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TWI335648B - Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials - Google Patents

Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials Download PDF

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Publication number
TWI335648B
TWI335648B TW092127949A TW92127949A TWI335648B TW I335648 B TWI335648 B TW I335648B TW 092127949 A TW092127949 A TW 092127949A TW 92127949 A TW92127949 A TW 92127949A TW I335648 B TWI335648 B TW I335648B
Authority
TW
Taiwan
Prior art keywords
lead
cts
less
alpha
solder
Prior art date
Application number
TW092127949A
Other languages
English (en)
Other versions
TW200421581A (en
Inventor
W Weiser Martin
F Dean Nancy
M Clark Brett
J Bossio Michael
H Fleming Ronald
P Flint James
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Publication of TW200421581A publication Critical patent/TW200421581A/zh
Application granted granted Critical
Publication of TWI335648B publication Critical patent/TWI335648B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/18—Electrolytic production, recovery or refining of metals by electrolysis of solutions of lead
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B13/00—Obtaining lead
    • C22B13/06—Refining
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/161—Disposition
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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  • Manufacture And Refinement Of Metals (AREA)

Description

1335648 玖、發明說明： 【相關前案】 本發明與2002年10月8曰提出申請之| 吴國5s時申請案第 60/417,241 號有關。 【發明所屬之技術領域】 本發明係關於半導體包裝；含錯之焊料及陽極；及自讨 料移除α放射物之方法。 【先前技術】 焊料普遍4用在半導體裝置包裝中。若焊料·含有α粒子 放射物同位素（在此稱為α粒子放射物），所放射的α粒子讦 能導致包裝半導體裝置的損傷。據此，預期降低烊料中之 α粒子放射物濃度。 一示範的先前技藝半導體包裝在圖】中示為包裝5〇，與該 示範包裝一起呈現的是一覆晶結構。該包裝包含一半導體 構件12(例如一積體電路晶片該包裝也包含一用來支撐該 半導體構件12的板材14。複數個接觸焊墊38(只有其中的某 些被標記）係與晶片12接合，並且複數個接觸焊塾4〇 (只有 其中的某些被標記）係與板材14接合。錫球或凸塊39 (只有 其中的某些被標記）係經提供在焊墊38和40之間以形成銲 墊3 8和40間的電氣內連線。運用錫球或凸塊39連同銲塾38 和40的電氣連線可以併入所謂的晶圓凸塊技術。 可以如圖示般在該晶片12及基板14上提供適合的封膠 44。此外’及/或另外，可在該晶片丨2上提供例如散熱片（heat sinks)和熱分散器之傳熱裝置（未示出）。 88541 -6- 1335648 接觸焊墊30(只有其中的某些被標記）係位於該板材丨斗下 侧（即在板材14相反於緊鄰晶片12一側的側邊上>接觸銲墊 3〇通常包含銅、鎳和金的堆疊。錫球32(只有其中的某些被 標記）係經提供在該等接觸焊墊上，並用來形成該等接觸焊 墊30和其他位於該晶片包裝外部的電路（未示出）間的電氣 内連線。該等接觸焊墊40可以透過延伸通過板材14的電路 軌跡（未示出）來與該等焊墊3〇連接。 所不的包裝50具有來自錫球39，並且可能經由與焊墊 及/或焊墊40j|關的晶圓凸塊，之緊鄰晶片12的焊料。在包 裝5〇内可能有其他沒有特別示出的焊料應用。例如，—錫 霄（solder paste)可經提供在晶片12和多種傳熱裝置之間。 用在包裝50内的該等焊料可能會有問題，如上所討論 者，因為該等烊料可能包含α粒子放射物。α粒子對於半 導體裝置來說是有問題的，因為該等α粒子可以引起所謂 的軟錯誤（soft errors) ^將該等錯誤稱為「軟的」是因為該 等錯誤並非永久性。但是，該等錯誤通常會導致至少—個 位數（round)的錯誤計算。 ^^粒子有許多來源，包含由宇宙射線（cosmic rays)所導致 的反應。但是，對半導體裝置包裝來說，通常最有問題的 來源是用來形成關診半導體晶粒之多種内連線的焊料。例 如，晶圓凸塊技術在形成對於半導體晶粒之高密度内連線 上逐漸變得普遍。該等凸塊是形成在與一半導體晶粒包裝 相關的電子結點（electrical n〇des)上之焊料的部分。若用在 該等凸塊中的焊料具有α粒予放射物成分的話，該等α粒 88541 1335648 子常常在接近與該半導體晶粒相關的積體電路處放射。 偶爾’形成在該等電子結點上的焊料係呈大的拄狀物型 式。此種柱狀物常被稱為圓柱（column)。為了解釋本揭示， 應將「凸塊」一詞理解為包含形成在電子結點上之多種型 式的焊料，包含常稱為圓柱的型式。 許多焊料的典型成分是鉛。但是，鉛同位素的一種（明確 也0Pb)具有導致α粒子發生的衷變鍵（decay chain)。此 外’多種常見的鉛污染物會發射α粒子，包含，例如，鈾、 赵、鐳和針的同位素。 —^ 存在鉛中的該等α粒子放射物可以存在於最初精鍊鉛的 礦石中。α粒子放射物可以，此外，或另外，在製程及/或 使用鉛期間被引進。例如，磷酸和某些抗靜電系統包含α 粒予放射物；某些研磨和清潔劑可以將α粒子放射物引進 錯内；而商用鉛的精鍊可以引入鈾。 —存在錯内的峰子放射物的量通常是由^量測試來決 定，其結果係以每小時每單元之α粒子數來說明 (cts/cm/hi^在商業上取得具有從〇 〇〇2至〇 〇2此仏^心的 ，是可能的’但是非常難取得具有更低α流量的材料。但 疋半導月丑工業要求α流量特別低的材料，包含例如，具 有小於G.GGGl ets/em2/hi^ α流量的材料。 在與將一材料内之《流量放射物濃度降低至極低水準] 關的固難中的-個困難是測量流量水準低糾獨㈣心 的放射物濃度。除非可以測量濃度’否則監控-純化製； 來決足《粒予放射物是否已經移除是困難的。例如，在么 88541 -8- 1335648 化製程的任何階段決定〇：粒子放射物是否連同—材料或離 開該材料分餾可能是困難的。 雖然上面的討論集中在將α粒子放射物從含鉛坪料中移 除’需瞭解α粒子放射物在其他材料中也是有問題的。例 如’用來降低烊料中之《粒子放射物濃度的方法之一創造 出所謂的無鉛焊料。此種焊料含有少量’若有任何的話， 的錯，其從環境觀點來說是預期的。但是，該烊料可能仍 然具有不預期數量的粒子放射物存在其中。示範的無鉛 坪料是錫：3二5%銀；錫：4%銀：0.5%鋼；以及鉍：213% 銀’其中該百分比是重量百分比β 已用來降低含鉛焊料中之α粒子放射物數量的方法之— 是從具有非常少的放射物在其中的鉛材料開始。目前此種 材料有三種來源。該等來源是（1)非常古老的鉛，其中2l0pb 基本上已全部衰變；（2)某些特定的硫化鉛礦石體，其中具 有非常少的210Pb，並且已被謹慎地精鍊；以及（3)經受雷射 同位素分離以從鉛中移除的鉛。所有的來源皆存在多 種問題。例如，該第一來源使用非常古老的鉛，因此精鍊 通常很拙劣並因而含有多種放射性核素做為污染物。該第 一來源通常沒有足夠低的α粒子放射物濃度以符合半導體 工業最終預期的要求《該第三來源的形成是非常耗費能源 的，因此不是商業可行的。 【發明内容】 在一觀點中，本發明包含一種精鍊—材料的方法。該材 料取初成份係經提供。該最初成分具有大於或等於〇 〇〇2 88541 1335648 cts/cm2/hr的α流量。該材料係經純化以形成該材料之第二 成份。該第二成份具有小於0.001 cts/cm2/hr的α流量，較佳 地小於0.0005 cts/cm2/hr，更佳地小於0.0002 cts/cm2/hr，並 且甚至更佳地小於0.0001 cts/cm2/hr。該純化可以包含，例 如，電精鍊及/或化學精鍊。
在又另一個觀點中，本發明包含一半導體結構，其含有 <2流量小於0.001 cts/cm2/hr之焊料，較佳地小於0.0005 cts/cm2/hr，更佳地小於0.0002 cts/cm2/hr，並且甚至更佳地 小於 0.0001 cts/cm2/hr° —5= 在又另一個觀點中，本發明包含一含鉛陽極，其α流量 小於0.001 cts/cm2/hr，較佳地小於0.0005 cts/cm2/lir，更佳地 小於0.0002 cts/cm2/hr，並且甚至更佳地小於0.0001 cts/cm /hr °
在又另一個觀點中，本發明包含一含鉛烊料凸塊，其α 流量小於0.001 cts/cm2/hr，較佳地小於0.0005 cts/cm2/hr， 更佳地小於0.0002 cts/cm2/hr，並且甚至更佳地小於0.0001 cts/cm2/lir。該凸塊可以，在具體觀點中，是一圓柱形式。 在又另一個觀點中，本發明包含一含鉛錫膏，其α流量 小於0.001 cts/cm2/hr，較佳地小於0.0005 cts/cm2/hr，更佳地 小於0.0002 cts/cm2/hr，並且甚至更佳地小於0.0001 cts/cm2/hr。 【實施方式】 本發明之此揭示係為促進美國專利法「促進科學和實用 技藝的進展」（條款1，第8項）之憲法立意而提呈》 88541 -10· 1335648 本發明之一觀點係對於即使鉛同位素（2i〇Pb)是含有高濃 度α放射物的鉛之永久α放射物，但這不是含有低或非常 低濃度α放射物的鉛的情況之認知。為了解釋本揭示和隨 後的申請專利範圍，含有低濃度α放射物的鉛是α流量約 〇-〇2cts/cm2/hr的鉛，並且含有非常低濃度^放射物的鉛是 α 流< 量約 〇_〇〇2 cts/cm2/hr的船。 鈾同位素、鉦同位素、以及或許其他非鉛同位素被認為 是含有低或非常低濃度〇;放射物的鉛之主要α放射物。此 、. 吊 濃度0：粒子放射物之錯的α 流量對時間關係並不遵守從2i〇pb衰變預測的長期平衡曲線 的觀察。對於鉛之主要α放射物是非鉛同位素的認知導致 改良的用來降低最初含有低和非常低濃度α粒子放射物的 鉛之α放射物水準的方法。具體地，該α放射物水準可以 利用純化方法來降低，其從鉛移除微量非鉛污染物。根據 本發明之觀點所發展的示範方法是利用含有硝酸：水浴的 電精鍊（硝酸濃度從約2%至約50%，體積百分比 對於非鉛不純物是含有低或非常低濃度α放射物的鉛之 主要α放射物的認知也經由此種鉛之α流量隨著鉛之不純 物含量而提升的觀察得到證實。 雖然本發明在此缉常關於從鉛移除α粒子放射材料來敘 述，需瞭解的是本發明也可以用來純化鉛以外的其他材科 (例如金屬，例如錫、銀、銅、銦、鉍等常合併在無鉛焊料 中者）。α粒子的移除對於使用在半導體製造中的金屬特別 有利；例如，合併在晶圓凸塊烊料中的金屬。 88541 •11· 1335648 本發明之一觀點是在純化一原始材料期間間接追蹤至少 一種低濃度α粒子放射物的方法。該α粒子放射物係一污 染物，而非該材料的同位素。在具體觀點中，該材料可以 疋:li» ’並且該粒子放射物是杜和抽的同位素。存在於原 始材料内之一種或多種濃度比〇粒子放射物高的污染物係 經確認’並且在純化期間與該等放射物同樣做分餾。確認 的污染物較佳地是可以在純化期間輕易追蹤的物質。該等 污染物的分餾係關於污染物在純化製程期間餘留欲純化的 原始材料部之與從該原始材料分離出的部分之間的分類。 較佳地’分餾可以使基本上所有的污染物在純化製程期間 從該原始材料中分離。 污染物的分餾在純化期間被追蹤，並且從此追蹤的分餾 推論一種或多種QJ粒子放射物的分餾。據此，該α粒子放 射物的分館是推斷的，而非直接測量的。如此可避免與測 量一具有非常低濃度〇：粒子放射物之材料的α流量有關的 問題。低或非常低濃度的α粒子放射物產生通常與背景無 顯著差異的〇：流量，因此一般非常難以有高信賴度的測 量。因為α粒予放射物是污染物而非所純化之原始材料的 同位素’該α粒子放射物會與其他污染物一起分餾，若純 化使用的是非常明確地將原始材料與污染物質分館的方法 的話。具有適當的明確性之示範方法是電精鍊。也可以使 用化學精鍊，除了電精鍊之外或二擇—的。 欲純化的原始材料可以，如上所討論般，是鉛，並且在 純化之前最初可以包含重量百分比至少99.99%的鉛。據 88541 •12· 1335648 此，可將欲純化之原始材料視為基本上由，或由，鉛所構 成。在其他觀點中，欲純化的原始材料基本上可由，或由 銀、錫、銅、麵和銦所構成。在具體觀點中，欲純化的材 料最終可以用在一無鉛焊料中。 純化方法可以是任何適合的方法，包含，例如，化學精 鍊及/或電精鍊。在純化鉛之示範方法中，電精鍊係以包含 水以及硝酸、曱基磺酸、氟矽酸鹽和氟硼酸鹽之一種或多 種的水浴來使用。在本發明之明確觀點中，發現在含有或 基本上含有硝酸和水的水浴中之鉛的電精鍊（具有以重量 β 百分比濃度從約2%至約50%存在的硝酸）對於降低最初含 · 有低或非常低濃度α放射物的鉛之α流量來說是特別有效 的。在一硝酸浴中的鉛之電精鍊示範條件包含從約70 °F (21 °C )至約l〇〇°F(3 8°C )的硝酸浴溫度，從約幾小至約幾天的處 理時間，以及從約1安培/平方英尺（A/ft2)至約70 A/ft2的處 理電流密度。
與此揭示一起提供幾個圖式（標示為圖2-5)，並且這些圖 式證實了一材料的α流量會隨著該材料中之不純物總量而 提升。據此，在純化製程期間的α放射粒子之分餾可以從 該純化製程期間其他不純物的分餾來推論。從銀純度 99.99%純化至銀純度99.999%使α活動從0.0162 ± 0.0017 cts/cm2/hr 降低至 0.0062 ± 0.0007 cts/cm2/hr。從錫純度 99.99%純化至錫純度99.999%使α活動從0.0066 ± 0.0005 cts/cm2/lir 降低至 0_0007±0.0008 cts/cm2/hr。 88541 -13 - 1335648 基本上可以從無船焊錫材料中移除α放射物（例如鉦和鈾 的同位素）。該等α放射污染物的移除可以利用測量樣品的 α流量來輕易確認，因為其通常以低於大部分分析方法之 偵測限度的量存在，例如輝光放電質譜儀（GDMS) ^但是類 似GDMS的分析方法可以用來追蹤以比該等α放射物高的 濃度存在並且在純化期間以與該等α放射物相似的速率移 除的非放射不純物的濃度。 順應法令，本發明已利用大約明確的方式關於結構和方 法特徵作表ft。但是應瞭解的是，本發明並不囿限於所示% 和所述的明確特徵，因為在此所述的方法包含使本發明產 生效用的較佳形式❶本發明，因此，主張任何在所附之根 據相同原理適當解釋之申請專利範圍的適當範圍内的形式 或調整。 【圖式簡單說明】 圖1係一先前技藝半導體包裝結構之概略剖面侧視圖。 圖2係根據本發明之觀點純化的材料之〇 c〇unts/cm2/hr 對於總不純杨之曲線圖。 · 圖3係根據本發明之觀點純化的材料之α c〇unts/cm2/hr 對於銅濃度之曲線圖。 圖4係根據本發％之觀點純化的材料之a counts/cm2/iir 對於總不純物之曲線圖。 圖5 Y系才艮 發明之觀點純化的材料之ύ： counts/cm2/hr 對於總銀濃度之曲線圖。 88541 -15- 1335648 【圖式代表符號說明】 12 半導體構件 14 基板 30、40 接觸銲墊 32、39 錫球 38、40 烊墊 44 封膠 50 包裝 88541

Claims (1)

  1. Ϊ335648 拾、申請專利範園： h —種半導體包裝’包含一 α流量小於〇 〇〇1總數/平方公分 /小時（cts/cm2/hr)的焊料。 2 其中該焊料主要包 其中該焊料主要包 其中該焊料主要包 其中該焊料基本上 其中該烊料係鉛重 其中該含鉛焊料具 其中該含鉛焊料具 其中該含鉛焊料具 如申請專利範園第1項之半導體包裝 含銀、叙、銅、鋼、錯或錫。 如申請專利範圍第1項之半導體包裝 含銀。 4 如申請專利範圍第1項之半導體包裝 含錫。 —* 如申請專利範圍第1項之半導體包裝 是無錯的。 6 如申請專利範圍第1項之半導體包裳 量百分比至少99°/❶的含錯焊料。 7 _如申請專利範園第6項之半導體包裝 有小於0.0005 (^/(；1112/111>的（^流量。 8‘如申請專利範圍第6項之半導體包裝 有小於0.00Ό2 cts/cm2/hr的α流量》 9 ·如申請專利範圍第6項之半導體包裝 有小於0.0001 «^/^112/111"的（^流量。 瓜一種CX流量小於0.001 cts/cm2/hl^含鉛陽極該含鉛陽名 包含重量百分比至少約5 0 %的錯。 11·如申請專利範圍第10項之含錯陽極’具有小於〇侧 cts/cm2/hr的 α 流量。 12.如申請專利範園第1()項之含㈣極，具有小於〇厕 88541 1335648 cts/cm2/hr的 α 流量。 13. 如申請專利範圍第10項之含鉛陽極，具有小於0.0001 cts/cm2/hr的 α 流量。 14. 一種α流量小於0.001 cts/cm2/hr的含鉛焊錫凸塊，該含鉛 焊錫凸塊包含重量百分比至少約50%的鉛。 15. 如申請專利範圍第14項之含鉛焊錫凸塊，具有小於0.0005 cts/cm2/hr的 α 流量。 16. 如申請專利範圍第14項之含鉛焊錫凸塊，具有小於0.0002 cts/cm2/hr的 α 流量。 ---- 17. 如申請專利範圍第14項之含鉛焊錫凸塊，具有小於0.0001 .cts/cm2/hr的 α 流量。 18_ —種α流量小於0.001 cts/cm2/hr的含鉛錫膏，該含鉛錫膏 包含重量百分比至少約50%的鉛。 19. 如申請專利範圍第18項之錫膏，具有小於0.0005 cts/cm2/hr的 α 流量。 20. 如申請專利範圍第18項之錫膏，具有小於0.0002 cts/cm2/lir的 α 流量。 21. 如申請專利範圍第18項之錫膏，具有小於0.0001 cts/cm2/hr的 α 流量。 22. —種精鍊含錯材料的方法，包含： 提供該含鉛材料的最初成份，該最初成份具有大於或 等於0.002 cts/cm2/hr的α流量；以及 純化該含鉛材料以形成該含鉛材料之第二成份，該第 二成分具有小於0.001 cts/cm2/hr的α流量。 88541 -2- 1335648 23. 如申請專利範圍第22項之方法，其中該純化包含一種或 多種電精鍊，區域精鍊和化學精鍊。 24. 如申請專利範圍第22項之方法，其中該純化包含利用含 有硝酸和水的水浴（bath)之電精鍊，具有以重量百分比濃 度從約2%至約50%存在的硝酸。 25. 如申請專利範圍第22項之方法，其中該純化包含利用主 要由硝酸和水構成的水浴之電精鍊，具有以重量百分比 濃度從約2%至約50%存在的硝酸。 26. 如申請專利範圍第22項之方法，其中該第二成份之含鉛 —，二 材料係重量百分比至少99.99%的鉛。 27. 如申請專利範園第22項之方法，其中該第二成份具有小 於0.0005 如/〇312/111^的〇:流量。 28. 如申請專利範圍第22項之方法，其中該第二成份具有小 於0.0002 cts./cm2/hr的 α 流量。 29. 如申請專利範圍第22項之方法，其中該第二成份具有小 KO.OOOlcts/cmVhr^atfu'l：0 88541
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