1327366 九、發明說明： 【發明所屬之技術領域】 本發明係有關-種基板結構及其植球方法，特別是關於一 種應用於球柵陣列封裝之基板結構及其植球方法。 、 【先前技術】 近年來，隨著終端消費性電子產品朝向「輕、薄、短、小及多 功能化發展的趨勢，積體電路(Integrated Circuit IQ之晶# 技術亦朝向高密度化、小型化、高腳數化的方向前進，為了實現小^ 化與窄腳距的封裝、以及改善散熱等問題，目前球拇陣列封裝二構 (Ball Grid Array，BGA)、覆晶(Flip Chip) ' 晶片尺寸封褒(chip、s_1327366 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate structure and a ball placement method thereof, and more particularly to a substrate structure applied to a ball grid array package and a ball placement method thereof. [Prior Art] In recent years, as the end-use consumer electronics products are moving toward "light, thin, short, small, and multi-functional, the integrated circuit (Integrated Circuit IQ) technology is also toward high density and small size. In order to achieve small and narrow pitch packaging and improve heat dissipation, Ball Grid Array (BGA) and Flip Chip are currently available. Chip size package (chip, s_
Package，CSP)等先進構裝技術已成為主流，其中之球极陣列封裝相較 於打線封裝，具有信號傳輸延遲小、應用頻率高、散熱能力強及封裝 體積小等優點，所以廣泛應用於各種不同型式的封裝結構，包括^ 型球柵陣列封裝結構、細間距球柵陣列(Fine pitch bga，FBGA)封裝名士 構、超細間距球柵陣列(Very Fine pitch BGA, VFBGA)封裝結構、微型 球柵陣列(micro BGA，eBGA)封裝結構及疊置式多晶片球柵陣列 (Stacked-type Multi-Chip Package BGA，St-MCP BGA)封裝結構等。 因此，高密度晶片構裝需要高密度、高品質與低成本的晶片封裝 基板(substrate)予以配合。 第1圖是一習知球柵陣列封裝基板的剖面示意圖，一基板2具有 一第一表面ό與一第二表面1〇，且基板2内部具有一佈線(trace) 4， 其材質為銅(Cu)，其中，第一表面6具有暴露出部分佈線4的複數第 一凹槽；複數焊球塾(solder ball pad) 8設於第一凹槽並暴露出第一表 面6，其中，焊球墊8與佈線4電性連接，任一焊球墊8為一有機可 焊性保護塾(Organic Solderability Preservative，OSP)，其用以電性連接 5 未朴焊球作為切酬帥携呻㈣) 二=?2得以電性連接一外界裝_中未示)，例如以表面 ^者=(f Gunt Tee_Ggy，SMT)來完成球栅陣列 =印刷f路板_ted C職lt B。㈣，PCB) _未示爾裝及電性 明’第—表面10具有暴露出部分佈線4的複數第二 12 數焊塾12設於第二凹槽並暴露出第二表面1G，其中，焊墊 糾'Π電性連接，任一焊塾12由"~層_ 14及一層金 =成Ί錦14設於佈線4表面，而金16設於錄14上；焊塾 用:電性連接複數焊線(b〇nding —(圖中未示)，焊線的功用是電 =連2載設於封裝結構中之一晶片（圖中未示 連接基板2，並_得以電性連接—外界裝置(圖中未示)片 例如一印刷電路板(圖中未示）。 第Μ圖至第2B圖是一習知球柵陣列封裝之植球_ _t)方 示意圖，其步驟包含：提供—球柵_封裝基板2，基板2 二一-表面6 ’且第—表面6具有複數凹槽，基板2内部具有佈 二’且凹槽暴露出部分佈線4，複數焊球塾8設於凹槽並暴露出第 面6其中，谭球塾8與佈線4電性連接，且焊球塾8為一有機 2性保雜；_ —助焊劑(flux)18於焊雜8表面·佈植(麵加） 複數焊球2〇於助焊劑㈣18上；以及迴焊，使複數焊球20 與佈線4電性連接。 然而’此種採用有機可焊性保護塾作為焊球墊之球柵陣列封裝基 板具有數項缺點’包括焊球墊下面之銅會發生銅氧化(Cu〇x咖〇n)現 象以及發生焊球遷移(ball shifting)現象。 第3圖是另一習知球柵陣列封裝基板的剖面示意圖，基板a具 有第-表面26與第二表面34，且基板22内部具有—佈線⑽㈤％， 其材質為鋼(Cu)，其中，第一表面26具有暴露出部分佈隸的複數 複數焊咖8設於第—凹槽並暴露出第—表面26,其中， 32 Z1 ΪΤ,24 f，^ S 28 3〇 wm '，鎳3〇设於佈線24表面，而金32設於錄30上，錄 ，通常是由電鍍(plating)或無電解錄含浸金(Ele_iess见制 焊玻r ιΓ ΤΑ舰咐方摘製作；焊雜28用時11連接複數 山’二〇 ei· au)(圖中未不），焊球作為輸人增出(bp满u㈣，I幻) 知’籍之使基板22得以電性連接一外界裝置(圖令未示）。 接續上述說明，第二表面34具有暴露出部分佈線24的複數第二 凹槽，複數焊塾36設於第二凹槽並暴露出第二表㈣，其中，雜 36與佈線24電性連接，任—焊心6由__層細及—層金_組成， ”中，鎳38设於佈線24表面，而金4〇設於鎳38上；焊墊％用以 電性連接複數焊線(bondingwire)(圖中未示），烊線的功用是電性連接 载設於封裝結構中之-晶片（圖中未示)與佈線24，藉之使晶片得以電 性連接基板22 ’並因而得以電性連接—外界裝置(圖中未示），例如一 印刷電路板(圖中未示）。 然而，此種採用一層鎳及一層金作為桿球墊之球柵陣列封裝基板 的缺點是㈣成本高，而且金屬間化合师ntei_Metame CGmp〇und， 瓜犯)上之焊球容易發生破裂(crack)現象。 【發明内容】 為解決習知技術以有機可焊性保護墊作為焊球墊所產生之鋼氧 化與焊球遷移等問題，本發明目的之一係提供一種採用錫/有機 可谭性保護墊作為焊球墊之基板結構及其植球方法。 為解決習知技術之金/錄焊球墊所產生之焊球破裂等問題，本 發明目的之一係提供一種採用錫/有機可焊性保護墊作為垾球墊 之基板結構及其植球方法。 ’ 觸有 結構目的’本發明—實施例之球柵陣列封裝基板 線土板，其具有"'表面，'表面具有複數凹槽；一佈 熱勺杯· -_出表其_，谭球墊與佈線電性連接，任一焊球 於^上。β ’其設於佈絲H層有機可焊性保護塾，其設 破方、、^，V1 到上述目的’本發明一實施例之球柵陣列封裝的植 日ml ‘提供—球柵_封裝基板，其中，基板具有一表面， 異命φ ^複數凹槽，基板内部具有一佈線，複數焊球塾設於凹槽並 ==Γ焊球塾與佈線電性連接，且任-焊球塾由-層錫 性保保_組成’其中’錫設於佈線表面，且有機可焊 ㈣1.13上，塗佈—助焊.焊轉表面；佈植複數焊球於助 知蜊上，及迴焊，使焊球與佈線電性連接。 底下藉由具體實施例配合所附的圖式詳加說明，當 易瞭解本發明之目的、技術内容、特點及其所達成之功效。 【實施方式】 詳細說明如下，所述較佳實施例僅做—說明而非用以限 定本發明。 第4圖是本發明-實關之球轉簡裝基板_面示意圖，一 基板42具有-第—表面46與—第二表面％，且基板42内部具有一 佈線(traCe)44,其中’第一表面46具有暴露出部分佈線μ的複數第 一凹槽，複數焊球墊48設於第-凹槽並暴露出第—表面46，其中， 焊球墊48與佈線44電性連接，任—科墊48由__層錫㈣％及一 1327366Advanced packaging technology such as Package, CSP) has become the mainstream. Among them, the spherical array package has many advantages such as small signal transmission delay, high application frequency, strong heat dissipation capability and small package size compared with the wire package. Different types of package structures, including ^ ball grid array package structure, fine pitch ball grid array (Fine pitch bga, FBGA) package name, ultra fine pitch ball grid array (Very Fine pitch BGA, VFBGA) package structure, miniature ball A gate array (micro BGA, eBGA) package structure and a stacked multi-chip package BGA (St-MCP BGA) package structure. Therefore, high density wafer fabrication requires high density, high quality and low cost wafer package substrates. 1 is a schematic cross-sectional view of a conventional ball grid array package substrate. A substrate 2 has a first surface ό and a second surface 〇, and the substrate 2 has a trace 4 therein, which is made of copper (Cu). The first surface 6 has a plurality of first grooves exposing the partial wires 4; a plurality of solder ball pads 8 are disposed on the first grooves and exposing the first surface 6, wherein the solder ball pads 8 It is electrically connected to the wiring 4, and any solder ball pad 8 is an Organic Solderability Preservative (OSP), which is used for electrically connecting 5 unpadded solder balls as a rewarding handsome (4)). 2 can be electrically connected to an external device (not shown), for example, with the surface ^ = (f Gunt Tee_Ggy, SMT) to complete the ball grid array = printing f board _ ted C job lt B. (4), PCB) _ not shown and electrically exposed 'the first surface 10 has a plurality of second soldering holes 12 exposing part of the wiring 4 is disposed in the second recess and exposing the second surface 1G, wherein, welding Pad 纠 'Π electrical connection, any solder 塾 12 from "~ layer _ 14 and a layer of gold = Ί Ί 14 14 is set on the surface of the wiring 4, and gold 16 is set on the record 14; welding :: electrical connection A plurality of bonding wires (b〇nding - (not shown), the function of the bonding wires is one of the wafers mounted in the package structure (the connection substrate 2 is not shown in the figure, and the electrical connection is made - the outside A device (not shown) is, for example, a printed circuit board (not shown). Figures 2 through 2B are schematic diagrams of a ball-grating __t of a conventional ball grid array package, the steps of which include: providing a ball grid _ package substrate 2, substrate 2 two-surface 6' and the first surface 6 has a plurality of grooves, the substrate 2 has a cloth 2' inside and the groove exposes a part of the wiring 4, and a plurality of solder balls 8 are provided in the groove and exposed Out of the sixth side, Tan ball 塾 8 is electrically connected to the wiring 4, and the solder ball 塾 8 is an organic bismuth; _ — flux 18 (welding) on the surface of the welding 8 (planting) The plurality of solder balls 2 are on the flux (four) 18; and the reflow soldering electrically connects the plurality of solder balls 20 to the wiring 4. However, the ball grid array package substrate using the organic solderability protection as the solder ball pad has several The shortcomings include the phenomenon of copper oxidation (Cu〇x curry n) and the occurrence of ball shifting of copper under the solder ball pad. Fig. 3 is a schematic cross-sectional view of another conventional ball grid array package substrate, the substrate a has a first surface 26 and a second surface 34, and the substrate 22 has a wiring (10) (five)%, the material of which is steel (Cu), wherein the first surface 26 has a plurality of soldering coffees 8 exposed to a portion of the cloth The first groove and the first surface 26 are exposed, wherein 32 Z1 ΪΤ, 24 f, ^ S 28 3 〇 wm ', nickel 3 〇 is disposed on the surface of the wiring 24, and the gold 32 is set on the record 30, recorded, usually It is made of electroplating (plating) or electroless recording of gold (Ele_iess see welding glass r Γ ΤΑ ΤΑ 咐 ; ; ; ; ; ; ; ; 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 焊 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 , , , , , The solder ball is added as a loser (bp full u (four), I illusion) knows that the substrate 22 can be electrically connected to the outside world In the above description, the second surface 34 has a plurality of second recesses exposing a portion of the wiring 24, and the plurality of solder bumps 36 are disposed in the second recess and expose the second surface (four), wherein 36 is electrically connected to the wiring 24, and the bonding core 6 is composed of a thin layer of __ and a layer of gold _, wherein, the nickel 38 is disposed on the surface of the wiring 24, and the gold 4 is disposed on the nickel 38; Electrically connecting a plurality of bonding wires (not shown), the function of the wires is to electrically connect the wafers (not shown) and the wires 24 in the package structure, thereby enabling the wafers to be electrically The substrate 22' is connected to the substrate and thus electrically connected to an external device (not shown), such as a printed circuit board (not shown). However, such a ball grid array package substrate using a layer of nickel and a layer of gold as a ball pad has the disadvantages of (4) high cost, and the solder ball on the metal interfader ntei_Metame CGmp〇und, melon is prone to cracking. phenomenon. SUMMARY OF THE INVENTION In order to solve the problems of steel oxidation and solder ball migration caused by an organic solderability protective pad as a solder ball pad, one of the objects of the present invention is to provide a tin/organic tantalum protective pad as a protective tape. The substrate structure of the solder ball pad and the ball placement method thereof. In order to solve the problem of cracking of the solder ball generated by the gold/recording solder ball pad of the prior art, one of the objects of the present invention is to provide a substrate structure using a tin/organic solderability protective pad as a ball ball pad and a ball placing method thereof. . The invention relates to a ball grid array package substrate line earth plate of the embodiment, which has a "'surface, 'the surface has a plurality of grooves; a cloth hot spoon cup · -_出表其_, Tan Ball The pad is electrically connected to the wiring, and any solder ball is placed on the soldering ball. '' is provided in the H-layer organic solderability protection 布 of the cloth, which is set to break the square, and V1 to the above-mentioned purpose. The ball grid array package of the embodiment of the present invention provides a ball-grating package. a substrate, wherein the substrate has a surface, a heterogeneous φ ^ a plurality of grooves, a wiring inside the substrate, a plurality of solder balls disposed in the groove and == solder balls are electrically connected to the wiring, and any solder balls By - layer tin protection _ composition 'where ' tin is set on the wiring surface, and organic weldable (four) 1.13, coating-welding. welding surface; planting a plurality of solder balls on the help 蜊, and back Soldering to electrically connect the solder balls to the wiring. The purpose, technical content, features and effects achieved by the present invention will be readily understood by the following detailed description of the embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following detailed description is merely illustrative of the preferred embodiments. Figure 4 is a schematic view of the ball-to-simplified substrate of the present invention, a substrate 42 having a - surface 46 and a second surface %, and a substrate 42 having a wiring (traCe) 44 therein, wherein The surface 46 has a plurality of first recesses exposing a portion of the wiring μ, and the plurality of solder ball pads 48 are disposed on the first recess and expose the first surface 46, wherein the solder ball pads 48 are electrically connected to the wiring 44, Pad 48 consists of __ layer tin (four)% and a 1327366
6、26、46 8、28、48 10、34、54 12、36、56 14、30、38、58 16、32、40、60 18、48、62 20、64 50 第一表面 焊球塾 第二表面 焊墊 鎳 金 助焊劑 焊球 錫 52 有機可焊性保護墊6, 26, 46 8, 28, 48 10, 34, 54 12, 36, 56 14, 30, 38, 58 16, 32, 40, 60 18, 48, 62 20, 64 50 First surface solder ball Two surface pad nickel gold flux solder ball tin 52 organic solderability protection pad