1313632 九、發明說明： 【發明所屬之技術領域】 本發明係有關於-種焊料，更特別地係指一種實質上無 斜的焊料。 【先前技術】 許多習用的焊料會含有錯，以作為主要的構成成分。通 常該焊料具有令人滿意的物理性f，且含鱗制使用已廣 泛地遍佈在許多JL業’包括生騎刷電路板的工業。 然而’因為(例如）對環境的考量，且似乎在未來的數年 内在々夕國豕中對於使用焊接技術來製造許多物品的焊料 將會有法律的要求，該要求為焊料的錯含量必須儘量的減 低’所以會增加對於無鱗料的需求。 已使用來作為習關紛W替代物的-類合金是錫銅合 金’且由".3%錫與Q.7%銅所組合的合金，已㈣較為廣泛 在業中使用然而，該錫銅合金的性質並不如習用的錫 錯焊料那触想，且她於__料料，魏銅合金會 特別地展現較低的強度，較低耐疲勞性及較高共晶溫度。 ㈠不里勺在於，因為許多工業機械及程序的配置在 1313632 使用習用的錫錯合金時，可以有效率地運轉，則理想的岭 焊料替代_在相_機械及程料，轉機械及程序= 需做大幅的調整。然而，許多的製造公喊現必須大幅度地 調適現行的焊接程序，以相符於無轉料，且—般認為此程 序及材料的調適是資源的不佳利用，特別㈣為所製物品的 標準時f知無鱗料時所能達叙鮮，通常會遠不 如使用習用含鉛焊料時所能達成者。 【發明内容】 本發明的目的為試圖提供一種改良之無錯焊料。 因此’本翻的觀點為提供—種實質上無㈣焊料，其 匕括’力96H約99. 3%的錫、約〇. 2%至約3. 〇%的銅、及 約0.02%至約0.12%的矽。 有盈地，該焊料尚包括約0. 005%至約0. 01%的磷。 較佳地，该焊料包括約〇· 的鱗。 方便地’該焊料尚包括約0. 005%至約0. 01%的鍺。 有盈地，該焊料包括約0. 01%的鍺。 方便地’該焊料尚包括約0· 7%至約3. 0%的銅。 較佳地’該焊料包括：約0. 7%的銅，及約0. 02%的矽。 1313632 有盈地，該烊料包括約0. 7%的銅。 較佳地，該焊料包括約2.0%的銅。 方便地，该焊料包括約3. 0%的銅。1313632 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to solder, and more particularly to a solder which is substantially free of slant. [Prior Art] Many conventional solders contain errors as a main constituent. Often the solder has a satisfactory physical property f, and scaly use has been widely spread throughout many JL industries, including the industry. However, 'because, for example, environmental considerations, and it seems that in the next few years in the future, there will be a legal requirement for solders that use soldering techniques to make many articles, which requires that the wrong content of the solder must be The reduction of 'will increase the demand for non-scaly materials. The alloy that has been used as a substitute for the W-type alloy is a tin-copper alloy and alloyed by ".3% tin and Q.7% copper, which has been used more widely in the industry. However, the tin The properties of the copper alloy are not as good as the conventional tin-waste solder, and she will exhibit a lower strength, lower fatigue resistance and higher eutectic temperature in the __ material. (1) The key lies in the fact that many industrial machines and procedures are configured to operate efficiently when used in 1313632, and the ideal ridge solder replacement _ in phase _ mechanical and process materials, turning machinery and procedures = Need to make major adjustments. However, many manufacturing slogans must now significantly adapt the current welding procedures to match the non-transfer, and generally consider the adaptation of the procedures and materials to be a poor use of resources, especially (d) for the standard time of the articles manufactured. f know that when there is no scaly material, it can be as good as it is, and it is usually far less than what can be achieved when using lead-containing solder. SUMMARY OF THE INVENTION It is an object of the present invention to provide an improved error-free solder. Therefore, the view of the present invention is to provide a substantially no (four) solder, which includes a force of 96H of about 99.3% of tin, about 〇. 2% to about 3. 〇% of copper, and about 0.02% to about 0.12% 矽. 01%的磷。 The amount of phosphorus, including about 0.005% to about 0.01% phosphorus. Preferably, the solder comprises a scale of about 〇·. 01%的锗。 The solder is also included in the solder. 01%的锗。 There is a surplus, the solder includes about 0.01% of 锗. 0%的铜。 The solder is also included. The solder further comprises from about 0.7% to about 3.0% copper. 2%的矽。 The solder is preferably: about 7% of copper, and about 0.02% of 矽. 13重量的铜。 The 1313632 has a surplus, the feed includes about 0.7% copper. Preferably, the solder comprises about 2.0% copper. 0%的铜。。 The solder comprises about 3.0% copper.
本發明的另—觀點為提供—種調配實質上無轉料的方 法’其包括混合錫、鋼及_步驟，即：在該焊射之錫的 比例為約96施約在該崎之銅的比例為約02% 至約3見·在辦料中之㈣比例為約〇.㈣至約〇.12%。 方便地，該方法尚包括㈣ 马令約0· 005%至約〇. 01% 的磷包括在桿料混合物中。 有益地，該方法包括步驟為， 娜马令約0.01%的磷包括在焊料 混合物中。Another aspect of the present invention is to provide a method of compounding substantially no transfer material, which comprises a step of mixing tin, steel and _, ie: the ratio of tin in the soldering is about 96 to the copper of the Saki The ratio is about 02% to about 3 see. The ratio of (iv) in the materials is about 〇. (4) to about 〇.12%. Conveniently, the method further comprises (iv) a horse ring of from about 0. 005% to about 〇. 01% of the phosphorus is included in the rod mixture. Beneficially, the method includes the step of cyclaminating about 0.01% of the phosphorus included in the solder mixture.
較佳地，該方法尚包括步騍為， 的錯包括在焊料混合物中。 令約0.005%至約0.01% 混合物中 方便地，該方法包括步驟為， 令約0.01%的鍺包括在焊料 混合物中。 較佳地，該方法包括步驟為， 令約0. 01%的鍺包括在焊料 0.7%至約3.0%的銅 方便地，該方法包括步驟為，含有約 1313632 有益地，該方法包括步驟為，令約0. 7%的銅及約0. 02 的矽包括在焊料混合物中。 較佳地，該方法包括步驟為，含有約0. 7%的銅。 有益地，該方法包括步驟為，含有約2.0%的銅。 方便地，該方法包括步驟為，含有約3. 0%的銅。 本發明的再一觀點為提供一種焊接的方法，包括使用一 實質上無鉛焊料的步驟，其包括：約96. 8%至約99. 3%的錫； 約0. 2%至約3. 0%的銅；約0. 02%至約0.12%的矽。 較佳地，該方法包括使用一焊料，其具有約0.005%至約 0. 01%的磷。 方便地，該方法包括使用一焊料，其具有約0. 01%的磷。 有益地，該方法包括使用一焊料，其具有約0.005%至約 0. 01%的鍺。 較佳地，該方法包括使用一焊料，其具有約0. 01%的鍺。 方便地，該方法包括使用一焊料，其具有約0.7%的銅及 約0. 02的矽。 【實施方式】 關於如上所述的錫銅焊料合金，已發現有明顯地增加數 1313632 第2圖之圖表是顯示由第丨圖之對照表所選擇之量，且 特別地顯示這些量隨著矽含量之變化而改變的方弋，节矽（ 添加至-鍚/銅焊料基底之以形成實作本發明的焊料。當錫/ 銅焊料基底中的魏例為㈣.〇2%時，大部份的這些性質可為 最大。 … 籲 觀察第1圖及第2圖可得知，增加〇. 〇2%至〇· m的石夕至 該錫/銅合金，會造成該合金之抗拉強度明顯的改良，而導致 抗拉強度的值高於別之錫/銅合金，且亦高於制的錫/錯 合金。因為該抗拉強度的增加，且在該錫/銅々合金的張力 百分比並沒有明顯的下降，則可證明當與該習用的錫/錯合金 相比時，該錫/銅々合金會有極㈣延展性。所需以造成該 鲁合金之龜_能量’亦會鶴地大於造成該習闕/錯合金， 及習用之錫/銅合金之龜裂的所需能量。 0藉由&加jz $的錯或碟於其中，而加強或改良以上 所述找錫/銅/石夕合金的性質。特別地，任-該等元素若增 加約〇·嶋至G·⑽，則會造成令人期待之結果，其中包括 增加抗氧化劑效果的強度及供應。 第3圖之圖表顯示多類合金在接受老化程序後的機械性 1313632 質，該老化程序即令該等合金處於125°C的溫度下達96小時 。右使用該等合金而製造的粒子必須接受如此之高溫達如此 長的日寸間’則該測試可用以發現該合金之性質改變的方式。 含有一錫基底，G.7%銅，G. 02%碎及G. 01%鍺的合金，會如同 含有-錫基底，〇. 7%銅，Q·⑽㈣及Q. Q1%磷的合金，顯示出 鲁 車父該習用之錫/〇. ?%銅/◦.㈣夕合金更優的腿(極限抗拉強 度）。熟習該項技藝者將可察知，這些合金會因此而顯示抵抗 Ik著a’間增加之熱疲勞或潛變的較強抗力，且使用如上述含 有鍺或科之焊料而製造的產品，在經過長久時間之後仍可維 持令人滿意的物理及機械性質。 第4圖顯不多類合金在接受改變長度之老化程序後的抗 • 拉強度’該老化程序即令該合金處於i25°c的溫度下達24、 J夺相較於習用的錫/紹合金，如同相較於習用之 錫/銅合金，可觀察到實作本發明的合金在老化之後會顯示較 優的抗拉強度。 弟5圖如多類合金在接受上述之老化程序後的屈曲強 又胃相車乂於白用锡/錯及錫/銅合金，可觀察到實作本發 月的合金在老化之後會顯示較優的屈㈣度。並且，當與實 11 1313632 、/叫料(其亚*含有鍺麵)相比時，實作含有小量 _ ^^之本《明的合金，其在接受簡的老化程序後，會顯 不較佳的屈曲強度。 八弟Μ顯衫類合金趣受上叙老條賴的張力百 ^ 乂老化私序即處於125°C的溫度下達24、48及96小時。 料習用錫/錯焊料相比時，及與制錫/銅合金相比時，可 Ί亍、心作本發明的合金會顯示較優的張力百分比。 第7圖及第8圖個別顯示在接受上述之老化程序後，多 麵焊料之㈣及_所需之能量。當與習闕/料料相比時 i及與制義合金她時，可再度觀_實作本發明的合 金會需要較多之能量。特職，在靴達％小時之老化程 序後’該錫/G. 7%銅/〇. 〇2辦合金會需要Q. Q5焦耳來產生屈 1而需要㈣5焦耳以產生斷裂；反之，該習用魏合 金會需要〇崩焦耳來產生屈曲，及f要5.647焦耳來產生 斷裂。相較之下，該習用錫/銅合金會需要〇. 〇18焦耳來產生 屈曲’及需要5· 364焦耳來產生斷裂。熟習該項技藝者將可 察知’實作本發明之合金經過延長的時期後，與f用錫/錯及 越/納合金相比，將明顯地更加穩定。 12 I313632 第9關示多類合金在接受上述之老化程序後的動度， 且當與習用騰及錫/銅焊料相比時，可再度觀察到额本 發明的合金在老化之後’會顯示較優的物度。 亦可發現當合金處於高溫下時，增加石夕至錫/銅焊料合金 可改良該合金的機械性質。第1G圖顯示當接受撕、说及 啊的溫度時，該習用馳合金，及實作本發明之錫/銅合 金及錫/0. 7%銅/0.隊夕合金的機械性質。當UTS、γδ(屈曲強 度）強化百分比，產生屈曲之所需能量，產生斷裂之所需能量 及所有合金的韋刃度在高溫的影響之下皆減少時，實作本發 明之該合金在錄況下魏示較少之效關失。例如，當溫 度由饥增減125t時，該f用錫/錯合金之阳會降Z 71.2% ’但是’當該合金接受相同的溫度提升時，則實作本發 明的该合金之UTS會僅降低約53. 04%。 第11圖之祕顯衫許好字财度祕抗拉測試裝置 中時，習用錫/紹合金，習用錫/銅合金及實作本發明之錫/ 0. 7W0. 02%石夕合錢UTS、YS，強化百分比，產生屈曲之所 需能量，魅_之所需能量及㈣度。可由騎照表觀察到， 當與習用合金相比時，實作本發明之該合金會明顯的顯示更 13 1313632 加穩定的機械特性。 >考第12圖’本圖顯示實作本發明之該錫/〇·顺後〇2% 的不同掃“里熱曲線，且可觀察到增加石夕至本合金對 其中的魏溫賴乎沒有影響。實作本發日狀本合金可因此Preferably, the method further comprises the step of being included in the solder mixture. Preferably, from about 0.005% to about 0.01% of the mixture, the method includes the step of allowing about 0.01% of the ruthenium to be included in the solder mixture. Preferably, the method comprises the steps of: tempering about 0.01% of the bismuth comprising 0.7% to about 3.0% copper in the solder, the method comprising the step of containing about 1313632 beneficially, the method comprising the step of约的约。 The copper and about 0.02 矽 are included in the solder mixture. 7%的铜。。 Preferably, the method comprises a step of containing about 0.7% of copper. Beneficially, the method includes the step of containing about 2.0% copper. 0%的铜。。 The method comprises a step of containing about 3.0% copper. A further embodiment of the present invention provides a method of soldering, comprising a step of using a substantially lead-free solder, comprising: about 96. 8% to about 99. 3% of tin; about 0.2% to about 3. 0. % of copper; about 0.02% to about 0.12% of bismuth. 01%的磷。 The method comprises a solder having a thickness of from about 0.005% to about 0.01% phosphorus. 01%的磷。 Phosphorus having a thickness of about 0.01%. 01%的锗。 In a method, the method comprising a solder having a solder having a thickness of from about 0.005% to about 0.01%. 01%的锗。 Preferably, the method comprises a solder, which has a 锗 of about 0.01%.矽的矽。 The method comprises a solder having about 0.7% copper and about 0.02. [Embodiment] With respect to the tin-copper solder alloy as described above, it has been found that the number of 1313632 is significantly increased. The graph of Fig. 2 shows the amount selected by the comparison chart of the second graph, and particularly shows that these amounts are along with 矽A change in the content, a throttling (addition to the -钖/copper solder substrate to form the solder of the present invention. When the case of the tin/copper solder substrate is (4). 〇 2%, most of the These properties can be the largest. ... Appearance of the first and second figures shows that increasing the tensile strength of the alloy by increasing the 〇. 〇2% to 〇·m to the tin/copper alloy. Significant improvement, resulting in higher tensile strength than other tin/copper alloys, and higher than the tin/stagger alloy, because of the increase in tensile strength and the percentage of tension in the tin/copper alloy Without a significant drop, it can be proved that the tin/copper-bismuth alloy will have a very (four) ductility when compared with the conventional tin/stagger alloy. The turtle required to cause the Lu alloy will also The ground is larger than the energy required to cause cracking of the haw/mis alloy and the tin/copper alloy 0 Enhance or improve the properties of the above-mentioned tin/copper/stone alloy by adding <> plus the jz$ error or dish. In particular, if any of these elements are increased by about 〇·嶋 to G· (10), which will produce promising results, including increased strength and supply of antioxidant effects. The graph in Figure 3 shows the mechanical properties of the various types of alloys after the aging process, which allows the alloys to be in At a temperature of 125 ° C for 96 hours. The particles produced by using these alloys must be subjected to such high temperatures for such a long period of time. This test can be used to find the way in which the properties of the alloy change. Containing a tin substrate, G.7% copper, G. 02% broken and G. 01% bismuth alloy, will be like the alloy containing - tin substrate, 7%. 7% copper, Q · (10) (four) and Q. Q1% phosphorus, showing Lu Lu father The tin/〇.?% copper/◦. (4) better alloy legs (extreme tensile strength). Those skilled in the art will be aware that these alloys will show an increase in resistance to Ik. Strong resistance to thermal fatigue or creep, and using a solder containing bismuth or a substance as described above The manufactured product maintains satisfactory physical and mechanical properties after a long period of time. Figure 4 shows the resistance of the alloy after receiving an aging process of varying lengths. At a temperature of i25 °c, the temperature of 24, J is better than that of the conventional tin/sand alloy. As compared with the conventional tin/copper alloy, it can be observed that the alloy of the present invention exhibits superior tensile strength after aging. Strength. Brother 5, such as multi-class alloy after receiving the above-mentioned aging procedure, the flexion strength and the stomach phase rut on the white tin/wrong and tin/copper alloy, it can be observed that the alloy of the actual month will be after aging. Shows a better yield (four degrees), and when compared with the real 11 1313632, / called material (its sub* contains kneading surface), the implementation of a small amount of _ ^ ^ this "fine alloy, which accepts Jane After the aging process, there will be an inferior buckling strength. The eight-sister scorpion-type alloy is subject to the tension of the old syllabus. The aging aging order is at a temperature of 125 ° C for 24, 48 and 96 hours. When compared to tin/wrong solders, and when compared to tin/copper alloys, the alloys of the present invention can exhibit a superior percentage of tension. Figures 7 and 8 show the energy required for (4) and _ of the multi-sided solder after receiving the above-mentioned aging procedure. When compared with the cook/material, i and the alloy of the alloy, it can be seen again that the alloy of the present invention would require more energy. Specialized, after the aging process of the boots up to % hours 'the tin / G. 7% copper / 〇. 〇 2 do the alloy will need Q. Q5 joules to produce a bend 1 and need (4) 5 joules to produce a break; otherwise, the practice Wei alloys will need to collapse the coke to produce buckling, and f will have 5.647 joules to break. In contrast, the conventional tin/copper alloy would require 〇18 joules to produce buckling' and 5·364 joules to produce fracture. Those skilled in the art will recognize that the alloys of the present invention will be significantly more stable over a longer period of time than tin with tin/wrong and nano/alloys. 12 I313632 Section 9 shows the kinetics of a multi-class alloy after receiving the above-mentioned aging procedure, and when compared with conventional tin and tin/copper solder, it can be observed again that the alloy of the present invention will show a better after aging. Excellent quality. It can also be found that when the alloy is at a high temperature, increasing the stone-to-tin/copper solder alloy improves the mechanical properties of the alloy. Fig. 1G shows the mechanical properties of the conventional alloy, and the tin/copper alloy and tin/0.77 copper/0. team alloy of the present invention when subjected to tearing, said, and the temperature. When UTS, γδ (buckling strength) is strengthened, the required energy for buckling is generated, the energy required to generate the fracture, and the edge of all alloys are reduced under the influence of high temperature, the alloy of the present invention is recorded. In the case of Wei, there is less effect. For example, when the temperature is reduced by hunger by 125t, the f of the tin/mis alloy will drop Z 71.2% 'but 'when the alloy receives the same temperature rise, then the UTS of the alloy of the invention will only Reduced by about 53.4%. In the 11th picture, the secret display shirt is good in the financial value of the secret tensile test device, the conventional tin / Shao alloy, the conventional tin / copper alloy and the implementation of the tin of the invention / 0. 7W0. 02% Shi Xihe Qian UTS , YS, the percentage of reinforcement, the energy required for buckling, the energy required for the charm, and (four) degrees. It can be observed from the riding table that the alloy of the present invention will exhibit significantly more stable mechanical properties when compared to conventional alloys. >Test 12 Figure 'This figure shows the different scans of the tin/〇·顺后〇2% of the present invention, and it can be observed that the addition of Shi Xi to the alloy to Wei Wen Lai No effect. The implementation of this hair-shaped alloy can therefore
而維持該99. 3%鍚/〇,合金的令人滿意之可濕性質，例如 其中的濕潤時間及濕潤力。 第13圖及第14圖顯不多類合金在某溫度的濕潤時間及 賴力’且可觀察到實作本發明之該合金，其相較於習用的 錫/銅合金’會顯示非常她的濕潤特性。 可預見對任何實作本文崎示之本發明的任何焊料而言 ’銅包括由約〇. 2%至約3· _銅。較佳地，該焊料會包括由 約0. 7%至約3. 〇%的銅。 在本發明之實施例巾，如本文巾所述且根據本發明之焊 料，包括由約〇. 5%至〇. 9%，更佳地為〇. 7%的銅；L 8%至2. 2%， 更佳地為2.議銅；2.酿3.2%，更佳地為3_ _銅。石夕的 比例可為約〇. 02%至0. 03%。 熟習該項技藝者應了解’相較於制之無錯焊料，本發 明可提供具有_改1性»之實質上純合金。仙可預見 14 1313632 貫作本發明之合金的使用，可作為取代習用含鉛焊料的直接 混入物，特別是用於波焊接儀器之時。 在後附申請專利範圍中，本發明的實質上無鉛焊料基本 上是由上述元件組成。換言之，除了不玎避免的雜質外，可 包括這些元件。然而，並非一定如此。 虽「包括」及其變化詞等專用詞語用在本說明文及申請 專利feu時’即代表所包括的特定特徵，步驟或事物。該等 專用詞語不應視為排除其他特徵，步驟或元件等的出現。While maintaining the 99.3% 钖/〇, the alloy has satisfactory wettability properties such as wetting time and wetting force therein. Figures 13 and 14 show the wetting time and the dependence of the alloy at a certain temperature, and it can be observed that the alloy of the present invention can be displayed very much compared to the conventional tin/copper alloy. Wetting characteristics. It is foreseeable that for any solder of the invention embodied herein, 'copper includes from about 2% to about 3% copper. 〇%的铜。。。。 The solder may comprise from about 0.7% to about 3. 〇% of copper. In the embodiment of the present invention, as described herein and in accordance with the present invention, the solder comprises from about 5% to about 9%, more preferably 7%. 7% of copper; and from 8% to 2. 2%, more preferably 2. copper; 2. brewed 3.2%, more preferably 3__ copper. 02%至0. 03%。 The proportion of the stone eve may be about 〇. 02% to 0. 03%. Those skilled in the art will appreciate that the present invention provides a substantially pure alloy having a singularity as compared to a solder-free solder. Fair can be foreseen 14 1313632 The use of the alloy of the present invention can be used as a direct incorporation for the replacement of conventional lead-containing solders, especially when used in wave soldering equipment. In the scope of the appended claims, the substantially lead-free solder of the present invention consists essentially of the above elements. In other words, these elements may be included in addition to impurities that are not avoided. However, this is not necessarily the case. Although specific terms such as "including" and its variations are used in this specification and in the application of the patent feu, it represents a particular feature, step or thing. These terms should not be taken as excluding the appearance of other features, steps or components.
在上文敘述中或以下之申請專利範_，或後附圖示中 ’使用其特定形式或制於執行職露之魏缸具而論， 或用以铜所揭露結果的方法或程序，所揭露的多項特徵， 可適當地分離_或以該等特_任何組合利 J^依本 务明的不同形式，來實現本發明。 【圖式簡單說明】 隨後附 為了更容易地了解本發明，在此將藉由範例且伴 圖式，來插述實施例，其中： 第固為夕類合金之機械性質的對照表，· 第2圖.為多類合金之機械性質的圖表； 15 1313632 第3圖.顯不多類合金在接受老化程序後的機械性質； 第4圖：顯示多類合金在接受改變長度之老化程序後的抗拉強 度； 弟5圖：顯示多類合金在接受改變長度之老化程序後的屈曲強 度； ♦ W圖··顯示多類合金在接受改變長度之老化程序後的張力 值； 第7圖，示多類合金在接受改變長度之老化程序後，欲引起 屈曲所需之能量； 第8圖：顯示多類合金在接受改變長度之老化程序後，欲斷裂 所需之能量； 第9圖：顯示多類合金在接受改變長度之老化程序後的章刀度； 第10圖及第11圖：對照表顯示多類合金之機械性質. 第12圖：為一實作本發明之合金的不同掃描量熱曲線； 第13圖.顯示多類合金在許多溫度下的濕潤時間；及 第14圖.顯示多類合金在許多溫度下的濕潤力。 【主要元件符號說明】 16In the above-mentioned or below patent application, or in the following figures, a method or a procedure for using the specific form or for the execution of the employee's disclosure, or the method or procedure for revealing the result by copper, The various features disclosed may be separated as appropriate or in various forms in accordance with the present invention. BRIEF DESCRIPTION OF THE DRAWINGS In order to more easily understand the present invention, embodiments will be described herein by way of example and accompanying drawings, in which: a comparison table of the mechanical properties of the first solid alloy, 2 Fig. is a graph of the mechanical properties of a multi-class alloy; 15 1313632 Figure 3. Mechanical properties of a multi-class alloy after undergoing an aging procedure; Figure 4: shows a multi-class alloy after undergoing an aging procedure with varying lengths Tensile strength; Figure 5: shows the buckling strength of a multi-class alloy after undergoing an aging procedure with varying lengths; ♦ W Figure·· shows the tension values of a multi-class alloy after receiving an aging procedure with varying lengths; Multi-class alloys are required to cause the energy required for buckling after undergoing an aging procedure of varying lengths; Figure 8: shows the energy required to break a multi-class alloy after undergoing an aging procedure of varying lengths; Figure 9: Show more The degree of knives of alloys after undergoing an aging procedure with varying lengths; Figures 10 and 11: The comparison table shows the mechanical properties of a multi-class alloy. Figure 12: Different scanning calorimetry for an alloy of the invention song ;. FIG. 13 show a multi-alloy wetting time in many temperature; and FIG. 14 show a multi-alloy wetting force at many temperatures. [Main component symbol description] 16