TWI322734B - Compression and cold weld sealing methods and devices - Google Patents

Description

1322734 IX. DESCRIPTION OF THE INVENTION: I [Technical method relates to a method of sealing together parts and devices] and more particularly to devices and/or implantable Into the medical device's hermetic seal method. - [Prior Art 3. Background of the Invention φ In many applications, two or more parts need to be connected (j0in), bonded, or sealed. Typically, particularly for medical implant devices, these seals must be biocompatible and sealed to, for example, protect the purity or properties of the contents of the reservoir. Examples of devices that may require sealing are described in U.S. Patent Nos. 5,797,898, 6, 527, 762, 6, 491, 666, and U.S. Pat. These controlled release or exposed means for storing the contents of the tank contain a plurality of storage φ slots in which the contents of the reservoir are housed. These reservoirs may include a pharmaceutical formulation for release, a sensor for exposure, or a combination thereof. In constructing these devices, it is often desirable to seal two or more substrates or other components that may contain storage tanks* and storage tank contents or electronic components associated with the operation of the device. There are various known sealing methods in the field of towels. Examples include U.S. Patent No. 6,730,072 (which describes the use of polymeric liners and backsheets), and U.S. Patent No. 6,827,25, which describes various techniques for sealing micro-storage tanks, including high temperature lasers or f-resistance. Welding, bribing (10)defing, (d) welding, and metal pressure linings), and those described in U.S. Patent Application Publication No. 2〇〇5/〇〇5〇 859 phantom 5, hereby incorporated by reference. . These methods may not be suitable or well suited for all sealing applications. Under the condition of %^ brother, the surface of the gold eyebrows usually cannot be combined when they are placed, because the metal surface is covered with surface oxides, organic pollutants, or both of them as obstacles formed by metal bonding. However, pressing two flat metal surfaces at a pressure exceeding the yield stress of the metal can cause the surface to become obstructed and expose the pure metal that can be bonded. However, even with two flat surfaces pressed together, significant metal deformation The actual bonding area is also significantly smaller than the area of the mating surface (Mohamed &

Washburn, Welding Research Supplement, September 1975, pp. 302s-310s ’ Welding & Joining Processes 3.371J/13.391J

Fabrication Technology, T. Eagar· MIT). This low bond area characteristic is due to two phenomena. First, the surface fraction of the newly exposed metal does not strongly depend on the amount of deformation of the flat surface. Second, the coarse seams prevent most surfaces from interacting and bonding. Since the surface is not completely bonded, there may be a leak path that hinders the formation of the seal.

Ferguson et al., "Contact Adhesion of Thin Gold Film on Elastomeric Supports: Cold Welding Under Ambient Condition,, 'Science, New Series, 253 (5021): 776-78 (August 16, 1991)) The thin gold metal surface is contacted with a gold-gold bond over the flexible polymer. However, the result is that the bonding interface has unbound contaminant "islands." These islands may form a connected leak path. It is desirable to provide improved sealing. Method, which can form a seal using a series of materials at low temperatures. It is also desirable to separately seal a plurality of closely spaced storage tanks between at least two substrates in a relatively simple and cost effective manner, particularly suitable for having High-reliability A-scale production. SUMMARY OF THE INVENTION Summary of the Invention - A pressure-cooled welding method and structure for sealing at least two substrates together is provided. This method can advantageously provide a seal without sealing Heat input in the process, which may be desirable in many applications where such additional heat may damage the device, formulation or bonding zone a nearby material. ▲ In a preferred embodiment, the method includes providing a first substrate, the money material having at least one first joint structure, the joint structure comprising a first joining surface comprising the first metal; a second substrate having at least one second joint structure, the joint structure comprising a second joint 2 surface, the surface comprising a second metal; and the at least one first joint structure and at least one second The joint structure is pressed together such that the joining surface produces an effective amount of local deformation and shear at one or more interfaces to bond the metal of the first metal (four) of the joining surface to the metal. In one embodiment The method further includes aligning the at least one first joint structure over the at least one second joint structure prior to the pressing step to impart one or more of the at least one second joint structure over the at least one second joint structure An overlap of a first joint structure, wherein the one or more overlaps form one or more interfaces of the joining surface during the pressing step. In one embodiment, the one or more overlaps can displace surface contaminants and promote intimate contact between the faces of the connection table 1322734 without heat entry. In a particular embodiment, the at least A first joint structure includes at least one tongue structure and the at least one second joint structure includes at least one groove structure and presses at least one first joint structure with at least one second structure The step includes at least partially pressing the at least one tenon structure into the at least one groove structure. In one embodiment, the tenon height of the at least one tenon structure ranges from 1 micron to 100 microns and a range of tenon widths It is from 1 micron to 100 microns, and the groove depth of the at least one groove structure ranges from 1 micrometer to 100 micrometers and the groove width ranges from 1 micrometer to 100 micrometers. Various combinations of structural materials can be used. For example, the first metal, the second metal, or both, may comprise gold or platinum. In a further embodiment, the first metal, the second metal, or both, comprise a metal selected from the group consisting of gold, indium, aluminum, copper, lead, zinc, nickel, silver, palladium, cadmium, titanium , tungsten, tin and combinations thereof. The first metal and the second metal may be different metals. The first substrate, the second substrate, or both, may comprise ruthenium, glass, ceramic, polymer, metal, and combinations thereof. The first joint structure, the second joint structure, or both, may comprise materials selected from the group consisting of metals, ceramics, glass, tantalum, and combinations thereof. In one embodiment, the first linker structure, the second linker structure, or both, may comprise, alloys, gold, lanthanum, chains, copper, ruthenium, tin, alloys thereof, and combinations thereof. In one embodiment, the at least one first joint structure is formed by bonding at least one preformed structure to the first substrate. The first connection surface may be formed by, for example, an electric key process, evaporation, chemical vapor deposition process, 8 1322734 sputtering, electron beam evaporation, or a wet etching process. In one embodiment, the first joint structure and the first joining surface are metal layers that cover at least a portion of the surface of the first substrate. In one embodiment, the method can further include providing one or more preforms between the first substrate and the second substrate, wherein the at least one first joint structure and the at least one second joint structure are pressed The step of further comprising further deforming and shearing the one or more preforms at a preform interface with the substrate or joining surface. In one embodiment, the preform comprises a metal, polymer, or metal clock coated polymer. In one embodiment, the method further comprises heating the joining surface at one or more of the interfaces. The pressing step and the heating step can occur substantially simultaneously. In one embodiment, the heating of the joining surface is performed using a micro heater. In another embodiment, the sealing method further comprises applying ultrasonic energy to the joining surface at one or more interfaces. In yet another embodiment, the sealing method further comprises clamping or soft-twisting the first substrate and the second substrate together. In a preferred embodiment of the method, the bonded substrate comprises at least one cavity defined therein. In one embodiment, the at least first substrate comprises a plurality of discrete storage tanks that contain the contents of the storage tank, each storage tank being sealed from each other and sealed from the external environment. In one embodiment, the storage tank contents include a biosensor or other auxiliary device. In another embodiment, the contents of the reservoir contain a pharmaceutical formulation. In yet another embodiment, the contents of the reservoir contain a fragrance or aroma compound, a dye or other coloring agent, a sweetener, or a flavoring agent. In one embodiment, the first substrate comprises a cavity in which a third substrate is disposed prior to pressing the first and second joint structures together. The third substrate can comprise, for example, a sensor, a MEMS device, or a combination thereof. In one embodiment, the deformation step in the process is carried out under vacuum or in an inert gas atmosphere to enable reduction of oxidation of the joint structure relative to oxidation that may occur if conducted in the atmosphere. In one embodiment, a method of sealing at least two substrates together is provided, the method comprising the steps of providing a first substrate having at least one first joint structure, the first joint structure comprising a first joining surface, The surface comprises a first flexible polymer bonded to a thin metal layer; a step of providing a second substrate having at least one second joint structure, the second joint structure comprising a second joining surface comprising a metal plated a thin layer of a second flexible polymer; and pressing the at least one first joint structure with the at least one second joint structure to cause the joining surface to produce an effective amount of local deformation at one or more interfaces to A bond is formed between the first and second joining surfaces. In one embodiment, the first or second metal plating polymer, or a metal layer of both, comprises gold, platinum, or a combination thereof. In another aspect, a container member is provided, the device comprising: a first substrate having a front side and a back side, and the substrate comprising at least one first joint structure, the first joint structure comprising a surface having a first metal a joining surface; a second substrate having at least one second joint structure, the second joint structure comprising a second joining surface having a second metal surface; forming between the first 10 1322734 substrate and the second substrate And sealing the joints thereof, wherein the seal is formed by pressure-welding the first joint surface to the second joint surface at one or more interfaces; and the seal is defined within the first substrate and the second substrate At least one containment space between, so that the containment space is sealed from the external environment. In one embodiment, the at least one containment space comprises a plurality of discrete reservoirs in the at least first substrate between the front side and the back side. In various embodiments, the at least one containment space comprises a sensor, MEMS device, pharmaceutical formulation, or a combination thereof that is contained within the containment space. In a preferred embodiment, the joining surfaces are joined together by a metal-to-metal bond formed by no heat input. In one embodiment, the at least one first joint structure and the at least one second joint structure comprise tenon and groove joints. In various embodiments, the first metal, the second metal, or both metals may comprise gold, platinum, or a combination thereof, and the substrate may comprise a material selected from the group consisting of ruthenium, metals, ceramics, polymers, Glass, and combinations of materials. In one embodiment, the preform structure is deformed between the first and second joint structures. In another embodiment, the first joint structure or the second joint structure comprises a micro-heater. Alternatively, an intermediate layer can be provided adjacent the micro heater. In one embodiment, the first joint structure or the second joint structure may comprise a magnetic material capable of heating the structure by an external induction heater. The device may further comprise other securing means, for example, a clip may be used to join the substrates together, or the first substrate and the second substrate may be secured together using a dip material. In one embodiment, the first substrate further comprises discrete openings associated with at least one of the spaces of the package, and the openings are closed by a plurality of discrete barrier covers. In one embodiment, the reservoir cover includes a metal film and the device includes means for selectively splitting (=Slot cover) (e.g., control circuitry and energy source). * In the aspect, an implantable medical device is provided that can be used to control the controlled exposure or release of contents in a sealed reservoir. In one embodiment, the device comprises a first substrate; a plurality of discrete storage slots in the first substrate, the storage slot having a first opening and a second opening remote from the first opening; the interior of the storage slot a storage tank contents, wherein the storage tank contents comprise a drug or a biosensor; a plurality of discontinuous storage tank covers closing the first opening; a device for selectively splitting the storage tank; and a second substrate and sealing And a hermetic joint closing the first opening, wherein the hermetic joint is formed by pressure cooling welding. In one embodiment, the hermetic joint comprises a tenon and a groove interface. Another aspect provides a method of forming an electrical conduction connection: providing a first electrically non-conductive substrate having a hole φ therethrough, wherein an inner surface of the first substrate defining the hole comprises a first layer of electrically conductive material Providing a second non-conductive substrate' having a protruding member extending from a surface of the second substrate, wherein the member is formed of or coated with a second electrically conductive material; The projecting member of the second substrate is pressed into the tie of the first substrate to cause the first and/or second conductive layer to produce an effective amount of local deformation and shearing to conduct the first and second conductive Bonding and electrical connections are formed between the layers. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of an embodiment of a sealing system having a tenon and groove joint design designed to provide a seal formed by a pressure cold welding process. 7 is a cross-sectional view of another embodiment of a sealing system having a tenon and groove joint structure design that provides a seal ❶ on the left side of the drawing >1 before the cold welding process, and The figure on the right shows the seal formed after the compression welding process. The scanning electron micrograph of Fig. 3 shows a cross section of the seal formed by the sealing design and the pressure cooling welding process shown in Fig. 2. Figure 4 is a cross-sectional view of one embodiment of a sealing system having a joint structure design with a single cold shear layer at each joint structure. Figure 5 is a cross-sectional view of one embodiment of a sealing system having a metal preform that can be compression welded between the joint structures. Figure 6 is a cross-sectional view of another embodiment of a sealing system having a metal preform that can be compression welded between the joint structures. Figure 7 is a plan view of five different embodiments of the bottom geometry of the joint structure. Figure 8 is a plan and cross-sectional view of six different embodiments of a joint structure design that can be used to form a seal by compression and cooling. Figure 9 is a cross-sectional view of four embodiments of a sealing system formed using different combinations of joint construction designs shown in Figure 8. Figure 10 is a cross-sectional and enlarged cross-sectional view of one embodiment of a sealing system having a tenon and groove joint design. Figure 11 is a cross-sectional view of one embodiment of a sealing system having a heater and an intermediate layer on the heater. Figure 12 is a cross-sectional view of one embodiment of a sealing system having a micro-heater on the core of the joint structure, the joint structure comprising an intermediate layer on the substrate material and the micro-heater. Figure 13 is a cross-sectional view of an embodiment of a sealing system with a microheater in direct contact with the joining surface material. Figure 14 is a cross-sectional view of a cross-sectional view of a sealing system having a micro-heater on the core of the joint structure, the joint structure comprising a substrate material and in direct contact with the joining surface material. Figure U is a perspective view of one embodiment of a sealing system with a Nitin〇i clamp. 16A-C is a cross-sectional view of one embodiment of a sealing system with a gripper showing the steps of assembly. Figure 17 is a cross-sectional view of one embodiment of a sealing system having a cold weld slip and a press seal material. Figure 18 is a cross-sectional view of one embodiment of a device including a memory cell array, with a compression and cooling process having a tenon and groove joint design that separately seals the storage cells. The body of the device in which the reservoir is defined includes two substrate portions which are also sealed together by a press-and-bake process having a convex drop and recessed joint design. Figure 19 is a perspective view of an embodiment of a device that includes a reservoir (4) and has a joint design for the 14 1322734 slot with a separate compression storage process. Figure 20 is a cross-sectional view of three embodiments of a sealing system having different polymer joint structures plated with a metal joining surface. Figure 21 is a cross-sectional view of an embodiment of a multiple storage tank container member showing the sealing of the storage tank by a pressure cooling process. Figure 22 is a cross-sectional view of one embodiment of a sealing structure that uses a bonded "sandwich" structure to protect the intermediate substrate from compression bonding. Figure 23 is a cross-sectional view of an embodiment of the part prior to joining for forming an electrical continuity connection by compression welding as described herein. Figures 24A-B are perspective views of the electronic circuit connections made by the compression-cooled welding described herein. Figure 24A shows the parts before the connection, while Figure 24B shows the connected components. Figure 25 is a perspective cross-sectional view of one embodiment of the part prior to joining, the part being electrically connected by pressure to form an electrical connection. Figure 26 is a diagram of one embodiment of an electrical continuity connection made by pressure refrigeration welding. This diagram shows the material overlap between the opening and the convex teeth. Figures 27A-B are scanning electron micrographs (SEM) of two tantalum substrates having micromachined sealing members for pressure refrigeration welding. I: Embodiment 3 Detailed Description of the Preferred Embodiment A method and a device for forming a seal by a pressure cooling welding process have been developed. This process and seal design advantageously combines device parts reliably and efficiently while protecting sensitive device components and contents from heat and solvent. The work includes: pressing and cold-welding two substrates having one or more joint sealing surfaces, which can be locally deformed and sheared during the pressing process to promote molecular _(four) and bonding . Advantageously, the shearing and deformation of the metal sealing surface will substantially be any metal ruthenium oxide or money or inorganic material present on the surface, thereby providing an atomically clean metal surface to promote the metallurgical bonding of the joining surface. And thus promotes the complexity. That is to say, cold welding produces a joint surface where the shirt contaminants are thus freely bonded. In a preferred cold welding technique, the pressure exceeding the metal yield stress deforms the joint structure and the joining surface. The metal deforms from two (four): intimate contact between the joining surfaces, and removal of surface oxides and other contaminants so that a combination of metal gold 4 can be produced. In the case of a gold metal bonded embodiment towel formed by cold welding, an additional jig may be unnecessary. In one aspect, a method of sealing at least two substrates together is provided, the method comprising the steps of: providing a first substrate having at least one first joint structure, the first joint structure comprising a first joining surface, the surface comprising a first metal; providing a second substrate having at least one second joint structure, the second joint structure comprising a second joining surface, the surface comprising a second metal; the at least one first joint structure and the at least one The second joint structure is pressed together such that the joining surface produces an effective amount of local deformation and shear at one or more interfaces to form a metal-metal bond between the first metal of the joining surface and the second metal The first metal and the second metal may be the same or different. They can be different alloys of the same base metal. If the same metal is used, the first metal and the second metal may have 16 different crystal structures, difficult structures, and the like. Non-limiting examples of suitable metal surface materials include indium, aluminum, copper, lead, zinc, nickel, silver palladium, titanium, crane, tin, and combinations thereof. Gold or fine may be preferred. The first substrate - the substrate, or both, may be formed from a variety of materials; in the 'example, shout, polymer, metal, and combinations thereof: Non-limiting examples of soil materials include quartz, acid carbonate glass, In what form is the emulsion, nitrite, and combinations thereof. The substrate and the to five joint structures may be composed of the same material or different materials. A variety of Wei art known in this j domain towel can be used in the substrate towel / on the joint knot. Only the deep reaction ions of the substrate L, the drilling (such as laser), milling (milling) 'Micromachining, MEMS process, or LIGA process. No. - Connector, . The _ joint structure, or both, may comprise a material selected from the group consisting of metal, ceramics, glass, stellite, and combinations thereof. Examples of possible joint structure materials include the above-mentioned metal surface metals such as indium, aluminum 'gold' chrome 'platinum' copper 'nickel' tin' alloys thereof, and their groups and any form of oxidized, quartz, dazzle (four) ^, oxidized stone eve, nitriding Shao 'carbon cut' and King Kong; s. The joint structure readable substrate is integrated or bonded thereto. In one embodiment, the joint structure is formed by combining at least one prefabricated structure with its substrate. This preforming can be formed by, for example, a bond, a chemical vapor deposition, a MEMS process, a micromachining, a LIGA process, or an anodic combination. Structure. It can be passed, such as hot pressing, soft boring welding or ultrasonic welding, and the joint structure can be composed of the same material or different materials. In an embodiment, the method further Included in the step of providing one or more separate preforms between the first substrate and the 17 1322734 second substrate, wherein the step of pressing the at least one first joint structure and the at least one second joint structure together further comprises: Or a plurality of preforms are deformed and sheared at the preform interface with the substrate or the joining surface. The preform can be formed by LIGA process, MEMS process, wet etching, laser micromachining, stamping, cutting, or micro-casting. The preform may comprise a metal, polymer, or metal plated polymer. In preferred applications of these methods and seal designs, The seal is used to seal the micromachined device components, particularly for sealing the implantable medical device. In a preferred embodiment, the present sealing method and joint structure are used in the device to individually encapsulate the containment storage a slot array, and/or an electronic component associated with device operation, the storage slot containing storage tank contents, such as drugs and/or biosensors for controlled release. In one aspect, one or more are provided One such sealed device. In one embodiment, the device comprises a first substrate having a plurality of storage slots (the substrate may comprise two or more wafer or substrate portions), each storage cell comprising a sensing Or a pharmaceutical preparation, wherein each storage tank includes a first opening on the first surface of the device. The first opening is closed by a storage tank cover that selectively and actively splits to control release of the contents of the storage tank Or the time and/or rate of exposure. In one embodiment, the storage tank further includes a second opening remote from the first opening. After loading the contents of the storage tank into the storage tank or The seal is simultaneously sealed. Typically, the seal includes bonding the first substrate to the second substrate using one or more sealing methods and joint designs as described herein. Optionally, the device further includes 18 (4) Storing a closed-loop package structure to protect the environment associated with the driver ft-fracture and any sensors associated with the memory tank from the environment == and sealing the contents of the electronic components and storage tanks. The term "environment" as used herein refers to the exterior of the storage tank as well as the biological fluids contained in the implanted position and the woven 'air, fluid, pieces of the particles stored or in vitro or in the body. The term “cold welding” of 4〇ί (4) refers to the intermolecular bond formed by the use of typical low and dilemma conditions without applying heat. The secret “sealing netie sea1” used in hi is used in 11 The messenger of the piece prevents the entry of chemicals into 11 pieces - screaming multiple compartments, or slamming out of it, especially the device (4). For the purposes of this, the ") transmission rate is less than lxl (y9atm!!: cc/sec is called the term "include," and "including" meaning, non-limiting terminology. Unless the counterexample is clearly stated.

The first sealing comprises a first substrate and a second substrate, the first substrate having at least (" a first joint structure having a first joining surface, the second substrate having a second solidifying surface having a second joining surface a joint structure that joins the two substrates by cold welding at one or a singular interface. In a preferred embodiment, the seal is biocompatible and suitable for medical implants. The two substrates can optionally contain one or more storage slots, sensors, music, and electronic components. The substrate can be cut, lang, pyfex glass, ^, titanium, alumina, sputum, and others. Biocompatible ceramics 19 and other metals or polymers. In one embodiment, the stone substrate allows the use of photodetectors in the near infrared (NIR) to infrared (IR) spectrum. It should be understood that by appropriate selection of bases Material, using a spectrum of visible, ultraviolet or other wavelengths of light = method is acceptable. In addition, the substrate may contain a polymer having a high enough Young's Larry and yield stress to produce a high temperature in the cold welding process. Shearing. ° Connection on each substrate The head structure (also referred to as "sealing member,") may comprise the same material as the substrate or, for example, if the joint is micromachined in the substrate towel, the joint is composed of the substrate material. Alternatively, the joint structure: U is a preform bonded to a substrate, the preform being composed of a material different from the substrate, such as a metal, a metal alloy or a combination of metals. In another embodiment, the (10) eight shaped nickel joint structure can be plated. The gold layer is then bonded to the (4) metal substrate by soft soldering, hard soldering, or subtractive bonding. The LIGA structure can be composed of any metal or metal alloy compatible with LIGA Weiyi. In yet another embodiment The joint structure preform may be formed from glass or tantalum using microelectromechanical systems (MEMS) processing. The joint structure has a metal-bonding surface (also referred to as a "shear layer" or "bonding surface,") The ground may be combined with other joining surfaces. In another embodiment detailed below, the joining surface may be a flexible polymer. A metal having a suitable low plastic deformation stress is used as the metal. Connecting surfaces. Those skilled in the art can determine suitability, for example based on the specific joint shape and the amount of force that can be reasonably applied to form the joint. Additionally, it is preferred to use no surface oxide or have a high relative oxide relative to the parent. The metal of the hardness of the metal serves as the joining surface. See 20 (2) 20 1322734 "Investigations on Pressure Welding" British Welding J. (March 1954) and Mohamed et al. "Mechanism of Solid State"

Pressure Welding", Welding Research Supplement, pp. 302-310 (September 1975). Representative examples of suitable metals (and their alloys) include gold (Au), indium (In), aluminum (A1), copper ( Cu), lead (Pb), zinc (Zn), nickel (Ni), silver (Ag), platinum (Pt), palladium (Pd), and cadmium (Cd). Representative of the preferred surface metal for biocompatibility Examples of sex include Jin Heming.

The first attachment surface may or may not be comprised of the same material as the second attachment surface, the first attachment surface will form a seal with the second attachment surface. For example, the joining surface may be composed of a dissimilar metal of the same parent metal or a different alloy. For example, the first attachment surface can be gold and the second attachment surface can be platinum. In one embodiment, the joining surface is comprised of the same material having a different structural morphology. For example, the first joining surface can be annealed to reduce by a standard annealing mechanism for recovery, recrystallization, and grain growth.

The yield stress, while depositing the second joining surface, results in a small grain size, thereby increasing the yield stress. The joining surface may comprise the same or a different material than the joint structure. This provides greater freedom in the joint manufacturing process and also provides better design control over the degree and location of plastic deformation. For example, precise joint structures can be micromachined on a tantalum substrate and joint surface materials can be deposited on these structures using defined process steps. However, the formation of precise joint structures on alumina substrates has proven to be difficult and may require additional materials and addition of X methods. As an example, for oxidation = substrate, the joint structure may be a deposited metal or alloy having mechanical properties different from the joining surface (e.g., 21 1322734 higher elasticity and higher yield stress). In one embodiment, the joint structure can be electroplated nickel, electroplated gold alloy, chrome plated structure, or plated platinum structure. It should therefore be clear that the joint structure may not require further processing and have a joining surface comprising the same material as the joint structure, or the joint structure may have at least one other material deposited, plated, or formed on the surface of the joint structure to produce a different The joining surface of the material of the joint structure. The joint structure may consist of a single material or a combination of materials. Method of making a seal The seal is made by pressing and cold welding. In one embodiment, the two substrates are sealed together by providing a first substrate having at least one first joint structure, the first joint structure comprising a first joining surface of the metal; providing at least one a second substrate of a two-joint structure, the second joint structure comprising a second joining surface of the metal; pressing the at least one first joint structure and the at least one second joint structure together such that the metal surface is at one or more interfaces An effective amount of local deformation and shear occurs to form a continuous metal-to-metal bond between the joining surfaces at one or more interfaces. In some embodiments, ultrasonic energy can be introduced into the sealing joint during the bonding process. While not being bound by any particular mechanism of action, it is believed that by removing contaminants from the joining surface and deforming the surface roughness such that there is intimate contact at the bonding interface causing metal-metal internal diffusion, the ultrasonic energy can promote sealing. In other embodiments where the bonding mechanism is not purely cold welding, the heat pulse 22 1322734

Or a small increase in temperature can promote metal bonding by enhancing diffusion and lowering the yield stress of the metal. For example, induction heating can be used to locally heat the joining surface metal. If non-magnetic other metals are present in the device, the connecting metal can be selectively heated by adding a magnetic material under the joining surface. Representative examples of magnetic materials include magnet, iron, cobalt, and combinations thereof. Alternatively, the geometry of the joint structure can be designed to selectively couple a magnetic field of a given frequency. (See Cao et al., "Selective and localized bonding using induction heating", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Headlsland, SC, June 2-6, 2002). ), nitrogen, vacuum, or some other condition that minimizes oxidation rate and joint surface contamination to minimize the surrounding environment. Example of sealing device and system 眚 竿 竿 Design joint structure to be effective at the joint surface for a given load

The ground produces large local pressures and deformations. The Fig. 6 shows a (four) face view of the actual (4) case of the seal line having the joint structure, and the head structure effectively converts the pressure on the base to the shear force on the joint surface to cold weld the joints together. This shearing force is generated by the interference (i_f(10)ce) or overlap between the joint structures, so that when the joint structures are put together, there is a metal joint table, which is deformed by (iv) force. The relative f-cut of the two overlapping structures eliminates the m and causes the surfaces to interact and mate. In some embodiments, 'only the interference portion of each joint structure is changed. In other embodiments, due to the different materials and related properties of each of the 23 1322734 forming the joint, the formation of the (four)-to-joint structure is only A joint structure is significantly deformed. The joint structure shown in Fig. 1-6 can be fabricated using, for example, a conventional MEMS process, although the subtractive structure should also have a _(four) effect on the Wei scale. Figures 1-6 show the joint structure only on each of the dense (four) systems, but the other schemes can include multiple sets of joint structures. In addition, the joint structure of the first to sixth dimensions is shown in a rectangular cross section. However, other cross sections such as triangular, rhombic, or hemispherical joint structures may also be used depending on, for example, geometrically defined micromachining limits. For example, a hemispherical joint structure can be produced by electroplating a material of the joint structure to a seed layer defined by photolithography without the presence of a plating mold. In another embodiment, a chamfered (circular) or circular joint structure can be formed from a rectangular tantalum structure using reactive ion etching (RIE). In yet another embodiment, the photoresist can be overexposed to create an undercut in development to form a diamond and then used as a mold for the plated joint structure. Multiple layers of photoresist can be used to create more complex part shapes. 1 shows a cross-sectional view of one embodiment of a sealing system 10 having a "bump and groove" sealable by cold welding, a joint structure design having a first substrate 12 The substrate has a first ram structure 16. Each of the first joint structures has a first joining surface 18 ◊ the first substrate 14 has a second joint structure comprising two joint structural members 2〇a and 2〇b. Each of the second joint structures 20a/20b has a second joint surface 22. The first joint structure 16 produces a "groove," which is at least partially mated with the second joint structure 2〇a/2〇b. . Measured across opposite sides of the sealing surface 18

V 24 1322734 has a greater visibility than the gap provided in the recess of the second joint structure connecting layer 22. Therefore, when the joint structure is pressed together during the cold welding process, the first joint, . The connecting layer 18 and/or the first joint structure joining surface 22 are deformed to produce shear at the joining surfaces 18 and 22 along the apex and side walls of each joint structure. The first attachment surface 18 and the second attachment surface 22 may be composed of the same or different materials. Figure 1 shows a layer of material ' forming the joining surfaces 18 and 22' and different materials forming the respective connecting structures 16 and 20a/20b. In another embodiment, the joining surface and/or joining structure may comprise a plurality of layers of material to finely adjust mechanical properties or cold weld bonding properties. Figure 2 shows a cross-sectional view of another embodiment of the sealing system 30 before and after forming a seal using cold welding. The sealing system 3 has a first substrate 32 and a second substrate 34. The first substrate 32 has a first joint structure 4〇 having a metal joint surface 38a/38b. The first joint structure 4A is in the form of a groove structure formed in the first substrate 32. The second substrate has a second joint structure 36 comprising a material different from the second substrate. The second joint structure 36 has a metal attachment surface 42a/42b that contains the same material as the second joint structure. This second joint structure 36 is in the form of a tenon structure that can partially fit into the groove structure of the first joint structure 4〇. A compressive bonding force is applied to the first substrate 32 to cold weld the two substrates together. When pressure is applied, the tenon of the second joint structure 36 deforms into the groove of the first joint structure 40. When the force exerted on the interference region between the first joint structure 4〇 and the second joint structure 36 produces a pressure exceeding the % 25 1322734 service stress, deformation occurs. The profit or overlap is also shown in the table (4) a/m, 42a/42b meets the interface to produce shear force. The combination of deformation and shear forces forms a metal-metal bond between the joining surfaces 38a and 42a and the joining surfaces 38b and 42b. Therefore, an effective seal is formed by using cold welding. See Figure 3

It should be understood that the overlap between the joint structures shown in Figure 2 is for illustrative purposes and may be smaller or larger than the illustration. The greater the overlap, the greater the pressure required to deform the joint layer to form a hermetic bond. It should be understood that the local deformation at the joint surface is the two-phase mechanical property of the joint structure disc joint surface. (IV) Function L In the __ embodiment, the entire joint structure containing the IU body gold tenon can be deformed under compression into (four) _ head In the structure. In another embodiment, if the embossing is smashed and the joining surface is gold, the deformation is limited to the sides and corners.千伐颂衣囟 ^ I Field I UUsi

R _ ... clearly, [she has a cross-section of two.] The read system has a cold weld shear at each joint structure. The tamping system 50 has a first substrate 2 2 and a mate-substrate 54. In this implementation, the head of the 58_two joint table (four) is in the stack. The upper side of the surface 58 and 62 and the amorphous upper side of the upper side can reduce the force required to form a seal 'because of the smaller = wide into the required pressure scheme, the joint is ejected, in- Another implementation, ° 0 is a triangle or trapezoidal joint structure; & form in order to further reduce the head, ·. The disadvantage of the design of the material surface is that it can only be 2 (four) required (four) force. This joint seals the perimeter, but the use of a symmetrical 26 design (such as Figure 2) gives the opportunity to create two sealed perimeters. A single joint structure such as the tenon and groove combination described herein is generally considered to have two perimeters. Multiple sealing perimeters can advantageously provide the required redundancy in the device, providing a fail-safe seal, wherein one or more but not all of the sealing perimeters may be incomplete or may fail, while the entire seal remains Closed. Figure 5 shows another embodiment of a sealed system using cold welding. The first substrate 72 and the second substrate 74 between the applied pressures are shown. The first substrate 72 has a first joint structure 76a/76b having a metal attachment surface 78. The first joint structure 76a/76b is aligned with the second joint structure 8〇a/8〇b having the metal joint surface 82. The joint structure 7 such as /7讣 and the joint structure 8〇a/8〇b form a groove into which the metal preform 84 is placed. When the first substrate 72 and the second substrate 74 are pressed together during cold welding, the preform 84 is deformed and sheared relative to the joining surfaces 78 and 82 to form a metal-to-metal bond between the preform and the joining surface. The preform 84 can be formed using a LIGA process, wet etching, or laser micromachining. It should be clear that the processing of the preform material depends on the phase of the processing with the preform = material. It should also be clear that the geometry of the cross-section of the preform can be limited by the method used by the new moon. For example, LIGA technology cannot produce a 1] cross-section that is not shown in Figure 5, but Wei Jingwei can make such a cross section. Figure 6 shows another embodiment of a sealing system 90 having a metal preform. (IV) ❹ View 'The preform can be cold welded between the (4) joint structures. The sealing system 9 has a first substrate 92 and a second substrate 94. The first substrate 92 has a first pick-up structure comprising a groove structure formed in a substrate of the 271222734. The first joint structure 96 has a first metal joint surface 98. The second substrate 94 has a second joint structure 100 comprising a groove structure formed in the substrate and a second metal joining surface 102. A metal preform 104 is placed between the first joint structure 96 and the second joint structure 100. The preform 104 can be formed using a similar method as described above with respect to the preform 84 in FIG. When the first substrate 92 and the second substrate 94 are pressed together, the preform 104 is deformed and sheared relative to the joining surfaces 98 and 102 to form a metal-to-metal bond between the preform and the joining surface to complete the sealing. Prefabricated parts, various combinations of male components (such as "claw" or "girdle") and grooves can be used in the pressure-cooled welding process. In one embodiment, one substrate has a tenon joint structure and the other substrate has a groove joint structure, the groove structure having a groove width greater than the width of the tenon joint structure, which can be pressed between them The preforms are cold welded together. The cross-section geometry of the preform may be circular, circular, rectangular or other suitable cross-section. In all of the above embodiments, it is desirable to minimize the distance between the bonded substrates. This adjustment can be achieved by minimizing the overlap to minimize the amount of metal that deforms into the space between the substrates. Alternatively, a recess can be formed adjacent the tenon joint structure to provide a volume that can be occupied by the deformed metal below the surface of the substrate. Alternatively, the groove structure can have two different widths, a wider opening and a narrower end such that the metal cut by the narrower groove flows into the wider groove at the opening. Figure 7 shows a top view of a different embodiment of the geometry of the joint structure that can be formed by cold welding to form a seal. The base structure of the joint structure is 28 and the geometry comprises a circle 11 (), an elliptical shape m, a hemispherical rise y 114 ' with a straight side wall, a square U6 with a ® angle, and a hexagon 118. Other implementations of the joint structure geometry may include any ridge shape or any ‘& route that produces a closed profile. It is advantageous to avoid sharp corners around the joint structure, as it may be difficult to form a seal at this angle. Figure 8 shows a top view and a cross-sectional view of different configurations of a joint structure that can be fabricated using a MEMS process. These embodiments have only one set of joint structures on the parent substrate, but other embodiments may include an array of peripheral teeth or grooves that serve as a set of multiple joint structures. Figure 8 shows the geometry of ''bumps' and 'grooves' in a rectangular cross section, but other cross sections, such as triangles or hemispheres, may also be used, depending on the micromachining limits defined by the geometry of the transverse wear. In other embodiments, the substrate may comprise a reservoir array of drug contents or sensors, wherein each reservoir needs to be sealed from other reservoirs and the external environment. One or two steps of deep reactive ion etching may be utilized, respectively ( DRIE), followed by a deposition step of the metal joining surface, joint structures 124a/l 24b and 132 of joint structure designs 120 and 128 can be machined in the tantalum substrates 122 and 130, respectively. The joint structures 132 and i24a/124b are convex, respectively. The MEMS equivalent of the 榫 and groove joints. During the cold welding of the substrate 122 to the substrate 130, the groove corners between the joint structural members 124a and 124b are at the edge of the joint structure 〖32 (girdle) and the groove High local stresses are created at the corners of the members 124a and 124b. High stresses cause plastic deformation and shear at the metal interface, forming intimate contact and bonding between the joining surfaces 126 and 134. The joint structure is formed by a combination of milling and plunge electrical discharge machining (EDM) 29 1322734 steps, and if desired, metallization of the joint structure can be performed using an electric ore step to create other implementations of the joint structure design. The joint structure design 136 includes a tenon joint structure 140 made of a low plastic deformation stress metal such as indium, aluminum, gold or copper. The joint structure design 136 has a transparent substrate 138. Pyrex or similar transparent base. Materials such as sapphire, other glass components allow for optical detection of the contents of the sealing device and provide an improved alignment process in cold welding. The formation of the joint structure 140 from a material other than the substrate 138 avoids formation in the substrate itself. In addition, by using a metal having a low plastic deformation stress, the joint structure design 136 produces a joint structure 140 that is more deformable than the joint structure design 128. Therefore, the joint structure 14 having a greater deformability can improve cold welding. The resulting seal. The joint structure is set si" 142 shows that it can be cold welded to the class separately A soft deformable metal attachment surface 146 on the joint structure of joint structures 132, 136, 148 and 156 of joint structures 128, 140, 152, and 156. Joint structure design 142 allows for joints protruding from the substrate The high local stress on the structure creates a groove in the metal plated joint surface 146 during cold weld pressing. One non-limiting example of a metal suitable for use as the joint surface 146 is gold. The advantage of the joint structure design 142 is that it greatly reduces the A problem with the standard. However, the joint design 142 may be quite difficult to cold weld because the flat joint surface 146 does not effectively convert the pressure into a shear-shear shape. The joint structure design 148 has a joint structure 152 which is a hybrid joint structure composed of more than one material, none of which are substrates 30 150 material. Since the joint structure 152 is not formed of the base material 15 material, the adjustment of the deformation characteristics of the joint structure 152 can be achieved without micromachining the base material 150. Additionally, the joint structure 152 may comprise nickel alloys or other high Young's modulus and yield stress materials to increase the stiffness of the joint structure. The seed layer is then sputter coated onto the joint structure 丨52 to plate the joint surface 154, which may be, for example, indium or gold. Alternatively, the joint structure 152 can comprise a different alloy of the material of the joining surface 154. In one embodiment, the alloy different from the joining surface 154 can also be deposited using an electrodeposition process that deposits the joint structure 152 onto the substrate 150 by changing the composition of the plating bath during the plating process. For example, a hard gold alloy can be initially plated as the joint structure 152, followed by electroplating the softer pure gold as the joint surface 154. In the case where it is inconvenient to micromachine the recessed features in the substrate 158, the joint design 156 allows for the creation of a grooved joint structure. The recess is defined by two concentric raised joint structural members 160a/160b, and the recess can be fabricated using a process similar to that described above with respect to joint design 148 and joint structure 152. Figure 9 shows a cross-sectional view of various embodiments of a sealing system comprising various combinations of joint structure designs shown in Figure 8. Sealing system 17 0 includes a joint structure design 120 that is coupled to joint design 丨28. The sealing system Π 2 includes a joint structure design 120 that is combined with the joint structure design 136. Sealing system 174 includes a joint structure design 142 that is combined with joint structure design 128. Sealing system 176 includes a joint structure design 142 that is combined with joint structure design 136. 1322734

Figure 10 shows a cross-sectional view and an enlarged cross-sectional view of one embodiment of a sealing system 180 having a tenon and grooved joint design. Joint structures 182a/182b and 184 are formed in the tantalum substrate by deep reactive ion etching (DRIE). The geometric dimensions of the joint structures 182aA82b, 184 include groove depth 186, groove width 187, tenon width 188, and tenon height 190. Preferably, these geometries are preferably in the range of from about 1 micron to about 100 microns. The male and female joint structures 184 and 182a/182b are separately machined to produce an overlap (also referred to as "interference") that exceeds the joint manufacturing tolerances and assembly equipment tolerances to ensure that the joint surface is at all edges. The points around the seal overlap. In a preferred embodiment, the overlap is in the range of from about 1 micron to about 20 microns and less than a quarter of the width 188 of the tenon. The material comprising the material different from the joint structure at the joining surface and produced using metal plating In an embodiment of the joining surface, the thickness of the metallized joining surface is from about ΐ.ΐμϊη to about 50μηι. Can be produced by, for example, vapor deposition

About 金属μηι metal thickness. A larger metal thickness can be produced by, for example, an electroplating process. Addition of Samarium Cobalt In some embodiments of the invention, selective pulse heating can be used in thermocompression bonding (4). The loud pulse heating can be provided by a micro resistance heater. An example of a micro-resistance heater is described in U.S. Patent No. 6,436, to Lin et al. The heater can be added to any of the embodiments of the sealing system described herein. Suitable heating is divided into two groups of heaters with an intermediate layer and heaters without an intermediate layer. \ 32 1322734 For any combination of the following three reasons, the heater may need to have an intermediate layer between the crucible heater and the other surface: (1) the self-resistivity and the amount of heating required, the heater material may need to be connected The surface and/or substrate are electrically insulated. (2) The difference in the coefficient of thermal expansion (CTE) between the heater and the adjacent material is sufficiently large (4) that in the case of (four) towel "unacceptable stress, an intermediate layer may be required in such an embodiment. During heating" If the stress exceeds the bond strength of the heater to the adjacent material or if the stress exceeds the ultimate tensile strength of any material at (4), these stresses may be manifested by causing delamination, cracking, or = cracking at the plurality of interfaces. (3) The intermediate layer may be required as a diffusion barrier to prevent the electrical characteristics of the heater from changing with repeated heating loops, or to slow the diffusion of the adhesion layer. Therefore, for electrical insulation, CTE mismatch, diffusion barrier, or depending on the specific Any combination of the three reasons for using the material may require the use of an intermediate layer. For the sake of simplicity, any adhesion layer at the intermediate layer or material interface between the heater and the substrate is not shown in Figures 11-14. An intermediate layer between the heater and the joining surface is shown. Figure 11 shows a cross-sectional view of an embodiment of a sealing system 2 with a heater 218. 218 is located on the second substrate 212. The intermediate layer 220 is located above the heater 218. The connection surface material 222 is heated from below the intermediate layer 220 by the heater 218. When the first substrate 21 is connected to the second substrate 212 Together and the material is deformed by the pulsed heating of the heater 218, a metallic metal bond is formed between the joining surface 216 and the joining surface material 222, at which point a seal is formed. 33 1322734 Figure 12 shows another seal system 230 with heater 234 In one embodiment, in Fig. 12, the second substrate 232 material is the structural core of the joint structure 233'. The sinuous joint structure comprises a structural core 233, a heater 234, an intermediate layer 236, and a joining surface material 238. The Fig. 1 illustrates an embodiment in which the heater 218 and the intermediate layer 220 form a core of the joint structure. Therefore, the joint structure on the second substrate 232 in Fig. 12 may be more rigid than the second substrate 212 in Fig. 11. The joint structure on the top. Therefore, during the thermocompression bonding process, a larger local deformation may occur on the joint surface of the seal system 230. It should be clear that the joint structure is rigid. The height also depends on the particular material selected. Figure 13 shows an embodiment of a sealing system 24A having a heater 244 in contact with the joining surface material 246. The illustration shows another implementation of the sealing system 250. The sealing system has a heater 254 in contact with the joining surface material 256. In Fig. 14, the second substrate 252 joint nucleation ~ comprises a substrate material * and the joint structure may have a greater rigidity than the first drawing A joint structure on the second substrate 242 that does not comprise a substrate material. The surface materials 246 and 256 can be heated primarily from the lower heaters 244 and 254. In other embodiments, the surface material can be drawn by current at the joint surface. Direct heating is performed. The embodiment shown in Figure 1M4 of the field/moon side may have a first substrate and a second substrate comprising different materials. In addition, the joint ' of the first substrate'. The structure may comprise a material that is the same or different from the joining surface of the first substrate and the joining surface of the second substrate. Further, the joining surface on the first substrate and the joining surface on the first substrate may comprise the same material or different materials. 34

V 1322734 The joining surface of the second substrate and the heater may comprise the same material or different materials. In addition, the bonding surface can be melted during pulse heating, as is the case in butadiene welding. Minimizing the mechanical force required for cold welding Minimizing the mechanical forces required to bond the substrate reduces the risk of damage to the substrate or substrate coating. The required mechanical force can be minimized in a number of ways. These methods include a variety of joint structure designs, joint surface material selection, joint surface material processing, and cold weld processing parameters. For example, the total amount of interference or overlap between the seal components is determined by the joint design. Overlap or overlap between the larger mating joint structures requires a relatively large force for cold welding because the volume of deformed metal is greater during the cold welding process. Therefore, in order to minimize the required force, the total amount of deformed metal should be minimized. This can be achieved by minimizing the shear layer or interface of the joint surface while minimizing the amount of interference between the joint structures. The overlap is preferably only slightly greater than the tolerance of the joint structure, the surface roughness, and the tolerance of the assembly equipment. Additionally, by forming only one shear layer (as shown in Figure 2), the required force can be significantly reduced. In addition, different combinations of cross-sectional geometries of the joint structure can be used to optimize the seal for a particular application. For example, a combination of rectangular tenon joint structures joined to a trapezoidal groove joint structure can reduce the contact area of the joint surface. In this embodiment, only the corners of the rectangular joint structure are initially sheared. The initial area of the partial shear is much smaller than in the embodiment with a rectangular tenon joint structure and a rectangular groove joint structure. Thereby, the force required for cold welding is reduced. 35 1322734 In another embodiment, if the rectangular embossed joint structure has only a corner and a slanted rectangular groove joint structure causing shear forces, the force required can be further reduced. The force g required to induce plastic deformation at one corner of the rectangular tenon produces a half of the force required for the same pressure at both corners of the rectangular tenon.疋

In addition to the joint design, the composition of the joining surface material and associated properties may affect the force required to form the seal. For example, the joining structure material ^ has a low yield stress, which thus makes the material more susceptible to deformation and which more easily exposes a clean bondable surface. Suitable joining surface materials with low yield stress include, but are not limited to, indium, aluminum, gold, and tin. Conversely, the quality will increase the strain energy of the crystal structure or affect the mobility of the dislocations, and the effect of increasing the base gold stress. Therefore, increasing the purity of the material can reduce the yield stress. The possible exception is that when the second material = join can drop the point, the total yield stress can be reduced because the Wei temperature is closer to the impurity.

Another physical property of the shirt to cool the required force is the hardness of the oxide connecting the surface metal. A metal with a high oxide hardness and a hardness of the parent metal is required for cold soldering. The smaller H soft metal oxide deforms with the parent metal and does not easily break, thereby remaining as an oxide hindering the cold bond. Metals having a high oxide to parent metal hardness ratio include 4 and are not limited to indium and 33. Φ in gold and no surface under the environmental conditions, there is no oxide, the ratio of oxide hardness to maternal metal hardness does not significantly affect the size of the force of cold welding these metals. However, the gold and button do have a layer that absorbs organic contaminants. This layer acts to hinder the cold welding bond. The grain structure and internal strain of the surface metal will affect the strength of the bend 36 1322734. In polycrystalline metals, the yield stress is usually described by the Hall-Petch relationship, where the yield stress is proportional to the square root of the grain size. This relationship exists because the crystallographic slip planes in adjacent grains are typically not line up, thus requiring additional stress to initiate new slip planes in adjacent grains. Therefore, the yield stress can be lowered by reducing the number of crystal grains (i.e., increasing the grain size). Annealing the metal reduces the yield stress by increasing the grain size and reducing the intrinsic strain in the metal. Annealing may also have other beneficial effects such as desorbing entrained hydrogen from the plating layer. Finally, the bonding process can affect the force required to form the seal. In addition, minimizing the total amount of deformation will reduce the amount of strain hardening produced by the joining surface material. For example, a smaller joint structure can result in less strain hardening due to a reduced total amount of deformation. In addition, the time or strain rate of cold welding may affect strain hardening. The bonding time can also affect the amount of metal interdiffusion. See Takahashi & Matsusaka, "Adhesional bonding of fine gold wires to metal substrates, 55 J. Adhesion Sci. Technol., 17(3): 435-51 (2003). In the use of pressure sealing, support forces may be required Align with the pressure to avoid cantilever-type forces acting on one of the substrates, which may result in cracking of some of the substrate material. In one embodiment, this can be achieved by inserting the first substrate to be protected from pressure. Between at least two other substrate structures, which are then sealed together by cold welding, such as described above. In a preferred embodiment, at least one of the two other substrates has a structure t suitable for placement or a cavity or depression of the first substrate of the valley. The at least two other substrate structures have a joint structure that can be pressed together 37 to accommodate the first substrate between at least two other substrate structures Within a defined cavity, an embodiment of such a sealing method is shown in Figure 22. The sealing device 500 includes a sensor substrate 鄕 on which a biosensor 5〇8 is fabricated. The substrate is under The cavity 5〇5 in the material 5〇2. The upper substrate 504 including the storage tank cover/opening 512 is joined to the lower substrate 5〇2 at the joint structure 510 by a pressure cold welding process. In another embodiment The third or "sensing substrate" has different auxiliary devices thereon instead of sensors. For example, the third substrate can include MEMS devices such as gyroscopes, resonators, and the like. The device can be sealed under vacuum. Pressing the heat lining method On the other hand, a pressure seal is formed in the absence of metal-metal bonding. In this case, the part may require a permanent connection force to maintain a tight seal. This connection force can be applied by a variety of inflammatory mechanisms. In a single solution, Nitin〇1 or other shape memory alloy fixtures can be utilized to provide a loose fit around the substrate until they are aligned, which can then be heated by Nitinol beyond its phase transition point to clamp the substrate. As shown in Figure 15. This phase transition temperature can be controlled (by changing the composition of the shape memory alloy). Thus, the device component can be formed below the phase transition temperature and then warmed to the phase transition temperature to initiate the clamping mechanism. In another embodiment, the metal or plastic clamp can be elastically deformed to allow loading of the substrate of the sealing system, wherein the zero stress configuration of the clamp is significantly less than the joining substrate. Once the connecting substrate is aligned between the clamps, all of the force on the clamp can be removed to allow it to be pressed into the substrate. Other fasteners can be used to clamp the substrate, including screws, rivets, dip, 38 1322734 heat shrinkable polymer 'opposite magnets, and so on. The clamp should be able to apply force permanently while minimizing the extra size of the pair. In Figures 16A-C, there is shown an embodiment of a sealing system 27A having a branch. In Fig. 16A, the sealing system 27A includes a post 276 attached, plated or micromachined on the second substrate 274. A dip 278 is formed over the column 276. The second joint structure 28'' on the second substrate is aligned to overlap the groove joint structure 282 on the first substrate 272. A metal-containing pad 284 is deposited over the first substrate 272. The heater plate 286 containing the heater 288 is aligned with the material 278 above the crucible 276 and overlaps the metal pad 284 on the first substrate 272. As shown in Fig. 16B, the heater plate 286 presses the first substrate 272 and the second substrate 274 together to form a seal between the first joint structure 28'' and the overlapping groove joint structure 282. When the heater plate 286 is depressed, the heater 2 is pulsed to cause the dip 278 to reflow so that the dip is returned to the metal pad on the first substrate 272. Once the dip 278 solidifies, the heater plate 286 can then be removed. Figure 16C shows the sealing system 270 after removal of the heater plate 286 and after the formation of the material clamping and sealing. In another embodiment (not shown), the heater plate 286 can be plated using a poor surface material that is resistant to the heater temperature used and used as the dip 278, depending on the dip used. In this embodiment, the heater plate 286' can be removed once the dip 278 solidifies! The material f does not combine with the heater 288. Alternatively, the thickness of the dip 278 that is reflowed onto the metal shim 284 can be adjusted according to the required strength of the dip clamp. It is also possible to use the cold welded sealing component of the present invention to form a pressure sealed 39 1322734 clamp. Figure 17 shows an embodiment of a sealing system 290 in which a press seal material 3〇6 is sandwiched between two substrates 292 and 294 using a & . The first joint structure 296a/296b includes a groove portion of the joint structure design. The tab portion of the joint structure design includes a heater 3 on the second substrate 294, an intermediate layer 302 on the heater, and a joint surface material 3〇4 on the intermediate layer. Press seal

Material 306 has a circular cross section and is located on the second substrate 294, between the tenon and the groove clamp, at the edge of the substrate. The crimp joint between the groove joint structure of the first substrate 292 and the tenon joint structure of the second substrate 294 is then joined by thermocompression bonding to form a seal. It should be clear that any cold material county can be formed into a cold welding fixture without heating. The cold welding fixture does not need to have a closed geometry because its main limbs sandwich the two substrates and only form a seal: in another Besch scheme (not shown), The pressure sealing material is placed on the second substrate, at the edge of the second substrate, the crown and the concave

side. However, it should be clear that the stress on the substrate material will vary depending on the placement of the pressure seal material. Depending on the application, any of the metal joint structures and joining surfaces of the above embodiments may be replaced with recorded polymers. Although the sealing flexible polymer bonding mechanism is not defined as cold welding, the effect of using a sealed isolation storage tank or a dielectric cavity to steal adjacent cavities or external contamination is the same. The pressure of the soft-spinning required for plastic deformation in the cold-baked processing may require significantly less force to create the seal. Traditionally, 'flexible polymers are poorly sealed in H polymer chemistry in water permeable harshness: 40 1322734 Over-added metals, or ceramic particles have produced polymers that have been modified to significantly reduce water permeability. . For example, by adding carbon nanoparticle-modified epoxy resins, the reported water permeability is an order of magnitude lower than conventional epoxy resins. Flexible polymer sealing requires the selection of a low Young's modulus polymer and minimizing the surface contact area to provide a seal using low pressure. In addition, increasing the number of perimeter joint structures can result in a significant reduction in the passage of water through the seal.

The above-described embodiments and embodiments may be implemented using a single-joint structural design or a multiple redundant joint structure that reduces potential manufacturing defects that cause one or more of the redundant joint structures to have a $ leak . In addition, the 'multiple attachment surface' serves to increase the length of the seal to increase the force required for the shape. The number of redundant joint structures requires strength with the substrate material, the force required to cold weld them, and any residual stresses present in the substrate towel after cold welding, including the stress balance applied by any of the sweet clip components. .封 器件 器件 器件 器件 器件

Weld technology has many advantages in terms of processing and manufacturability. The first X' is connected. p piece is suitable for standard MEMs process and can be integrated

Introduced into MEMS devices. Gan A τ τ ° Secondly, it is possible to simultaneously seal closely spaced storage tank arrays. Actually, d. At the same time, the chip can be sealed in the wafer-wafer bonding process. The plurality of wafers can be cold-welded on each surface of the internal wafer in sequence or in the same manner. In addition, the active device, ..., source device can be connected by a feedthrough under the sealing portion. Finally, because the process does not involve heat, temperature sensitive materials can be sealed within the storage tank volume. Temperature sensitive materials can include volatile liquids 'organic chemicals' drugs, explosive gases, chemical sensors, and sensitive electronic components. Figure 18 shows an embodiment of the active and passive wafers cold welded together to form an array of sealed devices (10). The array of sealed devices 31 represents a wafer (four)' which is part of a wafer array that is simultaneously cold soldered on the same wafer. The first active layer 312 includes a sensor 32A, a gold electronic trace layer 322, a dielectric layer 318', and a tenon joint structure 324. The dielectric between the active layer substrate and any of the electronic trace layers is ignored for simplicity. These tenon joint structures 324 contain gold and are cold welded to a passive layer having a grooved joint structure into which the first tenon joint structure is pressed. Passive layer 314 includes a metallization layer having a second tenon joint structure 326 and an opening aligned with sense 320 on first active layer 312. The second tenon joint structure 326 is cold welded to the recessed joint structure in the second active layer 316. The n source layer includes an opening that is aligned with the sensor 320 on the first active layer. Additionally, the second active layer includes a metal plating layer having a memory tank cover 328. Thus, the array of seals of the sealing device 310 shown in Fig. 18 separates the sensors from each other and from the environment. And the 'storage cover 328 may be opened later to cause the sensor 32 to smash the road. Electrical connection to active component 320 is achieved using conduction in accordance with substrate material and processing constraints. Figure 19 shows a perspective view of one embodiment of a multi-storage drug delivery wafer having a first active layer 332, a passive layer 334, and a first active layer 336° shown as separated layers. 2 and 334 are used to illustrate the joint structure on layer 332 'the two layers (will be joined by pressure cold welding). (Layeres 334 and 336 do not need to be combined by any special technique) 42 1322734 In implanted medical sensor applications, a flexible polymer can be formed on each substrate. The polymer can be shaped using conventional MEMS techniques such as molding (such as PDMS soft lithography), lithography (such as photoformable (poly) decane) 'stereolithography' selective laser sintering, spraying Ink printing, deposition and reflow, or etching (eg 〇2 plasma etching). Alternatively, the polymer can be shaped and plated with metal prior to being placed between the opposing substrates.

Figure 20 shows different embodiments of a ritual system having different polymer joint structures 346, 35, 366, 370, 382 having 368, 372, 383, 388, 392. The metal joining surfaces 348, 352 are deposited, in which case the metallurgical bond is not formed by shear deformation, but is formed by a mechanism as detailed by the person. Sealing system 340 maximizes the contact area and length of the material path I. The system outline minimizes the contact area and increases the local stress when removing surface contaminants during the second cold welding. The sealing system m is not a polymer preform that is machined on the base tree. The preform includes a metal plated surface ^83. Sealing system 380 can be described as gold plated

It is a lining sealing system. ^乂In the processing, the use of acoustic energy (such as ultrasound) or 钿 能 energy can be combined with the metal 盥 arm metal layer / coating or gold; can apply acoustic energy or recording energy in the method of bonding to the polymer substrate The combination of the polymer material in the embodiments of the polymer coating/layer comprising the polymer coating/layer includes a fluoropolymer such as a road ML-e-e-e (ePTFE), or a liquid crystal. The substrate (such as some secrets) is combined with the other liquid crystal polymer base (4), or the plating is applied to the substrate, and then the plated metal, butyl gold, and the surface of the other liquid crystal polymer substrate are combined with 43 1322734. Or combined with another metal-coated surface. In yet another or additional embodiment, the sealing concept described in U.S. Patent Application Publication No. 2002/0179921 A1 to Cohn, which is incorporated herein by reference. The seals in implantable drug delivery or analyte sensing applications described in U.S. Patent Application Publication Nos. 2004/0121486 A1, 2004/0127942 A1, and 2004/0106953 A1. The devices described herein can be used with or incorporated into a variety of devices, including implantable medical devices and other devices. Examples include drug delivery devices 'diagnostic and sensing devices, U.S. Patent No. 5,797,898 ' Νο. 6, 551 '838 ' Ν ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο Some such devices are disclosed in U.S. Pat. Figure 21 shows a cross-sectional view of a known embodiment of a micro beta beta device before and after sealing the open storage slot with cold soldering. The device substrate 402 has a reservoir 404 that houses the contents of the reservoir 4〇6. The storage tank 4〇4 is closed on the front side 401 of the substrate 402 by the storage tank cover 408. The back surface of the substrate 4〇2 has a tenon joint structure 414 on each side of each of the storage grooves 4〇4. The sealing substrate 410 is placed over the back surface 4〇3 of the device substrate 4〇2 over the open storage tank 404. The sealing substrate 41A has a groove joint structure 412a/412b that is aligned with the tenon joint structure 414. The sealing substrate can be transparent to light visible to the infrared wavelength by selecting a suitable material. In this way, the contents of the storage tank can be optically detected. The two substrates are then joined together at 44 1322734 and cold welded at the tenon and groove joint structures 414/412a and 412b to create a seal' separate the respective storage slots 4〇4 from the additional storage slots and from the environment. In some embodiments, the sealing device described herein is a sub-element of an additional device. For example, it can be a knife of an implantable drug delivery device. The device also includes a sensor that refers to a patient's physiological cancer, an electrode that provides electrical stimulation to the patient's body, a pump, a catheter, or a combination thereof. Examples of several of these elements are described in U.S. Patent Application Publication No. 2004/0127942 and No. 2004/0106953, the disclosure of which is incorporated herein by reference. Manufacture of Thunder Conductors and Leads Through Welded Cooling Welding On the other hand, the compression and cooling technology described here is suitable for forming highly reliable 'low resistance electrical connections without heating. In one embodiment, the bonded structure formed by compression welding can provide both mechanical fixtures and continuous conductive paths. One embodiment of an electrical continuity connection 600 is shown in FIG. The first metal layer 602 on the first surface 604 of the first substrate 618 will be electrically coupled to the second metal layer 606 on the surface 608 of the second substrate 609. The metal inside the sealing member 610 deposited on the first substrate makes electrical contact between the first metal layer 602 and the first connection surface 612. The second attachment surface 614 can be formed by plating a raised tooth 605 on the second metal layer 606. The width of the convex teeth is 1-50 μm larger than the width of the metal plated holes. The cross-section of the sealing structure 610 through the substrate 604 is shown as a rectangle, but it can be any shape that can be fabricated using micromachining or MEMS processes to maximize coverage of the deposited material and reduce residue in the joint. stress. When the joining surfaces 612 and 614 are aligned and the substrates 618 45 1322734 and 609 are pressed together, the material on the joining interface exposes the clean metal on the two joining surfaces, creating a cold weld bond. The resulting bond produces a low resistance electrical connection between the first metal layer 602 and the second metal layer 6A6.曰 It should be understood that this technique is not limited to a particular metal or alloy or braided plated ridge. The ridge section of the plating direction can be a moment rise ^ (as shown), hemispherical, triangular, trapezoidal - any suitable for production = this ^

The shape of the cold welded joint. Any of the electrically conductive materials described herein can be used as a joining material 'including metal or a conductive polymer having suitable mechanical and electrical properties to form an electrical connection by elastic pressing rather than cold welding. The core of the second connecting structure may be different from or identical to the joining surface material. All of the sealing members described herein for forming the cold welded joint can also be used to form electrical connections. The deposition of metal and patterned metal and the creation of conduction through the substrate using conventional MEMS processes and/or micromachining can create multiple electrical connections in a small area. The electrical connection component described herein may be included in a sealing component

The substrate can thus be electrically connected to the seal when the two opposing substrates are pressed together. In another embodiment, having a sloped side wall on the first attachment surface 612 is advantageous to more easily accommodate deposition of the first joint surface 612. In addition, material deposition may occur on both sides 616 and 618 of the first substrate 604. This is a method of ensuring that vias 607 are deposited throughout a suitable material. Figures 25 and 26 further illustrate possible embodiments for making electrical conduction by pressure refrigeration welding. One embodiment of a wire connection 700 is shown in Figures 24A-B. Conductor 46 1322734 Electrical leads 702a, 702b will be electrically coupled to traces 7A, 4a, 704b on substrate 706, respectively. Each of the conductive leads 7?2a, 7?2b has a diameter larger than the width 708a, 708b of the connection surface and is aligned with and pressed into the sealing members 71?a, 71?b. The sealing members 71a, 71b can be formed by etching the grooves in the substrate 706 and then depositing the metal layers 704a, 704b therein. The trench is wider at the end, which provides space to moderate strain in the conductive leads 7?2a, 7? using epoxy, (poly) alkane, tantalum, or other polymeric materials. This space also allows the leads to be placed in parallel with the upper surface of the substrate, although the trenches of the small area are cold welded to the conductive leads. The transverse surfaces of the sealing structures 71〇a, 710b of 710a, 710b are shown as rectangles.

The lead shows a cross-face with a round shape; however, any surface suitable for forming the cold or press seal described herein can be used. Through the substrate

47 fixed. Substrate and storage tank _ In a known solution, the container member comprises a substrate comprising a Godoga P trowel or a substrate, which is enclosed in a closed manner for containing a fluid-tight or dense container $ sub-slot contents. As used herein, the term "closed" β is used to isolate the sealing/inclusive effects of chaos, water vapor and other gases. S. I am "liquid-tight, dissolved in the phase of beta." Portuguese:: Non-gas tightly sealed but effective barrier liquid = Forming a storage material and (as in the case of - engraved, processed, or molded storage tanks. 匕 Included in the preferred scheme, the storage tank is not Continuous, and the array is located on the surface of the device's main 7 夂t (or its area). The quantity of the material is _strong_== contains (four) release / exposure of the fine parts, or sub-components of two:: cavity or hole " 'Or an auxiliary device—the interconnecting holes of the material are not storage slots. In a known scheme, the core member contains a plurality of locations (four) located at discrete locations on at least one surface of the body portion. In another embodiment Wherein, each storage tank substrate portion has one (four); optionally, two or more of these portions can be used in the same (four). Any suitable processing technique known in the art can be utilized in the structure. Processing the storage slot in the main knives. Representative defensive techniques include MEMS manufacturing蛰 'Micro-manufacturing workers' or other micro-weiwei art, various drilling techniques (such as recording, mechanical, and ultrasonic drilling), and build up or lamination technology, 48 ★ LTCC (low / dish) Common (4) D. Optionally, the surface of the storage tank may be treated or packaged to modify the surface or properties of the surface. Examples of these properties include hydrophilicity m (surface energy, system (4), surface roughness, The charge's release characteristic. The substrate/storage cell can be fabricated from a variety of materials using MEMS methods, microfabrication, micromachining, and microfabrication techniques known in the art. Many other known methods in the art can also be used. For example, U.S. Patent No. 6,123,861 and U.S. Patent No. 6'808,522. It is also possible to use a number of polymer forming techniques known in the art, such as injection molding, hot press forming, extrusion. In various embodiments, the body portion of the container member comprises tantalum, metal, ceramic, polymer, or a combination thereof. Examples of suitable substrate materials include metals (eg, titanium, stainless steel), ceramics ( example Alumina, tantalum nitride) 'semiconductor (eg germanium), glass (eg pyrexTM, BpSG), and degradable and non-degradable polymers. When only fluid tight is required, the substrate can be formed from a polymeric material rather than The gas tightness is typically required for the metal or ceramic. In one embodiment, each storage tank is formed (i.e., defined therein) from a containment material (e.g., metal, tantalum, glass 'ceramic) and sealed with a storage tank cap. Ideally, The substrate material is biocompatible and suitable for long-term implantation into a patient. In a preferred embodiment, the substrate is formed from one or more enclosed materials. The substrate or portion thereof can be coated, packaged prior to use. Or contained in a closed biocompatible material (eg inert ceramics, titanium, etc.). The town completely coats the non-hermetic material with a layer of a sealing material. For example, the polymer substrate may have a thin metal coating. If the substrate material is not biocompatible 49 to be packaged or contained in a biocompatible material prior to use, ·t _binding coating, tetrafluoroethylene material, diamond-like carbon, tantalum carbide : Alcohol's class of titanium and so on. In one embodiment, the base porcelain, alumina, the delivered molecule and the thief or fluid (eg, water 1 = 'that is for the solution to be treated by him) are impermeable (at least in the storage two '= or ). The life of the piece can be such that the substrate forms a variety of shapes or shaped surfaces. For example, it has a flat and silky surface, and it can be satisfactorily. In various embodiments, the substrate or container member i is as follows: Formula: Flat crystal [circular or oval disc, long tube, ball, or wire. The substrate can be flexible or rigid. In various embodiments, the reservoir is discontinuous, non-deformable, and located on one or more surfaces (or regions thereof) of the implantable medical device. The substrate may be composed of only one type of material, or may be a composite material or a plurality of layers, a laminate material 'that is composed of a plurality of layers of the same or the same base material. The substrate portion can be, for example, a combination of a crucible or another micro-machined substrate or a micro-machined substrate, such as a crucible and a glass, such as those described in U.S. Patent Application Publication No. 5/5,949, or U.S. Patent No. 6,527,762. In another embodiment, the substrate comprises a plurality of haptics bonded together. In yet another embodiment, the substrate comprises a low temperature co-fired ceramic (LTCC) or other ceramics such as oxidized. In one embodiment, the body portion is a carrier for the microchip device. In one embodiment, the substrate is formed from tantalum. In one embodiment t, either or both of the substrates to be bonded may be formed by a glass of 50 1322734. This is a yoke scheme of the core (four) contained in a desired material, cavity or storage tank. May be especially useful. That is, the fairy of the body window. A representative example of «package acid glass = permeate, crystal glass, crystal glass, and the like. ,

The total substrate thickness and storage tank volume can be increased by bonding or attaching a wafer or layer of substrate material. The volume of the tank and/or may affect the substrate a a loud number of deposits. The size and number of the largest day of the storage tank can be selected for the substrate and the storage; for the application, the processing limit, and/or the total device size limit the number of storage slots (4) (four), It is suitable for implanting a patient's body and preferably using a minimum invasive procedure. In a preferred embodiment of an implantable sensor using a planar sensor, as mentioned above, the substrate is preferably (four) ^ 1

The substrate may contain one, two, three or more stores (d). In various embodiments, tens, hundreds, or thousands of storage slots can be arranged on a substrate. For example, one embodiment of a implantable drug delivery device includes two 75 liter storage tanks, wherein each storage tank contains a single dose of the drug that is secretly released. In a sensing embodiment, the number of slots in the device is determined by a single 四(d) read life mosquito. For example, a single-age implantable glucose monitoring device with a single sense of 30 days of exposure to the body will contain at least 12 reservoirs (assuming each reservoir contains one: sensor). In another sensor embodiment, the distance between the sensor surface and the reservoir opening device is minimized, preferably close to a few microns. In the case of 51 2, the volume of the storage tank is mainly determined by the surface area of the sensor. 1 Typical enzymatic sugar sensing (4) _μπι space. Occupy see 400μιηη 2:: In the solution, the storage slot is a micro storage slot. A "micro-storage tank" is a storage tank for storing and releasing/exposing trace materials such as pharmaceutical preparations. In a solution, the micro-storage slot has less than or equal to 鄕(4), and is less than, exclusively, Xiaoma, less than coffee, Xiaoma, and greater than about lnL (eg, greater than 5 nL, greater than 1G) , greater than about Μ this, greater than the volume of .··spoon 50 nL, greater than about call, etc.). The term "micro," means a volume up to a maximum of 5. In one embodiment, the trace is between g and μ. In another embodiment, the trace is between (7) and 5〇〇nL. In yet another embodiment, the trace is between about Å and (% L. The shape and size of the microslot can be selected to maximize or minimize the medicinal material (or sensor or other) The storage tank contents eliminate the contact area between the surfaces of the micro-storage tank. In one embodiment, the storage tank is formed in a 200 micron thick substrate and the size of the 4 storage tank is i 5 mm long and 0.83 mm wide, and the volume is about 25〇nL·, the volume occupied by the support structure of about 20 to about 50 microns thick. In another embodiment, the storage tank is a large storage tank. “The large storage tank is suitable for storage and release/exposure. a storage tank having a quantity greater than a trace amount of material. In one embodiment, the large storage tank has a size greater than 5 〇〇 1 (eg, greater than 60 (VL ' greater than 750 μΙ^, greater than 9 〇〇μί, greater than 1 mL, etc.) and less than 5mL (eg less than 4mL, less than 3mL, less than 2mL, small Volume in lmL, etc. If not explicitly stated to be limited to microscale or large scale volume/number, 52 1322734 the term "storage tank" is meant to encompass both. In one embodiment, the device comprises microchip chemical delivery In another embodiment, the device comprises a polymer wafer or device composed of a non-ruthenium based material, which wafer or device may not be referred to as a "microchip,". In one embodiment, the device comprises an infiltration Pumps such as commercial devices such as VIADURTM implants (Bayer Healthcare Pharmaceuticals and

DUROSTM osmotic pump technology (Alza corporation) included in Alza Corporation) Storage tank cover tray The storage tank cover carrier may comprise a substrate material, a structural material or a coating material, or a combination thereof. The storage tank cover carrier containing the substrate ## can be formed in the same steps as the storage tank. The substrate/storage tanks and the storage tanks can be fabricated from various substrate materials by the above-mentioned method, microfabrication, micromolding, and micromachining techniques, and can also be deposited on the substrate.

Technology and then MEMS methods, microfabrication, micromolding and micromachining technology = storage tank recordings containing sizing materials. Known coatings and tape masking can be made, the mask mask is selected to be a shot removal technique, or other selective methods are applied to the storage tank cover carrier. Drying the cover of the carrier material on a variety of structures, such as the groove ι / 】 If a storage tank cover can be from the storage extension (Spa thorn opposite side; additional storage slot cover carrier can be This actually extends to the other side of the storage tank. In the storage tank, a fine tank cover can be supported. 53 In the sensing 11 application (for example, glucose sensing, an implementation of the two sub-storage tanks (belongs to - The device 'The device may only contain one storage sample' may contain two or more storage slots.) It has three or two ports and corresponding storage slot cover. The slot can be changed according to the specific requirements of the specific application. Structural geometry. You have prepared π ~ and liter carrier structures for thickness, width and cross-section (such as square 'rectangle, triangle) to adjust for specific drug release kinetics for a certain formulation or implant location, etc. ; Λ 交 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Solution towel, storage slot The chemical molecules, auxiliary devices, or a combination thereof of the contents of the package 3. The normal function of a storage tank contents such as a catalyst or a sensor usually does not need to be released from the storage tank, "their drum function (for example) Catalytic or transfer: Standing after the storage tank cover is opened, the contents of the storage tank are exposed to the outside of the storage tank. Therefore, the catalyst molecules or (4) components can be released, and the enemy's open reading glasses can be used for protection. Storage (4) contents such as drug knives may need to be released from the storage tank to pass through the device and be delivered to a location in the body to provide a therapeutic effect to the patient. However, the drug can be retained in the storage tank so that For some in vitro applications. In the right dry κ regimen, there is a requirement for the tightness of the sealed storage tank, which is allowed in the specific application of the formula (such as gas or water). Transmittance rate, ie whether the storage tank is m in different applications of the device depends on the specific requirements of the application. The contents of the storage tank may comprise substantially any natural or synthetic molecule, = organic or inorganic molecules, or a mixture of these molecules. The molecule can be substantially in the form of B, such as a neat solid or liquid, a gel or a hydrogel, a solution of the emulsion I 'body', a dry powder, or a suspension. , 〃 /, his material is mixed to control or increase the release rate and/or time from the open storage tank. In the preferred embodiment, the storage tank contents contain a pharmaceutical preparation. The pharmaceutical preparation is a combination comprising a drug. The term "drug" as used herein includes any therapeutic or rib test (4) a pharmaceutical ingredient or API). In one embodiment, the drug is provided in a solid form, particularly for the purpose of maintaining or Continuing the stability of the drug, for example, during the storage of the n-piece of the drug until the need to use the drug. The solid two-body can be in the form of pure particles or in the form of solid particles of other materials "drug package 3, suspended or dispersed in the particle in. In one embodiment, the drug is a protein or peptide. Examples include glycoproteinase (eg, proteolytic enzyme) hormones or other analogs, antibodies (eg, anti-VEGF antibodies, tumor necrosis-inhibitors), cytokines (eg, 々·, or plant interferon), , (eg IL_2, IL-1()), and diabetes/obesity-related treatments (such as insulin 'Exenatide ' ργγ, GLp i and its analogues). The storage slots in the pirate can contain a single A pharmaceutical preparation or a combination of two or more pharmaceutical preparations. The different preparations may be stored in and then released from the same or a plurality of storage tanks, or they may each be stored in a different 55 1322734 storage tank and then released therefrom. For in vitro applications, the chemical molecule can be any of a large number of molecules 'where a small amount (micrograms or nanograms) of controlled release of one or more molecules is required = for example in the field of analytical chemistry or medical diagnostics. Molecules can act as buffers' Diagnostic reagents' and complex reactions such as polymerase chain reaction or other nucleic acid amplification processes. In other embodiments, the molecule to be released may be a fragrance (frag眶e) Scent, dye or other colorant sweetener or other concentrated flavoring agent, or a variety of other compounds. In yet another embodiment, the storage tank contains immobilized molecules. Examples include reactions that may involve any chemical Classes, including touches, catalysts (such as 'metals and zeolites'), proteins (such as antibodies), nucleic acids, polysaccharides, cells, and polymers, and organic or inorganic molecules that can function as diagnostic reagents. The rate at which the released drug or other molecule is dispersed into the parent material = the release rate. The parent material may be a "release system" as described in U.S. Patent No.:, its degradation, dissolution or diffusion properties: A method of controlling the release rate of chemical molecules. In one implementation, the pharmaceutical formulation in the reservoir contains a layer of drug and non-pharmaceutical material. After the active release mechanism exposes the contents of the reservoir, the five meta-layers provide multiple pulses of drug release due to the presence of the non-pharmaceutical intermediate layer. This strategy can be used to obtain complex release profiles. See US Treasury for details. N〇··················· The auxiliary device, as used herein, the term "auxiliary device", includes any device or element that can be placed in a storage device. In an embodiment 56 1322734, the auxiliary device is a sensor or its transmission. Sense element. As used herein, "sensing element" includes elements for measuring or analyzing the presence of a chemical or ionic species at a location, without the presence or variation, energy or one or more physical properties (e.g., pH, pressure). The type of sensor includes a biosensor, a chemical sensor, a physical sensor, or an optical sensor. The auxiliary device is further described in U.S. Patent No. 6,551,838. In one embodiment, the sensor is pressure Sensors. See, for example, U.S. Patent Nos. 6,221,024, and 6,237,398, and U.S. Patent Application Publication No. 2004/0073137. Examples of sensing elements include measuring or analyzing a drug, chemical or ion at a certain location. The presence of a substance, an element that does not exist or change, energy (or light), or one or more physical properties (such as pH, pressure). In yet another embodiment, The sensor includes a cantilever beam type sensor, such as those used for chemical detection. See, for example, U.S. Patent Application Publication No. 2005/0005676, which is incorporated herein by reference. a device of a patient (such as a human or other mammal) and the contents of the reservoir containing at least one sensor that can indicate a physiological state within the patient. For example, the sensor can monitor a patient's blood, plasma, tissue fluid, The concentration of glucose, urea, feed, or hormone present in the vitreous humor, or other body fluids. In one embodiment, the two bonded substrates comprise at least one cavity, which may be defined on one substrate or two bases The MEMS device is contained within the material portion. The MEMS device can be on the third substrate. The space inside the sealing cavity can be evacuated or can contain an inert gas or a gas mixture (eg, nitrogen, helium). The MEMS device can be in the field. Well-known devices, such as pressure sensors, accelerometers, gyroscopes, and spectral oscillators. In another implementation, the combination At least one of the substrates is formed of a glass, and the cavity contains a chemical compound that can be inquired or can be inquired. The data obtained by the auxiliary device located in the main device is received and analyzed 2 in a variety of options, The master device can be a microchip device or other device. 1 The main device can be localized or remotely located. It can provide biosensor information to the controller for automatic or user intervention. , or a combination of the two to determine the time and type of start-up. It can be output on the board (ie, at the micro-section of the package (1) or the state machine controls 4 (4). The output signal generated by the pin after adjustment by appropriate circuitry (if needed) It will be acquired by the microprocessor. After analysis and processing, the core output signal will be stored in a writable computer memory chip and/or sent (eg, wirelessly) away from the micro" remote location. Energy can be supplied locally to the frontal crystal by means of a battery or a remote recording transmission, for example, U.S. Patent Application Publication No. 2002/0072784. In one embodiment, a capsule (s) containing the contents of the reservoir is provided for drug molecules and sensor/sensing elements that are released. example . The sensory money component can be located on a substrate that is stored or attached to the article. The sensor can be controlled or adjusted for variables of drug release by, for example, a microprocessor and device = ^, including volume: frequency, release time, effective release rate, drug or drug combination, quality, and properties. The micro: seeding signal that can be used to control the release of the device can finely control the release of the drug and/or provide feedback to its 58 1322734. In another embodiment, the device includes one or more biosensors that can be sealed in a storage tank until needed for use, the biosensor capable of detecting and/or measuring a patient The signal in the body. In one variation, the implantable medical device includes a memory slot containing a sensor that is sealed as described above and that transmits signals generated by the sensor (by many means, including hardwired Or telemetry) to an independent drug

In the delivery device, the device can be a portable (i.e., external) or internal pump that is used to control drug metering. The term "biological sensing" used by the forced-long ----------

The chemical potential is converted into an electrical signal (for example by converting mechanical energy or subtraction into an electrochemical number), and direct or indirect measurements, for example, the biosensor can measure different in vivo positions == (EKG, EEG) 'or other neural signals', pressure, temperature, ρΗ, or ^ woven = mechanical load on the structure. The slit can be passed, for example, by a microprocessor/control = * an electrical signal from the biosensor, and then the microprocessor/controler transmits the communication to the remote controller, other local controller, or it bites the implant The system can be used to transmit or record information about the patient's vitality implants, such as the brother, such as drug concentration. In a preferred embodiment, the smashing smash contains one or more sensors for use in 1 = island control. Information from the sensor; active control from the same device or independent pancreas, such as the conventional insulin pump, outside, 2 thieves (for example, can be used to - 礼 贱 贱 植 植 )) The cryoplem multi-storage device is provided in the form of a sealed residual tanker that stores an array of glucose sensors and is capable of transferring glucose 59 turns (wired or wireless) to a portable or portable glucose metering instrument, The instrument allows the patient to manually inject insulin into itself (eg, by injection). Other embodiments may induce other analytes and supply other types of drugs in a similar manner. Storage Tank 1 The term "storage tank cover" as used herein, is meant to be adapted to separate the contents of the storage tank from the external environment of the storage tank. Membrane, membrane, or other structure, but 2 which is intended to be removed or split at selected times to ribbed the reservoir and blasts out its contents. In a preferred embodiment, the *continuous storage slot cover will open the storage slot In a further embodiment, the continuous storage tank cover covers two or more but less than all of the storage slot openings. In a preferred active control device, the storage slot cover comprises Any material that can respond to additional stimuli (such as electric fields or currents, magnetic fields, pH changes, or by thermal, chemical, electrochemical, or mechanical means) to split or permeate (permea magnetically zed). Examples of suitable storage tank cover materials include Gold, 鈇, 、, _ = copper, alloy, and eutectic materials such as gold iridium and gold tin eutectic. Early - any combination of passive or active isolation layers can exist in the device. Embodiment, the storage tank and non-porous electrically conductive cover in - preferred embodiment, "the memory slot cover is in the form of a thin metal film. In another embodiment, the storage tank cover is formed from a plurality of metal layers - titanium, a multilayered/laminated structure. For example, the top layer and the bottom layer can be selected for the adhesion layer on the storage tank cover (typically only on a portion) to ensure that the groove cover and the storage tank are opened, and the storage tank cover and the electrical upper layer are attached/bonded. . In the case, the structure is a perovskite 60 Titanium where the top and bottom layers are used for attachment; I, while the initial layer provides additional stability/biostability and protects the primary intermediate titanium layer. The thickness of these layers may be, for example, about 3 Å nm for the intermediate titanium layer, about 4 Å for each of the platinum layers, and about 10 nm to 1 5 nm for the attached titanium layer. Check the slot cover split or readable control 奘i. The holster device includes control means for facilitating and controlling the opening of the storage tank, for example, splitting or permeable to the storage tank cover at a selected time after the storage tank is sealed as described herein. The control device includes (or one or more) structural components and electronics (e.g., circuitry and power) for energizing and controlling the startup time of the storage tank contents to be released and exposed. The control device can take a variety of forms. In one embodiment, the storage tank cover comprises a metal film that is electrothermally ablated by the electrothermal ablation described in U.S. Patent Application Publication No. 4/4,112,486, the disclosure of which is incorporated herein by reference. The energy storage capacitor) is a hardware, electronic component, and software that is required to transfer electrical energy to a selected storage tank cover for stimulating (eg, a storage slot opening). For example, the device can include a power supply and a memory slot cover connected between the leads through an electronic input lead that applies a quantity of current to effectively split the storage slot cover. The power can be supplied to the control device of the multi-capacity storage tank system by a battery 'capacitor' (bio) fuel cell either locally or by a wireless transmission remote end as described in, for example, U.S. Patent Application Publication No. 2002/0072784. The capacitor can be locally charged via the onboard battery or remotely charged, for example by radio frequency signals and ultrasound. In one embodiment the control device includes an input source, a microprocessor 61. Ten o'clock s #road distributor (and multiplexer). The timer and multi-tool aligner $) circuits can be designed and introduced directly onto the substrate surface in a S-process wipe. In another embodiment, several elements of the control device are provided as separate elements that may or may not be associated with the storage slot portion of the element. For example, the controller and/or power source can be physically remotely multiplexed with the storage unit H' but operatively coupled to and/or communicable therewith. In one embodiment, the operation of the multi-cap storage tank system can be controlled by an onboard (e.g., implantable) component microprocessor. In another embodiment, a simple state machine is used because it is typically simpler, smaller' and/or uses less power than a microprocessor. U.S. Patent Nos. 5,797,898, Νο. 6, 527, 762, and 6, 491, 666, U.S. Patent Application Publication No. 2004/0121486, 2002/0107470 A1, 2002/0072784 A1, 2002/0138067 A1, 2002/0151776 A1, 2002/ 0099359 Other storage slots are described in A1, 2002/0187260 A1 and 2003/0010808 A1; PCT WO 2004/022033 A2; PCT WO 2004/026281; and U.S. Patent Nos. 5,797,898; 6,123,861; and 6,527,762. And release control methods, which are hereby incorporated by reference. :^J_Multiple Cover Storage System/Device The multi-cover storage slot release/exposure devices and systems described herein can be used in a wide variety of applications. Preferred applications include controlled delivery of the drug, biosensing, or a combination thereof. In a preferred embodiment, the multi-capacity storage tank system is part of an implantable medical device. The implantable medical device can be in a wide variety of forms and can be used in a variety of therapeutic and/or diagnostic applications. In one embodiment, the reservoir stores and releases the pharmaceutical formulation over a sustained period of time 62 1322734. In another embodiment, the storage slot stores and includes a sensor for selective exposure, wherein the device can be turned on when needed (depending, for example, from a sensor failure) or under a predetermined schedule of instructions - Storage slot. For example, the reservoir can include a pressure sensor, a chemical sensor, or a biosensor. In a particular embodiment, the storage tank comprises a glucose sensor, the sensor may comprise an electrode oxidized φ enzyme coated on one or more permeable/semi-permeable membranes. . When the enzyme is exposed to the environment (e. g., the body) prior to the desired period of use, its activity may be lost, so the sealed storage tank is used to protect the enzyme until needed. In yet another embodiment, the multi-cap storage cell systems and devices described herein can be incorporated into many other devices. For example, sealed storage tanks can be integrated into other types and designs of implantable medical devices, such as the catheters and electrodes described in U.S. Patent Application Serial No. 2,2,112,601. In another embodiment, it can be incorporated into other medical devices that release the drug to the carrier towel, which then flows to the pre-applied application site. As described in the examples in U.S. Patent No. 6,491,666. The sealed reservoir can also be incorporated into a drug pump, inhaler or other 'pulmonary drug delivery device. The sealing devices described herein can also have many in vitro and commercial applications. The device is capable of delivering precisely metered molecules for in vitro applications such as analytical chemistry and medical diagnostics, as well as biological applications such as cell culture delivery factors. In yet another #medical application, the device is used to control the release of fragrances, dyes, or other useful chemicals. 63 1322734 U.S. Patent Nos. 5,797,898; 6,527,762; 6,491,666; and 6,551,838, and U.S. Patent Application Publication No. 2002/0183721, 2003/0100865 <2002/0099359 >2004/0082937 >2004/0127942 >2004/0121486,2004/ Other applications are described in 0106914, and 2004/0106953, which is incorporated herein by reference. Embodiments of the invention may be further understood by reference to the following non-limiting examples.

Example 1: Tenon and groove seals Seals were designed using a tenon and groove joint structure. The seal is made by a pressure cooling process. Figure 3 shows the SEM of the seal. The substrates are 矽 (top) and alumina (bottom). The metal is gold (sputtered on a crucible, sputtered and then electroplated onto alumina). This component is incorporated into the pC_15 flip-chip aligner. The instrument is an instrument that provides precise alignment in the X, y, and z directions and can be pitched, pitched, and pitched (inland yaw). Once the parts are aligned, the fci5 will press the parts together and form a cold weld bond.

Example 2: Effect of component size change and metal thickness on airtightness. Several different joint designs were made using different part sizes and metal layer thicknesses. The joint is pressure-cooled and welded, and then the dye is used according to the shape of the part, or the (four) leak detector is used to measure the joint (4). As shown in Table 1 below, it is found that the Lai Wan New Zealand has nothing to do with the thickness of the metal layer. It may be less than the lower limit of the heart tester or an undetectable leak rate of less than 5e-llatm*cc/sec. 64 Ridge width (188) Ridge height (190) μηι μιτι 145 50 50 50 60 50 60 50 60 50 Comparison of different joint sealing-leak tests

Example 3: An array of microfabricated cavities with separate sealing members provides two ♦ substrates that are fabricated with complementary cavities and sealing features for pressure cold welding. The sealing member includes ridges that are microfabricated on/in a substrate, and mating grooves that are microfabricated onto/in another substrate ◦ inside each groove and inside the ridges H wide cavity. Figure 27A B shows the resulting substrate and sealing member. The disclosure cited herein is incorporated by reference. The improvements and variations of the methods and devices described in the Detailed Description of the Invention are intended to be within the scope of the appended claims. [figure is simple] The fi map is a side view of the sealing system of a sealing system designed with a tenon and groove joint structure, which provides a seal formed by a pressure cold welding process. Figure 2 is a front elevational view of another embodiment of a sealing system having a tenon and groove joint design that provides a seal. The figure on the left shows the structure before the press-cooling welding is applied, and the figure on the right shows the seal formed after the press-welding process. A scanning electron micrograph of Fig. 3 shows a cross section of the seal formed by the sealing/shear pressure welding process shown in Fig. 2. = Figure is a cross-sectional view of a sealing system with a joint design designed to have a single cold at each joint structure. The metal preform can be (10) pressure cooled and welded in the joint structure. A cross-sectional view of one embodiment of the sealing system of the preform. Figure 6 is a cross-sectional view of another embodiment of a sealing system having a metal preform that can be cooled and welded between the joint structures. Figure 7 is a plan view of five different embodiments of the bottom geometry of the joint structure. Figure 8 is a plan view and cross-sectional view of six different embodiments of a joint structure design that can be used to form a seal by compression and cooling. Figure 9 is a cross-sectional view of four embodiments of a sealing system formed using different combinations of joint construction designs shown in Figure 8. Figure 1 is a cross-sectional view and an enlarged cross-sectional view of an embodiment of a sealing system having a tenon and groove joint design. Figure 11 is a cross-sectional view of one embodiment of a sealing system having a heater and an intermediate layer on the heater. Figure 12 is a cross-sectional view of an embodiment of a sealing system having a micro-heater on the core of the joint structure. The joint structure comprises an intermediate layer on the substrate material and the micro-heater. 66 1322734 Figure 13 is a cross-sectional view of one embodiment of a sealing system with a micro-heater in direct contact with the joining surface material. Figure 14 is a cross-sectional view of one embodiment of a sealing system having a micro-heater on the core of the joint structure, the joint structure comprising a substrate material and in direct contact with the joining surface material. Figure 15 is a perspective view of one embodiment of a sealing system with a Nitinol clamp. Figures 16A-C are cross-sectional views of one embodiment of a sealing system with a gripper showing the steps of assembly. Figure 17 is a cross-sectional view of one embodiment of a sealing system having a cold weld jig and a press seal material. Figure 18 is a cross-sectional view of one embodiment of a device including a memory cell array that is individually sealed by a pressure-cooled soldering process with a male and female joint design. The body of the device in which the reservoir is defined includes two substrate portions which are also sealed together by a pressure-cooled welding process having a male and female joint design. Figure 19 is a perspective view of an embodiment of a device that includes an array of memory cells and has a joint design that utilizes a pressure-cooled soldering process to separately seal the storage slots. Figure 20 is a cross-sectional view of three embodiments of a sealing system having different polymer joint structures plated with a metal joining surface. Figure 21 is a cross-sectional view of an embodiment of a multiple storage tank container member showing the sealing of the storage tank by a pressure cooling process. Figure 22 is a cross-sectional view of one embodiment of a sealing structure that uses a bonded "sandwich" structure to protect the intermediate substrate from compression bonding. Figure 23 is a cross-sectional view of an embodiment of the part prior to joining for forming an electrical continuity connection by compression welding as described herein. Figures 24A-B are perspective views of the electronic circuit connections made by the compression-cooled welding described herein. Figure 24A shows the parts before the connection, while Figure 24B shows the connected components. Figure 25 is a perspective cross-sectional view of one embodiment of the part prior to joining, the part being electrically connected by pressure to form an electrical connection. Figure 26 is a diagram of one embodiment of an electrical continuity connection made by pressure refrigeration welding. This diagram shows the material overlap between the opening and the convex teeth. Figures 27A-B are scanning electron micrographs (SEM) of two tantalum substrates having micromachined sealing members for pressure refrigeration welding. [Main component symbol description] 10...sealing system 36...second joint structure 12...first base material 38a,38b...metal joint surface 14...second base material 40...first joint structure 16...first joint structure 42a, 42b ...metal connection surface 18...first connection surface 50...seal system 20a,20b...second joint structure 52···first substrate 22...second connection surface 54...second substrate 30...sealing system 58...first Joint surface 32...first substrate 62...second joint surface 34...second substrate 70...sealing system 68 1322734

72...first substrate 74···second substrate 76a, 76b...first joint structure 78,82···connection surface 80a, 80b...joint structure 84...metal preform 90...sealing system 92··· a substrate 94...a second substrate 96...a first joint structure 98...a first metal joint surface 100...a second joint structure 102...a second metal joint surface 104...a metal preform 110...a circular 112...elliptical 114· · Hemispherical 116... Square 118···hexagon 120... Joint structure design 122, 130.················· ··· 榫 榫 结构 142 接头 接头 接头 接头 接头 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 连接 ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... System 174··· Sealing system 176··· Sealing system 180... Sealing system 182a, 182b, 184... Joint structure 186··· Groove depth 187··· Groove width 188... Convex width 190··· Height 200··. Sealing system 210...first substrate 2 12···Second substrate 216···Connection surface 69 1322734 218...Heater 286...Heater plate 220...intermediate layer 288...heater 222...connection surface material 290...sealing system 230...sealing system 292,294...substrate 232···second substrate 296a,296b...first joint structure 233...structure core 300...heater 234...heater 302...intermediate layer 236···intermediate layer 304...joining surface material 238···connection surface material 306...pressing sealing material 240...sealing system 310...sealing device array 242,·second substrate 312...active layer 244,254...heater 314...passive layer 246···connection surface material 316...active layer 250 Sealing System 318... Dielectric Layer 252··. Second Substrate 320... Detector 256... Connection Surface Material 322... Gold Electronic Trace Layer 270··· Sealing System 324... Convex Joint Structure 272·· First substrate 326...second ridge joint structure 274···second substrate 328...storage cover 276...column 332...active layer 278...dip 334...passive layer 280···second joint Structure 336...Active Layer 282···Groove Joint Structure 340 Sook 346,350,366,370,382 sealing system 284 ... 701,322,734 ... joint junction

508...sensor 348,352,368,372,383,388,392 ... 510... joint structure metal connection surface 512... storage slot cover/opening 360... sealing system 600... electrical conduction connection 380... sealing system 602... first metal layer 382···polymer prefabrication 604...first surface 383...surface 605...protrusion 401···front surface 606...second metal layer 402··device substrate 607...via 403...back surface 608...surface 404...storage groove 609,618...substrate 406 The contents 610...the sealing structure 408...the storage slot cover 612...the connection surface 410···the sealing substrate 614...the second connection surface 412a, 412b...the groove joint structure 616,618...the substrate 414...the tongue joint Structure 700...wire connection 500...sealing device 702a,702b...conductive lead 502···lower substrate 704a,704b...trace 504...upper substrate 706...substrate 505...cavity 708a,708b···width 506 ··· sensor substrate 710a, 710b... sealing member 71

Claims (1)

1322734 Patent Application No. 95113354 Applicable Patent Revision Amendment 98.08. 颂^月幻日修 (East) Original 1 Scope of application: ---- 1. A method of sealing at least two substrates together, The method includes: providing a first substrate having at least one first joint structure, the joint structure comprising a first joining surface, the surface comprising a first metal, the at least one first joint structure comprising being defined in a At least one groove structure formed in the recess in the first substrate; Providing a second substrate having at least one second joint structure, the joint structure comprising a second joining surface comprising a second metal, the at least one second joint structure comprising at least one tenon structure; Aligning at least one first joint structure relative to the at least one second joint structure to impart one or more overlaps of the at least one tenon structure relative to the at least one groove structure, and After the aligning step, the at least one tenon structure is at least partially pressed into the at least one groove structure to form a joining surface at one or more interfaces created by the one or more overlaps An effective amount of local deformation and shear such that at least a portion of one or both of the joining surfaces are plastically deformed into and between the first substrate and the second substrate Forming at least one metal-to-metal bond between the first metal and the second metal of the connecting surfaces, wherein the at least one metal-metal bond comprises the connecting surfaces outside the groove structure At least part of the deformation. 2. The method of claim 1, wherein the one or more overlaps 72 remove surface contaminants without heat input and promote intimate contact between the joined surfaces. 3. The method of claim 1, wherein the at least one tenon structure has a tenon height ranging from 1 micron to 1 micron and a tenon width ranging from 1 micron to 100 micron, and wherein The groove depth of at least one of the groove structures ranges from 1 micrometer to 100 micrometers and the groove width ranges from i micrometers to 100 micrometers. 4. The method of claim 1, wherein the first metal, the second metal or both comprise gold or platinum. 5. The method of claim 1, wherein the first metal, the second metal, or both comprise a metal selected from the group consisting of gold, indium, aluminum, copper, lead, zinc, nickel , silver, palladium, cadmium, titanium, tungsten, tin, and combinations thereof. The method of claim 1, wherein the first metal and the second metal are different metals. The method of claim 1, wherein the first substrate, the second substrate, or both comprise a material selected from the group consisting of ruthenium, glass, ceramic, polymer 'metal, and combinations thereof . 8. The method of claim 1, wherein the first joint structure, the second joint structure, or both comprise a material selected from the group consisting of metal, ceramic, glass, tantalum, and combinations thereof. 9. The method of claim 1, wherein the first joint structure, the second joint structure, or both thereof comprise indium, indium, gold, chromium, rhyme, steel, nickel, tin, alloys thereof, and Their combination. The method of claim 1, wherein the at least one first joint structure is formed by bonding at least one prefabricated structure to the first substrate. 11. The method of claim 1, wherein the first joining surface is formed by a plating process, an evaporation process, a chemical vapor deposition process, a "money shot", an electron beam evaporation, or a full-scale process. 12. The method of claim 1, wherein the method further comprises providing one or more preforms between the first substrate and the second substrate, wherein the at least one first joint structure and the at least The step of pressing a second joint structure together further includes deforming and shearing the one or more preforms at a preform interface with the substrate or joining surface. 13. The method of claim 12, wherein the preform comprises a metal, a polymer, or a mineral metal polymer. 14. The method of claim 1, wherein the first joint structure and the first joining surface are metal layers covering at least a portion of the surface of the first substrate. 15. The method of claim 1, wherein the method further comprises heating the joining surface at the one or more interfaces. 16. The method of claim 15, wherein the pressing step and the heating step occur substantially simultaneously. 17. The method of claim 15, wherein the connecting surface is heated using a micro heater. 18. The method of claim 1, wherein the method further comprises applying ultrasonic energy to a joining surface at a 74 1322734 or more interfaces. 19. The method of claim 1, wherein the method further comprises clamping or soft-bonding the first substrate and the second substrate together. 20. The method of claim 1, wherein the bonded substrate comprises at least one cavity defined therein. 21. The method of claim 1, wherein the first or second substrate comprises a plurality of discrete storage tanks containing storage tank contents, the storage tanks being sealed from one another and sealed from the external environment. 22. The method of claim 21, wherein the storage tank contents comprise a biosensor or other auxiliary device. 23. The method of claim 21, wherein the contents of the storage tank comprise a pharmaceutical preparation. 24. The method of claim 21, wherein the contents of the storage tank comprise a fragrance or aroma compound, a dye or other colorant, a sweetener, or a flavoring agent. 25. The method of claim 1, wherein the deformation is carried out under vacuum or in an inert atmosphere to oxidize the joint structure relative to oxidation reduction if deformation occurs in the atmosphere. 26. The method of claim 1, wherein the first or second substrate comprises a cavity, and a third substrate is disposed in the cavity prior to pressing the first and second joint structures together. 27. The method of claim 26, wherein the third substrate comprises a sensor, a MEMS device, or a combination thereof. 28. A method of sealing together at least two substrates, the method comprising: 75 1322734 providing a first substrate having at least one first joint structure, the joint structure comprising a first joining surface comprising plating a first flexible polymer having a thin metal layer, the at least one first joint structure comprising at least one groove structure defined in a recess formed in the first substrate; Providing a second substrate having at least one second joint structure, the joint structure comprising a second joining surface comprising a second flexible polymer plated with a thin metal layer, the at least one second joint structure comprising at least one a tenon structure; aligning the at least one first joint structure with respect to the at least one second joint structure to impart one or more overlaps of the at least one tenon structure relative to the at least one groove structure, and After the aligning step, the at least one tenon structure is at least partially pressed into the at least one groove structure such that the connecting surface is in two or more interfaces created by the one or more overlaps Forming an effective amount of local deformation to plastically deform at least a portion of one or both of the joining surfaces and forming at least one metal-metal bond between the first and second joining surfaces; At least one metal-to-metal bond includes at least a portion of the connecting surface that deforms outside of the groove structure. 29. The method of claim 28, wherein the metal layer of the first or the second metal-plated polymer, or both, comprises gold, platinum, or a combination thereof. 30. A package container member, the device comprising: 76 1322734 a first substrate having a front side and a back side, and the substrate comprising at least one first joint structure comprising a first joining surface having a surface of a first metal The at least one first joint structure includes at least one groove structure defined in a recess formed in the first substrate; a second substrate having at least one second joint structure, the joint structure comprising a surface a second connecting surface of the second metal, the at least one second joint structure comprising at least one tenon structure; a seal formed between the first substrate and the second substrate and joining them, wherein the first joining surface is pressure-welded to the second joining surface at one or more interfaces to form the seal a seal, wherein the seal comprises one or both of a space in which the joining surfaces are plastically deformed into the space outside the groove; and At least one containment space defined within the seal and between the first substrate and the second substrate to seal the containment space from an external environment. 31. The device of claim 30, wherein the at least one containment space comprises a plurality of discrete storage slots in the at least first substrate between the front side and the back side. 32. The device of claim 30, wherein the at least one containment space comprises at least one sensor, at least one MEMS device, or a combination thereof. 33. The device of claim 30, wherein the at least one containment space comprises a pharmaceutical formulation. 77 1322734 34. The device of claim 30, wherein the first metal, the second metal, or both metals comprise gold, diamond, or a combination thereof. 35. The device of claim 30, wherein the substrate comprises a material selected from the group consisting of ruthenium, metal, ceramic, polymer, glass, and combinations thereof. 36. The device of claim 30, wherein the preform structure is deformed between the first and second joint structures. 37. The device of claim 30, wherein the first joint structure or the second joint structure comprises a micro-heater. 38. The device of claim 37, further comprising an intermediate layer adjacent to the micro heater. 39. The device of claim 37, wherein the first joint structure or the second joint structure comprises a magnetic material that heats the structure by an external induction heater. 40. As claimed in claim 30, the device further comprises a clamp for joining the substrates together. 41. The device of claim 30, wherein the first substrate further comprises a plurality of discrete openings connected to the at least one containment space and the openings are closed by a plurality of discrete storage slot covers. 42. The device of claim 41, wherein the storage tank cover comprises a metal film and the device comprises means for selectively splitting the storage tank cover. 43. An implantable medical device for controlled exposure or release of contents in a sealed storage tank, the device comprising: a first substrate comprising at least one first joint structure, the joint structure comprising a joining surface, the surface being a first metal, the one to 78 1322734 having a first joint structure comprising at least one groove structure defined in a recess formed in the first substrate; a plurality of discontinuous storage slots in the substrate, the storage slots having a first opening and a second opening remote from the first opening; a storage tank contents located inside the storage tank, wherein the contents of the storage tank include a drug or a living being a sensor; a plurality of discontinuous storage slot covers that close the first opening; a device for selectively splitting the storage tank cover; and a second substrate having at least one second joint structure, the second joint structure comprising a second joint surface, the surface being a second metal, And a hermetic joint sealing and closing the second openings, the at least one second joint structure comprising at least one tenon structure, wherein the first joining surface is pressure-cooled to the second by at one or more interfaces Connecting a surface to form the hermetic joint, whereby the seal includes one of plastically deforming the joining surfaces into the space between the first substrate and the second substrate and located outside the groove structure or Part of both. 44. A method of forming an electrically conductive connection, the method comprising: providing a first electrically non-conductive substrate having a bore therethrough, wherein an inner surface of the first substrate defining the aperture comprises a first layer of electrically conductive material; Providing a second non-conductive substrate having a protruding member extending from a surface of the second substrate, wherein the member is formed of or coated with a second electrically conductive material; 79 1322734 Aligning with respect to the protruding member, the crucible imparting at least one overlap of the protruding member with respect to the hole; and pressing the protruding member of the second substrate into the hole of the first substrate so that The first and/or second conductive layer forms an effective amount of local deformation and shear at at least one interface created by at least one overlap to form a bond between the first and second conductive layers An electrical connection, wherein the bonding comprises a portion of the conductive material that is deformed into the space between the first substrate and the second substrate and located outside the hole