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TWI305552B - - Google Patents

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Publication number
TWI305552B
TWI305552B TW95127176A TW95127176A TWI305552B TW I305552 B TWI305552 B TW I305552B TW 95127176 A TW95127176 A TW 95127176A TW 95127176 A TW95127176 A TW 95127176A TW I305552 B TWI305552 B TW I305552B
Authority
TW
Taiwan
Prior art keywords
layer
microperforated
opening
substrate
metal structure
Prior art date
Application number
TW95127176A
Other languages
English (en)
Chinese (zh)
Other versions
TW200806813A (en
Inventor
Chun-You Lin
Original Assignee
Micro Base Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Base Technology Corp filed Critical Micro Base Technology Corp
Priority to TW95127176A priority Critical patent/TW200806813A/zh
Publication of TW200806813A publication Critical patent/TW200806813A/zh
Application granted granted Critical
Publication of TWI305552B publication Critical patent/TWI305552B/zh

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  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW95127176A 2006-07-25 2006-07-25 Method of producing a micro-perforated electroformed metal structure with a lift-off process and the structure thereof TW200806813A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95127176A TW200806813A (en) 2006-07-25 2006-07-25 Method of producing a micro-perforated electroformed metal structure with a lift-off process and the structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95127176A TW200806813A (en) 2006-07-25 2006-07-25 Method of producing a micro-perforated electroformed metal structure with a lift-off process and the structure thereof

Publications (2)

Publication Number Publication Date
TW200806813A TW200806813A (en) 2008-02-01
TWI305552B true TWI305552B (ja) 2009-01-21

Family

ID=44766437

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95127176A TW200806813A (en) 2006-07-25 2006-07-25 Method of producing a micro-perforated electroformed metal structure with a lift-off process and the structure thereof

Country Status (1)

Country Link
TW (1) TW200806813A (ja)

Also Published As

Publication number Publication date
TW200806813A (en) 2008-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees