1316658 卓H聲(_L替換頁 九、發明說明： 【發明所屬之技術領域】 ’特別係涉及一種中 本發明涉及一種中央處理器降溫控制系統及方法 央處理器被動式降溫控制系統及方法。 【先前技術】 隨著電腦技術之發展’包括處理器在_各種部件辭越來越高，資 料處理速度越來機，而發熱4也越來越A。其巾，巾域理^ .1316658 卓H sound (_L replacement page IX, invention description: [Technical field of the invention] 'Specially related to a system of the present invention relates to a central processor cooling control system and method central processor passive cooling control system and method. Technology] With the development of computer technology, including the processor in the _ various parts of the word is getting higher and higher, the data processing speed is getting more and more, and the fever 4 is getting more and more A. Its towel, towel domain management ^.
統中發熱量最大的部件之-。目前普遍使用風触動散齡I被動降溫 係主動散熱系統之有效補充，其實質係籍由減少中央處理器之卫作時間， 以減少發熱源之發熱量’達到降溫之目的。目前採用的—種被動降溫;式 主要係作業系統藉由高級配置電源介面（ACPI，Advanced —The largest part of the heat in the system -. At present, the wind-sensing age-passive passive cooling system is effectively supplemented by the active cooling system. The essence of the system is to reduce the maintenance time of the central processor to reduce the heat generated by the heat source to achieve the purpose of cooling. Currently used passive cooling; the main operating system is through advanced configuration power interface (ACPI, Advanced -
Power Interface)機制來實現的。該被動式降溫係指藉由調節中央處理器 (cpu，CentralProcessingUnit)之佔空比（Dmy cyde)來達到降溫之目的的 方式’佔空比雜在_健魏動’纽電平所佔之百分比。佔空比值 之大小對應鶴降溫程度之大小。把被動降溫程賴分成—定數量之佔空 比值，稱爲分級。 工 藉由ACPI機制纽CPlm崎溫方式具有—定的局雌，例如：在 工業電腦或者其他使用不支援ACPI機制作業系統之電腦上，就不能藉由上 φ 述被動降溫來實現對中央處理器之降溫。 【發明内容】 、鑒於以上内容，有必要提供一種中央處理器被動式際溫控制系統及方 法，可在所有作業系統中實現對中央處理器之分級被動式降温。 種中央處理器被動式降溫控制系統，該系統包括：一設置模組，用 於在基本輸入輸出系統中設置第一溫度界限值和第二溫度界限值，還用於 a 又置介於第一溫度界限值和第二溫度界限值之間的多個溫度區間及每一區 間對應之佔空比；一發送模組’用於發出週期性之系統管理中斷（smi， System Management Interrupt)來偵測並記錄中央處理器當前溫度；一判斷 模組’用於判斷偵測到的當前溫度和上述第一溫度界限值及第二溫度界限 值大小，並確定當前溫度所在之區間及該區間對應之佔空比；一處理模組， 1316658 用於根據上述佔空比對中央處理器進行降溫控制。 二、《進一步地，所述之處理模组對中央處理器進行之降溫控制包括：若當 二:度大於設置之第二溫度界限值時，處理模組自動關斷线電源；若當 刖/嚴度大於所述之第一溫度界限值且小於所述之第二溫度界限值時，處理 模組將中央處理器之工作狀_節成當前溫度所在區間之佔空比。 -種中央處理器被動式降溫控制方法，财法包括：⑷在基本輸入 輸出系統中&置第-溫度界限值和第二溫度界限值；⑻設置介於第一溫 度界限值和第二溫度界限值之間的多個溫度區間及每一區間對應之佔空 比，（c)發出週期性之SMI中斷，1貞測並記錄中央處理器之當前溫度；⑼ 判斷當前溫度是否大於第—溫度界限值；⑻若該#前溫度大於第一溫度 界限值’則判斷當前溫度是否大於第二溫度界限值；（F)若該當前溫度大 於第二溫度界限值’則自動關斷系統電源；若當前溫度小於第二溫度界限 值，則確疋當别溫度所在區間及該區間對應之佔空比，並將CPU之工作 狀態調節成當前溫度所在區間之伯空比，然後返回步驟（c)。 其中於步驟（D)中，進-步包括：若當前溫度小於第一溫度界限值， 則返回步驟（C)。 相較習知技術’所述中央處理器被動式降溫控⑽統及方法，可在所 有作業㈣巾實現射央處職之被動式降溫，处在中央處理器溫度變 化過程中能動態分級改變鶴降溫程度，提高了被動降溫時的中央處理器 可利用率，這-技術不僅可以拓展主動散熱系統（例如風冷散教系统）之 散熱能力，還可應餘無風摘靜態散熱系統（例如I業控制、軍事應用 等）。 ’一 【實施方式】 方式种央處理麵動·溫㈣纽較佳實施 方式之硬齡翻，巾央處理器觸絲溫控紙制贿儲於-入輸出系統（BIOS，BasicI_〇utput System) 1〇中。該 $ ▲ 理器(CPU , CentraIPro⑽ingUni〇 u相連接，運行於一主機巧:、T央處 參閱第二圖所示，係本發明中央處理辦皮動式降溫控制系統較 方式之功能模組圖。該甲央處理器被動式降溫控制系統綱包括··一設置模 1316658 -¾ 11 -*§ - - ' ·· . .. · .- . . ·....·-·- 組1000 ’用於在BIOS中設置溫度界限值TMP1和TMP2，其中，該TMP1係 ' 能夠详證CPU穩定運行之溫度界限值，該TMP2係防止CPU燒毀之溫度界限 ' 值，且™P2大於TMP1。例如’對於Intel Pentium 4 CPU，溫度界限值™P1 約爲70度，溫度界限值TMP2介於80度到90度之間。此外，設置模組1000還 • 用於設置介於TMP1及TMP2之間的多個溫度區間及每一區間對應之佔空 比’例如，當TMP1設置爲70度，TMP2設置爲84度時，可設置每增加2度爲 一區間’如（70度，72度]、（72度，74度]等，每一區間對應一佔空比，該 佔空比指一個信號週期内有效電平所佔之百分比，若溫度發生變化’佔空 比也隨之進行調整，對應不同之降溫程度，如（7〇度，72度]所對應之佔空 φ 比爲12.5% ’（72度’ 74度]所對應之佔空比爲25%。溫度與佔空比之間的變 化關係可根據實際需要隨線性變化、指數變化等進行設置，且溫度與佔空 比之設置可根據CPU之類型、機箱結構及散熱能力等進行調整。 一發送模組1002，用於發出週期性之系統管理中斷（SMI，systemPower Interface) mechanism to achieve. The passive cooling refers to the method of adjusting the duty ratio (Dmy cyde) of the central processing unit (cpu, Central Processing Unit) to achieve the purpose of cooling, and the percentage of the duty cycle is _jian Wei moving. The size of the duty cycle corresponds to the degree of cooling of the crane. The passive cooling process is divided into a fixed amount of duty ratio, called classification. By means of the ACPI mechanism, the New CPlm has a fixed-state approach. For example, on an industrial computer or other computer using an operating system that does not support the ACPI mechanism, the central processor cannot be implemented by the above-mentioned passive cooling. Cool down. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a central processor passive temperature control system and method for implementing hierarchical passive cooling of a central processor in all operating systems. A central processor passive cooling control system, the system comprising: a setting module for setting a first temperature threshold value and a second temperature threshold value in the basic input/output system, and also for a further being placed at the first temperature a plurality of temperature intervals between the threshold value and the second temperature threshold value and a duty ratio corresponding to each interval; a transmitting module 'is used to issue a periodic system management interrupt (smi, System Management Interrupt) to detect and Recording the current temperature of the central processing unit; a determining module 'for determining the detected current temperature and the first temperature threshold value and the second temperature threshold value, and determining the interval where the current temperature is located and the duty corresponding to the interval Ratio; a processing module, 1316658 is used to cool the central processor according to the above duty cycle. 2. Further, the cooling control performed by the processing module on the central processing unit includes: if the second degree is greater than the set second temperature threshold, the processing module automatically turns off the line power; When the severity is greater than the first temperature threshold value and less than the second temperature threshold value, the processing module divides the working state of the central processing unit into a duty ratio of the current temperature range. - a central processor passive cooling control method, the financial method includes: (4) in the basic input and output system & set the - temperature threshold value and the second temperature threshold value; (8) set between the first temperature threshold value and the second temperature limit a plurality of temperature intervals between values and a duty cycle corresponding to each interval, (c) issuing a periodic SMI interrupt, 1 detecting and recording the current temperature of the central processor; (9) determining whether the current temperature is greater than the first temperature limit (8) if the pre-# temperature is greater than the first temperature threshold value, it is determined whether the current temperature is greater than the second temperature threshold value; (F) if the current temperature is greater than the second temperature threshold value, the system power is automatically turned off; When the temperature is lower than the second temperature limit value, it is determined that the temperature range and the duty ratio corresponding to the interval, and the working state of the CPU is adjusted to the space ratio of the current temperature range, and then returns to step (c). Wherein in step (D), the step further comprises: if the current temperature is less than the first temperature threshold, returning to step (C). Compared with the conventional technology, the central processor passive cooling control (10) system and method can achieve passive cooling in all operations (four) towel, and can dynamically change the degree of crane cooling in the process of temperature change of the central processor. Improve the CPU utilization during passive cooling, this technology can not only expand the cooling capacity of active cooling systems (such as air-cooled devotional systems), but also the static cooling system (such as I industry control, military) Application, etc.). '一一实施方式】 Ways to deal with the surface treatment of the surface and warm (four) New preferred embodiment of the hard turn, the towel central handle touch silk temperature control paper bribe stored in the output system (BIOS, BasicI_〇utput System ) 1 〇. The $ ▲ processor (CPU, CentraIPro (10) ingUni〇u is connected, running on a host: please refer to the second figure in the central office, which is a functional module diagram of the central processing office of the present invention. The passive cooling control system of the central processor includes a set mode 1316658 -3⁄4 11 -*§ - - ' ·· . .. · .- . . ·....·-·- group 1000 ' The temperature limit values TMP1 and TMP2 are set in the BIOS, wherein the TMP1 is capable of verifying the temperature limit value of the stable operation of the CPU, the TMP2 is a temperature limit value for preventing the CPU from being burned, and TMP2 is greater than TMP1. For example, Intel Pentium 4 CPU, temperature limit value TMP1 is about 70 degrees, temperature limit value TMP2 is between 80 degrees and 90 degrees. In addition, setting module 1000 also • used to set multiple between TMP1 and TMP2 The temperature range and the duty ratio corresponding to each interval' For example, when TMP1 is set to 70 degrees and TMP2 is set to 84 degrees, each interval of 2 degrees can be set to an interval 'such as (70 degrees, 72 degrees), (72 degrees) , 74 degrees], etc., each interval corresponds to a duty cycle, which refers to the effective power in one signal period The percentage, if the temperature changes, the duty cycle is also adjusted accordingly, corresponding to different degrees of temperature drop, such as (7 degrees, 72 degrees) corresponding to the duty ratio φ is 12.5% '(72 degrees ' 74 The duty ratio corresponding to the degree is 25%. The relationship between the temperature and the duty ratio can be set according to the actual needs with linear changes, exponential changes, etc., and the temperature and duty ratio can be set according to the type of the CPU. The chassis structure and heat dissipation capability are adjusted. A transmitting module 1002 is used to issue periodic system management interrupts (SMI, system)
Management Interrupt)偵測並記錄CPU之當前溫度TMP。該SMI係不可屏蔽 並具備最高等級之中斷優先權，一旦發送模組發出SMI中斷，CPU則進入系 統管理模式（SMM，System Management Mode )中之系統管理記憶體 (SMRAM，System Management memory)内執行特殊代碼。 一判斷模組1004，用於判斷當前溫度tmp和溫度界限值xMpi、TMP2 之大小’並確定當前温度TMP所在區間及該區間對應之佔空比。例如，若 攀當前溫度™P為82度，則落入區間（80度，82度]内，其對應之佔空比為 87.5%。 一處理模组1006 ’用於根據判斷模組1004確定之溫度區間及該溫度區 間對應之佔空比對CPU進行降溫控制，該降溫控制包括：當CPU當前溫度 TMP大於設置之溫度界限值TMP2時，處理模組1〇〇6自動關斷系統電源；若 當前溫度TMP大於設置之溫度界限值11处1且小於設置之溫度界限值7]^2 時’處理模組1006將CPU之工作狀態調節成當前溫度所在區間之佔空比。 以Intel晶片組ICH7爲例’其節流（处越]^)控制週期係搬4個PCI(PeripheralManagement Interrupt) detects and records the current temperature TMP of the CPU. The SMI is non-maskable and has the highest level of interrupt priority. Once the SMI interrupt is sent by the sending module, the CPU enters the system management memory (SMRAM) in the System Management Mode (SMM). Special code. A determining module 1004 is configured to determine the current temperature tmp and the temperature threshold values xMpi, TMP2 and determine the current temperature TMP interval and the duty cycle corresponding to the interval. For example, if the current temperature TMP is 82 degrees, it falls within the interval (80 degrees, 82 degrees), and the corresponding duty ratio is 87.5%. A processing module 1006' is used to determine according to the determining module 1004. The temperature interval and the duty ratio corresponding to the temperature interval are used to cool the CPU, and the temperature reduction control includes: when the current temperature TMP of the CPU is greater than the set temperature limit value TMP2, the processing module 1〇〇6 automatically turns off the system power; When the current temperature TMP is greater than the set temperature limit value 11 and less than the set temperature limit value 7]^2, the processing module 1006 adjusts the operating state of the CPU to the duty ratio of the current temperature range. The Intel chipset ICH7 For example, 'the throttling (the more) ^) control cycle is to move 4 PCI (Peripheral
Component Interconnection)時鐘週期(約等於31微秒），可藉由STPCLK#信 號讓cpu時鐘暫時停止，從而使CPU處於休息狀態。當€1>1；溫度達到82度 7Component Interconnection) The clock period (approximately equal to 31 microseconds) that allows the CPU to be temporarily stopped by the STPCLK# signal to temporarily stop the CPU. When €1>1; temperature reaches 82 degrees 7
1316658 時，其對應之佔空比爲87.5%，即CPU休息時鐘週期佔Throttling控制週期之 百分电爲87.5%，這時ICH7晶片組會控制CPU休息1024*87.5%=896個PCI時 鐘週期(約等於27微秒），然後工作ι〇24*(ι·87·5%)=ΐ28個PCI時鐘週期(約等 mm» °At 1316658, the corresponding duty cycle is 87.5%, that is, the CPU rest clock cycle accounts for 87.5% of the Throttling control cycle. At this time, the ICH7 chipset will control the CPU to rest 1024*87.5%=896 PCI clock cycles (about Equal to 27 microseconds), then work ι〇24*(ι·87·5%)=ΐ28 PCI clock cycles (approximately mm» °
參閱第三圖所示，係本發明中央處理器被動式降温控制方法較佳實施 方式之具體實施流程圖。首先，設置模組1000引導系統進入BIOS中，設置 溫度界限值TMP1和TMP2，其中TMP1係能夠保證CPU穩定運行之溫度界限 值，™P2係防止CPU燒毀之溫度界限值（步驟si〇)。設置模組1〇00設置 介於溫度界限值TMP1及TMP2的溫度區間及每一區間對應之佔空比（步驟 S12)。發送模組1〇〇2發出週期性之smi中斷，偵測並記錄CPU之當前溫度 TMP (步驟S14)。判斷模組1〇〇4判斷當前溫度TMP是否大於溫度界限值 TMP1 (步驟S16)。若該當前溫度TMP大於溫度界限值TMP1，則判斷該當 前溫度TMP是否大於溫度界限值TMP2 (步驟S18)。若該當前溫度TMP大 於溫度界限值TMP2 ’處理模組1000將自動關斷系統電源（步驟S24)。 其中於步驟S16中，進一步包括：若當前溫度丁!^小於溫度界限值 TMP1，則返回步驟S14。 其中於步驟S18中，進一步包括：若當前溫度xjvn^、於溫度界限值 TMP2 ’則判斷模組1〇〇4確定該當前溫度TMP所在區間及該區間對應之佔空 比（步驟S20 )’將CPU之工作狀態調節成當前tmp所在區間之佔空比（步 驟S22)，然後返回步驟S14。 本發明之中央處理器被動式降溫控制系統及方法，雖以較佳實施方式 揭露如上，然其並非用以限定本發明。任何熟悉此項技藝之人士，在不脫 離本發明之精神和範圍内，當可做更動與潤飾，因此本發明之保護範圍當 視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第一圖係本發明中央處理器被動式降溫控制系統較佳實施方式之硬體 架構圖。 第二圖係本發明中央處理器被動式降溫控制系統較佳實施方式之功能 模組圖。 8 1316658 ... .. - - 第三圖係本發明中央處理器被動式降溫控制方法較佳實施方式之具體 實施涛程圖。 【主要元件符號說明】 中央處理器被動式降温控制系統 100 設置模組 1000 發送模組 1002 判斷模組 1004 處理模組 1006Referring to the third figure, there is shown a flowchart of a specific implementation of a preferred embodiment of the central processor passive cooling control method of the present invention. First, the setting module 1000 guides the system into the BIOS and sets the temperature limit values TMP1 and TMP2, wherein TMP1 is a temperature limit value for ensuring stable operation of the CPU, and TMP2 is a temperature limit value for preventing CPU burning (step si〇). The setting module 1〇00 sets a temperature range between the temperature limit values TMP1 and TMP2 and a duty ratio corresponding to each section (step S12). The transmitting module 1〇〇2 issues a periodic smi interrupt, detects and records the current temperature TMP of the CPU (step S14). The judging module 1〇〇4 judges whether or not the current temperature TMP is greater than the temperature limit value TMP1 (step S16). If the current temperature TMP is greater than the temperature limit value TMP1, it is judged whether or not the current temperature TMP is greater than the temperature limit value TMP2 (step S18). If the current temperature TMP is greater than the temperature threshold value TMP2', the processing module 1000 will automatically power down the system (step S24). In the step S16, the method further includes: if the current temperature is less than the temperature threshold value TMP1, the process returns to step S14. In the step S18, the method further includes: if the current temperature xjvn^ is at the temperature threshold value TMP2', the determining module 1〇〇4 determines the interval in which the current temperature TMP is located and the duty ratio corresponding to the interval (step S20)' The operating state of the CPU is adjusted to the duty ratio of the section in which the current tmp is located (step S22), and then returns to step S14. The central processor passive cooling control system and method of the present invention are disclosed above in the preferred embodiments, but are not intended to limit the present invention. Any person skilled in the art will be able to make changes and refinements without departing from the spirit and scope of the invention, and the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a hardware architecture diagram of a preferred embodiment of the central processor passive temperature drop control system of the present invention. The second figure is a functional module diagram of a preferred embodiment of the central processor passive cooling control system of the present invention. 8 1316658 .... - - The third figure is a concrete implementation of the preferred embodiment of the central processor passive cooling control method of the present invention. [Main component symbol description] Central processor passive cooling control system 100 Setting module 1000 Transmitting module 1002 Judging module 1004 Processing module 1006