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TWI317815B - Semiconductor package sorting method - Google Patents

Semiconductor package sorting method

Info

Publication number
TWI317815B
TWI317815B TW095137752A TW95137752A TWI317815B TW I317815 B TWI317815 B TW I317815B TW 095137752 A TW095137752 A TW 095137752A TW 95137752 A TW95137752 A TW 95137752A TW I317815 B TWI317815 B TW I317815B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
sorting method
package sorting
semiconductor
sorting
Prior art date
Application number
TW095137752A
Other languages
Chinese (zh)
Other versions
TW200745574A (en
Inventor
Min Gu Kang
Hyun Min Lee
Kyung Soo Song
Sang Yoon Lee
Ssang Gun Lim
Original Assignee
Intekplus Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of TW200745574A publication Critical patent/TW200745574A/en
Application granted granted Critical
Publication of TWI317815B publication Critical patent/TWI317815B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW095137752A 2005-10-19 2006-10-13 Semiconductor package sorting method TWI317815B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050098855A KR100705655B1 (en) 2005-10-19 2005-10-19 Classification method of semiconductor package

Publications (2)

Publication Number Publication Date
TW200745574A TW200745574A (en) 2007-12-16
TWI317815B true TWI317815B (en) 2009-12-01

Family

ID=37962691

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137752A TWI317815B (en) 2005-10-19 2006-10-13 Semiconductor package sorting method

Country Status (4)

Country Link
KR (1) KR100705655B1 (en)
CN (1) CN101292338A (en)
TW (1) TWI317815B (en)
WO (1) WO2007046629A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG154364A1 (en) * 2008-01-30 2009-08-28 Rokko Mechatronics Pte Ltd System and method for the sorting of ic units
KR101134985B1 (en) * 2009-03-05 2012-04-09 (주)제이티 Vision inspection apparatus
KR101275862B1 (en) 2011-10-12 2013-06-17 한미반도체 주식회사 semiconductor manufacturing system and a controlling method of the same
CN103021899B (en) * 2012-12-21 2015-07-15 日月光半导体（昆山）有限公司 Semiconductor product detection machine and detection method thereof
CN104900555A (en) * 2015-04-29 2015-09-09 海太半导体（无锡）有限公司 Semiconductor encapsulation testing device
KR102391516B1 (en) * 2015-10-08 2022-04-27 삼성전자주식회사 Semiconductor test apparatus
CN106841989A (en) * 2017-02-13 2017-06-13 张家港市欧微自动化研发有限公司 A kind of cmos sensor method of testing
CN111620118A (en) * 2020-05-29 2020-09-04 苏州天准科技股份有限公司 Blanking equipment and camera protection module detection system
CN117465986A (en) * 2023-01-30 2024-01-30 惠州华星光电显示有限公司 Intelligent tablet dispensing integrated machine and its operation process
CN118115038B (en) * 2024-03-12 2024-11-05 深圳市鹏乐智能系统有限公司 LED chip defect detection method, device, equipment and storage medium

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08262102A (en) * 1995-03-23 1996-10-11 Advantest Corp Method for reinspecting device in handler for ic tester
KR100481297B1 (en) * 1997-10-27 2005-07-07 삼성전자주식회사 Semiconductor packaging system and packaging method
JP2000258496A (en) 1999-03-05 2000-09-22 Nec Corp Inspection of semiconductor device and device thereof
KR100338194B1 (en) * 1999-10-16 2002-05-27 김주환 Inspection system of Semiconductor device package with 3 dimension type and the inspection method thereof
KR100819796B1 (en) * 2002-05-02 2008-04-07 삼성테크윈 주식회사 Classification method of semiconductor package
KR100498496B1 (en) * 2003-05-07 2005-07-01 삼성전자주식회사 Testing method of remnant semiconductor device
KR200339601Y1 (en) * 2003-10-13 2004-01-24 한미반도체 주식회사 apparatus for vision inspection of semiconductor devices

Also Published As

Publication number Publication date
KR100705655B1 (en) 2007-04-09
CN101292338A (en) 2008-10-22
TW200745574A (en) 2007-12-16
WO2007046629A1 (en) 2007-04-26

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