TWI387742B - Vibration testing device - Google Patents
Vibration testing device Download PDFInfo
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- TWI387742B TWI387742B TW98120904A TW98120904A TWI387742B TW I387742 B TWI387742 B TW I387742B TW 98120904 A TW98120904 A TW 98120904A TW 98120904 A TW98120904 A TW 98120904A TW I387742 B TWI387742 B TW I387742B
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- vibration
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- electronic product
- testing device
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- 238000012360 testing method Methods 0.000 title claims description 38
- 238000004891 communication Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
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- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Description
本發明涉及一種振動測試裝置。The invention relates to a vibration testing device.
隨著電子技術的快速發展,使得我們的生活愈來愈多的依賴於電子產品,如:手機、上網本、掌上型遊戲機等。為了確保電子產品的高品質,在電子產品的生產過程中,振動測試便成為一個非常重要的環節。通常,電子產品被放在一個振動測試裝置中來測試其振動性能是否達到標準。該振動測試裝置包括承載電子產品的機台和用於量测振動的振動感測器。With the rapid development of electronic technology, our lives are increasingly dependent on electronic products, such as mobile phones, netbooks, and handheld game consoles. In order to ensure the high quality of electronic products, vibration testing has become a very important part in the production of electronic products. Typically, electronic products are placed in a vibration test device to test whether their vibration performance is up to standard. The vibration testing device includes a machine that carries an electronic product and a vibration sensor that measures vibration.
然,習知的被測電子產品產生的振動能量透過機台傳導給振動感測器,在振動測試過程中,電子產品的振動能量會被機台部分吸收,從而減弱振動感測器所能檢測到的電子產品的振動能量,進而影響電子產品的振動測試結果。However, the vibration energy generated by the conventional electronic product under test is transmitted to the vibration sensor through the machine. During the vibration test, the vibration energy of the electronic product is absorbed by the machine part, thereby weakening the vibration sensor can detect The vibration energy of the electronic product that arrives, which in turn affects the vibration test results of the electronic product.
有鑒於此,需提供一種可提高測試精度的振動測試裝置。In view of this, it is necessary to provide a vibration test apparatus which can improve the test accuracy.
一種振動測試裝置,包括機台、振動感測器、傳導部件及彈性元件。機台包括用於承載電子產品的收容部及收容孔,該收容孔與該收容部連通。振動感測器用於測試該電子產品的振動頻率和強度。傳導部件包括支撐部和傳導軸,該傳導軸之一端穿過該收容孔與該振動感測器剛性連接。彈性元件彈性連接於該支撐部與該機台之間。其中,在測試時,該電子產品與該傳導軸的另一端直接接觸,從而該傳導軸可將該電子產品之振動能量直接傳導至該振動感測器。A vibration testing device includes a machine table, a vibration sensor, a conductive member, and an elastic member. The machine base includes a receiving portion for receiving an electronic product and a receiving hole, and the receiving hole is in communication with the receiving portion. A vibration sensor is used to test the vibration frequency and intensity of the electronic product. The conductive member includes a support portion and a conductive shaft, and one end of the conductive shaft is rigidly connected to the vibration sensor through the receiving hole. The elastic member is elastically coupled between the support portion and the machine table. Wherein, during testing, the electronic product is in direct contact with the other end of the conductive shaft, so that the conductive shaft can directly transmit the vibration energy of the electronic product to the vibration sensor.
因電子產品與傳導軸直接緊密接觸,從而電子產品產生的振動能量透過傳導軸直接傳導給振動感測器,減少了測試機台的吸能,增加了電子產品振動測試的準確性。Because the electronic product is in direct contact with the conduction axis, the vibration energy generated by the electronic product is directly transmitted to the vibration sensor through the conduction axis, which reduces the energy absorption of the test machine and increases the accuracy of the vibration test of the electronic product.
圖1係本發明之振動測試裝置100之組裝示意圖。本發明之振動測試裝置100包括振動感測器10、傳導部件20、彈性元件30及機台40。1 is a schematic view showing the assembly of the vibration testing device 100 of the present invention. The vibration testing apparatus 100 of the present invention includes a vibration sensor 10, a conductive member 20, an elastic member 30, and a machine table 40.
機台40用於承載待測試的電子產品200(請參照圖2),其包括收容部42和收容孔48。收容部42用於承載電子產品200。收容孔48設置於收容部42的底部44,並與收容部42連通。收容孔48為台階孔,其包括定位孔480、通孔482及台階部484。定位孔480的直徑大於通孔482的直徑,從而在定位孔480和通孔482之相交處形成台階部484。The machine 40 is used to carry the electronic product 200 to be tested (please refer to FIG. 2 ), and includes a receiving portion 42 and a receiving hole 48 . The accommodating portion 42 is for carrying the electronic product 200. The receiving hole 48 is provided in the bottom portion 44 of the accommodating portion 42 and communicates with the accommodating portion 42. The receiving hole 48 is a stepped hole, and includes a positioning hole 480, a through hole 482, and a step portion 484. The diameter of the positioning hole 480 is larger than the diameter of the through hole 482, so that the step portion 484 is formed at the intersection of the positioning hole 480 and the through hole 482.
振動感測器10用於量測電子產品200的振動頻率和強度,其包括螺紋孔12。The vibration sensor 10 is used to measure the vibration frequency and intensity of the electronic product 200, which includes a threaded hole 12.
傳導部件20與振動感測器10剛性連接,其包括支撐部22和傳導軸24。支撐部22為位於傳導軸24一端的凸緣,支撐部22的直徑大於傳導軸24的直徑並小於定位孔480的直徑。傳導軸24遠離支撐部22的另一端設有螺紋。傳導部件20的傳導軸24穿過收容孔48固定於振動感測器10的螺紋孔12中,以將傳導部件20與振動感測器10剛性連接。在本實施方式中,傳導部件20為螺釘或螺栓。傳導部件20與振動感測器10透過螺紋固定連接。The conductive member 20 is rigidly coupled to the vibration sensor 10 and includes a support portion 22 and a conductive shaft 24. The support portion 22 is a flange at one end of the conduction shaft 24, and the diameter of the support portion 22 is larger than the diameter of the conduction shaft 24 and smaller than the diameter of the positioning hole 480. The other end of the conduction shaft 24 away from the support portion 22 is provided with a thread. The conductive shaft 24 of the conductive member 20 is fixed in the threaded hole 12 of the vibration sensor 10 through the receiving hole 48 to rigidly connect the conductive member 20 with the vibration sensor 10. In the present embodiment, the conductive member 20 is a screw or a bolt. The conductive member 20 is fixedly coupled to the vibration sensor 10 through a screw.
在其它實施方式中,支撐部22為穿過該傳導軸24一端之銷軸,該銷軸的長度大於該傳導軸24的直徑。In other embodiments, the support portion 22 is a pin that passes through one end of the conductive shaft 24, the length of the pin being greater than the diameter of the conductive shaft 24.
彈性元件30套裝於傳導軸24並固定於支撐部22和台階部484之間,以使傳導軸24與電子產品200緊密接觸。在本實施方式中,彈性元件30為彈簧。The elastic member 30 is fitted over the conductive shaft 24 and fixed between the support portion 22 and the step portion 484 to bring the conductive shaft 24 into close contact with the electronic product 200. In the present embodiment, the elastic member 30 is a spring.
圖2係本發明之振動測試裝置100與電子產品200之組裝示意圖。組裝時,電子產品200收容於機台40的收容部42,且電子產品200的振動源(未圖示)恰好抵靠傳導部件20。此時,傳導部件20的支撐部22內缩至收容孔48的定位孔480中,彈性元件30被壓縮。振動感測器10不與機台40直接接觸,即振動感測器10懸吊。2 is a schematic view showing the assembly of the vibration testing device 100 of the present invention and the electronic product 200. At the time of assembly, the electronic product 200 is housed in the accommodating portion 42 of the machine table 40, and the vibration source (not shown) of the electronic product 200 abuts against the conductive member 20. At this time, the support portion 22 of the conductive member 20 is retracted into the positioning hole 480 of the receiving hole 48, and the elastic member 30 is compressed. The vibration sensor 10 is not in direct contact with the machine table 40, that is, the vibration sensor 10 is suspended.
在振動測試時,電子產品200的振動源產生的振動能量透過傳導部件20直接傳導給振動感測器10,再傳導給信號分析儀(未圖示),如電腦,從而分析出電子產品200的振動頻率及強度。During the vibration test, the vibration energy generated by the vibration source of the electronic product 200 is directly transmitted to the vibration sensor 10 through the conductive member 20, and then transmitted to a signal analyzer (not shown), such as a computer, to analyze the electronic product 200. Vibration frequency and intensity.
因電子產品200與傳導軸24緊密接觸,從而電子產品200產生的振動能量透過傳導軸24直接傳導給振動感測器10,進而減少了機台40對電子產品200振動能量的吸收,增加了電子產品200振動測試的準確性。Since the electronic product 200 is in close contact with the conductive shaft 24, the vibration energy generated by the electronic product 200 is directly transmitted to the vibration sensor 10 through the conduction shaft 24, thereby reducing the absorption of the vibration energy of the electronic product 200 by the machine 40, and increasing the electrons. The accuracy of the product 200 vibration test.
因傳導軸24與振動感測器10剛性連接,減少了傳導軸24對電子產品200振動能量的吸收,增加了電子產品200振動測試的準確性。Since the conductive shaft 24 is rigidly connected to the vibration sensor 10, the absorption of the vibration energy of the electronic product 200 by the conduction shaft 24 is reduced, and the accuracy of the vibration test of the electronic product 200 is increased.
在振動測試過程中,振動感測器10不與機台40接觸,從而機台40產生的振動不會傳導給振動感測器10,使振動感測器10量测的振動頻率和振幅準確且穩定,不受其它機構影響,進而保證了電子產品200的振動頻率及強度的測試的準確性。During the vibration test, the vibration sensor 10 is not in contact with the machine 40, so that the vibration generated by the machine 40 is not transmitted to the vibration sensor 10, so that the vibration frequency and amplitude measured by the vibration sensor 10 are accurate and Stable, not affected by other institutions, thereby ensuring the accuracy of the test of the vibration frequency and intensity of the electronic product 200.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本案發明精神所作之等效修飾或變化,皆應包含於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims.
100‧‧‧振動測試裝置100‧‧‧Vibration test device
10‧‧‧振動感測器10‧‧‧Vibration sensor
12‧‧‧螺紋孔12‧‧‧Threaded holes
20‧‧‧傳導部件20‧‧‧Transmission parts
22‧‧‧支撐部22‧‧‧Support
24‧‧‧傳導軸24‧‧‧Transmission axis
30‧‧‧彈性元件30‧‧‧Flexible components
40‧‧‧機台40‧‧‧ machine
42‧‧‧收容部42‧‧‧ Housing Department
44‧‧‧底部44‧‧‧ bottom
48‧‧‧收容孔48‧‧‧ receiving holes
480‧‧‧定位孔480‧‧‧Positioning holes
482‧‧‧通孔482‧‧‧through hole
484‧‧‧台階部484‧‧‧Steps
200‧‧‧電子產品200‧‧‧Electronic products
圖1係本發明之振動測試裝置之組裝示意圖。Figure 1 is a schematic view showing the assembly of the vibration testing device of the present invention.
圖2係本發明之振動測試裝置和電子產品之組裝示意圖。2 is a schematic view showing the assembly of the vibration testing device and the electronic product of the present invention.
100‧‧‧振動測試裝置 100‧‧‧Vibration test device
10‧‧‧振動感測器 10‧‧‧Vibration sensor
12‧‧‧螺紋孔 12‧‧‧Threaded holes
20‧‧‧傳導部件 20‧‧‧Transmission parts
22‧‧‧支撐部 22‧‧‧Support
24‧‧‧傳導軸 24‧‧‧Transmission axis
30‧‧‧彈性元件 30‧‧‧Flexible components
40‧‧‧機台 40‧‧‧ machine
42‧‧‧收容部 42‧‧‧ Housing Department
44‧‧‧底部 44‧‧‧ bottom
48‧‧‧收容孔 48‧‧‧ receiving holes
480‧‧‧定位孔 480‧‧‧Positioning holes
482‧‧‧通孔 482‧‧‧through hole
484‧‧‧台階部 484‧‧‧Steps
Claims (7)
機台,包括用於承載電子產品的收容部及收容孔,該收容孔與該收容部連通;
振動感測器,用於測試該電子產品的振動頻率和強度;
傳導部件,包括支撐部和傳導軸,該傳導軸之一端穿過該收容孔與該振動感測器剛性連接;及
彈性元件,彈性連接於該支撐部與該機台之間;
其中,在測試時,該電子產品與該傳導軸的另一端直接接觸,從而該傳導軸可將該電子產品之振動能量直接傳導至該振動感測器。A vibration testing device comprising:
The machine base includes a receiving portion for receiving an electronic product and a receiving hole, and the receiving hole is in communication with the receiving portion;
a vibration sensor for testing the vibration frequency and intensity of the electronic product;
The conductive member includes a support portion and a conductive shaft, and one end of the conductive shaft is rigidly connected to the vibration sensor through the receiving hole; and an elastic member is elastically connected between the support portion and the machine table;
Wherein, during testing, the electronic product is in direct contact with the other end of the conductive shaft, so that the conductive shaft can directly transmit the vibration energy of the electronic product to the vibration sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98120904A TWI387742B (en) | 2009-06-22 | 2009-06-22 | Vibration testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98120904A TWI387742B (en) | 2009-06-22 | 2009-06-22 | Vibration testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201100772A TW201100772A (en) | 2011-01-01 |
| TWI387742B true TWI387742B (en) | 2013-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98120904A TWI387742B (en) | 2009-06-22 | 2009-06-22 | Vibration testing device |
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| Country | Link |
|---|---|
| TW (1) | TWI387742B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI711812B (en) * | 2019-05-31 | 2020-12-01 | 國立高雄科技大學 | Inductive pressure plate type real-time monitoring device |
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| Publication number | Publication date |
|---|---|
| TW201100772A (en) | 2011-01-01 |
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