TWI398931B - Drive unit and solid crystal machine - Google Patents
Drive unit and solid crystal machine Download PDFInfo
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- TWI398931B TWI398931B TW098122681A TW98122681A TWI398931B TW I398931 B TWI398931 B TW I398931B TW 098122681 A TW098122681 A TW 098122681A TW 98122681 A TW98122681 A TW 98122681A TW I398931 B TWI398931 B TW I398931B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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Abstract
Description
本發明是有關於一種驅動裝置及固晶機,可達到於快速取放、精密定位之驅動裝置。The invention relates to a driving device and a solid crystal machine, which can be driven by a quick pick-and-place and precise positioning drive device.
目前,隨著發光二極體(Light Emitting Diode)之技術發展,使得LED廣泛應用於照明、訊號顯示等日常生活領域上。其中LED能夠大量生產,固晶技術的好壞影響著LED成品的品質,如此一來,固晶技術便成為LED品質關鍵技術其中之一。為了加速LED之固晶速度並增加LED之固晶良率,因此發展具有可快速且準確定位之特點的固晶機為目前產界之課題。At present, with the development of the technology of the Light Emitting Diode, the LED is widely used in daily life such as illumination and signal display. Among them, LED can be mass-produced, and the quality of solid-crystal technology affects the quality of LED products. As a result, solid-crystal technology has become one of the key technologies for LED quality. In order to accelerate the solid crystal growth rate of LEDs and increase the solid crystal yield of LEDs, the development of solid crystal machines with fast and accurate positioning is currently the subject of the production industry.
以習知之固晶機而言,單軸方向之位移通常以單一驅動裝置如線性馬達、馬達與滾珠導螺桿或是馬達與撓性傳動件來驅動固晶臂移動。In the case of conventional die bonding machines, the displacement in the uniaxial direction is typically driven by a single drive such as a linear motor, a motor and ball lead screw, or a motor and a flexible drive member to drive the fixed arm movement.
趨動裝置採用線性馬達之特點,在於可配合光學尺達到快速、精確控制目標物之移動位置,因此對於需要精確定位之固晶機,線性馬達為符合固晶機之需求。但受到線性馬達本身特性之限制,負載重量比滾珠導螺桿低,在有荷重的情況下無法達到較高的直線運動之需求,因此限制了固晶時之位移速度而無法進一步達到更高的生產效率。The linear device is characterized by the linear motor, which can be used to quickly and accurately control the moving position of the target with the optical scale. Therefore, for the solid crystal machine that needs precise positioning, the linear motor meets the requirements of the solid crystal machine. However, due to the characteristics of the linear motor itself, the load weight is lower than that of the ball lead screw, and the high linear motion cannot be achieved under the load. Therefore, the displacement speed at the time of the solid crystal is limited, and the higher production cannot be further achieved. effectiveness.
再者,驅動裝置採用馬達與導螺桿之特點在於負載重量大、精度高,但在位移速度上較線性馬達為慢,因此其生產效率跟驅動裝置採用線性馬達之固晶機相比更不理想。Furthermore, the motor and the lead screw of the driving device are characterized by large load weight and high precision, but the displacement speed is slower than that of the linear motor, so the production efficiency is less than that of the solid crystal machine with a linear motor. .
另外,驅動裝置採用馬達與撓性傳動件之特點在於,其位移速度比採用線性馬達以及馬達與滾珠導螺桿之固晶機為快,但精度與上述兩者相比是最差的。In addition, the driving device adopts a motor and a flexible transmission member, and its displacement speed is faster than that of a linear motor and a solid crystal machine of a motor and a ball lead screw, but the accuracy is the worst compared with the above two.
有鑑於上述習知技藝之問題,本發明之目的就是在提供一種驅動裝置及固晶機,用來快速及準確的物件移動。In view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a driving device and a die bonding machine for fast and accurate object movement.
根據本發明之目的,提出一種驅動裝置,包含一驅動裝置本體、一第一驅動模組、一第二驅動模組以及一驅動負載板。驅動負載板係設置於驅動裝置本體之一側,而第一驅動模組與第二驅動模組係裝設於驅動裝置本體上,且第一驅動模組與第二驅動模組分別帶動驅動負載板以產生第一位移與第二位移。其中,第一位移之位移速度大於第二位移,用來做為長距離位置的移動,且第二位移之位移精度大於第一位移,用來做第一位移到定位後,短距離的微補正,以得到良好的精度。According to the purpose of the present invention, a driving device is provided, including a driving device body, a first driving module, a second driving module and a driving load board. The driving load board is disposed on one side of the driving device body, and the first driving module and the second driving module are mounted on the driving device body, and the first driving module and the second driving module respectively drive the driving load The plate produces a first displacement and a second displacement. Wherein, the displacement speed of the first displacement is greater than the second displacement, and is used as the movement of the long distance position, and the displacement precision of the second displacement is greater than the first displacement, and is used for making the first displacement to the positioning, and the micro-correction of the short distance To get good precision.
其中,第一驅動模組包括一驅動單元及一撓性傳動件,撓性傳動件可藉由驅動單元產生一第一位移。The first driving module includes a driving unit and a flexible transmission member, and the flexible transmission member can generate a first displacement by the driving unit.
其中,驅動單元係為一馬達。The drive unit is a motor.
其中,第一驅動模組更包括至少兩轉軸,且輸送帶貼附於兩轉軸之其中一者,且兩轉軸之其中一者樞接於驅動單元,當驅動單元驅動轉軸轉動時,轉軸係帶動輸送帶產生第一位移。The first driving module further includes at least two rotating shafts, and the conveyor belt is attached to one of the two rotating shafts, and one of the two rotating shafts is pivotally connected to the driving unit, and when the driving unit drives the rotating shaft to rotate, the rotating shaft is driven The conveyor belt produces a first displacement.
其中,第二驅動模組為一線性馬達,包括一定子單元及一動子單元,動子單元係設置於定子單元之內側。The second driving module is a linear motor, including a certain sub-unit and a moving sub-unit, and the moving sub-unit is disposed inside the stator unit.
其中,動子單元與驅動負載板連結,在定子單元係驅動動子單元移動時,使動子單元帶動驅動負載板產生第二位移。Wherein, the mover unit is coupled to the driving load plate, and when the stator unit drives the mover unit to move, the mover unit drives the load plate to generate a second displacement.
其中,定子單元係為一永久磁鐵,且動子單元係為一線圈。Wherein, the stator unit is a permanent magnet, and the mover unit is a coil.
其中,驅動負載板具有一連接部,連接部係與撓性傳動件連接,且驅動單元驅動撓性傳動件移動時,撓性傳動件係帶動驅動負載板產生第一位移。Wherein, the driving load plate has a connecting portion, and the connecting portion is connected with the flexible transmission member, and when the driving unit drives the flexible transmission member to move, the flexible transmission member drives the load plate to generate the first displacement.
其中,第一位移平行於第二位移。Wherein the first displacement is parallel to the second displacement.
根據本發明之再一目的,提出一種固晶機,其包括一平台、一驅動裝置、一固晶臂以及一量測單元。驅動裝置係設置於平台上,其包括一驅動裝置本體、一驅動負載板、一第一驅動模組以及一第二驅動模組。驅動負載板係設置於驅動裝置本體之一側,而第一驅動模組與第二驅動模組係裝設於驅動裝置本體上,且第一驅動模組與第二驅動模組分別帶動驅動負載板以產生第一位移與第二位移。固晶臂設置於驅動負載板上。量測單元係設置於驅動裝置本體之一側,且量測單元係量測驅動負載板之位移。其中,第一位移之位移量大於第二位移,且第二位移之位移精度大於第一位移。According to still another object of the present invention, a die bonding machine is provided, which includes a platform, a driving device, a fixed crystal arm, and a measuring unit. The driving device is disposed on the platform, and includes a driving device body, a driving load board, a first driving module and a second driving module. The driving load board is disposed on one side of the driving device body, and the first driving module and the second driving module are mounted on the driving device body, and the first driving module and the second driving module respectively drive the driving load The plate produces a first displacement and a second displacement. The solid crystal arm is disposed on the driving load board. The measuring unit is disposed on one side of the driving device body, and the measuring unit measures the displacement of the driving load board. The displacement of the first displacement is greater than the second displacement, and the displacement accuracy of the second displacement is greater than the first displacement.
其中,該量測單元為一光學尺。Wherein, the measuring unit is an optical scale.
承上所述,依本發明之可切換不同速度之固晶機,其可具有一或多個下述優點:In view of the above, the die bonder capable of switching different speeds according to the present invention may have one or more of the following advantages:
(1)此固晶機可藉由不同驅動模組以切換不同工作速度,藉此可加速驅動裝置並提升固晶機之效率,且不會降低固晶機定位之精度。(1) The solid crystal machine can switch different working speeds by different driving modules, thereby accelerating the driving device and improving the efficiency of the solid crystal machine without reducing the precision of the positioning of the solid crystal machine.
(2)此固晶機具有不同驅動模組,因此其中一驅動模組故障時,另一驅動模組亦可繼續作業,可增進固晶作業之可靠度。(2) The solid crystal machine has different drive modules. Therefore, when one of the drive modules fails, the other drive module can continue to work, which can improve the reliability of the die bonding operation.
請參閱第1圖,其係為本發明驅動模組實施例之示意圖。在本實施例中,驅動裝置100包含一驅動裝置本體110、一第一驅動模組120、一第二驅動模組130以及一驅動負載板140。第一驅動模組120與第二驅動模組130係裝設於驅動裝置本體上,而驅動負載板140係設置於驅動裝置本體110之一側。Please refer to FIG. 1 , which is a schematic diagram of an embodiment of a driving module of the present invention. In this embodiment, the driving device 100 includes a driving device body 110, a first driving module 120, a second driving module 130, and a driving load board 140. The first driving module 120 and the second driving module 130 are mounted on the driving device body, and the driving load board 140 is disposed on one side of the driving device body 110.
第一驅動模組120包括一驅動單元122、一撓性傳動件124與兩轉軸126,且驅動單元122可為一馬達。另外,驅動負載板140具有一連接部142連接於撓性傳動件124上。驅動單元122樞接於轉軸126之其中一者上,因此驅動單元122可驅動轉軸126轉動,以藉由轉軸126帶動貼附於轉軸126之撓性傳動件124,因而帶動驅動負載板140產生一第一位移。The first driving module 120 includes a driving unit 122, a flexible transmission member 124 and two rotating shafts 126, and the driving unit 122 can be a motor. In addition, the driving load board 140 has a connecting portion 142 connected to the flexible transmission member 124. The driving unit 122 is pivotally connected to one of the rotating shafts 126. Therefore, the driving unit 122 can drive the rotating shaft 126 to rotate to drive the flexible transmission member 124 attached to the rotating shaft 126 by the rotating shaft 126, thereby driving the driving load plate 140 to generate a First displacement.
第二驅動模組130可為一線性馬達,其包含定子單元132與動子單元134。在本實施例中,定子單元132為一永久磁鐵,而動子單元134為一線圈,且驅動負載板140連結於動子單元134。當通電至動子單元134時,使其改變極性,因此動子單元134與定子單元132之間產生電磁作用力,以帶動動子單元134移動,而將連結於動子單元134之驅動負載板140產生一第二位移。The second driving module 130 can be a linear motor including a stator unit 132 and a mover unit 134. In the present embodiment, the stator unit 132 is a permanent magnet, and the mover unit 134 is a coil, and the drive load board 140 is coupled to the mover unit 134. When it is energized to the mover unit 134, it is changed in polarity, so that an electromagnetic force is generated between the mover unit 134 and the stator unit 132 to drive the mover unit 134 to move, and the drive load plate to be coupled to the mover unit 134 140 produces a second displacement.
值得注意的是,定子單元132為一線圈,動子單元134為一永久磁鐵,因此定子單元132可藉由改變線圈之極性將動子單元134帶動。由於線性馬達130中,定子單元132與動子單元134為磁性傳動,而使得線性馬達130負載重量較低。另外,傳統馬達搭配撓性傳動件時,因撓性傳動件在移動時因皮帶剛性差,而導致撓性傳動件之定位不精準。因此本發明中,可藉由傳統馬達為第一驅動模組120,而取其速度快之優點,來做快速位置定位;利用線性馬達為第二驅動模組130,而取其精度高之優點,來做精度控制。藉此,將傳統馬達與線性馬達互相搭配而提昇固晶機之效率。It should be noted that the stator unit 132 is a coil, and the mover unit 134 is a permanent magnet. Therefore, the stator unit 132 can drive the mover unit 134 by changing the polarity of the coil. Since the linear unit 130, the stator unit 132 and the mover unit 134 are magnetically driven, the linear motor 130 is made to have a lower load. In addition, when the conventional motor is matched with the flexible transmission member, the positioning of the flexible transmission member is not accurate due to the poor rigidity of the belt when the flexible transmission member moves. Therefore, in the present invention, the conventional motor can be used as the first driving module 120, and the speed is fast, so as to achieve rapid position positioning; and the linear motor is used as the second driving module 130, and the precision is high. , to do precision control. Thereby, the traditional motor and the linear motor are matched to each other to improve the efficiency of the die bonding machine.
請參閱第2圖,其係為本發明固晶機實施例之示意圖。由第1圖及第2圖中可知,固晶機1包含一驅動裝置100、一平台200、一固晶臂300與一量測單元400。驅動裝置100可設置於平台200上,且固晶臂300設置於驅動裝置100之驅動負載板140上,因此固晶臂300可隨著驅動負載板140移動。量測單元400設置於驅動裝置本體110上,可用以量測驅動負載板140之位移。Please refer to FIG. 2, which is a schematic view of an embodiment of the die bonding machine of the present invention. As can be seen from FIGS. 1 and 2, the die bonding machine 1 includes a driving device 100, a platform 200, a fixed crystal arm 300, and a measuring unit 400. The driving device 100 can be disposed on the platform 200, and the fixed crystal arm 300 is disposed on the driving load board 140 of the driving device 100, so the crystal holding arm 300 can move along with the driving load board 140. The measuring unit 400 is disposed on the driving device body 110 and can be used to measure the displacement of the driving load board 140.
驅動負載板140移動時,會同時帶動固晶臂300。當驅動裝置100啟動時,首先第一驅動模組120之驅動單元122帶動撓性傳動件124,進而帶動連接於撓性傳動件124之驅動負載板140與固晶臂300以產生第一位移。固晶臂300行進第一位移後,第一驅動模組120停止帶動固晶臂300。停止後,可根據預設程式控制,於數微秒至數十微秒之內,由第二驅動模組130接著開始帶動連接於動子單元134之驅動負載板140,而將驅動負載板140與固晶臂300作動以產生第二位移,直至固晶臂300移動至設定之位置為止。此第二位移須與第一位移位移互相平行,因此不會發生兩位移之行進路線互相干涉之狀況,並可正確定位固晶臂300之位置。且第一位移之位移速度大於第二位移,因此固晶臂300可在第一位移時迅速移動,並在第二位移時準確地移動至預設位置。另外,由於線性馬達較傳統馬達具有較高精度的定位特點,因此第二位移之位移精度大於第一位移。When the driving load plate 140 is moved, the fixed crystal arm 300 is driven at the same time. When the driving device 100 is activated, the driving unit 122 of the first driving module 120 drives the flexible transmission member 124 to drive the driving load plate 140 and the fixed crystal arm 300 connected to the flexible transmission member 124 to generate a first displacement. After the solid crystal arm 300 travels the first displacement, the first driving module 120 stops driving the solid crystal arm 300. After the stop, it can be controlled according to a preset program. Within a few microseconds to several tens of microseconds, the second driving module 130 then starts to drive the driving load board 140 connected to the moving unit 134, and the driving load board 140 is driven. Actuation with the crystallizer arm 300 to produce a second displacement until the crystallizer arm 300 moves to the set position. The second displacement must be parallel to the first displacement displacement, so that the condition that the two displacement travel paths interfere with each other does not occur, and the position of the solid crystal arm 300 can be correctly positioned. And the displacement speed of the first displacement is greater than the second displacement, so the crystallizer arm 300 can move rapidly at the first displacement and accurately move to the preset position during the second displacement. In addition, since the linear motor has a higher precision positioning feature than the conventional motor, the displacement accuracy of the second displacement is greater than the first displacement.
以上作動方式的優點為可將固晶臂300以有效率的方式運動,先將固晶臂300藉由第一驅動模組120做快速且較大範圍之移動,再藉由第二驅動模組130將固晶臂300做小範圍且較精密定位之移動。此時,量測單元400,可量測固晶臂300之位移,並搭配一預設之程式,以固晶臂300之位移與設定之位置之差距,來決定第一驅動模組120或第二驅動模組130兩者其中之一用以帶動固晶臂300移動。量測單元400可為一光學尺,並可撘配設置於平台200上之一光學讀頭500以進行量測定位。光學讀頭500可讀取光學尺400上之刻度,以量測固晶臂300之位移。因此第一驅動模組120與第二驅動模組130可互相搭配運用,並達到本發明具效率且精密之定位移動之特點。另外,以上包含第一位移與第二位移之作動方式除了單向移動外,並可為一來回之往復運動。再者,值得注意的是光學尺400亦可設置於平台200上,且光學讀頭500亦可設置於驅動裝置本體110上,互相交換光學尺400與光學讀頭500之位置並不會影響兩者於本發明中量測之功能性。The advantage of the above operation mode is that the solid crystal arm 300 can be moved in an efficient manner, and the solid crystal arm 300 is first moved by the first driving module 120 to be quickly and widely moved, and then the second driving module is used. 130 moves the fixed crystal arm 300 into a small range and a relatively precise positioning. At this time, the measuring unit 400 can measure the displacement of the solid crystal arm 300, and with a preset program, determine the first driving module 120 or the difference between the displacement of the solid crystal arm 300 and the set position. One of the two driving modules 130 is used to drive the fixed crystal arm 300 to move. The measuring unit 400 can be an optical scale and can be disposed on one of the optical reading heads 500 on the platform 200 for measuring the position. The optical pickup 500 can read the scale on the optical scale 400 to measure the displacement of the fixed crystal arm 300. Therefore, the first driving module 120 and the second driving module 130 can be used in combination with each other, and achieve the characteristics of the present invention with efficient and precise positioning and movement. In addition, the above-mentioned actuation method including the first displacement and the second displacement may be a reciprocating motion back and forth in addition to the one-way movement. In addition, it should be noted that the optical scale 400 can also be disposed on the platform 200, and the optical pickup 500 can also be disposed on the driving device body 110, and the positions of the optical scale 400 and the optical reading head 500 are exchanged without affecting the two. The functionality of the measurement is measured in the present invention.
綜上所述,本發明之驅動裝置及固晶機,其特點為利用第一驅動模組具快速且大範圍之移動,與第二驅動模組作小範圍且較精密之移動,因此可達到提昇固晶臂移動速度並維持原本移動精度之目的。In summary, the driving device and the die bonding machine of the present invention are characterized in that the first driving module has a fast and wide-range movement, and the second driving module performs a small range and precise movement, thereby achieving Improve the movement speed of the fixed crystal arm and maintain the original movement accuracy.
以上所述僅為舉例說明,而並非為限制本發明之用途。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。The above description is for illustrative purposes only and is not intended to limit the use of the invention. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.
1...固晶機1. . . Solid crystal machine
100...驅動裝置100. . . Drive unit
110...驅動裝置本體110. . . Drive unit
120...第一驅動模組120. . . First drive module
122...驅動單元122. . . Drive unit
124...撓性傳動件124. . . Flexible transmission
126...轉軸126. . . Rotating shaft
130...第二驅動模組130. . . Second drive module
132...定子單元132. . . Stator unit
134...動子單元134. . . Moving unit
140...驅動負載板140. . . Drive load board
142...連接部142. . . Connection
200...平台200. . . platform
300...固晶臂300. . . Solid crystal arm
400...量測單元400. . . Measuring unit
以及as well as
500...光學讀頭500. . . Optical read head
第1圖 本發明之一實施例之驅動模組之示意圖;以及1 is a schematic view of a drive module of an embodiment of the present invention;
第2圖 本發明之一實施例之固晶機示意圖。Fig. 2 is a schematic view of a die bonder according to an embodiment of the present invention.
100...驅動裝置100. . . Drive unit
110...驅動裝置本體110. . . Drive unit
120...第一驅動模組120. . . First drive module
122...驅動單元122. . . Drive unit
124...撓性傳動件124. . . Flexible transmission
126...轉軸126. . . Rotating shaft
130...第二驅動模組130. . . Second drive module
132...定子單元132. . . Stator unit
134...動子單元134. . . Moving unit
140...驅動負載板140. . . Drive load board
以及as well as
142...連接部142. . . Connection
Claims (19)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW098122681A TWI398931B (en) | 2009-07-03 | 2009-07-03 | Drive unit and solid crystal machine |
| JP2010011198A JP2011014866A (en) | 2009-07-03 | 2010-01-21 | Driving device, and die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW098122681A TWI398931B (en) | 2009-07-03 | 2009-07-03 | Drive unit and solid crystal machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201103099A TW201103099A (en) | 2011-01-16 |
| TWI398931B true TWI398931B (en) | 2013-06-11 |
Family
ID=43593437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098122681A TWI398931B (en) | 2009-07-03 | 2009-07-03 | Drive unit and solid crystal machine |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011014866A (en) |
| TW (1) | TWI398931B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7164314B2 (en) | 2017-04-28 | 2022-11-01 | ベシ スウィッツァーランド エージー | APPARATUS AND METHOD FOR MOUNTING COMPONENTS ON SUBSTRATE |
| TWI633742B (en) * | 2017-06-09 | 2018-08-21 | 財團法人精密機械研究發展中心 | Linear motor cross-track control device |
| TWI744850B (en) * | 2019-04-15 | 2021-11-01 | 日商新川股份有限公司 | Package device |
| CN113585676B (en) * | 2020-04-30 | 2023-03-28 | 广东博智林机器人有限公司 | Exercise device |
| TWI784622B (en) * | 2020-08-12 | 2022-11-21 | 日商捷進科技有限公司 | Die bonding device and method for manufacturing semiconductor device |
| US20230307412A1 (en) * | 2022-02-25 | 2023-09-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method of manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252026A (en) * | 1993-02-22 | 1994-09-09 | Canon Inc | Stage device and system using the same |
| TW200402924A (en) * | 2002-08-15 | 2004-02-16 | Asm Tech Singapore Pte Ltd | Motor system for positioning a load |
| TW200847973A (en) * | 2007-02-20 | 2008-12-16 | Electro Scient Ind Inc | Decoupled, multiple stage positioning system |
| TW200919620A (en) * | 2007-09-18 | 2009-05-01 | Oerlikon Assembly Equipment Ag Steinhausen | Pick and place system for a semiconductor mounting apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3510912B2 (en) * | 1993-12-28 | 2004-03-29 | ジューキ株式会社 | Head drive mechanism |
| JP3002142B2 (en) * | 1996-10-07 | 2000-01-24 | キヤノン株式会社 | Moving stage device and semiconductor baking device |
| JP2001267226A (en) * | 2000-03-21 | 2001-09-28 | Nikon Corp | Driving apparatus, exposure apparatus, device and manufacturing method thereof |
| JP2006050873A (en) * | 2004-08-09 | 2006-02-16 | Nikon Corp | Electromagnetic drive device and stage device |
-
2009
- 2009-07-03 TW TW098122681A patent/TWI398931B/en not_active IP Right Cessation
-
2010
- 2010-01-21 JP JP2010011198A patent/JP2011014866A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252026A (en) * | 1993-02-22 | 1994-09-09 | Canon Inc | Stage device and system using the same |
| TW200402924A (en) * | 2002-08-15 | 2004-02-16 | Asm Tech Singapore Pte Ltd | Motor system for positioning a load |
| TW200847973A (en) * | 2007-02-20 | 2008-12-16 | Electro Scient Ind Inc | Decoupled, multiple stage positioning system |
| TW200919620A (en) * | 2007-09-18 | 2009-05-01 | Oerlikon Assembly Equipment Ag Steinhausen | Pick and place system for a semiconductor mounting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011014866A (en) | 2011-01-20 |
| TW201103099A (en) | 2011-01-16 |
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