TWI320514B - Negative photosensitive composition and lithography process thereof - Google Patents
Negative photosensitive composition and lithography process thereofInfo
- Publication number
- TWI320514B TWI320514B TW95110684A TW95110684A TWI320514B TW I320514 B TWI320514 B TW I320514B TW 95110684 A TW95110684 A TW 95110684A TW 95110684 A TW95110684 A TW 95110684A TW I320514 B TWI320514 B TW I320514B
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive composition
- lithography process
- negative photosensitive
- negative
- lithography
- Prior art date
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95110684A TWI320514B (en) | 2006-03-28 | 2006-03-28 | Negative photosensitive composition and lithography process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95110684A TWI320514B (en) | 2006-03-28 | 2006-03-28 | Negative photosensitive composition and lithography process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200736833A TW200736833A (en) | 2007-10-01 |
| TWI320514B true TWI320514B (en) | 2010-02-11 |
Family
ID=45073751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95110684A TWI320514B (en) | 2006-03-28 | 2006-03-28 | Negative photosensitive composition and lithography process thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI320514B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9285680B2 (en) | 2014-07-16 | 2016-03-15 | Taiflex Scientific Co., Ltd. | Photosensitive polyimide composition, base agent thereof, method of making the base agent, and solder-resistant polyimide thin film made from the composition |
| CN107203099A (en) * | 2016-03-18 | 2017-09-26 | 台湾积体电路制造股份有限公司 | Semiconductor devices and its manufacture method |
| TWI725496B (en) * | 2018-12-21 | 2021-04-21 | 南韓商Lg化學股份有限公司 | Cross-linking agent compound, photosensitive composition comprising the same, and photosensitive material using the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113867104B (en) * | 2021-09-01 | 2024-12-27 | 安徽光智科技有限公司 | Preparation method of photoresist structure for lift-off |
-
2006
- 2006-03-28 TW TW95110684A patent/TWI320514B/en active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9285680B2 (en) | 2014-07-16 | 2016-03-15 | Taiflex Scientific Co., Ltd. | Photosensitive polyimide composition, base agent thereof, method of making the base agent, and solder-resistant polyimide thin film made from the composition |
| CN107203099A (en) * | 2016-03-18 | 2017-09-26 | 台湾积体电路制造股份有限公司 | Semiconductor devices and its manufacture method |
| TWI725496B (en) * | 2018-12-21 | 2021-04-21 | 南韓商Lg化學股份有限公司 | Cross-linking agent compound, photosensitive composition comprising the same, and photosensitive material using the same |
| US11754921B2 (en) | 2018-12-21 | 2023-09-12 | Lg Chem, Ltd. | Crosslinking agent compound, photosensitive composition comprising the same, and photosensitive material using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200736833A (en) | 2007-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL193903A0 (en) | Negative photoresist compositions | |
| GB2455955B (en) | Improving image masks | |
| EP1986221A4 (en) | Exposure method, exposure apparatus, photomask and photomask manufacturing method | |
| EP2157479A4 (en) | Resist composition for negative development and method of forming pattern therewith | |
| AU317302S (en) | Mask elbow | |
| PL2248519T3 (en) | Non-mucoadhesive film dosage forms | |
| EP2068349A4 (en) | Stage device and exposure device | |
| SG133550A1 (en) | Imprint lithography | |
| EP1918983A4 (en) | Stage apparatus and exposure apparatus | |
| TWI366743B (en) | Positive resist composition and patterning process | |
| EP2065444A4 (en) | Photopolymerizable composition | |
| EP2042304A4 (en) | Method of plate making and lithographic printing plate | |
| SG113541A1 (en) | Release process film | |
| EP1975980A4 (en) | Exposure device and fabrication method thereof | |
| TWI349834B (en) | Composition for positive type photoresist and positive type photoresist film manufactured thereby | |
| AU311190S (en) | Elbow for mask | |
| EP1983370A4 (en) | Pellicle for high numerical aperture exposure device | |
| EP2053465A4 (en) | Positive resist processing liquid composition and liquid developer | |
| EP2015937A4 (en) | Lithographic printing plates and processes for making them | |
| EP2034513A4 (en) | Holding device and exposure device | |
| PL2047496T3 (en) | Mercury releasing method | |
| EP1847878A4 (en) | Photosensitive composition removing liquid | |
| TWI349832B (en) | Negative resist composition and patterning process | |
| TWI320514B (en) | Negative photosensitive composition and lithography process thereof | |
| EP1847876A4 (en) | Photosensitive composition removing liquid |