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TWI300802B - Thermal interface material and semiconductor device - Google Patents

Thermal interface material and semiconductor device Download PDF

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Publication number
TWI300802B
TWI300802B TW94146348A TW94146348A TWI300802B TW I300802 B TWI300802 B TW I300802B TW 94146348 A TW94146348 A TW 94146348A TW 94146348 A TW94146348 A TW 94146348A TW I300802 B TWI300802 B TW I300802B
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TW
Taiwan
Prior art keywords
interface material
thermal interface
sheet
vulcanized
cloth
Prior art date
Application number
TW94146348A
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Chinese (zh)
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TW200724664A (en
Inventor
Ching Tai Cheng
Nien Tien Cheng
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Foxconn Tech Co Ltd
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Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94146348A priority Critical patent/TWI300802B/en
Priority to US11/309,250 priority patent/US20070148425A1/en
Publication of TW200724664A publication Critical patent/TW200724664A/en
Application granted granted Critical
Publication of TWI300802B publication Critical patent/TWI300802B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/02—Layered products comprising a layer of natural or synthetic rubber with fibres or particles being present as additives in the layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/10—Layered products comprising a layer of natural or synthetic rubber next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/103—Metal fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

1300802 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種熱介面材料及使用該熱介面材料的電子裝置。 【先前技術】 隨著電子產業的快速發展，電子元件的高速、高頻以及集成化， 使其發熱量劇增，因此需在電子元件上設置一散熱裝置，將電子元件 所產生的熱量導走，由於散熱裝置與電子元件在貼合時因其接觸面非 完全平整而無法有效接觸，導致散熱效果不良，直接影響電子元件的 正常工作。 .業者通常在散熱裝置與電子元件的接觸面上加設熱介面材料以填 補其接觸面間的空隙，增強了導熱效果，但是由於熱介面材料在生產 與使用過程中通常需裁切成若干小塊或是受到擠壓，因此易破裂或損 壞’以致造成不良效果，故需加以改進。 【發明内容】 有鑑於此，有必要提供一種具較佳抗破損性能之熱介面材料及使 用該熱介面材料的電子裝置。 該電子裝置包括一發熱元件、一用於對該發熱元件散熱的散熱元 件以及貼設在該發熱元件與餘元件之間的齡爾料，該熱介面材 料包括硫化薄片以及埋設在該硫化薄片中間的加強膜。 1 該熱介面材料呈片狀，其厚度為Μ〜5_m，該硫化薄片包括室溫 硫化石夕橡膠以及分散在該室溫硫化石夕橡膠内的氧化辞粉末，該氧化辞 粉末的平均絲為〇·1〜5μπι，該加賊伽網或銅布、不細網或不 鋼布以及碳纖維網或碳纖維布中至少一種。 由於製造該加強膜的材料具有較強的物理力學性能，可抗擠壓、 抗裂，具有很強的柔勃性，故提高了熱介面材料的物理強度，使該敛 介面材料在裁切成若干小塊或是受到擠壓時不易破裂或損壞。…、 【實施方式】 ' 下面結合實施例對本發明作詳細說明。 請參照第-圖，本發明熱介面材料13與散熱元件12以及人 裝置14組紐歸置1G⑽賴元件u進行散熱。該散熱元件& 6 1300802 具有一基板121，該熱介面材料13貼設在發熱元件η與基板121之間， 該扣合裝置W將賴树π f 扣合在賴元件u之上，使該熱 ;1、面材料13充分填充於發熱元件u與散熱元件12之基板間的空 隙内，降低該發熱元件11與散熱元件12之間的接觸熱阻，使該散執裝 置1〇達到良好的散熱效果。 、 , interface material)13 呈片狀，其厚度為25〜500μιη，該熱介面材料13包括硫化薄片（cured 如雄31以及埋設在該硫化糾131中間的加強膜㈣偷似 member) -L J w ^ 該硫化薄片131包括室溫硫化矽橡膠㈣m tempe論此 e astomer)以及分散在該室溫硫化石夕橡膠内的氧化辞粉末⑽c 〇涵 該室溫，化轉膠係指無需加熱、在室溫下就能硫化的石夕橡 二i^〇〇<：溫度範圍内能長期使用，具有優良的電氣絕緣性 =對:種金屬與非金屬材料有良好_合性，有助於發熱播11與 12的絕緣與枯合。該氧化辞粉末的平均徑粒為0·1〜5μιη，其 I:入面材料13之導熱性能，氧化辞係良好的電介質，可提 綑七ί132係銅網或銅布(W_哪㈣fabric °r cl°th)、不銹鋼 厂布(w〇ven stainless fabric 〇r c馳)以及碳纖維網或碳纖維布 她加沉峡中至少一種。由於製造該加強膜132 呈或銅布、不銹鋼網或不錄鋼布以及碳纖維網或碳纖維布 i古^人理力學性能，可抗擠壓、抗裂，具有很強的柔勃性，故 13之物理強度，使該熱介面材料13在生產或使用 膜net塊或是受到擠壓時不易破裂或損壞，另，該加強 為反纖維網或碳纖維布時還可提高熱介面材料13的絕緣性。 【圖式簡單說明】 第圖係本發明熱介面材料與相關組件組合之側視圖。 第二圖係本發明熱介面材料之立體圖。 【主要元件符號說明】 散熱裝置 10 發熱元件 11 7 1300802 散熱元件 12 基板 121 熱介面材料 13 硫化薄片 131 加強膜 132 扣合裝置 14 81300802 IX. Description of the Invention: [Technical Field] The present invention relates to a thermal interface material and an electronic device using the same. [Prior Art] With the rapid development of the electronics industry, the high-speed, high-frequency and integration of electronic components has caused a sudden increase in heat generation. Therefore, it is necessary to provide a heat sink on the electronic components to guide the heat generated by the electronic components. Since the heat dissipating device and the electronic component are not completely flat due to the non-completely flat contact surface of the electronic component, the heat dissipation effect is poor, which directly affects the normal operation of the electronic component. The manufacturer usually adds a thermal interface material on the contact surface of the heat sink and the electronic component to fill the gap between the contact faces, thereby enhancing the heat conduction effect, but the heat interface material usually needs to be cut into several small pieces during production and use. The block is either squeezed and therefore easily broken or damaged', resulting in undesirable effects, so it needs to be improved. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a thermal interface material having better damage resistance and an electronic device using the same. The electronic device includes a heat generating component, a heat dissipating component for dissipating heat to the heat generating component, and an ageing material disposed between the heat generating component and the remaining component, the thermal interface material including a vulcanized foil and embedded in the vulcanized foil Strengthening membrane. 1 The thermal interface material is in the form of a sheet having a thickness of Μ~5_m, and the vulcanized sheet comprises a room temperature sulphide rubber and an oxidized powder dispersed in the room temperature sulphide rubber, and the average filament of the oxidized powder is 〇·1~5μπι, at least one of a thief gamma or copper cloth, a fine mesh or a non-woven cloth, and a carbon fiber mesh or a carbon fiber cloth. Since the material for manufacturing the reinforced membrane has strong physical and mechanical properties, is resistant to extrusion and cracking, and has strong flexibility, so that the physical strength of the thermal interface material is improved, and the splicing interface material is cut into Some small pieces are not easily broken or damaged when squeezed. [Embodiment] The present invention will be described in detail below with reference to the embodiments. Referring to Fig. 1, the thermal interface material 13 of the present invention is cooled by the heat dissipating component 12 and the human device 14 group 1G (10). The heat dissipating component & 6 1300802 has a substrate 121, the thermal interface material 13 is disposed between the heat generating component η and the substrate 121, and the fastening device W fastens the lyopium π f over the ray element u. 1. The surface material 13 is sufficiently filled in the gap between the heating element u and the substrate of the heat dissipating component 12 to reduce the contact thermal resistance between the heating element 11 and the heat dissipating component 12, so that the dissipating device 1 〇 is good. heat radiation. , interface material) 13 is in the form of a sheet having a thickness of 25 to 500 μm, and the thermal interface material 13 comprises a vulcanized sheet (cured as a male 31 and a reinforcing film (four) embedded in the middle of the vulcanization correction 131). -LJ w ^ The vulcanized sheet 131 comprises a room temperature vulcanized rubber (IV) m tempe on the eastomer) and an oxidized powder (10) c dispersed in the room temperature vulcanized rubber. The room temperature is changed without heating, at room temperature. It can be vulcanized and can be used for a long time in the temperature range. It has excellent electrical insulation. = Pairs: Metals and non-metal materials have good _ symmetry, which helps to broadcast 11 and 12 insulation and dry. The average diameter of the oxidized powder is 0·1~5μιη, and the I: the thermal conductivity of the surface material 13 and the good dielectric of the oxidized system can be bundled with a copper or copper cloth (W_Which (four) fabric ° r cl°th), stainless steel fabric (w〇ven stainless fabric 〇rc) and carbon fiber mesh or carbon fiber cloth at least one of the addition of Shenxia. Since the reinforcing film 132 is made of copper cloth, stainless steel mesh or non-recorded steel cloth, carbon fiber mesh or carbon fiber cloth, it can resist extrusion and cracking, and has strong flexibility, so 13 The physical strength of the thermal interface material 13 is not easily broken or damaged when the film net block is produced or used, and the insulation of the thermal interface material 13 can be improved when the reinforcement is a reverse fiber web or a carbon fiber cloth. . BRIEF DESCRIPTION OF THE DRAWINGS The drawings are a side view of a combination of a thermal interface material of the present invention and related components. The second figure is a perspective view of the thermal interface material of the present invention. [Main component symbol description] Heat sink 10 Heat-generating component 11 7 1300802 Heat-dissipating component 12 Substrate 121 Thermal interface material 13 Vulcanized sheet 131 Reinforced film 132 Fastening device 14 8

Claims (1)

Ι3Ό0802 申請專利範圍： β β & 1. 了種熱介面材料’該熱介面材料包括硫化薄片以及埋設在該疏化 薄片中間的加強膜，該硫化薄片包括室溫硫化石夕橡膠以及分 該硫化石夕橡膠内的氧化辞粉末，該加強膜係銅網或銅布、不細 網或不銹鋼布以及碳纖維或碳纖維布中至少一種。 2. 如申請專利範圍第i項所述之熱介面材料，其中 片狀，其厚度為25〜500μιη。 3·Ι3Ό0802 Patent Application Range: β β & 1. A thermal interface material 'The thermal interface material comprises a vulcanized sheet and a reinforcing film embedded in the middle of the thinned sheet, the vulcanized sheet comprising room temperature sulfide stone rubber and the vulcanization An oxidized powder in the scouring rubber, the reinforced film being at least one of a copper mesh or a copper cloth, a fine mesh or a stainless steel cloth, and a carbon fiber or a carbon fiber cloth. 2. The thermal interface material according to claim i, wherein the sheet has a thickness of 25 to 500 μm. 3· 4· -種電子裝置，包括-發熱耕、—聽對該發熱元件散熱的散 熱兀件以及貼設在該發熱元件與散熱元件之_齡面材料，其 中該熱介面材料包括硫化薄片以及埋設在該硫化薄片中間的力: 強膜三該硫化薄片包括室溫硫化石夕轉以及綠在該硫化石夕橡膠 内的氧化鋅粉末，該加強麟銅網或銅布、不銹鋼喊不鎮鋼 以及碳纖維或碳纖維布中至少一種。 5·如申請專利範圍第4項所述之電子裝置，其中該熱介面材料呈片 狀，其厚度為25〜500μηι。 6.如申請專利範圍帛4項所述之電子裝置，其中該氧化辞粉末的平 均控粒為0.1〜5μπι。 9 •1300802 十一、圖式：4·- an electronic device comprising: a heating cultivating device, a heat dissipating component for dissipating heat to the heating element, and an ageing surface material attached to the heating element and the heat dissipating component, wherein the thermal interface material comprises a vulcanized sheet and is embedded in The force in the middle of the vulcanized sheet: strong film 3, the vulcanized flake includes a room temperature sulfide stone and a zinc oxide powder in the vulcanized stone, the reinforcing copper or copper cloth, stainless steel shouting steel and carbon fiber Or at least one of carbon fiber cloth. 5. The electronic device of claim 4, wherein the thermal interface material is in the form of a sheet having a thickness of 25 to 500 μm. 6. The electronic device of claim 4, wherein the oxidized powder has an average particle size of 0.1 to 5 μm. 9 • 1300802 XI, Schema: 1010
TW94146348A 2005-12-23 2005-12-23 Thermal interface material and semiconductor device TWI300802B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW94146348A TWI300802B (en) 2005-12-23 2005-12-23 Thermal interface material and semiconductor device
US11/309,250 US20070148425A1 (en) 2005-12-23 2006-07-20 Thermal interface material and semiconductor device incorporating the same

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TWI300802B true TWI300802B (en) 2008-09-11

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