TWI440969B - Method for making light blocking member array - Google Patents

Description

Method for manufacturing shading element array

The present invention relates to a method of fabricating an optical component, and more particularly to a method of fabricating a wafer level shading element array.

With the development of camera technology, the combination of lens modules and various portable electronic devices such as mobile phones, cameras, computers, etc., has been favored by many consumers. Therefore, the market demand for miniaturized lens modules has increased.

At present, the miniaturized lens module uses a precision mold and other processes to manufacture micro-optical components, and then electrically connects, packages, and then cuts the image sensor made of the silicon wafer to obtain a camera module. However, as portable electronic devices are becoming more compact, the distance between the image sensor and other electronic components such as capacitors and inductors in the portable electronic device is also becoming shorter and shorter, thereby making the image sensor work. The electromagnetic wave interference generated by the operation of other electronic components such as capacitors and inductors (that is, when the portable electronic device receives or transmits an electronic signal) is also becoming more and more serious, which directly leads to a decrease in the imaging quality of the camera module.

In view of the above, it is necessary to provide a method of manufacturing a light shielding element array that is resistant to electromagnetic interference.

A method of manufacturing a light shielding element array, comprising the steps of: (1) providing a light-transmissive plate; (2) providing a light-shielding layer on the light-transmissive plate; (3) forming a magnetic shield layer on the light-shielding layer, and (4) applying a photoresist layer on the magnetic shield layer, The photoresist layer includes a central region of a plurality of spaced apart distributions and a peripheral region surrounding the plurality of central regions; (5) exposing and developing to remove photoresist on the plurality of central regions; and (6) performing the magnetic shield layer and the light shielding layer Etching to expose the light transmissive plate facing the plurality of central regions to the outside; (7) removing the photoresist on the peripheral region to form an array of shading elements.

Compared with the prior art, the shading element array prepared by the method for manufacturing the shading element array according to the present invention not only has a shading function but also can prevent external electromagnetic interference, thereby improving imaging of the lens module array having the shading element array. quality.

100, 300‧‧‧ shading element array

10‧‧‧Lighting plate

20‧‧‧Filter layer

30‧‧‧ shading shield

301‧‧‧Lighting layer

303‧‧‧Magnetic shielding

305, 305a, 501‧‧‧ light hole

3031‧‧‧ copper film layer

3033‧‧‧Stainless steel film layer

101‧‧‧ first surface

102‧‧‧ second surface

40‧‧‧ photoresist layer

401‧‧‧Central area

402‧‧‧ surrounding area

50‧‧‧Photomask

403‧‧‧Light resistance

200‧‧‧ lens module array

60, 70‧‧‧ alignment holes

400‧‧‧ lens array

80‧‧‧ lenses

90‧‧‧ alignment structure

1 is a perspective view of a light shielding element array according to a first embodiment of the present invention.

Figure 2 is a cross-sectional view taken along line II-II of Figure 1.

3 is a flow chart showing a method of manufacturing the light shielding element array of FIG. 2.

Figure 4 is a schematic view of a light transmissive plate provided.

FIG. 5 is a schematic view showing a filter layer disposed on the light-transmissive plate of FIG. 4.

Figure 6 is a schematic view showing the formation of a light shielding layer on the filter layer of Figure 5.

FIG. 7 is a schematic view showing the formation of a magnetic shielding layer on the light shielding layer of FIG. 6. The magnetic shielding layer includes a copper thin film layer and a stainless steel thin film layer which are sequentially disposed outward from the light shielding layer.

Figure 8 is a schematic view showing the application of a photoresist layer on the stainless steel film layer of Figure 7, the photoresist layer having a central region of a plurality of spaced apart distributions and a peripheral region surrounding the plurality of central regions.

Figure 9 is a schematic view showing exposure of the photoresist on the peripheral region of Figure 8.

Figure 10 is a schematic illustration of the removal of photoresist on a plurality of central regions after development.

Figure 11 is a schematic view showing the porcelain shield layer and the light-shielding layer of Figure 10 etched to expose the filter layer facing the plurality of central regions.

Figure 12 is a schematic view showing the formation of alignment holes by the array of masks in Figure 2;

FIG. 13 is a schematic diagram of a lens module array according to a second embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2, which are schematic diagrams of a light shielding device array 100 according to a first embodiment of the present invention. The light shielding element array 100 includes a light transmitting plate 10 and a filter layer 20 and a light shielding layer 30 which are disposed outward from the light transmitting plate 10 . The light shielding layer 30 includes a light shielding layer 301 and a magnetic shielding layer 303 which are disposed outward from the filter layer 20 in order. The light shielding layer 30 has a plurality of light-dissipating apertures 305 spaced apart. The magnetic shield layer 303 includes a copper thin film layer 3031 and a stainless steel thin film layer 3033 which are sequentially outward from the light shielding layer 301.

Please refer to FIG. 3 , which is a flow chart of a method for manufacturing the shading element array 100 . The method comprises the following steps: (1) providing a light-transmissive plate; (2) providing a light-shielding layer on the light-transmissive plate; (3) forming a magnetic shielding layer on the light shielding layer; (4) applying a photoresist layer on the magnetic shielding layer, the photoresist layer including a central region of a plurality of spaced intervals and a peripheral region surrounding the plurality of central regions; Exposing and developing to remove the photoresist on the central region; (6) etching the magnetic shield layer and the light shielding layer to expose the transparent flat plate facing the plurality of central regions; (7) The photoresist on the peripheral region is removed to form an array of shading elements.

The method of manufacturing the light shielding element array 100 will be described in detail below.

Referring to Figure 4, a light transmissive plate 10 is first provided. The light transmissive plate 10 has a first surface 101 and a second surface 102 opposite thereto. In this embodiment, the light transmissive plate 10 is made of glass. Of course, the light transmissive plate 10 can also be made of a light transmissive material such as plastic.

Referring to FIG. 5, a filter layer 20 is disposed on the first surface 101 of the transparent plate 10 to prevent noise from being generated by an image sensor (not shown). The filter layer 20 can be of different design to achieve filtering of light of different wavelengths. In this embodiment, the filter layer 20 is an infrared cut filter film. Of course, the filter layer 20 can also be other types of filters such as a low pass filter film, an ultraviolet cut filter film, or other types of filters such as an infrared cut filter and an ultraviolet cut filter. Of course, the filter layer 20 can also be disposed on the second surface 102 of the light transmissive plate 10. Of course, the filter layer 20 may not be provided.

Referring to FIG. 6, an upper light shielding layer 301 is formed on the filter layer 20. In this embodiment, the light shielding layer 301 is formed on the filter layer 20 by sputtering, and the material of the light shielding layer 301 is chromium. Of course, the light shielding layer 301 may be formed by another plating method such as vapor deposition. Of course, the material of the light shielding layer 301 may be other materials that can absorb light such as titanium nitride.

Referring to FIG. 7 , a magnetic shield layer 303 is formed on the light shielding layer 301 to form a light shielding layer 30 having a light shielding layer 301 and a magnetic shielding layer 303 . The magnetic shielding layer 303 can prevent external electromagnetic waves from interfering with the operation of the image sensor. In this embodiment, the magnetic shielding layer 303 is formed on the light shielding layer 301 by a sputtering method, and the magnetic shielding layer 303 includes a copper thin film layer 3031 and a stainless steel thin film layer 3033 which are sequentially formed outward from the light shielding layer 301. The stainless steel film layer 3033 not only shields the magnetic field, but also prevents the copper thin film layer 3031 from being oxidized, thereby improving the shielding effectiveness of the magnetic shield layer 303. Of course, the magnetic shielding layer 303 may be formed by another plating method such as vapor deposition. Of course, the material of the magnetic shielding layer 303 may also be other shieldable magnetic field materials such as iron, aluminum, nickel, iron-nickel soft magnetic alloy or iron-aluminum alloy.

Referring to FIGS. 8 and 9, a photoresist layer 40 is coated on the magnetic shield layer 303. The photoresist layer 40 includes a plurality of spaced apart central regions 401 and a peripheral region 402 surrounding the plurality of central regions 401. In this embodiment, the photoresist layer 40 is applied to the magnetic shield layer 303 by spin coating, and the photoresist layer 40 is composed of a negative photoresist. Of course, the photoresist layer 40 can also be composed of a positive photoresist.

The light-transmissive flat plate 10 coated with the photoresist layer 40 is placed under the photomask 50 having a plurality of light-passing holes 501 to expose the photoresist on the peripheral region 402 to form the exposed photoresist 403. Preferably, in order to better dissolve the photoresist on the central region 401 in the developer, the light-transmissive plate 10 having the photoresist 403 is exposed and baked. After exposure, the baking can also be carried out by using hot air convection in the oven, infrared radiation or heat transfer of the thermal pad. In this embodiment, heat conduction is performed by using a heat pad, wherein the baking temperature is 70 to 100 degrees Celsius, and the baking time is 4 to 8 minutes. Of course, it is also possible to expose the photoresist on the peripheral region 402 by other direct writing techniques such as laser direct writing or electron beam direct writing.

Referring to Figure 10, development is performed to remove the photoresist on the plurality of central regions 401, thereby leaving the photoresist 403 on the peripheral region 402 as a protective layer in the subsequent etching process. Preferably, in order to better adhere the photoresist 403 on the peripheral region 402 to the magnetic shield layer 303, flatten the edges, reduce defect voids, resist corrosion, and minimize the amount of solvent in the photoresist 403 on the peripheral region 402, The light transmissive plate 10 is hard baked. Hard roasting can also be carried out using hot air convection in the oven, infrared radiation or heat transfer from the thermal pad. In this embodiment, the thermal conduction of the thermal pad is used for hard baking, wherein the baking temperature is 70 to 200 degrees Celsius, and the baking time is 15 to 20 minutes. Of course, in the above process, whether the system needs to be baked or hard baked should be determined according to the actual situation. If it is necessary to bake or hard-bake after exposure, the baking temperature and time should also be determined according to the actual situation.

Referring to FIG. 11, the magnetic shield layer 303 and the light shielding layer 301 formed on the transparent plate 10 are etched so that the filter layer 20 facing the plurality of central regions 401 is exposed. That is, the light shielding layer 30 is etched so that the light shielding layer 30 has a plurality of light passing holes 305 that face the plurality of central regions 401 one by one.

The photoresist 403 on the peripheral region 402 is removed to form the light shielding element array 100 (see FIG. 2). Of course, when the light-shielding element array 100 is manufactured, the light-transmitting plate 10 is not provided with the filter layer 20, or the filter layer 20 is disposed on the second surface 102 of the light-transmitting plate 10, and after etching, is opposite to the plurality of central regions 401. The light panel 10 is exposed to the outside.

The light-shielding element array 100 obtained by the manufacturing method of the light-shielding element array 100 not only has a light-shielding and filtering function but also can prevent external electromagnetic interference, so that the imaging quality of the lens module array having the light-shielding element array 100 can be improved.

Preferably, referring to FIG. 12, in order to better align the light-shielding element array 100 with the lens array (not shown), the central axis of the plurality of light-passing holes 305 is paired with the central axis of the plurality of lenses of the lens array. In this embodiment, the magnetic shield layer 303 is further provided with Two alignment holes 60 penetrating through the light shielding layer 30, the filter layer 20 and the light transmission plate 10. Of course, the number of the alignment holes 60 can also be three, four, and the like, and can be designed as needed.

Please refer to FIG. 13 , which illustrates a lens module array 200 according to a second embodiment of the present invention. The lens module array 200 includes an array of shading elements 300 and a lens array 400 superposed with the shading element array 300.

The light-shielding element array 300 and the light-shielding element array 100 are manufactured in substantially the same manner and structure, except that the alignment holes 70 are provided between each of the two light-passing holes 305a.

Lens array 400 includes a plurality of lenses 80 and a plurality of alignment structures 90. In this embodiment, the plurality of alignment structures 90 are both through holes, and each of the two lenses 80 has an alignment structure 90 therebetween. Of course, the alignment structure 90 can also be a bump.

The alignment hole 70 is matched with the alignment structure 90 such that when the light shielding element array 300 and the lens array 400 are overlapped, the central axis of the plurality of light transmission holes 305a coincides with the central axis of the plurality of lenses 80, and finally is cut into a plurality of lenses. Module.

Of course, a spacer array (not shown) may be disposed between the light shielding element array 300 and the lens array 400. The spacer array has a plurality of spaced-apart vias, and a central axis of the plurality of vias coincides with a central axis of the plurality of lenses 80 and a central axis of the plurality of light-passing holes 305a.

Of course, the light-shielding element array 300 and the plurality of lens arrays may be first stacked together, then packaged with a silicon wafer having a plurality of image sensors, and finally cut into a plurality of camera modules.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and cannot be limited thereto. The scope of the patent application for this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Lighting element array

10‧‧‧Lighting plate

20‧‧‧Filter layer

30‧‧‧ shading shield

301‧‧‧Lighting layer

303‧‧‧Magnetic shielding

305‧‧‧Lighting hole

3031‧‧‧ copper film layer

3033‧‧‧Stainless steel film layer

Claims (9)

A method for manufacturing a light shielding element array, comprising: (1) providing a light transmissive plate; (2) providing a light shielding layer on the light transmissive plate; and (3) forming a magnetic shielding layer on the light shielding layer, the magnetic shielding layer The invention comprises a copper film layer and a stainless steel film layer disposed outwardly from the light shielding layer; (4) applying a photoresist layer on the magnetic shielding layer, the photoresist layer comprising a central region of a plurality of spaced distributions and surrounding the plurality of central regions a peripheral region; (5) exposing and developing to remove the photoresist on the central region; (6) etching the magnetic shield layer and the light shielding layer to expose the transparent flat plate facing the plurality of central regions (7) removing the photoresist on the peripheral region to form an array of shading elements. The method for manufacturing a light shielding element array according to claim 1, wherein the light shielding layer comprises a chromium layer or a chromium nitride layer. The method for manufacturing a light-shielding element array according to claim 1, wherein the method for manufacturing the light-shielding element array further comprises: performing a filter on the light-transmitting plate between steps (1) and (2) The steps of the light layer. The method of manufacturing the light-shielding element array of claim 1, wherein the method of manufacturing the light-shielding element array further comprises: performing post-exposure baking on the light-transmissive substrate after exposure and before development. The method for manufacturing a light-shielding element array according to claim 4, wherein the post-exposure baking temperature is 70 to 100 degrees Celsius, and the baking time is 4 to 8 minutes. The method for manufacturing a light shielding element array according to claim 1, wherein: the manufacturing mask The method of optical element arrays further includes hard baking the light transmissive substrate after development, prior to etching. The manufacturing method of the light shielding element array according to claim 6, wherein the hard baking temperature is 70 to 200 degrees Celsius, and the baking time is 15 to 20 minutes. The method for manufacturing a light-shielding element array according to claim 1, wherein in the step (5), the photoresist layer is exposed by a photomask or a direct writing technique. The method for manufacturing a shading element array according to claim 8, wherein the direct writing technique is a laser direct writing technique or an electron beam direct writing technique.