1330068 070363.TW 24543twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱器，且特別是有關於一種具 有除塵機構的散熱器。 【先前技術】 近年來隨著電腦科技的突飛猛進，使得電腦之運作速 度不斷地提咼，並且電腦主機内部之電子元件的發熱功率 亦不斷地攀升。為了預防電腦主機之内部的電子元件過 熱，而導致電子元件發生暫時性或永久性的失效，必須提 供足夠的散熱效能予電腦内部之電子元件。因此，對於高 發熱功率之電子元件，例如中央處理器、繪圖晶片、北橋 晶片、南橋晶片及暫存記憶體模組等，通常會加裝散熱器 來降低這些電子元件之溫度。 一般而s，散熱器主要由風扇（fan)、散熱鰭片組 (cooling fins)及熱管（heat pipe)所組成。散熱鰭片組 配置在風扇的出風口，並與熱管連接，用以吸收由熱管所 傳導的廢熱。散熱鰭片組由多數個平行排列的金屬片所組 成，而相鄰之金屬片之間具有一定的間隙，提供廢熱經由 對流的方式散逸到空氣中。因此，當風扇處於運作狀態下， 冷卻氣流可經由出風口流向散熱鰭片組，並通過金屬片之 間的間隙，以將廢熱經對流而排出機體之外，進而降低内 部電子元件的工作溫度。 值得注意的是，當散熱器經過長時間使用之後，空氣 5 1330068 070363.TW 24543twf.d〇c/n t的灰塵會漸漸地堆積在散熱鰭片組的金屬片之間。一旦 過多的灰塵累積在金屬片上，傳導至金屬片的廢熱會受到 灰塵的阻隔而無法有效的散出。此外，灰塵亦會阻擋風扇 的氣流，使得對流的效果變差。因此，灰塵將造成廢熱不 • 易自散熱鰭片組移除的問題，而導致散熱器的散熱能力大 • 鴨地降低。 【發明内容】 本發明提供一種具有除塵機構的散熱器，其藉由除塵 機構清除附著於散熱器上的灰塵。 本發明提出一種具有除塵機構的散熱器，其包括一熱 傳導組件以及一除塵機構。熱傳導組件包括多數個等向排 列的金屬韓片。除塵機構包括一刮鈑（strickle sweep)以及 傳動tl件（transmission element)。刮鈑滑設於這些金屬 ’’’、曰片之一側，並適於沿一滑動路徑依序地接觸這些金屬鰭 片傳動元件連接於刮鈑，用以帶動到鈑沿滑動路徑滑動’ 而刮除附著於這些金屬鰭片之灰塵。 在本發明之一實施例中，除塵機構更可包括一復歸元 、彳^歸元件連接於刮鈑，使得到鈑常態位於滑動路徑上 的了第一位置《其中，復歸元件可為一蜗線彈簧（spiral Spring)或—螺旋彈簧（helical spring)。 在本發明之一實施例中，傳動元件可包括一線材，其 =置於滑動路徑上，且適於受一外力帶動刮鈑自第一位置 ⑺動至滑祕徑上的-第二位置，且復歸元件可藉由線材 6 1330068 070363.TW 24543twf.doc/n 與到飯相連接。 在本發明之一實施例中，傳動元件可包括一步進馬 達。 在本發明之一實施例中，熱傳導組件更可包括至少一 熱管。熱管之一端連接這些金屬鰭片’而另一端連接一熱 源。 在本發明之一實施例中，具有除塵機構的散熱器，更 可包括一風扇模組。風扇模組配置於這些金屬鰭片之一 側，且除塵機構位於風扇模組與這些金屬鰭片之間，用以 提供一冷卻氣流通過這些金屬鰭片之間。 在本發明之一實施例中，刮鈑的材質可包括銅或橡 膠。 本發明由於藉由刮鈑在這些金屬鰭片之間滑動，而能 移除其上的灰塵，所以散熱效果在長期使用下不會受灰塵 影響，因此散熱效果較為一致。此外，使用者僅需藉由傳 動元件來帶動刮鈑，使得刮鈑在這些金屬鰭片間滑動，即 可移除這些金屬鰭片上的灰塵，使用上相當便利。另外， 藉由風扇模組產生的風壓即可將灰塵吹出機殼之外，使用 者無須費時地拆却機殼與熱傳導組件，因此相當省力且省 時。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 7 1330068 070363.TW 24543twf.doc/n 圖1為本發明一實施例之具有除塵機構的散熱器之立 體示意圖。請參考圖1，具有除塵機構的散熱器100包括 一熱傳導組件110以及一除塵機構120。熱傳導組件110 可應用於筆記型電腦等電子裝置中，以提供裝置中高發熱 量的電子元件散熱之用。熱傳導組件110 —般以銅、銘等 高導熱性金屬材質製成，其可配置在電子元件上或連接到 系統内部的氣冷式散熱模組或水冷式散熱模組，以達到降 溫的目的。在本實施例中，熱傳導組件no包括多數個等 向排列的金屬鰭片112,而這些平行排列的金屬鰭片112 彼此相疊並相隔一間隙’以增加熱傳導組件110的散熱面 積。 圖2為圖1之A區域的局部放大示意圖，請一併參考 圖1與圖2,除塵機構120配置於熱傳導組件110的一側， 且除塵機構120主要包括一刮鈑122以及一傳動元件 124。在本實施例中，傳動元件124可包括一線材12知。 線材U4a的一端連接於一復歸元件13〇，其中線材124a 的材質可包括尼龍或金屬，而復歸元件13〇可為一蝸線彈 黃或者是一螺旋彈簧。此外，到鈑122滑設於這些金屬鰭 片112之間，而線材i24a可穿過並纏繞於刮鈑122上的兩 開孔122a，使得刮鈑122固定於線材124a上。 在本實施例中，線材124a的另一端還可延伸至電子 裝置的機殼（未繪示）之外，並固定於機殼外的一拉環（未繪 示）上，以讓使用者可以方便地拉動線材124a。亦或者是， 將線材124a連接到筆記型電腦等折疊式電子裝置的抱轴 8 1330068 070363.TW 24543twf.doc/n (未繪示）上，當螢幕相對於底座開啟時，線材124&即可受 到樞軸轉動而被拉動。 _圖3為圖1之具有除塵機構的散熱器沿1-1，線之剖面 示意圖。請參考圖3’當使用者拉動線材ma或是藉由樞 軸的轉動而帶動線材124a時，線材124a便受到一作用力 朝一第一方向di移動，而帶動到鈑122沿一滑動路徑s 依序地接觸這些金屬鰭片使得刮鈑丨22從一第一位 置P1滑動至一第二位置P2，且復歸元件13〇對應此作用 力而產生一反向的回復力。當施予線材124a的作用力釋放 ，，復歸元件130產生的回復力便會帶動線材124a朝向一 第二方向d2移動，使得刮鈑122從第二位置P2滑動至第 一位置P1。 值得注意的是，藉由傳動元件124的帶動，使得刮鈑 122在滑動路徑S上滑動並接觸這些金屬鰭片U2，即可 將附著於這些金屬鰭片112的灰塵刮除或振動下來，所以 這些金屬鰭片112不會受到灰塵包覆而減低散熱的效果。 因此，具有除塵機構的散熱器1〇〇在長期的使用下，亦能 夠維持相當的散熱效果。 此 在另一未繪示的實施例中’傳動元件124可更包括— 馬達，線材124a連接於馬達的轉軸上，使得馬達捲動線材 124a’以讓刮鈑122受到線材124a的帶動而滑動。而在又 一未繪示的實施例中，傳動元件124可包括一步進馬達。 到鈑122可直接固定於步進馬達之上，而可不需線材 124a。使用者可藉由控制步進馬達的方式，使得步進馬達 9 070363 .TW 24543twf.doc/n 帶動到鈑122在這些金屬鰭片112之間滑動。 此外，由於刮鈑122位於熱傳導組件11〇上下兩侧的 凸緣E(見圖2及圖3)之間，使得刮鈑122在滑動時藉由 兩側之凸緣E的限制而不會脫出熱傳導组件110。在另一 未繪示的實施例中，在熱傳導組件110上下兩側的凸緣E 還可分別具有對應刮鈑122的一導槽（未繪示），而可讓 刮飯122能藉由這兩導槽的導引而更加順暢地滑動。另 外，在本實施例中，線材124a可穿設於熱傳導組件U〇 左右兩側的孔槽118之中’以讓線材124a的延伸方向平行 於滑動路徑S ’而可避免線材124a受力移動時產生不規則 的晃動。 另外，請再參考圖1，在本實施例中，具有除塵機構 的散熱器100更可包括一風扇模組14〇。風扇模組14〇產 生的冷卻氣流流過這些金屬鰭片112之間的空隙，以藉由 強制對流的方式將這些金屬鰭片112上的熱量散出。^另 一未繪示的實施例中，熱傳導組件11〇更可包括一熱管。 熱管的一端可與這些金屬鰭片112相接觸，而另一端二與 一熱源相接觸’使得熱源產生的熱量可透過熱管 ^ 這些金屬鰭片112。 值得-提的是，除塵機構120位於風扇模組14〇 些金屬鰭片112之間，使得除塵機構12〇刮除 下 的灰^能藉由風扇模組！40產生的氣流吹出機殼之、外。 綜上所述，本發明之具有除塵機構 在這些金制片之間滑動’而能刮除或振下； 1330068 070363.TW 24543twf.doc/n 上的灰塵，因此至少具有下列優點· -、可減少附著於這些金屬則上的 除塵機構的散熱ϋ在長期的㈣下H ^具有 響，而能夠維持相當的散熱效果。 火的影 二、使用者僅需藉由傳動元件來帶動刮飯， 在這些金屬鰭片間滑動，即可移除這些金 塵，使用上相當便利。 —胃’~01330068 070363.TW 24543twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink having a dust removing mechanism. [Prior Art] In recent years, with the rapid advancement of computer technology, the operating speed of computers has been continuously improved, and the heating power of electronic components inside computer mainframes has continuously increased. In order to prevent the electronic components inside the computer from overheating, causing temporary or permanent failure of the electronic components, it is necessary to provide sufficient heat dissipation performance to the electronic components inside the computer. Therefore, for high-heat-power electronic components such as a central processing unit, a graphics chip, a north bridge chip, a south bridge chip, and a temporary memory module, heat sinks are usually added to reduce the temperature of these electronic components. Generally, the heat sink is mainly composed of a fan, a cooling fins, and a heat pipe. The heat sink fin group is disposed at the air outlet of the fan and connected to the heat pipe to absorb waste heat conducted by the heat pipe. The heat sink fin group is composed of a plurality of metal sheets arranged in parallel, and a gap is provided between adjacent metal sheets to provide waste heat to escape into the air via convection. Therefore, when the fan is in operation, the cooling airflow can flow to the heat dissipation fin group through the air outlet and pass through the gap between the metal sheets to convect the waste heat out of the body, thereby reducing the operating temperature of the internal electronic components. It is worth noting that when the heat sink is used for a long time, the dust of the air 5 1330068 070363.TW 24543twf.d〇c/n t gradually accumulates between the metal sheets of the heat sink fin group. Once excessive dust accumulates on the metal sheet, the waste heat transferred to the metal sheet is blocked by dust and cannot be effectively dissipated. In addition, dust also blocks the airflow of the fan, making the convection effect worse. Therefore, the dust will cause the waste heat to be removed from the heat sink fin group, and the heat sink has a large heat dissipation capability. SUMMARY OF THE INVENTION The present invention provides a heat sink having a dust removing mechanism that removes dust attached to a heat sink by a dust removing mechanism. The present invention provides a heat sink having a dust removal mechanism that includes a heat transfer assembly and a dust removal mechanism. The heat transfer assembly includes a plurality of isotropically arranged metal Korean sheets. The dust removal mechanism includes a strickle sweep and a transmission t-transmission element. The scraping slide is disposed on one side of the metal ''', one side of the cymbal piece, and is adapted to sequentially contact the metal fin transmission elements along the sliding path to connect the scraping shovel to drive the cymbal to slide along the sliding path' Scrap off dust attached to these metal fins. In an embodiment of the present invention, the dust removing mechanism may further include a returning element, and the component is connected to the scraping so that the first position is located on the sliding path to the normal state, wherein the resetting element may be a worm line Spiral spring or - helical spring. In an embodiment of the present invention, the transmission component may include a wire that is placed on the sliding path and adapted to be driven by an external force to move from the first position (7) to the second position on the sliding path. And the reset component can be connected to the rice by wire 6 1330068 070363.TW 24543twf.doc/n. In an embodiment of the invention, the transmission element can include a stepper motor. In an embodiment of the invention, the heat transfer component may further comprise at least one heat pipe. One end of the heat pipe connects the metal fins' and the other end is connected to a heat source. In an embodiment of the invention, the heat sink having the dust removing mechanism may further include a fan module. The fan module is disposed on one side of the metal fins, and the dust removing mechanism is located between the fan module and the metal fins to provide a cooling airflow between the metal fins. In one embodiment of the invention, the material of the scraping may comprise copper or rubber. Since the dust can be removed by sliding between the metal fins by scraping, the heat dissipation effect is not affected by dust under long-term use, so the heat dissipation effect is relatively uniform. In addition, the user only needs to drive the scraping by the driving element, so that the scraping slides between the metal fins, that is, the dust on the metal fins can be removed, which is quite convenient to use. In addition, dust can be blown out of the casing by the wind pressure generated by the fan module, so that the user does not need to remove the casing and the heat conduction component in a time-consuming manner, which is labor-saving and time-saving. The above described features and advantages of the present invention will become more apparent from the following description. [Embodiment] 7 1330068 070363.TW 24543twf.doc/n FIG. 1 is a schematic perspective view of a heat sink having a dust removing mechanism according to an embodiment of the present invention. Referring to Figure 1, a heat sink 100 having a dust removal mechanism includes a heat transfer assembly 110 and a dust removal mechanism 120. The heat transfer component 110 can be applied to electronic devices such as notebook computers to provide heat dissipation for high heat generating electronic components in the device. The heat conduction component 110 is generally made of a high thermal conductivity metal such as copper or ingot, and can be disposed on an electronic component or connected to an air-cooled heat dissipation module or a water-cooled heat dissipation module inside the system to achieve the purpose of cooling. In the present embodiment, the thermally conductive component no includes a plurality of substantially aligned metal fins 112, and the parallel aligned metal fins 112 are stacked one on another and separated by a gap ′ to increase the heat dissipation area of the heat conducting component 110. 2 is a partially enlarged schematic view of the area A of FIG. 1. Referring to FIG. 1 and FIG. 2 together, the dust removing mechanism 120 is disposed on one side of the heat conducting component 110, and the dust removing mechanism 120 mainly includes a scraping 122 and a transmission component 124. . In the present embodiment, the transmission element 124 can include a wire 12 known. One end of the wire U4a is connected to a resetting element 13〇, wherein the material of the wire 124a may include nylon or metal, and the resetting element 13 may be a volute or a coil spring. Further, the cymbal 122 is slidably disposed between the metal fins 112, and the wire i24a is permeable to and wound around the two openings 122a of the squeegee 122 such that the squeegee 122 is fixed to the wire 124a. In this embodiment, the other end of the wire 124a extends to the outside of the casing (not shown) of the electronic device, and is fixed on a pull ring (not shown) outside the casing, so that the user can The wire 124a is conveniently pulled. Or, the wire 124a is connected to the holding shaft 8 1330068 070363.TW 24543twf.doc/n (not shown) of the folding electronic device such as a notebook computer, and when the screen is opened relative to the base, the wire 124& It is pulled by the pivot. Figure 3 is a cross-sectional view of the heat sink of Figure 1 with a dust removal mechanism taken along line 1-1. Referring to FIG. 3', when the user pulls the wire ma or drives the wire 124a by the rotation of the pivot, the wire 124a is subjected to a force to move toward a first direction di, and is driven to the 钣122 along a sliding path s. The sequential contact of the metal fins causes the scraper 22 to slide from a first position P1 to a second position P2, and the reset element 13 〇 corresponds to the force to generate a reverse restoring force. When the force applied to the wire 124a is released, the restoring force generated by the resetting member 130 causes the wire 124a to move toward a second direction d2, so that the scraper 122 slides from the second position P2 to the first position P1. It should be noted that, by the driving of the transmission component 124, the scraper 122 slides on the sliding path S and contacts the metal fins U2, so that the dust attached to the metal fins 112 can be scraped off or vibrated. These metal fins 112 are not covered by dust to reduce heat dissipation. Therefore, the heat sink 1 with the dust removing mechanism can maintain a considerable heat dissipation effect under long-term use. In another embodiment, not shown, the transmission member 124 can further include a motor, and the wire 124a is coupled to the shaft of the motor such that the motor rolls the wire 124a' to slide the blade 122 by the wire 124a. In yet another embodiment, the transmission member 124 can include a stepper motor. The rafter 122 can be directly attached to the stepper motor without the need for the wire 124a. The user can control the stepper motor to cause the stepper motor 9 070363 .TW 24543twf.doc/n to move to the crucible 122 to slide between the metal fins 112. In addition, since the scraper 122 is located between the flanges E (see FIGS. 2 and 3) on the upper and lower sides of the heat conducting component 11〇, the scraper 122 is not restricted by the limitation of the flanges E on both sides when sliding. The heat conduction component 110 is exited. In another embodiment, not shown, the flanges E on the upper and lower sides of the heat conducting component 110 can also have a guiding groove (not shown) corresponding to the scraper 122, so that the scraping rice 122 can be used by The guides of the two guide grooves slide more smoothly. In addition, in the embodiment, the wire 124a can pass through the hole 118 in the left and right sides of the heat conducting component U〇 to make the extending direction of the wire 124a parallel to the sliding path S′, and the wire 124a can be prevented from moving under force. Produce irregular shaking. In addition, referring to FIG. 1, in the embodiment, the heat sink 100 having the dust removing mechanism may further include a fan module 14A. The cooling airflow generated by the fan module 14 flows through the gap between the metal fins 112 to dissipate heat from the metal fins 112 by forced convection. In another embodiment not shown, the heat transfer component 11 can further include a heat pipe. One end of the heat pipe is in contact with the metal fins 112, and the other end is in contact with a heat source so that heat generated by the heat source can pass through the heat pipes. It is worth mentioning that the dust removing mechanism 120 is located between the metal fins 112 of the fan module 14 so that the dust removed by the dust removing mechanism 12 can be driven by the fan module! The air generated by 40 is blown out of the casing. In summary, the dust removing mechanism of the present invention slides between the gold sheets to scrape or vibrate; 1330068 070363.TW 24543twf.doc/n dust, thus having at least the following advantages - The heat dissipation of the dust removing mechanism attached to these metals is reduced in the long-term (four) H ^, and the heat dissipation effect can be maintained. The shadow of fire 2. The user only needs to drive the scraping rice by the transmission component, and sliding the metal fins can remove the dust, which is quite convenient to use. - stomach '~0
使得到鈑 片上的灰 仕微料些金屬柯乃上的及塵到除之後 風扇模組產生的風壓即謂灰塵吹⑽殼之外 ^ =也:卸機殼與熱傳導組件’因此清理的過程相當地 雖然本發明已以較佳實施例揭露如上，然其並非 限定本發明，任何所屬技術領域巾具有通常知識者，在 脫離本發明之精神和範圍内，當可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所 為準。The wind pressure generated by the fan module after the removal of the dust on the metal sheet is the dust blow (10) outside the shell ^ = also: unloading the shell and the heat conduction component 'so the cleaning process The present invention has been described above with reference to the preferred embodiments thereof, and is not intended to limit the scope of the invention, and the scope of the invention may be modified and modified. The scope of the invention is therefore intended to be limited by the scope of the appended claims.
【圖式簡單說明】 圖1為本發明一實施例之具有除塵機構的散熱器之立 體示意圖。 圖2為圖1之A區域的局部放大示意圖 圖3為圖1之具有除塵機構的散熱器沿14，線之剖面 示意圖。 1330068 070363.TW 24543twf.doc/n 【主要元件符號說明】 100 :具有除塵機構的散熱器 110 :熱傳導組件 ' 112:金屬鰭片 118:孔槽 120 :除塵機構 122 :刮鈑 122a :開孔 • 124:傳動元件 124a :線材 130 :復歸元件 140 :風扇模組 A. ·區域 E :邊緣 dl、d2 :方向 PI、P2 :位置 巍 S:滑動路徑 12BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view of a heat sink having a dust removing mechanism according to an embodiment of the present invention. Figure 2 is a partially enlarged schematic view of the area A of Figure 1; Figure 3 is a cross-sectional view of the heat sink of Figure 1 having a dust removal mechanism along line 14. 1330068 070363.TW 24543twf.doc/n [Description of main component symbols] 100: Heat sink 110 with dust removal mechanism: Heat conduction component '112: Metal fin 118: Hole groove 120: Dust removal mechanism 122: Scrape 122a: Opening • 124: Transmission element 124a: Wire 130: Reversion element 140: Fan module A. · Area E: Edge dl, d2: Direction PI, P2: Position 巍S: Sliding path 12