TWI398499B - An anti - surge insulation coating with flexibility and abrasion resistance - Google Patents
An anti - surge insulation coating with flexibility and abrasion resistance Download PDFInfo
- Publication number
- TWI398499B TWI398499B TW098139280A TW98139280A TWI398499B TW I398499 B TWI398499 B TW I398499B TW 098139280 A TW098139280 A TW 098139280A TW 98139280 A TW98139280 A TW 98139280A TW I398499 B TWI398499 B TW I398499B
- Authority
- TW
- Taiwan
- Prior art keywords
- surge
- flexibility
- wear resistance
- peo
- insulating coating
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims description 57
- 239000011248 coating agent Substances 0.000 title claims description 49
- 238000009413 insulation Methods 0.000 title description 15
- 238000005299 abrasion Methods 0.000 title description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 44
- 239000004927 clay Substances 0.000 claims description 43
- 239000002245 particle Substances 0.000 claims description 28
- 239000002904 solvent Substances 0.000 claims description 28
- 229920003002 synthetic resin Polymers 0.000 claims description 22
- 239000000057 synthetic resin Substances 0.000 claims description 22
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 15
- 229920001601 polyetherimide Polymers 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- 229910052618 mica group Inorganic materials 0.000 claims description 12
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 11
- 229930003836 cresol Natural products 0.000 claims description 11
- 229940094522 laponite Drugs 0.000 claims description 10
- XCOBTUNSZUJCDH-UHFFFAOYSA-B lithium magnesium sodium silicate Chemical compound [Li+].[Li+].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Na+].[Na+].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3 XCOBTUNSZUJCDH-UHFFFAOYSA-B 0.000 claims description 10
- 238000009830 intercalation Methods 0.000 claims description 7
- 230000002687 intercalation Effects 0.000 claims description 7
- 239000010445 mica Substances 0.000 claims description 7
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 5
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 5
- 229910000275 saponite Inorganic materials 0.000 claims description 5
- 241001595840 Margarites Species 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229910052626 biotite Inorganic materials 0.000 claims description 4
- 229910001919 chlorite Inorganic materials 0.000 claims description 4
- 229910052619 chlorite group Inorganic materials 0.000 claims description 4
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 claims description 4
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 4
- YGANSGVIUGARFR-UHFFFAOYSA-N dipotassium dioxosilane oxo(oxoalumanyloxy)alumane oxygen(2-) Chemical compound [O--].[K+].[K+].O=[Si]=O.O=[Al]O[Al]=O YGANSGVIUGARFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910000271 hectorite Inorganic materials 0.000 claims description 4
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims description 4
- 229910052630 margarite Inorganic materials 0.000 claims description 4
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 4
- 229910052627 muscovite Inorganic materials 0.000 claims description 4
- 229910000273 nontronite Inorganic materials 0.000 claims description 4
- 229910001737 paragonite Inorganic materials 0.000 claims description 4
- 229910052628 phlogopite Inorganic materials 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229910000276 sauconite Inorganic materials 0.000 claims description 4
- 229910052902 vermiculite Inorganic materials 0.000 claims description 4
- 239000010455 vermiculite Substances 0.000 claims description 4
- 235000019354 vermiculite Nutrition 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- -1 Lipidolite Inorganic materials 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 229910052629 lepidolite Inorganic materials 0.000 claims description 3
- YWWNNLPSZSEZNZ-UHFFFAOYSA-N n,n-dimethyldecan-1-amine Chemical compound CCCCCCCCCCN(C)C YWWNNLPSZSEZNZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 235000013824 polyphenols Nutrition 0.000 claims description 3
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 claims description 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 2
- 239000003607 modifier Substances 0.000 claims description 2
- 239000000344 soap Substances 0.000 claims 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 150000002923 oximes Chemical class 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 18
- 230000006378 damage Effects 0.000 description 12
- 229910010272 inorganic material Inorganic materials 0.000 description 11
- 239000011147 inorganic material Substances 0.000 description 11
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 10
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 10
- 239000008096 xylene Substances 0.000 description 10
- 239000007787 solid Substances 0.000 description 9
- 239000011810 insulating material Substances 0.000 description 8
- 238000000227 grinding Methods 0.000 description 7
- 239000004962 Polyamide-imide Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920002312 polyamide-imide Polymers 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000000138 intercalating agent Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009528 severe injury Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/40—Compounds of aluminium
- C09C1/42—Clays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/0009—Pigments for ceramics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/04—Compounds of zinc
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/40—Compounds of aluminium
- C09C1/402—Satin white, modifications thereof, e.g. carbonated or silicated; Calcium sulfoaluminates; Mixtures thereof, e.g. with calcium carbonate or kaolin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/02—Emulsion paints including aerosols
- C09D5/024—Emulsion paints including aerosols characterised by the additives
- C09D5/028—Pigments; Filters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Nanotechnology (AREA)
- Wood Science & Technology (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Organic Insulating Materials (AREA)
- Paints Or Removers (AREA)
Description
本發明係關於一種絕緣塗料，特指用於塗佈在漆包線之金屬導線表面作為絕緣層用者。
經歷過二次能源危機以及二氧化碳過量排放而使地球環境遭受到嚴重破壞與溫暖化後，全球先進國家莫不對能源節省以及環境保護給予相當程度之重視，並制定各種產業政策以節制能源浪費與推動環境保護措施。其中，在電力利用方面，具備節約能源效果的變頻器因為各國政府環保政策的大力推行而備受矚目。變頻器可以改變電壓與頻率來控制馬達的轉速，由於具有可變速的特性，除了能提升負載驅動效率之外，在提升電動機效率，利用再生電力的領域上，變頻器的技術也能為省能源帶來極大的貢獻。隨著半導體功率元件進步、微處理器低價化，以及優化的電動機控制理論不斷被提出，變頻器不僅因為高控制性能與高可靠度的開發而活耀於產業機械領域，並且由於智慧型模組(Intelligent Power Modules，IPMs)的應用，變頻器的體積小型化，產品售價便宜化，也就逐漸被應用在民生、輕便、更多樣的用途上。同時，隨著變頻器應用範圍逐步擴大，把多個變頻器連成網路系統，建立遠端控制、遠端維護等系統化管理則成為未來發展趨勢。由此可知，從宏觀的環境保護與能源節省，到產業生產力的提升，一直到日常生活的便利性、快速性，都跟變頻器產生密不可分的關係，換句話說，變頻器對整個社會發展的進步扮演著極重要的角色。
正常狀況之下，電力公司所輸送到用戶家中的電源電壓應為110伏特，但是在某些狀況下會在瞬間出現高過正常值的電壓值，其稱為突波(Surge)。若是從示波器來看，即是在穩定電子信號中突然產生的電壓準位或電流急速變化，在穩定波形中突然出現一個跳的特別高且特別陡的波形。突波產生的原因很多，像是遭遇雷擊或電力系統故障時，雖然電力公司設有保護措施，但因其回應速度與保護程度有一定的極限，因此還是有一些突波可能會在瞬間傳送到用戶家裡。此外，電力公司的這些保護裝置在「作動」與「複置」的瞬間往往也會產生一些突波，並且像是家裡的電源開關在動作的瞬間，同樣也會有突波產生。這些不正常的突波，雖然都只是在瞬間發生，但是過程中的電壓、電流往往高過正常值甚多，嚴重時足以破壞家中的許多電器產品，尤其像是電腦、電視與音響設備等，因為這些家電產品的工作電壓相對較低，所能夠承受突波的能力也就相對不足。
此外，變頻器本身也會產生突波。利用變頻器來驅動馬達時會同時釋出脈衝電流形成所謂變頻突波(Inverter Surge)，所產生的變頻突波可能會直接造成馬達外層所捲繞的漆包線的絕緣破壞、形成貫穿性短路破壞或造成信號不穩定，進而損壞終端元件，阻斷馬達、繼電器或變壓器磁場。一般而言，突波產生時可視為瞬間給予漆包線一個非常大的能量(負載)，在此巨大的能量下，若是材料絕緣強度無法承受或是無法將此能量導通散逸，則絕緣皮膜容易被擊穿或是破壞，進而造成貫穿性短路或造成信號不穩定，最後將造成儀器無法運轉或是毀壞。雖然利用突波吸收器可避免家電產品遭到破壞，但是突波對於漆包線外層絕緣材料的破壞仍無法藉由突波吸收器來防範。因此，如何開發耐突波用漆包線絕緣材料將是未來大量使用變頻器時重要的課題。
有鑑於上述需求，業界目前已開發出數種可抗突波之絕緣樹脂塗料，其中Phelps Dodge與GE在1985年就已經發表抗突波用絕緣塗料的專利技術，其主要是在絕緣塗料中加入金屬氧化物如：TiO2
、Al2
O3
、Cr2
O3
、ZnO等，藉由金屬氧化物高介電常數的特性，使其產生類似電容的效果將突波吸收、均勻分散、導通，因而不會對於絕緣皮膜造成破壞。為了更加確保能夠抵抗突波所造成的破壞，該技術採多層絕緣皮膜塗裝結構，意即在金屬導線與有機絕緣材料混合塗層外，再製作一層有機絕緣材料保護層，如此可在突波擊穿金屬導線與有機絕緣材料混合層後，透過最外層的有機絕緣材料保護層來抵抗剩餘能量所產生的破壞。該技術最大關鍵在於金屬氧化物與有機絕緣材料間的界面相容性，若是相容性不佳，則金屬氧化物易自行聚集形成大顆粒金屬粉體。若此，則因為粒子間隔較遠且分散不均，對於突波的分散及導通可能效果不佳，進而造成抗突波性能無法顯現。
此外，由於例如二氧化矽(silica)粒子等等無機絕緣材料可以有效地降低電暈放電所產生的突波對於馬達用絕緣漆包線的破壞，因此若是將無機材料加入有機的絕緣材料中，將可提高漆包線絕緣層抵抗突波破壞的效果。但是無機材料最大的缺點是不夠柔軟，若是無機材料無法均勻地分散在有機材料中，則漆包線在線圈快速繞線時可能會因為應力的產生，而使得漆包線在往後使用時產生電性及機械性的缺陷造成破壞。因此如何將無機材料均勻地分散在有機材料中，將是此技術可應用最大的關鍵。
抗突波用絕緣材料除了可添加金屬氧化物或是奈米無機二氧化矽粒子外，亦可添加含層狀結構的無機材料。日本新型專利申請第S59-176363號、發明專利公開第2005-190699號以及美國專利第4,476,192、第5,654,095、第6,906,258及公開2005-0142349號皆有提及使用層狀結構無機添加物之絕緣塗料可以增加漆包線材料的耐變頻突波使用壽命。這些專利所使用的層狀結構無機材料，使用時可以是未改質或是改質狀態，在改質狀下，皆是以不同結構之四級銨鹽或是四級磷鹽進行層間插層改質，然而，使用四級銨鹽作為插層劑之層狀結構無機添加物，其加入樹脂後，在後段烘烤硬化的過程中，四級銨鹽會造成樹脂架橋不完全，進而造成漆包線絕緣皮膜脆裂。
有鑒於無機材料添加劑有造成絕緣皮膜不夠柔軟之缺點，以及現有技術中以四級銨鹽作為插層劑進行改質後的層狀結構的無機材料，其添加入樹脂後，將造成樹脂在後段烘烤硬化的過程中架橋不完全，而有致使漆包線絕緣皮膜脆裂之缺點，本發明係期望能開發一種塗料，由此塗料所形成的絕緣皮膜，除可抗突波破壞之外，尚可同時兼具柔軟性以及耐磨耗性。
為達成上述發明目的，本發明所使用之技術手段在於提供一種具可撓性與耐磨耗性之耐突波絕緣塗料，其包含有：合成樹脂，其佔總成分之12wt%至76wt%；有機溶劑，其佔總成分之20wt%至80wt%；聚氧化乙烯(polyethylene oxide;PEO)插層改質的層狀黏土材料，其佔總成分之0.005wt%至16wt%；有機可分散奈米二氧化矽(silica)粒子，其佔總成分之0.995wt%至16wt%。
所述樹脂可選自於聚醯胺醯亞胺(polyamideimides；PAI)、聚醚醯亞胺(polyetherimides；PEI)、聚酯亞氨(polyesterimides)、聚醯亞胺(polyimides)、聚醯胺(polyamides)、聚酯(polyesters)、聚胺基甲酸酯(polyurethanes)、環氧樹脂(epoxies)、酚醛樹酯(phenolics)、苯氧樹脂(phenoxy)、聚氟乙烯(PVF)或聚乙烯醇縮丁醛(PVB)。
所述有機溶劑可選自於甲酚、碳氫溶劑、酚、二甲苯、甲苯、二甲酚、乙基苯、DMF(N,N-二甲基醯胺)、NMP(N-甲基四氫吡咯酮)、酯類、酮類或其混合物。
所述聚氧化乙烯(polyethylene oxide;PEO)插層改質的層狀黏土材料，其中黏土可選自於蒙特石(smectites)、雲母(micas)或蛭石(vermiculite)，該蒙特石(smectites)可選自於蒙特土(montmorillonite)、水輝石(hectorite)、雷膨土(laponite)、皂石(saponite)、鋅皂石(sauconite)、鋁蒙脫石(beidellite)、矽鎂石(stevensite)或囊脫石(nontronite)，而該雲母(micas)可選自於綠泥石(chlorite)、金雲母(phlogopite)、鋰雲母(lepidolite)、白雲母(muscovite)、黑雲母(biotite)、鈉雲母(paragonite)、珍珠雲母(margarite)、帶雲母(taeniolite)或矽雲母(tetrasilicic mica)。
本發明之塗料，其添加有屬於矽酸鹽類的黏土及屬於氧化物的奈米二氧化矽粒子，該些添加物均為非金屬無機材料，具有高介電常數及優越的強度、硬度、絕緣性、熱傳導、耐高溫、耐氧化、耐腐蝕、耐磨耗與高溫強度等等特性，其中高介電常數的特性可使其產生類似電容的效果將突波吸收、均勻分散、導通，因而在突波產生時，可避免其對絕緣皮膜造成破壞，並且可令絕緣皮膜具有優良的耐磨耗特性，此外，本發明所使用之PEO插層劑，其具有反應性官能基，在後段烘烤硬化的過程中，不僅可使層狀黏土脫層均勻分散在絕緣皮膜中，而且可以與合成樹脂反應形成鍵結，由於PEO結構具有柔軟可撓的特性，因而使漆包線絕緣皮膜具有較佳的柔軟性。
本發明之具可撓性與耐磨耗性之耐突波絕緣塗料，其成分包含有合成樹脂、有機溶劑、一種具烘烤架橋反應性的聚氧化乙烯(polyethylene oxide；以下稱PEO)插層改質的層狀黏土(clay)材料及有機可分散奈米二氧化矽(silica)粒子，其中：該合成樹脂含量佔總成分之12~76wt%，其可選自於聚醯胺醯亞胺(polyamideimides；以下稱PAI)、聚醚醯亞胺(polyetherimides；以下稱PEI)、聚酯亞氨(polyesterimides)、聚醯亞胺(polyimides)、聚醯胺(polyamides)、聚酯(polyesters)、聚胺基甲酸酯(polyurethanes)、環氧樹脂(epoxies)、酚醛樹酯(phenolics)、苯氧樹脂(phenoxy)、聚氟乙烯(PVF)或聚乙烯醇縮丁醛(PVB)；該有機溶劑含佔總成分之20~80wt%，其可選自於甲酚(Cresol)、碳氫溶劑、酚、二甲苯(Xylene)、甲苯、二甲酚、乙基苯、DMF(N,N-二甲基醯胺)、NMP(N-甲基四氫吡咯酮)、酯類、酮類或其混合物；該PEO插層的層狀黏土佔總成分之0.005~16wt%，其中PEO分子量介於600~1,000,000之間，PEO改質劑與黏土之重量比介於20：80至45：55之間，而黏土可選自於蒙特石(smectites)、雲母(micas)或蛭石(vermiculite)，該蒙特石(smectites)可選自於蒙特土(montmorillonite)、水輝石(hectorite)、雷膨土(laponite)、皂石(saponite)、鋅皂石(sauconite)、鋁蒙脫石(beidellite)、矽鎂石(stevensite)或囊脫石(nontronite)，而該雲母(micas)可選自於綠泥石(chlorite)、金雲母(phlogopite)、鋰雲母(lepidolite)、白雲母(muscovite)、黑雲母(biotite)、(palagonite)鈉雲母(paragonite)、珍珠雲母(margarite)、帶雲母(taeniolite)或矽雲母(tetrasilicic mica)，於較佳實施例中，黏土可選用平均粒徑小於20μm者；該有機可分散奈米二氧化矽粒子，其佔總成分之0.995wt%至16wt%，於較佳實施例中，有機可分散奈米二氧化矽粒子可選用平均粒徑小於50nm者。
上述中，PEO插層改質的層狀黏土材料，其與有機可分散奈米二氧化矽粒子之間的重量比係介於0.5：99.5至50：50之間，且PEO插層改質的層狀黏土材料及有機可分散奈米二氧化矽粒子，其對合成樹脂之重量比係介於5：95至40：60之間，於較佳實施例中可介於10：90至30：70之間。
參見第一圖所示，本發明之具可撓性與耐磨耗性之耐突波絕緣塗料，其製備方式為：先將合成樹脂、有機溶劑及有機可分散奈米二氧化矽粒子先混合，之後再將PEO插層的層狀黏土加入其中均勻攪拌、研磨及分散，隨後進行真空脫泡30分鐘後，即可得到本發明之塗料，該塗料塗佈於一金屬導線後經乾燥與固化可形成一絕緣皮膜，以下列舉本發明塗料的數個實施例以及比較例，其所形成之絕緣皮膜之成分彙整如表一所示。
實施例1：使用1000mL燒杯，加入950g合成樹脂PEI溶液(固形分：40%，470g溶劑Cresol，70g溶劑NMP，30g溶劑二甲苯)及10.0g奈米二氧化矽粒子，室溫下高速攪拌30分鐘，再加入10.0gPEO插層的Laponite RDS黏土(PEO分子量100,000，PEO對黏土重量比為30：70)，經過研磨及分散，真空脫泡30分鐘後得到具有可撓性與耐磨耗特性之耐變頻突波絕緣樹脂塗料。
實施例2：使用1000mL燒杯，加入800g合成樹脂聚PEI溶液(固形分：40%，380g溶劑甲酚，70g溶劑NMP，30g溶劑二甲苯)及79.6g奈米二氧化矽粒子，室溫下高速攪拌30分鐘，再加入0.4gPEO插層的Laponite RDS黏土(PEO分子量100,000，PEO對黏土重量比為30：70)，經過研磨及分散，真空脫泡30分鐘後得到具有可撓性與耐磨耗特性之耐變頻突波絕緣樹脂塗料。
實施例3：使用1000mL燒杯，加入750g合成樹脂PEI溶液(固形分：40%，350g溶劑甲酚，70g溶劑NMP，30g溶劑二甲苯)及60.0g奈米二氧化矽粒子，室溫下高速攪拌30分鐘，再加入40.0gPEO插層的Laponite RDS黏土(PEO分子量為100,000，PEO對黏土重量比為30：70)，經過研磨及分散，真空脫泡30分鐘後得到具有具有可撓性與耐磨耗特性之耐變頻突波絕緣樹脂塗料。
實施例4：使用1000mL燒杯，加入800g合成樹脂PAI溶液(固形分：30%，460g溶劑甲酚，70g溶劑NMP，30g溶劑二甲苯)及30.0g奈米二氧化矽粒子，室溫下高速攪拌30分鐘，再加入30.0gPEO插層的Laponite RDS黏土(PEO分子量100,000，PEO對黏土重量比為30：70)，經過研磨及分散，真空脫泡30分鐘後得到具有可撓性與耐磨耗特性之耐變頻突波絕緣樹脂塗料。
實施例5：使用1000mL燒杯，加入800g合成樹脂PEI溶液(固形分：40%，320g溶劑甲酚，70g溶劑NMP，30g溶劑二甲苯)及48.0g奈米二氧化矽粒子，室溫下高速攪拌30分鐘，再加入32.0gPEO插層的Laponite RDS黏土(PEO分子量6,000，PEO對黏土重量比為30：70)，經過研磨及分散，真空脫泡30分鐘後得到具有可撓性與耐磨耗特性之耐變頻突波絕緣樹脂塗料。
實施例6：使用1000mL燒杯，加入800g合成樹脂PEI溶液(固形分：40%，320g溶劑甲酚，70g溶劑NMP，30g溶劑二甲苯)及48.0g奈米二氧化矽粒子，室溫下高速攪拌30分鐘，再加入32.0gPEO插層的Laponite RDS黏土(PEO分子量100,000，PEO對黏土重量比為45：55)，經過研磨及分散，真空脫泡30分鐘後得到具有可撓性與耐磨耗特性之耐變頻突波絕緣樹脂塗料。
比較例1：使用1000mL燒杯，加入900g合成樹脂PEI溶液(固形分：40%，440g溶劑甲酚，70g溶劑NMP，30g溶劑二甲苯)及40.0g四級銨鹽改質的30B黏土，室溫下高速攪拌30分鐘，經過研磨及分散，真空脫泡30分鐘後得到絕緣樹脂塗料。
比較例2：使用1000mL燒杯，加入700g合成樹脂PEI溶液(固形分：40%，320g溶劑甲酚，70g溶劑NMP，30g溶劑二甲苯)及72.0g奈米二氧化矽粒子，室溫下高速攪拌30分鐘，再加入48.0g四級銨鹽改質的30B黏土，經過研磨及分散，真空脫泡30分鐘後得到絕緣樹脂塗料。
比較例3：將合成樹脂PAI溶液(固形分：30%)真空脫泡30分鐘後得到絕緣樹脂塗料。
上述各實施例以及比較例之塗料塗佈於金屬導線之方式，可依塗料黏度而選用任一傳統方式，如眼模、滾輪或是毛氈供應系統，塗佈速度一般為每分鐘3至150公尺。每回塗佈後，使用傳統烘烤爐施以乾燥和固化成膜，烘烤爐溫度視塗料種類、爐長和漆膜厚度而異，一般入口溫度為300到350℃，出口溫度為350到700℃，此處為便於比較絕緣皮膜之特性，各實施例及比較例之塗料均採眼膜塗佈於線徑1.024毫米的銅材上，且絕緣皮膜厚度約為25μm，固化成形後的絕緣皮膜並進行可撓性、密著性、熱衝擊、破壞電壓、伸長率、耐軟化溫度、耐磨耗性及抗突波壽命之測試，其中抗突波測試之方式為取適當長度線樣依規定荷重(荷重：13N)及絞線回數(8回)作成心絞線，再置入連接抗突波測試機特定溫度(190℃)的烘箱中，啟動抗突波測試機(440V，30Hz，突波：1.2KV↑)量測突波破壞時間，其餘特性則依據NEMA 1000 PART3進行測試，各實施例及比較例之塗料所形成之絕緣皮膜的特性彙整如表二所示。
上述中，比較例3為未添加任何無機材料之塗料，比較例1為現有技術中添加四級銨鹽改質黏土之塗料，比較例2為除了四級銨鹽改質黏土外進一步添加二氧化矽粒子之塗料，其中由比較例3之塗料所形成之絕緣皮膜，其具有良好的可撓性、密著性與熱衝擊性，但抗突波壽命極低，僅達10小時，而比較例1之塗料由於成分中添加有黏土，使其抗突波壽命可提升至110小時，但由於使用四級銨鹽改質的插層黏土加入抗突波樹脂系統後，在後段烘烤硬化的過程中，四級銨鹽會造成樹脂架橋不完全，進而造成漆包線絕緣皮膜脆裂，因此其可撓性、密著性與熱衝擊性皆較未添加黏土者為差，而比較例2之塗料由於成分中進一步添加有二氧化矽粒子，是以其抗突波壽命可進一步提升至186小時，惟可撓性、密著性與熱衝擊性也隨之進一步下降；由本發明各實施例可得知，塗料所添加之黏土及奈米二氧化矽粒子，可使其所形成的絕緣皮膜的抗突波壽命遠較比較例中未添加任何無機材料之塗料所形成的絕緣皮膜的抗突波壽命為高，其中實施例1之塗料中，所添加的PEO插層改質層狀黏土材料及奈米二氧化矽粒子的量較低，其對合成樹脂之重量比為5：95，是以抗突波壽命僅達166小時，但已較比較例1及3為高且接近於比較例2，而隨著添加的PEO插層改質層狀黏土材料及有奈米二氧化矽粒子的量的增加，如第2至6實施例中對合成樹脂之重量比介於20：80至25：75之間，則抗突波壽命可大幅提升380至450小時之間，遠高於任一比較例之塗料所形成之絕緣皮膜之抗突波壽命；此外，由於本發明所使用的PEO插層劑具有反應性官能基，在後段烘烤硬化的過程中，不僅可使黏土脫層均勻分散在絕緣皮膜中，而且可以與合成樹脂反應形成鍵結，由於PEO結構具有柔軟可撓的特性，因而各實施例之塗料所形成之絕緣皮膜均具有較佳的可撓性、密著性與熱衝擊性，並且在破壞電壓、伸長率、耐軟化溫度以及耐磨耗性上，也均優於比較例1及2之塗料所形成之絕緣皮膜，因此，本發明之塗料確為一種可以形成具可撓與耐磨耗特性之耐變頻突波絕緣皮膜之塗料。
第一圖為本發明之塗料的製備流程。
Claims (11)
- 一種具可撓性與耐磨耗性之耐突波絕緣塗料，其包含有：合成樹脂，其佔總成分之12wt%至76wt%；有機溶劑，其佔總成分之20wt%至80wt%；聚氧化乙烯(polyethylene oxide；PEO)插層改質的層狀黏土材料，其佔總成分之0.005wt%至16wt%；有機可分散奈米二氧化矽(silica)粒子，其佔總成分之0.995wt%至16wt%；其中，PEO插層改質的層狀黏土材料及有機可分散奈米二氧化矽粒子，其對合成樹脂之重量比介於20：80至25：75之間。
- 如申請專利範圍第1項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中所述樹脂可選自於聚醯胺醯亞胺(polyamideimides；PAI)、聚醚醯亞胺(polyetherimides；PEI)、聚酯亞氨(polyesterimides)、聚醯亞胺(polyimides)、聚醯胺(polyamides)、聚酯(polyesters)、聚胺基甲酸酯(polyurethanes)、環氧樹脂(epoxies)、酚醛樹酯(phenolics)、苯氧樹脂(phenoxy)、聚氟乙烯(PVF)或聚乙烯醇縮丁醛(PVB)。
- 如申請專利範圍第1項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中所述PEO插層改質的層狀黏土材料，其黏土可選自於蒙特石(smectites)、雲母(micas)或蛭石(vermiculite)，該蒙特石(smectites)可選自於蒙特土(montmorillonite)、水輝石(hectorite)、雷膨土(laponite)、皂 石(saponite)、鋅皂石(sauconite)、鋁蒙脫石(beidellite)、矽鎂石(stevensite)或囊脫石(nontronite)，而該雲母(micas)可選自於綠泥石(chlorite)、金雲母(phlogopite)、鋰雲母(lepidolite)、白雲母(muscovite)、黑雲母(biotite)、鈉雲母(paragonite)、珍珠雲母(margarite)、帶雲母(taeniolite)或矽雲母(tetrasilicic mica)。
- 如申請專利範圍第2項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中所述PEO插層改質的層狀黏土材料，其黏土可選自於蒙特石(smectites)、雲母(micas)或蛭石(vermiculite)，該蒙特石(smectites)可選自於蒙特土(montmorillonite)、水輝石(hectorite)、雷膨土(laponite)、皂石(saponite)、鋅皂石(sauconite)、鋁蒙脫石(beidellite)、矽鎂石(stevensite)或囊脫石(nontronite)，而該雲母(micas)可選自於綠泥石(chlorite)、金雲母(phlogopite)、鋰雲母(lepidolite)、白雲母(muscovite)、黑雲母(biotite)、鈉雲母(paragonite)、珍珠雲母(margarite)、帶雲母(taeniolite)或矽雲母(tetrasilicic mica)。
- 如申請專利範圍第1至4項任一項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中所述有機溶劑可選自於甲酚、碳氫溶劑、酚、二甲苯、甲苯、二甲酚、乙基苯、DMF(N,N-二甲基醯胺)、NMP(N-甲基四氫吡咯酮)、酯類、酮類或其混合物。
- 如申請專利範圍第5項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中PEO改質劑與黏土之重量比介於20：80至45：55之間。
- 如申請專利範圍第5項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中PEO分子量介於600至1,000,000之間。
- 如申請專利範圍第5項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中有機可分散奈米二氧化矽粒子之平均粒徑小於50nm。
- 如申請專利範圍第5項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中所述層狀黏土材料之平均粒徑小於20μm。
- 如申請專利範圍第5項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中合成樹脂、PEO插層改質的層狀黏土材料與有機可分散奈米二氧化矽粒子共佔總成分之20wt%至80wt%。
- 如申請專利範圍第10項所述之具可撓性與耐磨耗性之耐突波絕緣塗料，其中PEO插層改質的層狀黏土材料對有機可分散奈米二氧化矽粒子之重量比介於0.5：99.5至50：50之間。
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| TW098139280A TWI398499B (zh) | 2009-11-19 | 2009-11-19 | An anti - surge insulation coating with flexibility and abrasion resistance |
| US12/705,507 US20110118393A1 (en) | 2009-11-19 | 2010-02-12 | Surge-resistant and abrasion-resistant flexible insulating enamel |
| US13/176,617 US8324303B2 (en) | 2009-11-19 | 2011-07-05 | Surge-resistant and abrasion-resistant flexible insulating enamel |
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| TW098139280A TWI398499B (zh) | 2009-11-19 | 2009-11-19 | An anti - surge insulation coating with flexibility and abrasion resistance |
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| US9389525B2 (en) * | 2011-03-09 | 2016-07-12 | Fuji Xerox Co., Ltd. | Fluorine-containing resin particle dispersion, method for preparing fluorine-containing resin particle dispersion, coating liquid which contains fluorine-containing resin particles, method for preparing coating film which contains fluorine-containing resin particles, coating film which contains fluorine-containing resin particles, molded body, electrophotographic photoreceptor, method for preparing electrophotographic photoreceptor, image forming apparatus, and process cartridge |
| TWI450759B (zh) * | 2012-12-07 | 2014-09-01 | Ind Tech Res Inst | 有機分散液及其製法及應用其之塗層組成物 |
| WO2014172139A2 (en) * | 2013-04-18 | 2014-10-23 | 3M Innovative Properties Company | Buried clay/nanosilica static dissipative coatings |
| EP3378912B1 (en) * | 2015-11-20 | 2021-06-16 | National Institute of Advanced Industrial Science and Technology | Coating agent containing clay, resin, and organic solvent, protective film using same, and product |
| CN110564288A (zh) * | 2019-09-05 | 2019-12-13 | 合肥盛宝电气有限公司 | 一种变压器用改性漆包线漆 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW413978B (en) * | 1995-06-08 | 2000-12-01 | Phelps Dodge Ind Inc | Pulsed voltage surge resistant magnet wire |
| US6911258B1 (en) * | 1999-05-06 | 2005-06-28 | Alcatel | Optical fiber cable having improved properties |
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| JPS5818809A (ja) * | 1981-07-24 | 1983-02-03 | 株式会社デンソー | 耐過負荷絶縁電線及びその製造方法 |
| US4493873A (en) * | 1982-05-05 | 1985-01-15 | General Electric Company | Corona-resistant wire enamel compositions and conductors insulated therewith |
| US5654095A (en) * | 1995-06-08 | 1997-08-05 | Phelps Dodge Industries, Inc. | Pulsed voltage surge resistant magnet wire |
| US20010018981A1 (en) * | 1997-02-03 | 2001-09-06 | Weijun Yin | Pulsed voltage surge resistant magnet wire |
| US6555610B1 (en) * | 2000-07-17 | 2003-04-29 | Eastman Kodak Company | Reduced crystallinity polyethylene oxide with intercalated clay |
| JP2004055185A (ja) * | 2002-07-17 | 2004-02-19 | Toshiba Aitekku Kk | エナメル線 |
| US7803457B2 (en) * | 2003-12-29 | 2010-09-28 | General Electric Company | Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom |
| WO2009078301A1 (ja) * | 2007-12-14 | 2009-06-25 | Sony Chemical & Information Device Corporation | 光半導体パッケージ封止樹脂材料 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW413978B (en) * | 1995-06-08 | 2000-12-01 | Phelps Dodge Ind Inc | Pulsed voltage surge resistant magnet wire |
| US6911258B1 (en) * | 1999-05-06 | 2005-06-28 | Alcatel | Optical fiber cable having improved properties |
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