TWI397955B - The cutting device of the workpiece - Google Patents

Description

Cutting device for workpiece

The present invention relates to a cutting apparatus for a workpiece, and more particularly to a cutting apparatus for preventing a semiconductor wafer from being diced and a chip adhered to a surface of a wafer-formed semiconductor wafer.

Generally, a semiconductor wafer to be manufactured is formed by dividing a plurality of rectangular regions by a grid arranged in a lattice pattern on the surface of the semiconductor wafer, and a semiconductor circuit is formed in each of the rectangular regions. Further, the semiconductor wafer is manufactured by cutting the semiconductor wafer along the boundary and cutting the rectangular regions. In the cutting of the above semiconductor wafer, generally, a cutting device called a cutter is used. The cutting device has a main shaft that can rotate at a high speed, and a rotating blade made of abrasive grains of diamond or the like is attached to the tip end of the main shaft.

However, in such a cutting device, the blade is cut at a high speed to cut the semiconductor wafer. Frictional heat is generated between the rotating blade and the semiconductor wafer, causing wear or breakage of the rotating blade, and also causes a small chip or the like in the cutting groove of the semiconductor wafer. In order to prevent this, in general, the cutting fluid is supplied and cooled in the processing field of the rotary blade.

As a method of supplying the cutting fluid, a pair of cutting fluid supply nozzle tubes are disposed along both side surfaces of the rotary blades in the vicinity of the machining area, and the cutting fluid is sprayed on the side of the rotary blades. Further, the cutting fluid can be ejected onto the outer circumference of the rotary blade from the outer peripheral nozzle of the outer periphery of the rotary blade. The cutting fluid sprayed in the machining field is scattered in the rotation direction of the rotary blade together with the cutting by the cutting process, and thus there is a problem that the cutting adheres to the surface of the semiconductor wafer. The chip is not easily peeled off from the surface of the semiconductor wafer, and in the spindle cleaning process after the cutting process, there is a problem that the adhered chips are not easily peeled off.

In order to solve such a problem, it is known that a liquid discharge guiding member for separating a cutting fluid containing chips from a surface of a semiconductor wafer is provided by a side in which a cutting fluid is scattered by rotation of a rotary blade, so as to prevent chips from being attached to the processed portion. The technology of the surface of the object. (Refer to Japanese Patent Laid-Open No. 4-74607 and Japanese Patent Laid-Open No. 7-115075)

However, since an imaging element such as a CCD or a C-MOS or another circuit surface is formed on the surface of the semiconductor wafer, the liquid discharge guiding member is brought into contact with the surface of the semiconductor wafer to damage the circuit surface.

In view of the above, it is an object of the present invention to provide a cutting device that can reliably prevent a chip from adhering to a workpiece on a surface of a workpiece during cutting of a workpiece.

In order to achieve the above object, the present invention provides a cutting apparatus for a workpiece, which is provided with a fixed support body on a side where the chips of the rotating blade of the workpiece are scattered, and a cutting fluid for supplying the cutting fluid to the rotary blade. A cutting device for a workpiece of a supply pipe, characterized in that a liquid ejecting means for supplying a liquid for forming a liquid film is provided between the lower surface of the support and the upper surface of the workpiece to be cut.

It is preferable that the liquid ejecting means is provided inside the support body.

Further, the liquid ejecting means is constituted by an injection nozzle hole that is inclined at a predetermined angle with respect to the upper surface of the workpiece, and the injection port of the injection nozzle hole is opened on the bottom surface of the support.

Further, the hole axis of the injection nozzle hole is preferably inclined at an angle of about 45 degrees with respect to the upper surface of the workpiece to be cut.

Further, it is preferable that the injection port of the injection nozzle hole is formed as a rectangular slit hole that is orthogonal to the direction in which the workpiece is transferred.

According to the present invention, a liquid is formed by filling a liquid in a gap between the bottom surface of the fixed support and the surface of the workpiece, so that the liquid containing the cutting liquid can be prevented from entering the gap. Thereby, it is possible to prevent the adhesion of the chips to the surface of the workpiece and prevent the quality of the product.

Hereinafter, a cutting device for a workpiece according to the present invention will be described with reference to the drawings. This embodiment is described as an example in which it is applied to a semiconductor wafer as a workpiece.

Fig. 1 is a view showing the overall configuration of a dicing apparatus 10 for dicing a semiconductor wafer. In the drawing, the semiconductor wafer 12 is a semiconductor circuit in which an imaging element such as a CCD or a C-MOS is formed on the surface thereof, and is held on the frame 14 via the wafer tape 13. The semiconductor wafer 12 is placed on the chuck table 15 in this set state. The chuck table 15 is an approximately flat disk-shaped stage on which a vacuum chuck is provided, and the semiconductor wafer 12 placed on the vacuum chuck is vacuum-sucked.

Moreover, the cutting device 10 is provided with the cutting unit 20 and the chuck moving mechanism for cutting the cutting means for processing the semiconductor wafer 12.

The cutting unit 20 has a high-speed rotating main shaft, and a rotary blade 22 is attached to the front end portion thereof. The cutting unit moving mechanism moves the cutting unit 20 in the axial direction (Y-axis direction) of the main shaft. By moving the cutting unit 20 in the Y-axis direction in this manner, the tip of the rotary blade 22 can be positioned at the cutting position on the semiconductor wafer 12. Further, the cutting unit moving mechanism moves the cutting unit 20 in the vertical direction (Z-axis direction), whereby the depth of engraving of the rotary blade 22 of the semiconductor wafer 12 can be adjusted.

On the other hand, the chuck moving mechanism is a chuck table 15 for reciprocatingly moving the semiconductor wafer 12 toward the rotary blade 22 (X-axis direction) during the cutting of the semiconductor wafer.

According to the dicing apparatus 10 configured as described above, the rotary blade 22 is moved along a plurality of boundaries which are formed in a lattice shape on the surface of the semiconductor wafer 12, whereby the semiconductor wafer is cut and processed, and the semiconductor crystal can be cut. The circle 12 is cut into a plurality of wafers.

Further, the cutting device 10 is provided with a pair of cutting fluid supply nozzle tubes 26 for supplying the cutting fluid to the machining field of the rotary blade 22. Further, the cutting device 10 includes a blade cover 28 that is disposed to cover the outer circumference of the rotary blade 22, and a support body 40 that is attached to the blade cover 28 and supports the cutting fluid supply nozzle tube 26, and is coupled to the support body. The discharge guide 50 of 40 and the discharge duct 52 connected to the discharge guide 50.

The rotary blade 22 is formed by bonding an extremely thin cutting stone formed of a polishing material such as a diamond to an abrasive material, and is attached to the spindle 24 by a fixing means (such as a bolt or a nut) (not shown). Front end. In the present embodiment, the rotary blade 22 is constituted by a ring-shaped grinding stone portion that is disposed on the outer peripheral portion of the blade and a hub-shaped grinding blade that is integrally formed by the base that supports the cutting stone portion. However, the present invention is not limited to such an embodiment, and a so-called washer blade that uses a ring-shaped cutting grindstone as a rotary blade can be attached to the main shaft 24 by both sides of the flange.

The cutting fluid supply nozzle pipe 26 is a pair of linear nozzle tubes disposed approximately horizontally adjacent to the lower portion of the rotary blade 22, as will be apparent from FIGS. 2 and 3. As shown in FIG. 3, the cutting fluid supply nozzle pipe 26 is disposed on both sides of the rotary blade 22 with the rotary blade 22 interposed therebetween. Each of the cutting fluid supply nozzle tubes 26 is provided with a plurality of injection ports (not shown) on a side facing the rotary blade 22, and the cutting fluid is sprayed with a cutting fluid (for example, water) toward the lower portion of the rotary blade 22 and the machining area. In this manner, by supplying a pair of cutting fluid supply nozzle tubes 26 on both sides of the rotary blade 22 to supply the cutting fluid, and cooling the rotary blade 22 and the processing field during the cutting process, small fragments of the semiconductor wafer 12 can be prevented from occurring. The rotating blade 22 is damaged.

Further, in Fig. 2, a blade cover 28 is provided above the rotary blade 22. The blade cover 28 is disposed to cover the outer circumference of the rotary blade 22, and is fixed to the front end portion of the spindle housing 29. The blade cover 28 protects the rotary blade 22 and prevents scattering of the cutting fluid or chips or the broken pieces of the broken rotary blade 22 which are scraped toward the outside. A support body 40 is fixed to the blade cover 28. The support body 40 is caused by the rotation of the rotary blade 22 to cause the cutting fluid to scatter. That is, in the second drawing, it is disposed on the left side of the rotary blade 22.

Further, on the upper portion of the support body 40, two cutting fluid supply ports 38 connected to a cutting fluid supply source (for example, a water supply facility of a factory equipment) (not shown) are provided. Further, inside the support body 40, an L-shaped cutting fluid supply path 30 that communicates between the two cutting fluid supply ports 38 and the pair of cutting fluid supply nozzle tubes 26 is formed. The cutting fluid that has flowed in from each of the cutting fluid supply ports 38 is supplied to each of the cutting fluid supply nozzle tubes 26 through the respective cutting fluid supply passages 30, and is supplied to the rotary blades 22 by the injection ports of the respective cutting fluid supply nozzle tubes 26. injection.

As shown in FIG. 3 and FIG. 4, a drain discharge port 60 penetrating in the X-axis direction is formed inside the support body 40. The liquid discharge port 60 is formed by one side of the cutting fluid being scattered by the rotation of the rotary blade 22. Further, the drain D is a liquid in which the chips generated by the cutting process of the semiconductor wafer 12 by the rotary blade 22 are mixed in the cutting fluid. One side of the rotary blade 22 of the above-described liquid discharge port 60 serves as an inlet of the liquid discharge port. On the other hand, the side opposite to the rotary blade 22 of the liquid discharge port 60 serves as an outlet of the drain D, and communicates with the discharge guide 50. Further, a discharge guide 52 is connected to the outlet side of the discharge guide 50.

The lower surface of the liquid discharge port 60 is the liquid discharge guide surface 62, and the lower end portion of the liquid discharge port 60 on the side of the rotary blade 22 serves as the liquid discharge recovery introduction portion 64.

The liquid discharge guide surface 62 is formed by an inclined guide surface that is inclined downward toward the rotary blade 22. The drain guide surface 62 smoothly discharges the drain D and guides the drain D into the discharge duct 50. Further, the liquid discharge recovery introduction portion 64 is a portion having a sharply-shaped cross section disposed at the tip end of the liquid discharge guide surface 62 on the side of the rotary blade 22. The liquid discharge recovery introduction portion 64 is located on one side of the discharge D due to the rotation of the rotary blade 22, and is adjacent to the rotary blade 22 and the semiconductor wafer 12. The liquid discharge recovery introduction unit 64 guides the liquid discharge D on the surface 12a of the semiconductor wafer 12 in the vicinity of the processing area due to the rotary blade 22 to the liquid discharge guide surface 62.

The liquid discharge guide surface 62 and the liquid discharge recovery introduction portion 64 function as a liquid discharge guiding member, and the liquid discharge D on the surface of the semiconductor wafer 12 is utilized by the rotation of the rotary blade 22 by the force of liquid discharge scattering. Immediately removed from the surface 12a of the semiconductor wafer 12.

The discharge guide 50 is a tubular member that is attached to the support 40. Further, the discharge duct 52 is a tubular member that is detachably connectable to the discharge portion guide 50. As shown in Fig. 5, the discharge guide 50 and the discharge duct 52 function as discharge paths for discharging the liquid discharge D flowing from the liquid discharge port 60 to the outside without coming into contact with the semiconductor wafer 12. The length of the discharge duct 52 is set to a sufficient length so that the discharge D discharged when the semiconductor wafer 12 is cut does not come into contact with the semiconductor wafer 12.

As can be seen from Fig. 2, the bottom surface 40a of the support 40 is a horizontal plane that faces approximately parallel to the surface 12a of the semiconductor wafer 12. Therefore, for example, a gap S of about 2 mm exists between the bottom surface 40a of the support 40 and the surface 12a of the semiconductor wafer 12, and both of them are in a contact state. As described above, the reason why the gap S is provided is to prevent the semiconductor wafer from coming into contact with the support 40 and to damage the circuit surface formed on the surface 12a.

As shown in Fig. 2 and Fig. 6, according to the present invention, a liquid ejecting means is provided inside the support body 40, whereby a liquid such as water can be ejected onto the bottom surface 40a of the support body 40 by the liquid ejecting means. A gap S between the surfaces 12a of the semiconductor wafer 12. The liquid that is ejected into the gap S is a liquid film that forms a predetermined pressure. This liquid film effectively prevents the discharge D containing the chips from intruding into the gap S.

As can be seen from FIGS. 2 and 6, the liquid ejecting means forms a nozzle hole 34 in the inside of the support 40, and ejects the liquid into the gap S. Specifically, the liquid ejecting means is a liquid ejecting port 70 that ejects a liquid into the gap S, and a liquid supply path 32 and a nozzle for supplying a liquid (for example, water) identical to the cutting fluid to the liquid ejecting port 70. Hole 34.

The ejection opening 70 of the liquid ejecting nozzle is a slit which can be formed in a straight line shape. At this time, as is clear from Fig. 3, the liquid ejection opening 70 of the linear slit is formed on the bottom surface 40a of the support body 40 so as to extend in the axial direction of the main shaft 24. In this manner, by forming the liquid ejection opening 70 as a linear slit, the liquid can be uniformly ejected toward the depth direction of the gap S, and the discharge D can be prevented from entering the gap S.

The liquid supply path 32 is a bifurcation flow path that is branched from the two cutting fluid supply paths 30 that supply the cutting fluid to the cutting fluid supply nozzle pipe 26. The nozzle hole 34 is a flow path that communicates with the side surface of the liquid supply path 32 and the slit-shaped liquid ejection port 70.

In this manner, the same liquid as the cutting fluid injected from the cutting fluid supply nozzle tube 26 can be ejected from the liquid ejection port 70 to the gap S.

Further, in accordance with a preferred embodiment, the nozzle apertures 34 are angled at an angle of, for example, 45 degrees with respect to the upper surface of the semiconductor wafer 12. Therefore, the liquid ejecting port 70 is sprayed to the gap S at an angle of 45 degrees below the cutting insert 22 side. Thereby, the liquid film W of a predetermined pressure can be formed by filling the gap S with the liquid, and the liquid discharge D can be effectively prevented from entering the gap S from the end portion of the gap S on the cutting insert 22 side.

Hereinafter, the discharge operation of the discharge D generated when the rotary blade 22 cuts the semiconductor wafer 12 will be described in detail with reference to FIGS. 5 and 6 .

As shown in Fig. 5, at the time of cutting, the cutting edge of the rotating blade 22 that rotates at a high speed is injected into the semiconductor wafer 12, and the cutting fluid supply nozzle tube 26 is sprayed toward the lower processing region of the rotary blade 22. Supply cutting fluid. With the cutting fluid, the rotating blade 22 and the processing area are cooled, and the semiconductor wafer 12 is cut by the rotating blade 22 to form a cutting groove. In the vicinity of the processing area, the chips generated by the cutting of the semiconductor wafer 12 by the rotary blade 22 are mixed into the cutting fluid supplied from the cutting fluid supply nozzle pipe 26 to become the discharge D. At this timing, the chips float in the drain D and do not adhere to the surface 12a of the semiconductor wafer 12.

The liquid discharge D including such a chip is moved toward the rear side (the left side of FIG. 5) in the rotation direction of the rotary blade 22 by the rotational force of the rotary blade 22 that rotates at a high speed, and is intended to be scattered toward the left side of the figure. The liquid discharge D is picked up from the surface 12a of the semiconductor wafer 12 by the liquid discharge recovery tip end portion 64 of the support body 40, and is introduced into the liquid discharge port 60, and is guided by the liquid discharge guide portion 62. The rising drain guiding portion 62 (D2) flows into the discharge guide 50 and is discharged (D3).

At this time, the cutting fluid is ejected from the liquid ejecting port 70 of the liquid ejecting means toward the cutting insert 22 to the gap S between the bottom surface 40a of the support 40 and the surface 12a of the semiconductor wafer 12. Thereby, the gap S on the side of the rotary blade 22 is filled with the liquid to be ejected more than the liquid ejection port 70, and the liquid film W1 of the liquid having a constant pressure is formed, and the gap S is closed. As a result, the liquid discharge D to be scattered by the rotational force of the rotary blade 22 does not enter the gap S from between the liquid discharge collecting tip end portion 64 and the surface 12a of the semiconductor wafer 12. Therefore, most of the liquid discharge D1 is separated from the surface 12a of the semiconductor wafer 12 and flows into the liquid discharge port 60 before the chips floating inside thereof adhere to the surface 12a of the semiconductor wafer 12, with the borrowing The liquid discharge guide 62 (D2) is raised by the liquid flow generated by the rotation of the rotary blade 22, and is discharged into the discharge guide 60 (D3).

Further, the liquid W1 that closes the gap S as described above flows into the liquid discharge port 60 together with the liquid discharge D1 and is discharged. Further, a part of the liquid ejected from the liquid ejecting port 70 overflows on the surface 12a of the semiconductor wafer 12 on the side opposite to the rotating blade 22.

As described above, before the surface 12a of the semiconductor wafer 12 is cut and attached, the liquid discharge D1 containing the chips is recovered from the surface 12a of the semiconductor wafer 12, and then discharged from the liquid discharge guide 62 through the discharge guide 50 and the discharge conduit. 52 is discharged to the outside. At this time, as described above, the length of the discharge duct 52 is longer than that of the semiconductor wafer 12, and therefore, even if the rotary blade 22 is moved to an arbitrary position on the semiconductor wafer 12 during the cutting process, it is discharged from the discharge duct 52. The drain D also does not touch the semiconductor wafer 12.

As shown in Fig. 7, in place of the discharge duct 52, a suction means 56 constituted by a suction pump or the like may be provided in the tubular coupling member 54 connected to the discharge guide 50. According to this configuration, the liquid discharge D in the connection member 54 can be forcibly sucked and discharged by the suction means 56. Therefore, even when the semiconductor wafer 12 is large, the discharge D can be reliably discharged. Further, when the discharge duct 52 and the connecting member 54 are replaced and connected to the discharge member 50, the same support 40 can be used to correspond to the semiconductor wafers 12 of various sizes.

As described above, according to the present invention, the liquid is ejected onto the gap S between the bottom surface 40a of the support 40 and the surface 12a of the semiconductor wafer 12 to be filled, whereby the liquid-containing D containing the chips is prevented from intruding into the gap S, On the other hand, most of the drain D can be immediately guided to the drain guiding portion 62 to be discharged. Therefore, it is possible to more reliably prevent the chip contained in the drain D from adhering to the surface 12a of the semiconductor wafer 12.

In the above-described embodiment, the cutting device is described as an example of a cutting device. However, the present invention is not limited to such an embodiment, and a device for cutting a workpiece by using a rotating blade that rotates at a high speed is used. Various cutting apparatuses for performing cutting processing other than the cutting apparatus can be widely applied.

Further, the shape and arrangement of the liquid ejecting port 70 are not limited to the above-described linear slit, and a plurality of dot holes, such as a curved slit, a plurality of slits, a linear shape, or a matrix shape, are arranged. Any shape and arrangement may be considered if the liquid cannot enter the gap S described above.

Further, in the above-described embodiment, the support body 40 and the liquid ejecting means are integrally formed, and the liquid supply path 32 and the nozzle hole 34 are formed inside the support body 40, and the liquid ejecting port 70 is provided on the bottom surface thereof, but the present invention is It is not limited to such an embodiment, and for example, the support 40 and the liquid ejecting means may be configured by other bodies. As described above, the same effect can be expected by supplying the liquid to the liquid ejecting means provided outside the support 40.

Further, in the above-described embodiment, an example in which a pair of cutting fluid supply nozzle tubes 26 for supplying cutting fluid are ejected from both sides of the rotary blade 22 as the cutting fluid supply means will be described, but the present invention is not limited thereto. In such an embodiment, for example, instead of the above-described cutting supply nozzle tube 26, the outer peripheral nozzle is provided on the front side in the rotational direction of the rotary blade 22 so as to face the outer peripheral surface of the rotary blade 22, and the outer peripheral nozzle is directed toward the outer periphery of the rotary blade 22. It is also possible to supply the cutting fluid by surface jet.

Industrial utilization possibility

The present invention is applicable to a dicing apparatus or the like for a semiconductor wafer, and is particularly applicable to a cutting apparatus that is required to prevent chips from adhering to the surface of a semiconductor wafer.

10. . . Cutting device

12. . . Semiconductor wafer

13. . . Wafer tape

14. . . frame

15. . . Suction table

20. . . Cutting wafer

twenty two. . . Rotating blade

twenty four. . . Spindle

26. . . Cutting fluid supply nozzle tube

28. . . Blade cover

29. . . Spindle shell

30. . . Cutting fluid supply path

34. . . Nozzle hole

38. . . Cutting fluid supply port

40. . . Support

50. . . Exhaust guide

52. . . Discharge conduit

54. . . Connecting member

56. . . Attraction

60. . . Drain discharge

62. . . Drainage guide

64. . . Drainage recovery introduction

70. . . Liquid injection port

D. . . Drainage

S. . . gap

Fig. 1 is a perspective view showing the entire cutting device.

Fig. 2 is a side view showing the cutting device according to the present invention.

Figure 3 is a bottom view showing the same device.

Figure 4 is a view along A of Figure 2. A cross-sectional view of the A line cut.

Fig. 5 is a side view showing a discharge state of the liquid discharge including the chips at the time of cutting.

Fig. 6 is a side sectional view showing an enlarged main part of the present invention.

Fig. 7 is a side view showing a flow state of the liquid discharge including the chips at the time of cutting.

Fig. 8 is a side view showing the flow state of the liquid discharge.

twenty two. . . Rotating blade

26. . . Cutting fluid supply nozzle tube

30. . . Cutting fluid supply path

40. . . Support

60. . . Drain discharge

62. . . Drainage guide

64. . . Drainage recovery introduction

Claims (5)

A cutting device for a workpiece, comprising: a suction cup table for holding a workpiece; a rotary blade assembled to the main shaft for cutting the workpiece; and a cutting fluid supply nozzle tube for processing the rotary blade a cutting fluid is supplied; and a support body is disposed on a side where the cutting debris generated when the rotating blade performs cutting of the workpiece is disposed opposite to an outer circumference of the rotating blade to support the cutting fluid supply nozzle pipe; A cutting device for a workpiece, characterized in that a discharge outlet is formed in the support body for discharging a discharge liquid containing cutting chips in the cutting fluid, and a liquid ejection means is further disposed on the support body. For supplying a liquid, a liquid film is formed between the lower surface of the support body and the upper surface of the workpiece held on the suction cup table to prevent liquid from entering the lower surface of the support body and the upper surface of the workpiece. between. The cutting device for a workpiece according to the first aspect of the invention, wherein the liquid ejecting means is provided inside the support. The cutting device of the workpiece according to the first aspect of the invention, wherein the liquid ejecting means is formed by an injection nozzle hole inclined at a predetermined angle with respect to an upper surface of the workpiece, and the injection nozzle hole is ejected. The mouth is opened on the bottom surface of the above support body. The cutting device for a workpiece according to the third aspect of the invention, wherein the hole axis of the injection nozzle hole is inclined at an angle of about 45 degrees with respect to an upper surface of the workpiece to be cut. The cutting device for a workpiece according to the third aspect of the invention, wherein the injection port of the injection nozzle hole is a rectangular slit hole that is orthogonal to a direction in which the workpiece is transferred.