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TWI394436B - Digital camera module and a method of assembling the same - Google Patents

Digital camera module and a method of assembling the same Download PDF

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Publication number
TWI394436B
TWI394436B TW95137321A TW95137321A TWI394436B TW I394436 B TWI394436 B TW I394436B TW 95137321 A TW95137321 A TW 95137321A TW 95137321 A TW95137321 A TW 95137321A TW I394436 B TWI394436 B TW I394436B
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Taiwan
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image sensing
lens
digital camera
module
camera module
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TW95137321A
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Chinese (zh)
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TW200818876A (en
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Steven Webster
Yu Chieh Cheng
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Hon Hai Prec Ind Co Ltd
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Publication of TWI394436B publication Critical patent/TWI394436B/en

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Description

數位相機模組及其組裝方法 Digital camera module and assembly method thereof

本發明係關於一種數位相機模組及其組裝方法,尤其係關於一種應用於行動電話上之數位相機模組及其組裝方法。 The present invention relates to a digital camera module and an assembly method thereof, and more particularly to a digital camera module applied to a mobile phone and an assembly method thereof.

目前,行動電話向著多功能之趨勢發展,具有數位相機模組之行動電話一經推出便倍受消費者歡迎。應用於行動電話之數位相機模組不僅需具有較好之成像功能,且需要其結構與行動電話外殼結構相配合以達到節省行動電話內部空間之目的,以滿足消費者對行動電話薄形化發展之需要。 At present, mobile phones are moving toward a multi-functional trend, and mobile phones with digital camera modules are popular with consumers as soon as they are launched. The digital camera module used in mobile phones not only needs to have better imaging functions, but also needs its structure to cooperate with the structure of the mobile phone casing to save the space of the mobile phone to meet the consumer's thinning of the mobile phone. Need.

請參閱圖1,一種習知數位相機模組300安裝於行動電話100內,該數位相機模組300包括一鏡座301及一鏡筒302,該鏡座301和鏡筒302藉由螺紋連接成一體,該鏡座301及鏡筒302之外週緣與其各自自身之頂面相交處呈直角。該行動電話100包括一機體1001,該機體1001具有一曲面部分1004與一平面部分1005。 Referring to FIG. 1 , a conventional digital camera module 300 is mounted in a mobile phone 100. The digital camera module 300 includes a lens holder 301 and a lens barrel 302. The lens holder 301 and the lens barrel 302 are connected by screws. In one piece, the outer periphery of the lens holder 301 and the lens barrel 302 is at right angles to the top surface of each of the mirror holders 302. The mobile phone 100 includes a body 1001 having a curved portion 1004 and a planar portion 1005.

所述數位相機模組300缺點在於:將該數位相機模組300安裝於行動電話100內時,若將該鏡筒302之外週緣與頂面相交處抵持於該行動電話100機體1001之曲面部分1004與平面部分1005之臨界點1002或臨界點1002向平面部分1005一側,會使該行動電話100頂部空出很大之空間1003,從而增加該影像感測模組300於行動電話中所占之空間。若將該鏡座301及鏡筒302鋒利的直角邊緣直接抵持於該行動電話100機體1001之曲面部分1004上,不僅易使該行動電話100之機體1001內部受損,而且該直角外邊緣會抵 頂曲面部分1004,會使鏡筒302之頂面與平面部分1005間產生一定之間隙,從而增大整個數位相機模組300於行動電話100中佔用之空間,既相當於無形中增加行動電話100之厚度,不利於行動電話向薄形化方向發展,且亦由於鏡筒302之頂面與平面部分1005間有間隔,而使該數位相機模組300於行動電話100中之安裝穩定性變差。 The digital camera module 300 has the disadvantage that when the digital camera module 300 is installed in the mobile phone 100, if the outer periphery of the lens barrel 302 intersects with the top surface, the surface of the mobile phone 100 is fixed to the surface of the mobile phone 100. The portion 1004 and the critical point 1002 of the plane portion 1005 or the critical point 1002 to the plane portion 1005 side will make a large space 1003 on the top of the mobile phone 100, thereby increasing the image sensing module 300 in the mobile phone. Take up space. If the sharp right-angled edge of the lens holder 301 and the lens barrel 302 directly abut against the curved surface portion 1004 of the mobile phone 100 body 1001, not only the internal body 1001 of the mobile phone 100 is easily damaged, but also the outer edge of the right angle will be Arrive The top curved surface portion 1004 causes a certain gap between the top surface of the lens barrel 302 and the planar portion 1005, thereby increasing the space occupied by the entire digital camera module 300 in the mobile phone 100, which is equivalent to adding the mobile phone 100 invisibly. The thickness is not conducive to the development of the mobile phone in the thinning direction, and the mounting stability of the digital camera module 300 in the mobile phone 100 is deteriorated because of the spacing between the top surface of the lens barrel 302 and the planar portion 1005. .

有鑒於此,本發明提供一種可減小與行動電話內部配合空間之數位相機模組。 In view of this, the present invention provides a digital camera module that can reduce the space for intercommunication with a mobile phone.

另,本發明亦提供一種組裝該數位相機模組之方法。 In addition, the present invention also provides a method of assembling the digital camera module.

一種數位相機模組,其包括一影像感測模組和與其相連接之一鏡頭模組,該鏡頭模組頂面週緣為曲面。 A digital camera module includes an image sensing module and a lens module connected thereto, and a peripheral surface of the lens module is a curved surface.

一種數位相機模組之組裝方法,其包括以下步驟:提供一影像感測模組;提供一頂面週緣為曲面之鏡座;提供一頂面週緣為曲面之鏡筒;將所述鏡座和鏡筒相連接組成一鏡頭模組;將所述鏡頭模組和影像感測模組相連接。 A method for assembling a digital camera module, comprising the steps of: providing an image sensing module; providing a lens holder having a top surface as a curved surface; providing a lens barrel having a top surface as a curved surface; The lens barrels are connected to form a lens module; the lens module and the image sensing module are connected.

相較習知技術,所述數位相機模組採用具有曲面外形之鏡座和鏡筒,不僅可避免鋒利邊緣對與其配合殼體之損傷,而且減少其所占之空間。 Compared with the prior art, the digital camera module adopts a mirror base and a lens barrel with a curved outer shape, which can avoid the damage of the sharp edge to the mating shell and reduce the space occupied by the digital camera module.

所述數位相機模組組裝方法簡單,加工容易,易於達到減小行動電話體積之目的。 The digital camera module has a simple assembly method, is easy to process, and is easy to achieve the purpose of reducing the volume of the mobile phone.

(習知) (known)

100‧‧‧行動電話 100‧‧‧Mobile Phone

1001‧‧‧機體 1001‧‧‧ body

1002‧‧‧臨界點 1002‧‧ ‧ critical point

1003‧‧‧空間 1003‧‧‧ space

1104‧‧‧曲面部分 1104‧‧‧Surface part

1105‧‧‧平面部分 1105‧‧‧ Planar section

300‧‧‧數位相機 300‧‧‧ digital camera

301‧‧‧鏡座 301‧‧‧ mirror base

302‧‧‧鏡筒 302‧‧‧Mirror tube

(本發明) (this invention)

200‧‧‧數位相機模組 200‧‧‧Digital Camera Module

400‧‧‧行動電話 400‧‧‧Mobile Phone

4001‧‧‧機體 4001‧‧‧ body

4002‧‧‧螢幕 4002‧‧‧ screen

4003‧‧‧鍵盤 4003‧‧‧ keyboard

50‧‧‧影像感測模組 50‧‧‧Image Sensing Module

52‧‧‧基板 52‧‧‧Substrate

520‧‧‧頂面 520‧‧‧ top surface

522‧‧‧第一焊墊 522‧‧‧First pad

54‧‧‧影像感測晶片 54‧‧‧Image sensing chip

540‧‧‧感測區 540‧‧‧Sensing area

542‧‧‧第二焊墊 542‧‧‧Second pad

56‧‧‧焊線 56‧‧‧welding line

58‧‧‧透明蓋體 58‧‧‧Transparent cover

60‧‧‧鏡頭模組 60‧‧‧Lens module

62‧‧‧鏡座 62‧‧‧Mirror base

620‧‧‧第一開口端 620‧‧‧first open end

621‧‧‧本體 621‧‧‧Ontology

622‧‧‧第二開口端 622‧‧‧second open end

624‧‧‧外週壁 624‧‧‧ peripheral wall

626‧‧‧凸台 626‧‧‧Boss

628‧‧‧內螺紋 628‧‧‧ internal thread

64‧‧‧鏡筒 64‧‧‧Mirror tube

640‧‧‧頂端 640‧‧‧Top

642‧‧‧底端 642‧‧‧ bottom

644‧‧‧週壁 644‧‧‧The wall

646‧‧‧透光孔 646‧‧‧Light hole

648‧‧‧外螺紋 648‧‧‧ external thread

66‧‧‧鏡片 66‧‧‧ lenses

80‧‧‧黏膠 80‧‧‧Viscos

90‧‧‧容室 90‧‧ ‧ room

圖1係習知數位相機模組安裝於行動電話上之剖視圖;圖2係本發明數位相機模組封裝結構圖;圖3係本發明數位相機模組安裝於行動電話上之剖視圖。 1 is a cross-sectional view of a conventional digital camera module mounted on a mobile phone; FIG. 2 is a block diagram of a digital camera module of the present invention; and FIG. 3 is a cross-sectional view of the digital camera module of the present invention mounted on a mobile phone.

請參閱圖2,本發明較佳實施方式數位相機模組200包括一影像感測模組50和一鏡頭模組60。該影像感測模組50包括一基板52、一影像感測晶片54、複數焊線56和一透明蓋體58。該鏡頭模組60包括一鏡座62、一鏡筒64和一鏡片66。 Referring to FIG. 2 , the digital camera module 200 of the preferred embodiment of the present invention includes an image sensing module 50 and a lens module 60 . The image sensing module 50 includes a substrate 52 , an image sensing wafer 54 , a plurality of bonding wires 56 , and a transparent cover 58 . The lens module 60 includes a lens holder 62, a lens barrel 64 and a lens 66.

該基板52大致呈平板狀,通常由陶瓷或玻璃等材料製成,其具有一頂面520,於該頂面520上設有複數第一焊墊522。 The substrate 52 is substantially flat and is typically made of a material such as ceramic or glass and has a top surface 520 on which a plurality of first pads 522 are disposed.

該影像感測晶片54設置於該基板52之頂面520上,該影像感測晶片54之頂面中部具有一感測區540,於該感測區540週圍佈設有複數第二焊墊542,所述第二焊墊542用於輸出該影像感測晶片54產生之影像訊號。 The image sensing chip 54 is disposed on the top surface 520 of the substrate 52. The top surface of the image sensing chip 54 has a sensing area 540. A plurality of second pads 542 are disposed around the sensing area 540. The second pad 542 is configured to output an image signal generated by the image sensing chip 54.

所述複數焊線56之一端分別連接第一焊墊522,另一端分別連接至第二焊墊542,從而實現基板52與影像感測晶片54之電連接。 One end of the plurality of bonding wires 56 is connected to the first pad 522 and the other end is connected to the second pad 542 respectively, thereby electrically connecting the substrate 52 and the image sensing chip 54.

該透明蓋體58設置於影像感測晶片54之上,其由透光性好之玻璃或塑膠材質製成。 The transparent cover 58 is disposed on the image sensing chip 54 and is made of a light transmissive glass or plastic material.

該鏡座62為中空圓柱狀,其具有一本體621,該本體621具有一第一開口端620、一第二開口端622和一外週壁624。該第一開口端620以封抵該頂面520上之方式固定連接於該基板52上,該第二開口端622和本體621之外週壁624相交處大致呈曲面,該曲面具有一定弧度,該弧度可依需要配合之殼體加以調整。此種設計不僅有助於減小數位相機模組200於具有曲面或斜面 外形之行動電話中所占之空間,從而減小行動電話之體積,有利於行動電話向薄形化方向發展。另,該曲面結構避免了鋒利邊緣對與其配合殼體之損傷,且提高安裝之可靠性。於該本體621內週壁中部向內延伸出一環狀凸台626,該凸台626內直徑之尺寸大於影像感測晶片54之感測區540之長度。凸台626將鏡座62之內部分成兩空間,於第一開口端620一側之空間用以將影像感測晶片54容納於其中,於第二開口端622一側空間之內週壁上形成內螺紋628。該透明蓋體58藉由粘膠80粘接於凸台626之下表面,其尺寸大於凸台626內直徑之尺寸,使影像感測晶片54被封閉於由基板52、鏡座62及其凸台626與透明蓋體58圍成之密閉容室90中,以避免灰塵等雜質之污染。 The lens holder 62 has a hollow cylindrical shape and has a body 621 having a first open end 620, a second open end 622 and an outer peripheral wall 624. The first open end 620 is fixedly connected to the substrate 52 in a manner of sealing against the top surface 520. The second open end 622 and the outer peripheral wall 624 of the body 621 intersect at a substantially curved surface, and the curved surface has a certain curvature. The curvature can be adjusted according to the housing to be fitted. This design not only helps to reduce the digital camera module 200 with curved or beveled surfaces. The space occupied by the shape of the mobile phone, thereby reducing the size of the mobile phone, is conducive to the development of mobile phones in the direction of thinning. In addition, the curved structure avoids the damage of the sharp edge to the mating shell and improves the reliability of the installation. An annular boss 626 extends inwardly from a central portion of the inner wall of the body 621. The diameter of the inner diameter of the boss 626 is greater than the length of the sensing region 540 of the image sensing chip 54. The boss 626 divides the interior of the lens holder 62 into two spaces. The space on the side of the first open end 620 is used to receive the image sensing wafer 54 therein, and is formed on the inner peripheral wall of the space on the side of the second open end 622. Internal thread 628. The transparent cover 58 is adhered to the lower surface of the boss 626 by the adhesive 80, and its size is larger than the inner diameter of the boss 626, so that the image sensing wafer 54 is enclosed by the substrate 52, the mirror 62 and the convex portion thereof. The table 626 and the transparent cover 58 enclose a sealed chamber 90 to prevent contamination of impurities such as dust.

該鏡筒64呈一中空圓筒狀,其具有一頂端640、一底端642和週壁644。該頂端640開有一透光孔646,以保證外部光線進入鏡筒64內;於週壁644上,從其中部到底端642之間形成外螺紋648,用以與鏡座62內螺紋628相配合;該頂端640和週壁644相交處呈曲面,該曲面亦具有一定之弧度並可依需要配合之殼體加以調整。 The lens barrel 64 has a hollow cylindrical shape with a top end 640, a bottom end 642 and a peripheral wall 644. The top end 640 defines a light transmission hole 646 to ensure that external light enters the lens barrel 64. On the peripheral wall 644, an external thread 648 is formed between the middle portion and the bottom end portion 642 for cooperating with the internal thread 628 of the lens holder 62. The top end 640 and the peripheral wall 644 intersect at a curved surface, and the curved surface also has a certain degree of curvature and can be adjusted according to the required housing.

該鏡片66固設於鏡筒64內,其與影像感測晶片54之感測區540相對正,同時與透光孔646之中心對齊。 The lens 66 is fixed in the lens barrel 64 and is opposite to the sensing area 540 of the image sensing wafer 54 while being aligned with the center of the light transmission hole 646.

本發明優選實施方式之數位相機模組200之組裝方法,其包括以下步驟: A method of assembling a digital camera module 200 according to a preferred embodiment of the present invention includes the following steps:

提供一基板52,其具有一頂面520,於該頂面520上設有間隔排列之複數第一焊墊522。 A substrate 52 is provided having a top surface 520 on which a plurality of first pads 522 are spaced apart.

於該基板52之頂面520上塗上粘膠,再將影像感測晶片54放置於該粘膠上,以將影像感測晶片54與基板52連接;該影像感測晶片54頂面中央具有一感測區540,於該感測區540之週緣部佈設有複數第二焊墊542。 An adhesive is applied to the top surface 520 of the substrate 52, and the image sensing wafer 54 is placed on the adhesive to connect the image sensing wafer 54 to the substrate 52. The image sensing wafer 54 has a center in the top surface. The sensing region 540 is provided with a plurality of second pads 542 at a peripheral portion of the sensing region 540.

複數焊線56藉由打線機打出,將每一焊線56之一端電連接於基板52頂面520上之第一焊墊522,另一端電連接於影像感測晶片54上表面之第二焊墊542上,以使影像感測晶片54之訊號得以傳輸至基板52上。該複數焊線56之材料係由導電性較好之黃金等金屬製成。 The plurality of bonding wires 56 are driven by a wire bonding machine, and one end of each bonding wire 56 is electrically connected to the first pad 522 on the top surface 520 of the substrate 52, and the other end is electrically connected to the second electrode of the upper surface of the image sensing chip 54. The pad 542 is mounted to transmit the signal of the image sensing wafer 54 to the substrate 52. The material of the plurality of bonding wires 56 is made of a metal such as gold having good conductivity.

利用射出成型技術製造一中空鏡座62,其方法係利用注塑機將加熱軟化之熔融塑膠材料注入金屬模具之型腔中,經冷卻後從而一次形成具有於第二開口端622和外週壁624相交處呈曲面之鏡座62,並於內週壁上形成內螺紋628。 A hollow mirror holder 62 is manufactured by injection molding technology by injecting a heated softened molten plastic material into a cavity of a metal mold by an injection molding machine, and cooling to form a second open end 622 and a peripheral wall 624 at a time. The intersection is a curved mirror mount 62 and defines internal threads 628 on the inner peripheral wall.

將一由透光性較好之玻璃或塑膠製成之透明蓋體58藉由粘膠80粘接於所述鏡座62凸台626之下表面。 A transparent cover 58 made of a light transmissive glass or plastic is adhered to the lower surface of the boss 626 of the lens holder 62 by an adhesive 80.

利用射出成型技術製造一中空鏡筒64,其製造方法與鏡座62製造方法相同,從而形成具有曲面之鏡筒64,並於鏡筒64之週壁644上形成外螺紋648。 A hollow lens barrel 64 is manufactured by injection molding technique in the same manner as the lens holder 62, thereby forming a lens barrel 64 having a curved surface, and forming an external thread 648 on the peripheral wall 644 of the lens barrel 64.

將鏡片66藉由粘膠固接於鏡筒64內。 The lens 66 is fixed in the lens barrel 64 by adhesive.

將鏡座62之內螺紋628和鏡筒64之外螺紋648相連接,經過調整焦距後,再用粘膠將鏡座62和鏡筒64固定。 The internal thread 628 of the lens holder 62 is connected to the external thread 648 of the lens barrel 64. After the focal length is adjusted, the lens holder 62 and the lens barrel 64 are fixed by adhesive.

最後,將連接有鏡筒64之鏡座62之第一開口端620藉由粘膠封抵於基板52之頂面520上,使影像感測晶片54被封閉於由基板52、鏡座62及其凸台626和透明蓋體58圍成之密閉容室90中,以避免灰塵等雜質之污染,從而完成數位相機模組200之組裝。 Finally, the first open end 620 of the lens holder 62 to which the lens barrel 64 is attached is sealed to the top surface 520 of the substrate 52 by adhesive, so that the image sensing wafer 54 is enclosed by the substrate 52 and the mirror holder 62. The boss 626 and the transparent cover 58 enclose the sealed chamber 90 to prevent contamination of impurities such as dust, thereby completing the assembly of the digital camera module 200.

當該數位相機模組200安裝於行動電話400內時,請參閱圖3,其中行動電話400包括一具有曲面或斜面外形之機體4001、一屏幕4002、一鍵盤4003和安裝於該行動電話400中之數位相機模組200,該數位相機模組200包含具有曲面外形之鏡座62和鏡筒64。將該數位相機模組200安裝於具有曲面 或斜面外形之行動電話400中,藉由該鏡座62和鏡筒64之曲面與該行動電話400邊緣相配合,減小該數位相機模組200於行動電話400中所占之體積。 When the digital camera module 200 is installed in the mobile phone 400, please refer to FIG. 3, wherein the mobile phone 400 includes a body 4001 having a curved or beveled shape, a screen 4002, a keyboard 4003, and is installed in the mobile phone 400. The digital camera module 200 includes a mirror mount 62 having a curved outer shape and a lens barrel 64. Mounting the digital camera module 200 with a curved surface In the mobile phone 400 of the beveled shape, the curved surface of the lens holder 62 and the lens barrel 64 cooperate with the edge of the mobile phone 400 to reduce the volume occupied by the digital camera module 200 in the mobile phone 400.

可以理解,該鏡筒可以省略,可以於鏡座內藉由卡配或粘合等方式固設至少一鏡片以滿足成像之需求。 It can be understood that the lens barrel can be omitted, and at least one lens can be fixed in the lens holder by snapping or bonding to meet the needs of imaging.

可以理解,該鏡座和鏡筒分別包括一頂面和側面,該頂面與該側面相交,所述曲面位於其頂面和側面之相交處。 It can be understood that the lens holder and the lens barrel respectively comprise a top surface and a side surface, the top surface intersecting the side surface, the curved surface being located at the intersection of the top surface and the side surface thereof.

可以理解,於製造鏡座和鏡筒時,可以先成型頂面週緣無曲面之鏡座和鏡筒,經切削加工後可獲得頂面週緣為曲面之鏡座和鏡筒。 It can be understood that when manufacturing the mirror base and the lens barrel, the mirror base and the lens barrel with no curved surface on the top surface of the top surface can be formed, and after the cutting process, the lens holder and the lens barrel with the curved top surface of the top surface can be obtained.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,本發明之範圍幷不以上述實施方式為限,舉凡熟習本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆 應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in accordance with the spirit of the present invention are It should be covered by the following patent application.

200‧‧‧數位相機模組 200‧‧‧Digital Camera Module

50‧‧‧影像感測模組 50‧‧‧Image Sensing Module

52‧‧‧基板 52‧‧‧Substrate

520‧‧‧頂面 520‧‧‧ top surface

522‧‧‧第一焊墊 522‧‧‧First pad

54‧‧‧影像感測晶片 54‧‧‧Image sensing chip

540‧‧‧感測區 540‧‧‧Sensing area

542‧‧‧第二焊墊 542‧‧‧Second pad

56‧‧‧焊線 56‧‧‧welding line

58‧‧‧透明蓋體 58‧‧‧Transparent cover

60‧‧‧鏡頭模組 60‧‧‧Lens module

62‧‧‧鏡座 62‧‧‧Mirror base

620‧‧‧第一開口端 620‧‧‧first open end

621‧‧‧本體 621‧‧‧Ontology

622‧‧‧第二開口端 622‧‧‧second open end

624‧‧‧外週壁 624‧‧‧ peripheral wall

626‧‧‧凸台 626‧‧‧Boss

628‧‧‧內螺紋 628‧‧‧ internal thread

64‧‧‧鏡筒 64‧‧‧Mirror tube

640‧‧‧頂端 640‧‧‧Top

642‧‧‧底端 642‧‧‧ bottom

644‧‧‧週壁 644‧‧‧The wall

646‧‧‧透光孔 646‧‧‧Light hole

648‧‧‧外螺紋 648‧‧‧ external thread

66‧‧‧鏡片 66‧‧‧ lenses

80‧‧‧黏膠 80‧‧‧Viscos

90‧‧‧容室 90‧‧ ‧ room

Claims (12)

一種安裝在行動電話內之數位相機模組,該行動電話包括一具有曲面或斜面外形的機體,該數位相機模組包括:一影像感測模組;一鏡頭模組,其頂面週緣包括一曲面,該鏡頭模組與影像感測模組相連接,該曲面與具有曲面或斜面外形的機體相配合。 A digital camera module installed in a mobile phone, the mobile phone comprising a body having a curved or beveled shape, the digital camera module comprising: an image sensing module; and a lens module having a top surface including a periphery The curved surface is connected to the image sensing module, and the curved surface is matched with a body having a curved or beveled shape. 如申請專利範圍第1項所述之數位相機模組,其中所述鏡頭模組包括一鏡筒,所述鏡筒包括一頂面及一側面,所述曲面設於鏡筒頂面及側面之相交處。 The digital camera module of claim 1, wherein the lens module comprises a lens barrel, the lens barrel includes a top surface and a side surface, and the curved surface is disposed on a top surface and a side surface of the lens barrel. Intersection. 如申請專利範圍第1項所述之數位相機模組,其中所述鏡頭模組包括一鏡座,所述鏡座包括一頂面及一側面,所述曲面設於鏡座頂面及側面之相交處。 The digital camera module of claim 1, wherein the lens module comprises a lens holder, the lens holder comprises a top surface and a side surface, wherein the curved surface is disposed on the top surface and the side surface of the lens holder. Intersection. 如申請專利範圍第1項所述之數位相機模組,其中所述鏡頭模組包括一鏡筒及一鏡座,所述鏡筒包括一頂面及一側面,所述曲面設於鏡筒頂面及側面之相交處;所述鏡座亦包括一頂面和一側面,該鏡座頂面及側面之相交處設有另一曲面。 The digital camera module of claim 1, wherein the lens module comprises a lens barrel and a lens holder, the lens barrel includes a top surface and a side surface, and the curved surface is disposed on the top of the lens barrel. The intersection of the face and the side; the mirror base also includes a top surface and a side surface, and the intersection of the top surface and the side surface of the mirror holder is provided with another curved surface. 如申請專利範圍第1至第4項中任一項所述之數位相機模組,其中所述影像感測模組包括一基板、一影像感測晶片及複數焊線;所述影像感測模組與鏡座固接;所述基板具有一頂面;所述影像感測晶片設置於該基板頂面上;所述複數焊線將基板和影像感測晶片電連接。 The digital camera module of any one of the preceding claims, wherein the image sensing module comprises a substrate, an image sensing chip and a plurality of bonding wires; and the image sensing module The group is fixed to the lens holder; the substrate has a top surface; the image sensing wafer is disposed on the top surface of the substrate; and the plurality of bonding wires electrically connect the substrate and the image sensing wafer. 如申請專利範圍第5項所述之數位相機模組,其中所述鏡座中部內週壁向內延伸出一凸台,所述影像感測模組包括一透明蓋體,所述透明蓋體設置於該凸台之下表面,覆蓋影像感測晶片。 The digital camera module of claim 5, wherein the inner peripheral wall of the middle portion of the lens holder extends inwardly, and the image sensing module comprises a transparent cover body, and the transparent cover body It is disposed on the lower surface of the boss to cover the image sensing wafer. 如申請專利範圍第6項所述之數位相機模組,其中所述透明蓋體、鏡座及其凸台和基板將影像感測晶片密封。 The digital camera module of claim 6, wherein the transparent cover, the mirror holder and the boss thereof and the substrate seal the image sensing wafer. 一種數位相機模組組裝方法,其包括以下步驟:提供一影像感測模組;提供一頂面週緣為曲面之鏡座;提供一頂面週緣為曲面之鏡筒;提供一具有曲面或斜面外形之機體之行動電話;將所述鏡座和鏡筒相連接組成一鏡頭模組;將所述鏡頭模組和影像感測模組相連接;將所述與影像感測模組相連接之鏡頭模組安裝到所述行動電話中,使鏡頭模組周緣的曲面與具有曲面或斜面外形的機體相配合。 A method for assembling a digital camera module, comprising the steps of: providing an image sensing module; providing a mirror base with a top surface as a curved surface; providing a lens barrel with a top surface as a curved surface; providing a curved or beveled shape a mobile phone of the body; connecting the lens holder and the lens barrel to form a lens module; connecting the lens module and the image sensing module; and connecting the lens to the image sensing module The module is mounted in the mobile phone such that the curved surface of the periphery of the lens module matches the body having a curved or beveled shape. 如申請專利範圍第8項所述之數位相機模組組裝方法,其中所述具有曲面之鏡座和鏡筒是係利用射出成型技術製作而成;鏡筒藉由螺紋連接於鏡座上。 The method of assembling a digital camera module according to claim 8, wherein the mirror base and the lens barrel are manufactured by injection molding technology; the lens barrel is screwed to the lens holder. 如申請專利範圍第8項所述之數位相機模組組裝方法,其中鏡座及鏡筒經調整焦距後再用黏膠固定。 The method for assembling a digital camera module according to claim 8, wherein the lens holder and the lens barrel are fixed by a glue after adjusting the focal length. 如申請專利範圍第8項所述之數位相機模組組裝方法,其中所述影像感測模組包括一基板、一影像感測晶片、複數焊線和一透明蓋體;所述影像感測模組與鏡座固接;所述基板具有一頂面;所述影像感測晶片設置於該基板頂面上;所述複數焊線電連接於基板和影像感測晶片上。 The method of assembling a digital camera module according to claim 8, wherein the image sensing module comprises a substrate, an image sensing chip, a plurality of bonding wires and a transparent cover; the image sensing module The group is fixed to the lens holder; the substrate has a top surface; the image sensing wafer is disposed on the top surface of the substrate; and the plurality of bonding wires are electrically connected to the substrate and the image sensing wafer. 如申請專利範圍第11項所述之數位相機模組組裝方法,其中所述鏡座中部內週壁向內延伸出一凸台,所述透明蓋體藉由粘膠固定於鏡座內。 The method of assembling a digital camera module according to claim 11, wherein a central portion of the inner peripheral wall of the lens holder extends inwardly, and the transparent cover is fixed in the lens holder by an adhesive.
TW95137321A 2006-10-11 2006-10-11 Digital camera module and a method of assembling the same TWI394436B (en)

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US5177641A (en) * 1989-10-31 1993-01-05 Asahi Kogaku Kogyo Kabushiki Kaisha Structure for holding lens in lens holding member
JPH09274125A (en) * 1996-04-05 1997-10-21 Minolta Co Ltd Mount structure for plastic lens
US20020191103A1 (en) * 2001-06-05 2002-12-19 Kazuo Akimoto Solid photographing apparatus
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US20040061957A1 (en) * 2002-09-27 2004-04-01 Savage John M. Threaded lens coupling to led apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177641A (en) * 1989-10-31 1993-01-05 Asahi Kogaku Kogyo Kabushiki Kaisha Structure for holding lens in lens holding member
JPH09274125A (en) * 1996-04-05 1997-10-21 Minolta Co Ltd Mount structure for plastic lens
US6678499B1 (en) * 1999-06-30 2004-01-13 Silverbrook Research Pty Ltd Method and system for examinations
US20020191103A1 (en) * 2001-06-05 2002-12-19 Kazuo Akimoto Solid photographing apparatus
US20040061957A1 (en) * 2002-09-27 2004-04-01 Savage John M. Threaded lens coupling to led apparatus

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