the vertical load bearing platform 10 is moved (ie, moved downward), so that at least one probe of the probe test module 23 is electrically connected to at least one test point of the circuit board 50 for performing a corresponding electrical test of the circuit board 50.

When the circuit board automatic testing device 1 is provided with the heat dissipation module 24, the automatic circuit board testing method of the present invention further includes step S5: moving a heat dissipation module 24 to contact the carrier platform 10 or the circuit board 50.

After the load bearing platform 10 is moved to the test position, the main control module 21 can notify the driving module 25b of the corresponding heat dissipation module 24 to start operation, and the heat dissipation module 24 located under the load bearing platform 10 is substantially vertically loaded toward the load bearing platform 10. The platform 10 moves (ie moves upwards), so that the heat dissipation module 24 contacts the carrier platform 10 or the circuit board 50 to provide heat dissipation during board testing.

It should be noted that the foregoing steps S3 to S5 have no absolute execution order, and the present invention is not limited thereto, that is, steps S3 to S5 can adjust the sequential execution of the steps according to different requirements or implementation states.

After step S4 or S5, step S6 is performed: after the input/output connection module 22 and the probe test module 23 are electrically connected to the circuit board 50, and the heat dissipation module 24 has contacted the carrier platform 10 or the circuit board 50, Power is supplied to the circuit board 50 for testing operations.

When the main control module 21 confirms that the carrying platform 10 is moved to the test position, the corresponding input/output connection module 22 and the probe test module 23 have been moved to the position and electrically connected to the circuit board 50, and the heat dissipation module 24 After having moved to position to contact the carrier platform 10 or the circuit board 50, the previous preparation process indicating that the circuit board 50 is being tested has been completed, so the main control module 21 can begin to power the circuit board 50 for testing. The main control module 21 can confirm whether the module has been moved to the positioning by the signal sent by each anti-danger component, but the invention is not limited thereto. In addition, before the power supply to the circuit board 50, the main control module 21 can detect the power supply timing of the circuit board 50 by the detecting and feedback unit to determine the time point at which the circuit board 50 can be powered.

In addition, FIG. 11 is another flow chart of the automatic test method for the circuit board of the present invention, which illustrates the corresponding execution steps after the test operation of the circuit board is completed. As shown in FIG. 11, the automatic board testing method of the present invention further includes steps S7 to S11, and the steps of the method will be described in detail below.

After the foregoing step S6, the step S7 is performed: after the test operation is completed, the power supply to the circuit board is interrupted.

After the test operation is completed, the main control module 21 can also detect the power supply timing of the circuit board 50 by detecting the power supply timing of the circuit board 50, and then the main control module 21 can be interrupted. The power supply to the board can be interrupted.

In the state in which the heat dissipation module 24 is disposed and moved, the automatic board test method of the present invention further includes step S8: moving the heat dissipation module 24 to be out of contact with the carrier platform 10 or the circuit board 50.

After the test operation is completed, the main control module 21 can notify the driving module 25b of the corresponding heat dissipation module 24 to start operating, and move the heat dissipation module 24 to the substantially vertical bearing platform 10 away from the loading platform 10 (ie, move downward) The heat dissipation module 24 is brought out of contact with the carrier platform 10 or the circuit board 50.

Step S9 is performed after step S7 or S8: moving the probe test module 23 to disengage the electrical connection state of at least one test point of the circuit board 50.

After the test operation is completed, the main control module 21 can notify the driving module 25b of the corresponding probe testing module 23 to start operating, and move the probe testing module 23 to the substantially vertical carrying platform 10 away from the carrying platform 10 ( That is, moving upwards, the at least one probe of the probe test module 23 is disconnected from the electrical connection state of at least one test point of the circuit board 50.

Step S10: The input/output connection module 22 is moved to be disconnected from the electrical connection state of at least one corresponding input/output connection interface of the circuit board 50.

After the test operation is completed, the main control module 21 can notify the driving module 25a of the corresponding input/output connection module 22 to start operating, and move the input/output connection module 22 substantially horizontally away from the carrying platform 10. The at least one connection interface of the input/output connection module 22 is disconnected from the electrical connection state with at least one corresponding input/output connection interface of the circuit board 50.

Similarly, the foregoing steps S8 to S10 have no absolute execution order, and the present invention is not limited thereto, that is, steps S8 to S10 can be adjusted in sequence according to different requirements or implementation states.

Step S11: After confirming that the input/output connection module, the probe test module, and the heat dissipation module are moved to the positioning, the carrier platform is moved to exit the device body.

When the main control module 21 confirms that the input/output connection module 22 and the probe test module 23 have moved to the position and are disconnected from the electrical connection with the circuit board 50, the heat dissipation module 24 has also moved to the position and is separated. After the contact with the platform 10 or the circuit board 50, the circuit board 50 is disconnected from the modules. Therefore, the main control module 21 can notify the driving module 25 of the corresponding carrier platform 10 to start operation, and the platform will be carried. 10 moves from the test position in the device body 20 to a standby position exposed outside the device body 20, so that the tester takes out the circuit board and completes the entire test process. The main control module 21 can confirm whether the module has been moved to the positioning by the signal sent by each anti-danger component, but the invention is not limited thereto.

In summary, the present invention exhibits features that are different from conventional techniques in terms of purpose, means, and efficacy. It should be noted that the above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to be limiting The scope of the invention is made. Modifications and variations of the embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. The scope of protection of the present invention should be as described in the scope of the patent application to be described later.

1‧‧‧Circuit board automatic test device

10‧‧‧Loading platform

11‧‧‧Sensors

12‧‧‧Guide structure

20‧‧‧ device body

21‧‧‧Master Module

211‧‧‧Main control unit

212‧‧‧Drive Control Unit

213‧‧‧Monitoring warning unit

214‧‧‧Detection and feedback unit

215‧‧‧Communication unit

216‧‧‧Automatic test unit

22‧‧‧Input/Output Connection Module

23‧‧‧ Probe Test Module

231‧‧‧ probe

232‧‧‧buffer structure

233‧‧‧ Corresponding guiding structure

234‧‧‧First roller

24‧‧‧ Thermal Module

241‧‧‧Second roller

25, 25a, 25b‧‧‧ drive module

26‧‧‧Display module

27, 27a, 27b‧‧‧ foolproof components

28‧‧‧Barcode Identification Module

30‧‧‧Base

31‧‧‧First channel

32‧‧‧Second guiding channel

50‧‧‧ boards

51‧‧‧ corresponding input/output connection interface

52‧‧‧Test points

53‧‧‧Tool hole

1 is a structural view of an automatic test apparatus for a circuit board of the present invention.

2 is a system block diagram of an automatic board test apparatus of the present invention.

3 is a system block diagram of a main control module of the automatic test device for a circuit board of the present invention.

4 is a schematic view showing the carrying platform of the automatic test device for a circuit board of the present invention in a standby position.

FIG. 5 is a schematic view showing the carrying platform of the automatic test device for a circuit board of the present invention at a test position.

6 is a schematic diagram showing the electrical connection between the input/output connection module of the automatic board test device of the present invention and the circuit board.

7 is a schematic diagram of a probe test module and a load bearing platform of the automatic test device for a circuit board of the present invention.

FIG. 8 is a schematic view showing the position of the probe test module and the heat dissipation module of the automatic board test device of the present invention before the test.

FIG. 9 is a schematic diagram showing the position of a probe test module and a heat dissipation module of the automatic test device for a circuit board of the present invention during testing.

Figure 10 is a flow chart showing the automatic test method of the circuit board of the present invention.

Figure 11 is another flow chart of the automatic test method for the circuit board of the present invention.

1‧‧‧Circuit board automatic test device

10‧‧‧Loading platform

11‧‧‧Sensors

20‧‧‧ device body

21‧‧‧Master Module

22‧‧‧Input/Output Connection Module

23‧‧‧ Probe Test Module

24‧‧‧ Thermal Module

25‧‧‧Drive Module

26‧‧‧Display module

27‧‧‧Dangerproof components

Claims (16)

An automatic testing device for a circuit board includes: a carrying platform for carrying a circuit board, the carrying platform comprising at least one sensing component; and a device body movably coupled to the device body, the carrying platform being The device body is moved to a test position in the body of the device or exposed to a standby position outside the device body; the device body includes: a main control module; and an input/output connection module for fixing at least one An input/output connection interface, wherein the input/output connection module is movable relative to the carrier platform that is moved to the test position to electrically connect at least one corresponding input of the circuit board by the at least one input/output connection interface/ And a probe test module, comprising: at least one probe, wherein the probe detection module is movable relative to the carrier platform that is moved to the test position, to electrically connect the circuit by the at least one At least one test point of the board; wherein the main control module controls the bearing after the at least one sensing component detects that the circuit board has been correctly placed on the carrying platform Platform moves from the standby position to the test position; and the control of the input / output module is connected to the circuit board is connected to the test probe is electrically module, the power supply to the circuit board to execute a test job. The automatic testing device of the circuit board of claim 1, wherein the carrying platform further comprises at least one guiding structure, and the probe testing module further comprises at least one corresponding guiding corresponding to the at least one guiding structure. Knot The guiding test module can be stably moved in a direction substantially perpendicular to the carrying platform by the guiding structures of the guiding structures. The automatic board testing device of claim 2, wherein the probe testing module further comprises at least one buffer structure, and the probe testing module is substantially vertically moved toward the carrying platform. Each of the buffer structures abuts the circuit board to offset the stress applied to the circuit board by the probe test module. The automatic board testing device of claim 1, wherein the device body further comprises a plurality of driving modules, wherein the main control module respectively drives the carrying platform and the input/output connection by the plurality of driving modules The module and the probe test module are moved. The automatic board test device of claim 4, wherein the device body further comprises a heat dissipation module, wherein the heat dissipation module is movable relative to the carrier platform moved to the test position to contact the carrier platform Or the circuit board; wherein the main control module drives the heat dissipation module to contact the carrier platform or the circuit board by the plurality of driving modules before the test operation is performed on the circuit board. The automatic board testing device of claim 4, wherein the device body further comprises a plurality of foolproof components, the plurality of foolproof components are corresponding to the carrying platform, the input/output connecting module and the probe testing The movement path setting of the module is used for the main control module to confirm whether to stop driving the loading platform, the input/output connection module or the probe test module to move. The automatic test device of the circuit board of claim 1, wherein the device body further comprises a code recognition module for driving an image capture module of the circuit board, and extracting the image on the circuit board An image of the label barcode information is attached, and the barcode recognition module identifies and acquires a node address from the image through the image decoding process to be burned in the circuit board. The automatic board testing device of claim 1, wherein the main control module comprises a monitoring warning unit for instantly determining the running status of the testing operation and issuing a warning signal when an abnormality occurs. The automatic test device of the circuit board of claim 1, wherein the main control module includes a detection and feedback unit for detecting a power sequence of the circuit board to determine whether The board begins to power up to perform the test or interrupt power to end the test. The automatic board test apparatus of claim 1, wherein the input/output connection module remains substantially horizontally moved relative to the carrier platform. The automatic board testing device of claim 1, wherein the device body further comprises a display module for displaying the status or result of the testing operation of the circuit board. An automatic testing method for a circuit board is applied to an integrated testing device, the integrated testing device comprising a device body and a carrying platform, the method comprising the steps of: determining whether a circuit board is correctly placed on the carrying platform; If yes, moving the carrying platform to a test position in the body of the device; Moving an input/output connection module to electrically connect at least one corresponding input/output connection interface of the circuit board; moving a probe test module to electrically connect at least one test point of the circuit board; and when confirming the input After the output connection module and the probe test module are electrically connected to the circuit board, power is supplied to the circuit board for a test operation. The method for automatically testing a circuit board according to claim 12, further comprising the steps of: interrupting power supply to the circuit board after the test operation is completed; moving the probe test module to disengage the circuit board An electrical connection state of the at least one test point; moving the input/output connection module to be disconnected from an electrical connection state of the at least one corresponding input/output connection interface of the circuit board; and confirming the input/output connection module and the probe After the needle test module is moved, the carrier platform is moved to exit the device body. The method for automatically testing a circuit board according to claim 13 , wherein before the power is supplied to the circuit board, the method further comprises the steps of: moving a heat dissipation module to contact the load platform or the circuit board, and confirming the heat dissipation mode The group has contacted the carrier platform or the circuit board. The method for automatically testing a circuit board according to claim 14, wherein before moving the carrier platform to exit the device body, the method further comprises the steps of: moving the heat dissipation module to disengage the carrier platform or the circuit board. The contact state and confirm that the heat dissipation module has been moved. The method for automatically testing a circuit board according to claim 12, wherein the power supply timing of the circuit board is detected before the power is supplied to the circuit board or before the power supply to the circuit board is interrupted. Whether to start powering or interrupting power to the board.