TWI318421B - Structure and method for improving carrier mobility of a channel - Google Patents
Structure and method for improving carrier mobility of a channelInfo
- Publication number
- TWI318421B TWI318421B TW093103284A TW93103284A TWI318421B TW I318421 B TWI318421 B TW I318421B TW 093103284 A TW093103284 A TW 093103284A TW 93103284 A TW93103284 A TW 93103284A TW I318421 B TWI318421 B TW I318421B
- Authority
- TW
- Taiwan
- Prior art keywords
- channel
- carrier mobility
- improving carrier
- improving
- mobility
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/791—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/2807—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being Si or Ge or C and their alloys except Si
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/473—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/933—Germanium or silicon or Ge-Si on III-V
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/366,220 US6924181B2 (en) | 2003-02-13 | 2003-02-13 | Strained silicon layer semiconductor product employing strained insulator layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200419659A TW200419659A (en) | 2004-10-01 |
| TWI318421B true TWI318421B (en) | 2009-12-11 |
Family
ID=32849726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093103284A TWI318421B (en) | 2003-02-13 | 2004-02-12 | Structure and method for improving carrier mobility of a channel |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6924181B2 (en) |
| CN (1) | CN1293646C (en) |
| TW (1) | TWI318421B (en) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100437970C (en) | 2003-03-07 | 2008-11-26 | 琥珀波系统公司 | A structure and method for forming a semiconductor structure |
| US6967143B2 (en) * | 2003-04-30 | 2005-11-22 | Freescale Semiconductor, Inc. | Semiconductor fabrication process with asymmetrical conductive spacers |
| US6940705B2 (en) * | 2003-07-25 | 2005-09-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Capacitor with enhanced performance and method of manufacture |
| US6936881B2 (en) * | 2003-07-25 | 2005-08-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Capacitor that includes high permittivity capacitor dielectric |
| US7078742B2 (en) | 2003-07-25 | 2006-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Strained-channel semiconductor structure and method of fabricating the same |
| US7163867B2 (en) * | 2003-07-28 | 2007-01-16 | International Business Machines Corporation | Method for slowing down dopant-enhanced diffusion in substrates and devices fabricated therefrom |
| US7112495B2 (en) * | 2003-08-15 | 2006-09-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method of a strained channel transistor and a second semiconductor component in an integrated circuit |
| US7071052B2 (en) * | 2003-08-18 | 2006-07-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Resistor with reduced leakage |
| US20050077574A1 (en) * | 2003-10-08 | 2005-04-14 | Chandra Mouli | 1T/0C RAM cell with a wrapped-around gate device structure |
| US8008724B2 (en) * | 2003-10-30 | 2011-08-30 | International Business Machines Corporation | Structure and method to enhance both nFET and pFET performance using different kinds of stressed layers |
| US7888201B2 (en) | 2003-11-04 | 2011-02-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor-on-insulator SRAM configured using partially-depleted and fully-depleted transistors |
| US7119404B2 (en) * | 2004-05-19 | 2006-10-10 | Taiwan Semiconductor Manufacturing Co. Ltd. | High performance strained channel MOSFETs by coupled stress effects |
| US7495266B2 (en) * | 2004-06-16 | 2009-02-24 | Massachusetts Institute Of Technology | Strained silicon-on-silicon by wafer bonding and layer transfer |
| DE102004031710B4 (en) * | 2004-06-30 | 2007-12-27 | Advanced Micro Devices, Inc., Sunnyvale | Method for producing differently deformed semiconductor regions and transistor pair in differently shaped semiconductor regions |
| US7397087B2 (en) * | 2004-08-06 | 2008-07-08 | International Business Machines Corporation | FEOL/MEOL metal resistor for high end CMOS |
| DE102004042167B4 (en) * | 2004-08-31 | 2009-04-02 | Advanced Micro Devices, Inc., Sunnyvale | A method of forming a semiconductor structure comprising transistor elements having differently strained channel regions, and corresponding semiconductor structure |
| US7323391B2 (en) * | 2005-01-15 | 2008-01-29 | Applied Materials, Inc. | Substrate having silicon germanium material and stressed silicon nitride layer |
| US7442597B2 (en) * | 2005-02-02 | 2008-10-28 | Texas Instruments Incorporated | Systems and methods that selectively modify liner induced stress |
| US8138104B2 (en) * | 2005-05-26 | 2012-03-20 | Applied Materials, Inc. | Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure |
| US8129290B2 (en) | 2005-05-26 | 2012-03-06 | Applied Materials, Inc. | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure |
| US7566655B2 (en) * | 2005-05-26 | 2009-07-28 | Applied Materials, Inc. | Integration process for fabricating stressed transistor structure |
| US7425740B2 (en) * | 2005-10-07 | 2008-09-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and structure for a 1T-RAM bit cell and macro |
| US20070246776A1 (en) * | 2006-04-20 | 2007-10-25 | Synopsys, Inc. | Stress engineering for cap layer induced stress |
| US7678636B2 (en) * | 2006-06-29 | 2010-03-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Selective formation of stress memorization layer |
| US20080157292A1 (en) * | 2006-12-29 | 2008-07-03 | Texas Instruments Inc. | High-stress liners for semiconductor fabrication |
| US8558278B2 (en) | 2007-01-16 | 2013-10-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained transistor with optimized drive current and method of forming |
| US20080191285A1 (en) | 2007-02-09 | 2008-08-14 | Chih-Hsin Ko | CMOS devices with schottky source and drain regions |
| US8466508B2 (en) * | 2007-10-03 | 2013-06-18 | Macronix International Co., Ltd. | Non-volatile memory structure including stress material between stacked patterns |
| US7943961B2 (en) | 2008-03-13 | 2011-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strain bars in stressed layers of MOS devices |
| US7808051B2 (en) | 2008-09-29 | 2010-10-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Standard cell without OD space effect in Y-direction |
| DE102009010883B4 (en) * | 2009-02-27 | 2011-05-26 | Amd Fab 36 Limited Liability Company & Co. Kg | Adjusting a non-silicon content in a semiconductor alloy during FET transistor fabrication by an intermediate oxidation process |
| US8236709B2 (en) | 2009-07-29 | 2012-08-07 | International Business Machines Corporation | Method of fabricating a device using low temperature anneal processes, a device and design structure |
| CN102110710A (en) * | 2009-12-23 | 2011-06-29 | 中国科学院微电子研究所 | Semiconductor structure with channel stress layer and forming method thereof |
| US8883598B2 (en) * | 2012-03-05 | 2014-11-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thin capped channel layers of semiconductor devices and methods of forming the same |
| US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
| US10084063B2 (en) * | 2014-06-23 | 2018-09-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5534713A (en) | 1994-05-20 | 1996-07-09 | International Business Machines Corporation | Complementary metal-oxide semiconductor transistor logic using strained SI/SIGE heterostructure layers |
| US5633202A (en) * | 1994-09-30 | 1997-05-27 | Intel Corporation | High tensile nitride layer |
| JPH08321612A (en) * | 1995-05-26 | 1996-12-03 | Ricoh Co Ltd | Semiconductor device and manufacturing method thereof |
| JPH10144919A (en) * | 1996-11-14 | 1998-05-29 | Denso Corp | Method for manufacturing mis transistor |
| US5963817A (en) | 1997-10-16 | 1999-10-05 | International Business Machines Corporation | Bulk and strained silicon on insulator using local selective oxidation |
| JPH11274315A (en) * | 1998-03-19 | 1999-10-08 | Hitachi Ltd | Semiconductor device |
| US6690043B1 (en) * | 1999-11-26 | 2004-02-10 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| WO2002052652A1 (en) * | 2000-12-26 | 2002-07-04 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and its manufacturing method |
| JP2002198368A (en) * | 2000-12-26 | 2002-07-12 | Nec Corp | Method for manufacturing semiconductor device |
| US20020168802A1 (en) * | 2001-05-14 | 2002-11-14 | Hsu Sheng Teng | SiGe/SOI CMOS and method of making the same |
| US20020167048A1 (en) * | 2001-05-14 | 2002-11-14 | Tweet Douglas J. | Enhanced mobility NMOS and PMOS transistors using strained Si/SiGe layers on silicon-on-insulator substrates |
| JP2004538634A (en) * | 2001-08-06 | 2004-12-24 | マサチューセッツ インスティテュート オブ テクノロジー | Semiconductor substrate having strained layer and method for forming the same |
-
2003
- 2003-02-13 US US10/366,220 patent/US6924181B2/en not_active Expired - Lifetime
-
2004
- 2004-02-12 TW TW093103284A patent/TWI318421B/en not_active IP Right Cessation
- 2004-02-13 CN CNB2004100043357A patent/CN1293646C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1293646C (en) | 2007-01-03 |
| US6924181B2 (en) | 2005-08-02 |
| CN1525574A (en) | 2004-09-01 |
| US20040159834A1 (en) | 2004-08-19 |
| TW200419659A (en) | 2004-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI318421B (en) | Structure and method for improving carrier mobility of a channel | |
| SG120086A1 (en) | Method of forming a transistor with a strained channel | |
| AU2003293056A8 (en) | Multimedia editor for wireless communication devices and method therefor | |
| AU2003266149A1 (en) | Finfet having improved carrier mobility and method of its formation | |
| GB2428547B (en) | Method and apparatus for providing channel state information | |
| SG123567A1 (en) | Multiple-gate transistor structure and method for fabricating | |
| AU2003220088A8 (en) | Ald method and apparatus | |
| GB2392067B (en) | Channel estimation apparatus and methods | |
| GB2436035B (en) | Apparatus and method capable of improved coexistence of multiple wireless communication techniques | |
| GB0306603D0 (en) | Method and apparatus for broadcasting communications | |
| EP1578251A4 (en) | Apparatus and method for beneficial modification of biorhythmic activity | |
| AU2003265618A8 (en) | Method and apparatus of position location | |
| AU2003225740A8 (en) | Antenna adaptation comparison method for high mobility | |
| AU2003225153A8 (en) | Method and apparatus for efficient channel assignment | |
| EP1651075A4 (en) | Bag and method of moving | |
| EP1632074A4 (en) | Method and system for suppressing carrier leakage | |
| EP1577280A4 (en) | Method of deuterization | |
| TWI371856B (en) | Structure for and method of fabricating a high-mobility field-effect transistor | |
| GB0313668D0 (en) | Method of containing peas | |
| SG108874A1 (en) | Channel equalisation | |
| GB0319361D0 (en) | A method of and system for wireless communication | |
| AU2003250710A8 (en) | Sampling method | |
| PL363797A1 (en) | Method and device designed for making tunnels and channels | |
| EP1512783A4 (en) | Method of knitting knit-wear | |
| AU2003201218A8 (en) | Device and method for improving wireless outdoor-to-indoor digital communication |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |