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TWI318088B - Carrying head for electronic parts, parts assembly device and control methods of the same - Google Patents

Carrying head for electronic parts, parts assembly device and control methods of the same

Info

Publication number
TWI318088B
TWI318088B TW95102158A TW95102158A TWI318088B TW I318088 B TWI318088 B TW I318088B TW 95102158 A TW95102158 A TW 95102158A TW 95102158 A TW95102158 A TW 95102158A TW I318088 B TWI318088 B TW I318088B
Authority
TW
Taiwan
Prior art keywords
parts
same
control methods
assembly device
carrying head
Prior art date
Application number
TW95102158A
Other languages
Chinese (zh)
Other versions
TW200635457A (en
Inventor
Kouki Kusakari
Original Assignee
Yamagata Casio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamagata Casio Co Ltd filed Critical Yamagata Casio Co Ltd
Publication of TW200635457A publication Critical patent/TW200635457A/en
Application granted granted Critical
Publication of TWI318088B publication Critical patent/TWI318088B/en

Links

TW95102158A 2005-03-31 2006-01-20 Carrying head for electronic parts, parts assembly device and control methods of the same TWI318088B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005102533A JP2006286781A (en) 2005-03-31 2005-03-31 Mounting head of electronic parts, parts mounting device, and its control method

Publications (2)

Publication Number Publication Date
TW200635457A TW200635457A (en) 2006-10-01
TWI318088B true TWI318088B (en) 2009-12-01

Family

ID=37031061

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95102158A TWI318088B (en) 2005-03-31 2006-01-20 Carrying head for electronic parts, parts assembly device and control methods of the same

Country Status (3)

Country Link
JP (1) JP2006286781A (en)
CN (1) CN1842267A (en)
TW (1) TWI318088B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4794483B2 (en) * 2007-03-09 2011-10-19 富士機械製造株式会社 Component mounter
WO2008142744A1 (en) * 2007-05-09 2008-11-27 Advantest Corporation Component carrier device, electronic component testing device, and method for recognizing optimal distance in component carrier device
JP2009088035A (en) * 2007-09-28 2009-04-23 Hitachi High-Tech Instruments Co Ltd Electronic component mounting device
JP2009231817A (en) * 2008-02-25 2009-10-08 Shibaura Mechatronics Corp Device for mounting electronic parts and method of mounting electronic parts
KR101521529B1 (en) * 2010-06-14 2015-05-19 삼성테크윈 주식회사 Device mounter head and device mounting method using the same
CN102294692B (en) * 2011-07-27 2014-02-26 苏州大学 a mechanical arm
JP2018054463A (en) * 2016-09-29 2018-04-05 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
KR101893823B1 (en) * 2016-10-04 2018-08-31 주식회사 고영테크놀러지 Board inspection apparatus and method of compensating board distortion using the same
WO2018179317A1 (en) * 2017-03-31 2018-10-04 株式会社Ｆｕｊｉ Component mounter and mounting head
CN106969003A (en) * 2017-04-12 2017-07-21 上海与德科技有限公司 Servicing unit for radio circuit matching and debugging
JP2023086496A (en) * 2021-12-10 2023-06-22 パナソニックＩｐマネジメント株式会社 COMPONENT MOUNTING APPARATUS, COMPONENT MOUNTING METHOD, AND COMPONENT MOUNTING SYSTEM
CN115379756A (en) * 2021-12-21 2022-11-22 微见智能封装技术(深圳)有限公司 A pressure control device, a solid crystal machine and a method for controlling the pressing force of a suction nozzle
CN115443060A (en) * 2022-09-30 2022-12-06 苏州科韵激光科技有限公司 Device and method for retrieving components
CN118234218B (en) * 2024-03-28 2025-04-11 深圳市格林赛德科技有限公司 A pressure output control method and device for chip placement machine

Also Published As

Publication number Publication date
CN1842267A (en) 2006-10-04
TW200635457A (en) 2006-10-01
JP2006286781A (en) 2006-10-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees