1328990 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種平面顯示器用結合機（Flat Panel1328990 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a flat panel display machine (Flat Panel)
Display Laboratory，FPDL)之軟性電路板（Flexible Printed Circuit Board，FPC)機台及採用上述機台對不同機進行實 裝之液晶顯示模組之實裝方法。 【先前技術】 液晶顯示器通常包括液晶面板、光源系統以及周邊驅 動系統三大部份。在液晶顯示模組（Liquid Crystal M〇dule, LCM)封裝中’液晶面板與周邊驅動系統之電連接採用表面 封裝技術’例如：打線封裝（Chip 〇n Board，COB)、捲帶接 合技術（Tape Automatic Bonding，TAB)、玻璃覆晶技術 (Chip On Glass，COG)以及薄膜覆晶技術（Chip 〇n FUm， COF)。 ’ > COB封裝是一種早期的IC封裝技術，其體積大、成 本同。TAB封裝是後續發展出的體積小、重量輕的技術， 隨後又發展tB CQG封|技術，其㈣阻抗高、無法承載 被動元件’同時隨著顯示器解析度要求增加，其輸出訊號 數^大幅增力α。在輕量及薄型封裝的需求下，#界研發出 更面密度之驅動1C封裳技術，即更細線化、彎折性優良且 可承載被動元件之驅動Ic之c〇F封裝技術。目前Display Laboratory, FPDL) Flexible Printed Circuit Board (FPC) machine and mounting method of liquid crystal display module for mounting different machines using the above machine. [Prior Art] A liquid crystal display usually includes three parts of a liquid crystal panel, a light source system, and a peripheral driving system. In the liquid crystal display module (LCM) package, the 'electrical connection between the liquid crystal panel and the peripheral drive system is surface-mounting technology'. For example: Chip 〇n Board (COB), tape bonding technology (Tape) Automatic Bonding (TAB), Chip On Glass (COG) and Chip 〇n FUm (COF). ’ > COB package is an early IC packaging technology that is bulky and cost effective. TAB package is a small and light-weight technology developed in the future, and then developed tB CQG seal technology, which has high impedance and cannot carry passive components. At the same time, as the display resolution requirements increase, the number of output signals is greatly increased. Force α. Under the demand of lightweight and thin package, #界界 developed a more surface-density driving 1C sealing technology, which is a finer wire, excellent bending and can drive passive components of the drive Ic c〇F packaging technology. Currently
^對C〇F的需求漸增的情況下，已有從COG製程向C〇F 製程轉變的趨勢。 °月參閱圖1，係—種先前技術液晶顯示模組實裝方法 1328990 之流程圖。該液晶顯示模組係主要採用COG封裝技術， 其實装流程如下： 步驟S11 :提供Cell完成品（液晶面板）； 步驟S12 : COG實裝； 對Cell完成品進行COG實裝。 步驟 S13 :印刷電路板（Printed Circuit Board，PCB)實 裝； 步驟S14 :背光系統實裝； 步驟S15 :殼體（Case)實裝。 其中COG實裝係將驅動1C直接熱壓焊接在液晶面板 上，再用軟性電路板去銜接液晶面板與PCB基板，即將 FPC分別邦定（bonding)在液晶面板與PCB基板上。 請參閱圖2，係圖1所示COG實裝步驟之詳細操作流 程圖。COG實裝步驟包括以下流程： 步驟S21 :邦定1C ; 將異方性導電膜（Anisotropic Conductive Film，ACF ) 貼附在液晶面板上，利用ACF為介面材料將1C壓接在液 晶面板上。 步驟S22 :邦定FPC ; 將ACF貼附在液晶面板上，利用ACF為介面材料將 FPC壓接在液晶面板上。 步驟S23 :邦定PCB ;^ With the increasing demand for C〇F, there has been a shift from the COG process to the C〇F process. FIG. 1 is a flow chart of a prior art liquid crystal display module mounting method 1328990. The liquid crystal display module mainly adopts COG packaging technology, and the actual loading process is as follows: Step S11: providing a finished product of the Cell (liquid crystal panel); Step S12: COG mounting; performing COG mounting on the finished product of the Cell. Step S13: Printed Circuit Board (PCB) mounting; Step S14: Backlight system mounting; Step S15: Case mounting. The COG mounting system will drive the 1C direct thermocompression bonding on the liquid crystal panel, and then use the flexible circuit board to connect the liquid crystal panel and the PCB substrate, that is, the FPC is bonded on the liquid crystal panel and the PCB substrate. Please refer to Figure 2 for a detailed operational flow chart of the COG mounting steps shown in Figure 1. The COG mounting step includes the following steps: Step S21: bonding 1C; attaching an anisotropic conductive film (ACF) to the liquid crystal panel, and crimping 1C on the liquid crystal panel by using ACF as an interface material. Step S22: bonding the FPC; attaching the ACF to the liquid crystal panel, and crimping the FPC to the liquid crystal panel by using the ACF as an interface material. Step S23: bonding the PCB;
將ACF貼附在PCB板上，利用ACF為介面材料將FPC 壓接在PCB板上。 1328990 請參閱圖3，係一種先前技術FPDL結合機之FPC機 台部份之立體示意圖。該FPC機台1包括載料機台（圖未 示）、FPC假壓機台12和FPC本壓機台14。該FPC假壓 機台12與FPC本壓機台14並排相鄰設置，該載料機台鄰 近FPC假壓機台12設置，設置於FPC假壓機台12後方， 其用於裝載FPC，該FPC係沖切好之單片FPC，並放置於 托盤（Tray)中，該托盤放置於載料機台，用以向FPC假壓 機台12提供FPC。該FPC假壓機台12包括ACF貼附部 (圖未示）及FPC假壓部（圖未示）。 請一併參閱圖4，其係利用圖3所示FPC機台進行邦 定FPC的流程，其包括： 步驟S31 :壓接有1C之液晶面板傳送至FPC假壓機 台； 將壓接有1C之液晶面板經由流水線傳送至FPC假壓 機台12之ACF貼附部。 步驟S32 :貼附ACF膜於液晶面板上並對其進行熱壓 接； 真空吸附液晶面板至FPC假壓機台12之ACF貼附部 之工作平台，對位後將ACF膜貼附於液晶面板上，並對其 進行熱壓接。 步驟S33 :進行FPC假壓動作； 將貼附有ACF膜之液晶面板傳送至FPC假壓機台12 之FPC假壓部之工作平台，並由載料機台中放置FPC的托 盤中依次真空吸附FPC，將FPC與液晶面板對位，進行 1328990 .FPC假壓； 步驟S34 :進行FPC本壓動作； 將假壓後之液晶面板傳送至FPC本壓機台14，於FPC 本壓機台14中進行FPC本壓。 惟，COF機種之液晶顯示模組亦採用上述機台進行 生產時，由於兩種機種之區別，COF機種係將驅動1C係 • 直接壓接在軟性電路板上形成COF單元，再用COF單元 去銜接液晶面板與PCB基板，即將COF單元分別邦定在 ® 液晶面板與PCB基板上，而COF單元之端部的金手指之 間的間距較FPC小，其對設備的精度要求亦較高，在生產 COF機種之液晶顯示模組時，若採用上述設備來實現COF 單元壓接，COF單元對位偏移之不良率較高。 且由於COF單元之結構與FPC不同，其包括驅動1C， 因此生產COF機種時，FPDL結合機之FPC機台1需將吸 附、輸送FPC之工具更換為吸附、輸送COF單元之工具， 假壓壓頭以及假壓工作平台等亦需要更換，即上述工具對 ® 應COF單元之驅動1C處需設置凹槽以收容驅動1C ;且對 應生產不同機種時要輸入不同的程式及不同的相關參數以 執行操作步驟，如此造成換線時間較長。 另，採用上述機台邦定FPC需將沖切好的FPC原料置 於托盤並將托盤置於載料機台中，因此需要事先將FPC沖 切完畢，並用托盤供料，其浪費人力和原料成本。 【發明内容】 有鑑於上述内容，提供一種壓接精度較高之平面顯 1328990 示态用結合機之FPC機台。 還提供一種採用前述Fpc機台對不同機種進 之液晶顯示模組之實裝方法。 貝、 一種平面顯示器用結合機之軟性電路板機台，其包 括軟性電路板假壓機台、薄膜覆晶假壓機台及：性電： 本筌機。s玄薄膜覆晶假壓機台設置於軟性電路板假 壓機台及軟性電路板本壓機台之間。該軟性電路板機台 ::玻：覆晶機種之液晶顯示模組進行軟性電路板邦定 2刀別利用軟性電路板假壓機台及軟性電路板本壓機 台對液晶面板進行軟性電路板之假壓及本壓；該軟性電 ，板機。對薄膜覆晶機種或捲帶接合機種之液晶顯示模 2行薄膜覆晶單元或捲帶接合單元之邦定時，分別利 二f覆晶假壓機台及軟性電路板本壓機台對液晶面板 订涛膜覆晶單元或捲帶接合單元之假壓及本壓。 -種採用前述平面顯示器用結合機之軟性電路板機 不同機種進行實裝之液晶顯示模組之實裝方法，其 ^括：若對玻璃覆晶機種之液晶顯示模組進行軟性電路 迮：：Γ時’其包括以下步驟：於軟性電路板假壓機台 覆：二生：路板假虔動作；假壓後之液晶面板經由薄膜 台傳送至軟性電路板本壓機台；於軟性電路 晶或搖;$订軟性電路板本壓動作。若對薄膜覆 =接人/機種之液晶顯示模組進行薄膜覆晶單元或 邦定時’其包括以下步驟··液晶面板經 “ h壓機台傳送至薄膜覆晶假壓機台；於薄 11 ζ S ； 13.28990 . 膜覆晶假壓機台中，進行薄膜覆晶或捲帶接合假壓動 作；假壓後之液晶面板傳送至軟性電路板本壓機台，進 行薄膜覆晶或捲帶接合本壓動作。 與先前技術相比較，本發明之平面顯示器用結合機 之軟性電路板機台及採用上述機台之液晶顯示模組之實 ' 裝方法可對不同機種之液晶顯示模組進行壓接，在生產 玻璃覆晶機種時，由軟性電路板假壓機台對液晶面板進 行假壓，在生產薄膜覆晶機種時，由薄膜覆晶假壓機台 ® 對液晶面板進行假壓，由於薄膜覆晶假壓機台壓接精度 較軟性電路板假壓機台壓接精度高，因此可以降低薄膜 覆晶單元對位偏移之不良率。 【實施方式】 請參閱圖5，係本發明之平面顯示器用結合機之FPC 機台2之立體示意圖。該FPC機台2包括載料機台（圖未 示）、FPC假壓機台22、COF假壓機台23和FPC本壓機 台24。該FPC假壓機台22、COF假壓機台23與FPC本 ® 壓機台24並排相鄰設置，即在FPC假壓機台22及FPC 本壓機台24之間增加了 COF假壓機台23。該載料機台鄰 近FPC假壓機台22設置，設置於FPC假壓機台22後方， 其用於裝載FPC，該FPC係沖切好之單片FPC並排放於托 盤中，該托盤放置於載料機台，用以向FPC假壓機台提供 FPC原料。該FPC假壓機台22包括ACF貼附部（圖未示） 及FPC假壓部（圖未示）。該COF假壓機台23包括捲材 機架（圖未示）以及假壓部（圖未示），COF單元之卷狀 12 1328990 . 原材料係安裝於捲材機架上。 請參閱圖6，係利用該FPC機台2對COG機種之液晶 顯示模組進行邦定FPC的流程，其包括： 步驟S41 :壓接有1C之液晶面板傳送至FPC假壓機 台； 壓接有1C之液晶面板經由流水線傳送至FPC假壓機 台22之ACF貼附部。 步驟S42 :貼附ACF膜於液晶面板上並對其進行熱壓 籲接； 真空吸附該液晶面板至FPC假壓機台22之ACF貼附 部之工作平台，對位後將ACF膜貼附於液晶面板上，並對 其進行熱壓接。 步驟S43 :進行FPC假壓動作； 將貼附有ACF膜之液晶面板傳送至FPC假壓機台22 之FPC假壓部之工作平台，並由載料機台中放置FPC的托 盤中依次真空吸附FPC，再將FPC與液晶面板對位，進行 ® FPC假壓。 步驟S44 :假壓後之液晶面板經由COF假壓機台傳送 至FPC本壓機台； 將假壓後之液晶面板傳送至COF假壓機台23，並經 由COF假壓機台23將液晶面板傳送至FPC本壓機台24， 此時，COF假壓機台23只起到傳送的作用。 步驟S45 :進行FPC本壓動作； 於FPC本壓機台中，進行FPC本壓。 V s ) 13 13.28990 請參閱圖7，利用該FPC機台2機台對COF機種之液 晶顯示模組進行邦定COF單元的流程，其包括： 步驟S51 :未壓接有1C之液晶面板傳送至FPC假壓 機台； 液晶面板經由流水線傳送至FPC假壓機台22之ACF 貼附部。 步驟S52 :貼附ACF膜於液晶面板上並對其進行熱壓 接； 真空吸附該液晶面板至FPC假壓機台22之ACF貼附 部之工作平台，對位後將ACF膜貼附於液晶面板上，並對 其進行熱壓接。 步驟S53 :貼附有ACF膜之液晶面板經由FPC假壓機 台22之FPC假壓部傳送至COF假壓機台； 將貼附有ACF膜之液晶面板傳送至FPC假壓機台22 之FPC假壓部之工作平台上，此時，僅進行對位動作，其 不需從載料機台真空吸附COF單元，應於FPC假壓機台 22之FPC假壓部進行之假壓動作亦停止，直接將貼附有 ACF膜之液晶面板傳送至COF假壓機台23即可。 步驟S54 :進行COF假壓動作； 於COF假壓機台23中，進行COF假壓動作，即COF 單元之原材料係成卷放置於COF假壓機台23之捲材機架 上，經由沖切工具沖切出單片COF單元後，將單片之COF 單元與液晶面板對位，進行假壓動作。 步驟S55 :進行COF本壓動作； 14 1328990 將假壓後之液晶面板傳送至FPC本壓機台24，進行 COF本壓動作。 與先前技術相比較，採用本發明之FPDL結合機之 FPC機台2進行壓接，在生產COG機種時，由FPC假壓 機台22對液晶面板進行假壓，在生產COF機種時，由COF 假壓機台23對液晶面板進行假壓，而COF假壓機台23壓 接精度較FPC假壓機台22壓接精度高，因此可以降低COF 單元對位偏移之不良率。 又，由生產COG機種之液晶顯示裝置變換為生產COF 機種時，用於吸附及輸送FPC之工具不必更換為吸附及輸 送COF單元之工具，假壓壓頭以及假壓工作平台亦不必更 換，不同機種之假壓動作在不同假壓機台中進行，僅需輸 入不同的程式及不同的相關參數以執行操作步驟即可，從 而減少換線時間。 另，用本發明之機台生產COF機種時，COF單元在 COF假壓機台中進行沖切，不需要事先將COF單元沖切完 畢並用托盤供料，可以節省人力和原料成本。 且，本發明在原有機台設備基礎上，僅增加一 COF假 壓機台即可形成一良率較高之COF機種之流水線，其可以 較大限度的利用原有設備，節省設備成本。 惟，生產TAB機種時，亦可採用與COF機種同樣的 實裝方法，其與COF機種的不同之處在於：僅將COF單 元更換為TAB單元即可。TAB單元為1C直接壓接在TAB 軟帶上，而COF單元係採用軟性電路板基材。 15 1328990 綜上所述，本發明確已符合發明專利之要件，爰依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，本發明之範圍並不以上述實施方式為限，舉凡熟習本 案技藝之人士援依本發明之精神所作之等效修飾或變化， 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係一種先前技術液晶顯示模組實裝方法之流程圖。 圖2係圖1所示LCM實裝之COG實裝步驟之詳細操作流 程圖。 圖3係一種先前技術平面顯示器用結合機之FPC機台部份 之立體示意圖。 圖4係利用圖3所示FPC機台進行邦定FPC之流程圖。 圖5係本發明之平面顯示器用結合機之FPC機台部份之立 體示意圖。 圖6係利用圖5所示FPC機台對COG機種之液晶顯示模 組進行邦定FPC之流程圖。 圖7係利用圖5所示FPC機台對COF機種之液晶顯示模 組進行邦定COF單元之流程圖。 【主要元件符號說明】 FPC機台 2 FPC假壓機台 22 COF假壓機台 23 FPC本壓機台 24 16Attach the ACF to the PCB and crimp the FPC to the PCB using ACF as the interface material. 1328990 Please refer to FIG. 3, which is a perspective view of a portion of an FPC machine of a prior art FPDL combiner. The FPC machine 1 includes a loader table (not shown), an FPC press table 12, and an FPC press table 14. The FPC false press table 12 is disposed adjacent to the FPC press table 14 side by side, and the loader table is disposed adjacent to the FPC false press table 12 and disposed behind the FPC false press table 12 for loading the FPC. The FPC is die cut a single piece of FPC and placed in a tray (Tray) placed on the loader table to provide an FPC to the FPC press table 12. The FPC false press table 12 includes an ACF attaching portion (not shown) and an FPC false pressing portion (not shown). Please refer to FIG. 4 together, which is a flow of bonding FPC using the FPC machine shown in FIG. 3, which includes: Step S31: The liquid crystal panel with 1C is crimped and transferred to the FPC false press machine; The liquid crystal panel is transferred to the ACF attaching portion of the FPC false press table 12 via a pipeline. Step S32: attaching the ACF film to the liquid crystal panel and thermocompression bonding the same; vacuum-adsorbing the liquid crystal panel to the working platform of the ACF attaching portion of the FPC false press machine 12, and attaching the ACF film to the liquid crystal panel after the alignment Upper and hot-pressed. Step S33: performing an FPC false pressing operation; transferring the liquid crystal panel to which the ACF film is attached to the working platform of the FPC false pressing portion of the FPC false pressing machine table 12, and sequentially vacuum-absorbing the FPC from the tray in which the FPC is placed in the loading machine table. The FPC is aligned with the liquid crystal panel to perform the 1328990 .FPC false pressing; Step S34: performing the FPC local pressing operation; and transmitting the false-pressed liquid crystal panel to the FPC pressing machine table 14 in the FPC pressing machine table 14 FPC this pressure. However, when the liquid crystal display module of the COF model is also produced by the above-mentioned machine, the COF machine will drive the 1C system due to the difference between the two models. • The direct crimping is performed on the flexible circuit board to form the COF unit, and then the COF unit is used. The LCD panel and the PCB substrate are connected, that is, the COF unit is respectively bonded to the liquid crystal panel and the PCB substrate, and the spacing between the gold fingers at the end of the COF unit is smaller than that of the FPC, and the precision of the device is also high. When the liquid crystal display module of the COF model is produced, if the above device is used to achieve the COF unit crimping, the COF unit has a high defect rate of the alignment offset. Since the structure of the COF unit is different from that of the FPC, it includes the drive 1C. Therefore, when the COF model is produced, the FPC machine 1 of the FPDL combiner needs to replace the tool for adsorbing and transporting the FPC with the tool for adsorbing and transporting the COF unit, and the pseudo pressure is pressed. The head and the false-pressure work platform need to be replaced, that is, the above-mentioned tool pair should be provided with a groove for driving the drive 1C at the drive 1C of the COF unit; and different programs and different related parameters should be input to execute different models. The operation steps, which result in a longer changeover time. In addition, the above-mentioned machine bonding FPC needs to put the punched FPC raw material on the tray and place the tray in the loading machine table. Therefore, it is necessary to punch the FPC in advance and feed the tray, which wastes manpower and raw material cost. . SUMMARY OF THE INVENTION In view of the above, an FPC machine with a bonding machine with a high precision of crimping is provided. A method of mounting a liquid crystal display module using different types of FPC machines for different types of machines is also provided. Bay, a flat panel display with a flexible circuit board machine, which includes a flexible circuit board false press machine, a film flip chip press machine and: Sex: This machine. The s-thin film flip-chip false press machine is placed between the flexible circuit board and the flexible circuit board. The flexible circuit board machine:: glass: flip-chip type liquid crystal display module for flexible circuit board bonding 2 knife, using flexible circuit board, false press machine and flexible circuit board, the press machine, the flexible circuit board for the liquid crystal panel The false pressure and the pressure; the soft electricity, the board machine. For the film-on-film type or the tape-bonding machine type, the liquid crystal display module 2 is a film-flip-chip unit or a tape-joining unit, respectively, and the flip-chip press machine and the flexible circuit board are pressed against the liquid crystal panel. The false pressure and the pressure of the splicing unit or the tape joining unit. - A method for mounting a liquid crystal display module using a different type of flexible circuit board machine for a flat-panel display, which comprises: if a soft circuit is applied to a liquid crystal display module of a glass flip chip type: Γ ' ' It includes the following steps: on the flexible circuit board false press table cover: two students: road board false 虔 action; after the false pressure of the liquid crystal panel through the film table to the flexible circuit board this press machine; in the soft circuit crystal Or shake; $ subscribe to the soft board this pressure action. If the film overlay = access panel / model of the liquid crystal display module for film flip-chip unit or state timing 'which includes the following steps · · liquid crystal panel through the h press machine to the film flip chip press machine; ζ S ; 13.28990 . In the film flip-chip press machine, the film flip-chip or the tape-bonding false-pressing action; the false-pressed liquid crystal panel is transferred to the flexible circuit board of the press machine for film flip-chip or tape-bonding Compared with the prior art, the flat panel display of the present invention can be crimped to different types of liquid crystal display modules by using a flexible circuit board machine and a liquid crystal display module using the above-mentioned machine. In the production of glass-clad crystallizers, the liquid crystal panel is pseudo-pressed by a flexible circuit board pseudo-pressing machine. When the film-coated crystal-type machine is produced, the liquid crystal panel is false-pressed by the film flip-chip press machine, due to the film. The crimping precision of the flip-chip false press machine is higher than that of the flexible circuit board, and the precision of the crimping of the flip-chip press is high, so that the defect rate of the alignment of the film flip-chip unit can be reduced. [Embodiment] Please refer to FIG. A schematic view of a FPC machine 2 for a flat-panel display. The FPC machine 2 includes a loader table (not shown), an FPC press table 22, a COF press table 23, and an FPC press table 24. The FPC false press table 22, the COF false press table 23 and the FPC home press table 24 are arranged side by side, that is, the COF false pressure is increased between the FPC false press table 22 and the FPC press table 24. The machine platform 23 is disposed adjacent to the FPC false press table 22 and disposed at the rear of the FPC false press table 22 for loading the FPC, and the FPC is punched and cut into a single piece of FPC and discharged into the tray. The tray is placed on the loader table for supplying FPC material to the FPC false press table. The FPC false press table 22 includes an ACF attaching portion (not shown) and an FPC false pressing portion (not shown). The COF false press table 23 includes a coil frame (not shown) and a false pressing portion (not shown), and the coil of the COF unit 12 1328990. The raw material is mounted on the coil frame. Referring to Fig. 6, Using the FPC machine 2 to perform the process of bonding FPC to the liquid crystal display module of the COG model, the method includes the following steps: Step S41: the liquid crystal panel with 1C is crimped and transferred to the FPC false press machine; The liquid crystal panel connected to the 1C is transferred to the ACF attaching portion of the FPC pseudo press table 22 via the pipeline. Step S42: attaching the ACF film to the liquid crystal panel and hot pressing it; vacuum absorbing the liquid crystal panel to the FPC The working platform of the ACF attaching portion of the press table 22, after the alignment, attaches the ACF film to the liquid crystal panel and thermocompression bonding. Step S43: performing FPC false pressing action; attaching the ACF film The liquid crystal panel is transferred to the working platform of the FPC false pressing portion of the FPC false press table 22, and the FPC is vacuum-adsorbed from the tray in which the FPC is placed in the loading machine, and the FPC is aligned with the liquid crystal panel to perform the FPC false pressing. Step S44: the false-pressed liquid crystal panel is transferred to the FPC press machine via the COF false press machine; the false-pressed liquid crystal panel is transferred to the COF false press table 23, and the liquid crystal panel is passed through the COF false press table 23. The transfer to the FPC press table 24, at this time, the COF false press table 23 only serves as a transfer. Step S45: Perform FPC local pressure operation; perform FPC local pressure in the FPC press machine. V s ) 13 13.28990 Please refer to FIG. 7 , the process of bonding the COF unit of the liquid crystal display module of the COF model by using the FPC machine 2 machine, which comprises: Step S51 : The liquid crystal panel without 1C is not connected to the liquid crystal panel FPC false press table; The liquid crystal panel is conveyed to the ACF attaching portion of the FPC false press table 22 via a pipeline. Step S52: attaching the ACF film to the liquid crystal panel and thermocompression bonding the same; vacuum-adsorbing the liquid crystal panel to the working platform of the ACF attaching portion of the FPC pseudo press table 22, and attaching the ACF film to the liquid crystal after the alignment On the panel and thermocompression bonding it. Step S53: The liquid crystal panel to which the ACF film is attached is transferred to the COF false press table via the FPC false pressing portion of the FPC false press table 22; and the FPC to which the liquid crystal panel to which the ACF film is attached is transferred to the FPC false press table 22 On the working platform of the false pressing part, at this time, only the alignment operation is performed, and the vacuum pressure action of the FPC false pressing part of the FPC false pressing machine 22 is also stopped without vacuuming the COF unit from the loading machine table. The liquid crystal panel to which the ACF film is attached is directly transferred to the COF false press table 23. Step S54: Performing a COF false pressing operation; performing a COF false pressing operation on the COF false pressing machine 23, that is, the raw material of the COF unit is placed on a coil frame of the COF false pressing machine 23, and is punched. After the tool punches out the single-piece COF unit, the single-piece COF unit is aligned with the liquid crystal panel to perform a false pressing operation. Step S55: Performing a COF local pressure operation; 14 1328990 The pseudo-pressed liquid crystal panel is sent to the FPC press machine 24 to perform a COF local pressure operation. Compared with the prior art, the FPC machine 2 of the FPDL bonding machine of the present invention is used for crimping. When the COG model is produced, the liquid crystal panel is pseudo-pressed by the FPC pseudo press table 22, and COF is produced when the COF model is produced. The false press table 23 performs false pressing on the liquid crystal panel, and the crimping accuracy of the COF false press table 23 is higher than that of the FPC false press table 22, so that the defective ratio of the COF unit alignment shift can be reduced. Moreover, when the liquid crystal display device that produces the COG model is converted into a COF model, the tool for adsorbing and transporting the FPC does not have to be replaced with a tool for adsorbing and transporting the COF unit, and the pseudo-pressure head and the false-pressure work platform do not have to be replaced. The pseudo-pressure action of the model is carried out in different false presses. It only needs to input different programs and different related parameters to perform the operation steps, thus reducing the changeover time. In addition, when the COF model is produced by the machine of the present invention, the COF unit is punched in the COF false press machine, and the COF unit is not required to be punched out and the tray is fed in advance, thereby saving manpower and raw material costs. Moreover, the present invention can form a pipeline of a COF model with a high yield by adding only one COF false press machine based on the original organic table equipment, which can utilize the original equipment to a large extent and save equipment costs. However, when producing a TAB model, the same mounting method as the COF model can be used. The difference from the COF model is that only the COF unit can be replaced with a TAB unit. The TAB unit is 1C directly crimped onto the TAB flexible tape, while the COF unit is a flexible circuit board substrate. 15 1328990 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a prior art liquid crystal display module mounting method. Figure 2 is a detailed operational flow diagram of the COG mounting steps of the LCM package shown in Figure 1. Figure 3 is a perspective view of a portion of an FPC machine of a prior art flat panel display. Figure 4 is a flow chart of the bonding FPC using the FPC machine shown in Figure 3. Fig. 5 is a perspective view showing the FPC machine portion of the bonding machine for a flat panel display of the present invention. Fig. 6 is a flow chart showing the bonding FPC of the liquid crystal display module of the COG model by using the FPC machine shown in Fig. 5. Fig. 7 is a flow chart showing the bonding of the COF unit of the liquid crystal display module of the COF model using the FPC machine shown in Fig. 5. [Main component symbol description] FPC machine 2 FPC false press machine 22 COF false press machine 23 FPC press machine 24 16