TWI382278B - Mold film composition for forming pattern and mold film manufactured by using the same - Google Patents
Mold film composition for forming pattern and mold film manufactured by using the same Download PDFInfo
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- TWI382278B TWI382278B TW097128912A TW97128912A TWI382278B TW I382278 B TWI382278 B TW I382278B TW 097128912 A TW097128912 A TW 097128912A TW 97128912 A TW97128912 A TW 97128912A TW I382278 B TWI382278 B TW I382278B
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- Prior art keywords
- acrylate
- meth
- weight
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- oligomer
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- 239000000203 mixture Substances 0.000 title claims description 29
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 45
- 239000000178 monomer Substances 0.000 claims description 18
- 239000000654 additive Substances 0.000 claims description 12
- 230000000996 additive effect Effects 0.000 claims description 10
- 229920000728 polyester Polymers 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 claims description 2
- 150000008062 acetophenones Chemical class 0.000 claims description 2
- 125000005605 benzo group Chemical group 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical class [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 claims description 2
- 239000003999 initiator Substances 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- 150000008366 benzophenones Chemical class 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000012954 diazonium Substances 0.000 claims 1
- 150000001989 diazonium salts Chemical class 0.000 claims 1
- 150000002170 ethers Chemical class 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 46
- -1 acryl Chemical group 0.000 description 19
- 239000000758 substrate Substances 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052707 ruthenium Inorganic materials 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 241000219739 Lens Species 0.000 description 6
- 239000012467 final product Substances 0.000 description 6
- 238000001459 lithography Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000001406 capillary force lithography Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 238000000845 micromoulding in capillary Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000006552 photochemical reaction Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- RHUYHJGZWVXEHW-UHFFFAOYSA-N 1,1-Dimethyhydrazine Chemical compound CN(C)N RHUYHJGZWVXEHW-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- YSVQGHIOJPVICX-UHFFFAOYSA-N 1-(1-hydroxycyclohexyl)-1-phenylpropan-2-one Chemical compound C1CCCCC1(O)C(C(=O)C)C1=CC=CC=C1 YSVQGHIOJPVICX-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical group C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- FSPSELPMWGWDRY-UHFFFAOYSA-N m-Methylacetophenone Chemical compound CC(=O)C1=CC=CC(C)=C1 FSPSELPMWGWDRY-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 238000001682 microtransfer moulding Methods 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 238000001127 nanoimprint lithography Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- YQUQWHNMBPIWGK-UHFFFAOYSA-N p-isopropyl-phenol Natural products CC(C)C1=CC=C(O)C=C1 YQUQWHNMBPIWGK-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 125000004805 propylene group Chemical class [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Polymerisation Methods In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
本發明係關於一種模製薄膜組合物(mold film composition)，其係於製造半導體裝置、電子裝置、光電裝置、磁裝置、顯示器裝置、微電機系統、或光學透鏡薄片(例如：稜鏡薄片及扁豆狀透鏡薄片)等時，用於形成圖案於一基板(substrate)上。本發明亦關於一種利用該模製薄膜組合物所製得之模製薄膜(mold film)。The present invention relates to a mold film composition for manufacturing a semiconductor device, an electronic device, an optoelectronic device, a magnetic device, a display device, a micro-motor system, or an optical lens sheet (for example, a bismuth sheet and The lentil lens sheet) is used to form a pattern on a substrate. The invention also relates to a mold film made using the molded film composition.
一般而言，當製造半導體裝置、電子裝置、光電裝置、磁裝置、顯示器裝置、微電機系統、或光學透鏡薄片(例如：稜鏡薄片及扁豆狀透鏡薄片)等時，須進行一將微圖案(micropattern)形成於基板上之製程。微影技術(photolithography)係一種利用光以在一基板上形成微圖案之程序。In general, when manufacturing a semiconductor device, an electronic device, an optoelectronic device, a magnetic device, a display device, a micro-motor system, or an optical lens sheet (for example, a sheet of enamel and a lenticular lens sheet), a micropattern is required. (micropattern) A process formed on a substrate. Photolithography is a process that uses light to form a micropattern on a substrate.
然而，習知微影製程所涉之操作係：基板清理、基板表面處理、感光聚合物塗佈、軟烤(soft－baking)、曝光、顯影(development)、清洗、及硬烤(hard－baking)。因此，習知微影製程係複雜、耗時、且須昂貴的裝備。是故，增加了製造成本且降低生產力。However, the conventional lithography process involves: substrate cleaning, substrate surface treatment, photopolymer coating, soft-baking, exposure, development, cleaning, and hard-baking. ). Therefore, conventional lithography processes are complex, time consuming, and expensive equipment. Therefore, it increases manufacturing costs and reduces productivity.
為克服微影技術的問題，已提出非傳統式平版印刷術(lithography)。To overcome the problems of lithography, non-traditional lithography has been proposed.
非傳統式平版印刷術的例子為：奈米壓模微影術 (nanoimprint lithography)、微接觸式印刷術(micro contact printing，μCP)、毛細管微模製法(micro－molding in capillaries，MIMIC)、微轉換成型(micro－transfer molding，μTM)、軟模製(soft molding)、及毛細力微影術(capillary force lithography，CFL)。An example of non-traditional lithography is: nano-die lithography (nanoimprint lithography), micro contact printing (μCP), micro-molding in capillaries (MIMIC), micro-transfer molding (μTM), soft molding (soft molding) ), and capillary force lithography (CFL).
除上述形成圖案之方法外，亦已知一種使用金屬模以形成圖案之方法。然而，若使用金屬模，薄的薄膜金屬模不易處理，且須耗時地製造，故即使轉錄(transcription)可精確地進行，製造成本亦是昂貴的。In addition to the above-described method of forming a pattern, a method of forming a pattern using a metal mold is also known. However, if a metal mold is used, a thin film metal mold is difficult to handle and time-consuming to manufacture, so even if the transcription can be accurately performed, the manufacturing cost is expensive.
可利用一用於形成圖案之模製薄膜以形成一微圖案。對用於製造該模製薄膜之組合物而言，熱阻係一重要特性。A molded film for patterning can be utilized to form a micropattern. Thermal resistance is an important property for the composition used to make the molded film.
因此，本發明提供一種用於形成圖案之模製薄膜。於利用該模製薄膜製造最終產物之製程中，當該模製薄膜長時間地重覆暴露於紫外線下時，該模製薄膜不會使利用其所形成之圖案變形，並提供高品質予利用其所製得之最終產物。Accordingly, the present invention provides a molded film for forming a pattern. In the process for producing the final product by using the molded film, when the molded film is repeatedly exposed to ultraviolet light for a long time, the molded film does not deform the pattern formed by the molded film, and provides high quality and utilization. The final product it produces.
本發明一方面提供一種用於形成圖案之模製薄膜組合物，以100重量份數之該組合物計，包含：30至70重量份數之一或多種選自以下群組之活性寡聚物(reactive oligomer)：以聚酯為基質之活性寡聚物、以矽為基質之活性寡聚物、以丙烯醛基(acryl)為基質之活性寡聚物、及以環氧丙烯酸酯為基質之寡聚物；30至70重量份數之一具至少一不飽和基之單官能基或多官能基單體；以及一1至10重量份數之光起始劑 (photoinitiator)。In one aspect, the present invention provides a molded film composition for forming a pattern comprising, in an amount of from 30 to 70 parts by weight, based on 100 parts by weight of the composition, of an active oligomer selected from the group consisting of Reactive oligomer: a polyester-based active oligomer, a ruthenium-based active oligomer, an acryl-based active oligomer, and an epoxy acrylate-based Oligomer; 30 to 70 parts by weight of a monofunctional or polyfunctional monomer having at least one unsaturated group; and 1 to 10 parts by weight of a photoinitiator (photoinitiator).
本發明另一方面提供一種用於形成圖案之模製薄膜，其係利用該模製薄膜組合物所製得。Another aspect of the present invention provides a molded film for forming a pattern which is produced by using the molded film composition.
本發明係提供一種具極佳熱阻且用於形成圖案之模製薄膜組合物，以及一利用該模製薄膜組合物所製得之模製薄膜。SUMMARY OF THE INVENTION The present invention provides a molded film composition having excellent thermal resistance and used for patterning, and a molded film obtained by using the molded film composition.
如上所述，本發明用於形成圖案之模製薄膜組合物具極佳熱阻。因此，若利用該模製薄膜組合物於基板上形成一圖案，即使長時間重覆地暴露於紫外線下，該圖案也不會變形，因此改善了形成於基板上之圖案的均勻性。As described above, the molded film composition for forming a pattern of the present invention has excellent heat resistance. Therefore, if a pattern is formed on the substrate by using the molded film composition, the pattern is not deformed even if it is repeatedly exposed to ultraviolet light for a long period of time, thereby improving the uniformity of the pattern formed on the substrate.
以下將以例示之實施態樣更完整地描述本發明。The invention will be described more fully hereinafter with reference to the illustrated embodiments.
本發明之一實施態樣之一用於形成圖案之模製薄膜組合物，以100重量份數之該組合物計，包含：30至70重量份數之一或多種選自以下群組之活性寡聚物：以聚酯為基質之活性寡聚物、以矽為基質之活性寡聚物、以丙烯醛基為基質之活性寡聚物、及以環氧丙烯酸酯為基質之寡聚物；30至70重量份數之一具至少一不飽和基之單官能基或多官能基單體；以及一1至10重量份數之光起始劑。One of the embodiments of the present invention is for forming a patterned molded film composition comprising, in an amount of from 30 to 70 parts by weight, based on 100 parts by weight of the composition, of one or more activities selected from the group consisting of Oligomers: polyester-based active oligomers, ruthenium-based active oligomers, acrolein-based active oligomers, and epoxy acrylate-based oligomers; 30 to 70 parts by weight of a monofunctional or polyfunctional monomer having at least one unsaturated group; and 1 to 10 parts by weight of a photoinitiator.
當使用一或多種選自以聚酯為基質之活性寡聚物、以矽為基質之活性寡聚物、以丙烯醛基為基質之活性寡聚物、及以環氧丙烯酸酯為基質之寡聚物所組成之群組之活性寡聚物時，係藉由雙官能基至六官能基之丙烯酸酯基來發生光化學反應。When one or more active oligomers selected from polyester-based substrates, active oligomers based on ruthenium, active oligomers based on acrolein, and epoxy acrylate-based oligomers are used. When the reactive oligomers of the group consisting of the polymers are photochemically reacted by a difunctional to hexafunctional acrylate group.
活性寡聚物係一提供本發明之用於形成一圖案之模製薄膜 之基本物理特性的成分，並改善了形成於該模製薄膜中之凹板印刷圖案(intaglio pattern)的熱阻。The active oligomer is a molded film for forming a pattern of the present invention. The composition of the basic physical properties and improves the thermal resistance of the intaglio pattern formed in the molded film.
以100重量份數之該組合物計，一或多種選自以聚酯為基質之活性寡聚物、以矽為基質之活性寡聚物、以丙烯醛基為基質之活性寡聚物、及以環氧丙烯酸酯為基質之寡聚物所組成之群組之活性寡聚物，其含量可為30至70重量份數。若該活性寡聚物之含量係於上述範圍內，則由於足夠的熱阻及經調整的黏度，將可提升加工性。One or more selected from the group consisting of a polyester-based active oligomer, a ruthenium-based active oligomer, an acrolein-based active oligomer, and 100 parts by weight of the composition The active oligomer of the group consisting of epoxy acrylate-based oligomers may be included in an amount of 30 to 70 parts by weight. If the content of the active oligomer is within the above range, workability can be improved due to sufficient thermal resistance and adjusted viscosity.
以聚酯為基質之活性寡聚物可為一分子量為200至5,000之雙官能基或多於雙官能基之寡聚物。此外，以矽為基質之活性寡聚物可為一分子量為200至5,000之雙官能基或多於雙官能基之寡聚物。The polyester-based reactive oligomer can be a difunctional or more than difunctional oligomer having a molecular weight of from 200 to 5,000. Further, the ruthenium-based active oligomer may be a difunctional group having a molecular weight of 200 to 5,000 or an oligomer having more than a difunctional group.
另外，以丙烯醛基為基質之活性寡聚物可為一分子量為200至5,000之雙官能基或多於雙官能基之以丙烯酸酯為基質之寡聚物。Further, the acrolein-based reactive oligomer may be an acrylate-based oligomer having a difunctional group having a molecular weight of 200 to 5,000 or more than a difunctional group.
活性寡聚物可為芳香族寡聚物(例如：芳香族聚酯丙烯酸酯)或脂肪族寡聚物(Aliphati oligomer)。此外，活性寡聚物之羥值可為50至500毫克氫氧化鉀/公克，且黏度可為300至20,000厘泊(centipoises，cps)。The reactive oligomer may be an aromatic oligomer (for example, an aromatic polyester acrylate) or an aliphatic oligomer (Aliphati oligomer). Further, the reactive oligomer may have a hydroxyl value of 50 to 500 mg of potassium hydroxide per gram and a viscosity of 300 to 20,000 centipoises (cps).
若活性寡聚物之羥值低於50毫克氫氧化鉀/公克，則黏著力可能不足。另一方面，若活性寡聚物之羥值高於500毫克氫氧化鉀/公克，則吸水率高，因此耐候性不足。If the hydroxyl value of the active oligomer is less than 50 mg of potassium hydroxide per gram, the adhesion may be insufficient. On the other hand, if the hydroxyl value of the active oligomer is higher than 500 mg of potassium hydroxide per gram, the water absorption rate is high, and thus the weather resistance is insufficient.
根據本發明，具至少一不飽合基之單官能基或多官能基單體 係與活性寡聚物之一活性官能基發生光化學反應，以加強凹板印刷圖案的塗佈特性，其中凹板印刷圖案係形成於用於形成圖案之模製薄膜中。具至少一不飽合基之單官能基或多官能基單體則降低了活性寡聚物的黏度。According to the invention, a monofunctional or polyfunctional monomer having at least one unsaturated group The photochemical reaction is carried out with a reactive functional group of one of the active oligomers to enhance the coating characteristics of the intaglio printing pattern, wherein the intaglio printing pattern is formed in the molded film for forming the pattern. Monofunctional or polyfunctional monomers having at least one unsaturated group reduce the viscosity of the reactive oligomer.
根據本發明，由於活性寡聚物一般具等於或大於5,000厘泊之高黏度，故必須將活性寡聚物之黏度降低至例如小於2,000厘泊，以形成用於形成圖案之模製薄膜的凹板印刷圖案。因此，將具至少一不飽合基之單官能基或多官能基單體加入活性寡聚物中，以降低活性寡聚物的黏度。According to the present invention, since the active oligomer generally has a high viscosity of 5,000 centipoise or more, it is necessary to reduce the viscosity of the active oligomer to, for example, less than 2,000 centipoise to form a concave film for forming a patterned film. Board printing pattern. Thus, a monofunctional or polyfunctional monomer having at least one unsaturated group is added to the reactive oligomer to reduce the viscosity of the reactive oligomer.
以100重量份數之該組合物計，具至少一不飽合基之單官能基或多官能基單體之含量可為30至70重量份數。此時，若單官能基或多官能基單體之含量係於上述範圍內，則由於經調整的黏度，將可提升加工性，並改善塗佈之熱特性。The content of the monofunctional or polyfunctional monomer having at least one unsaturated group may be from 30 to 70 parts by weight based on 100 parts by weight of the composition. At this time, if the content of the monofunctional or polyfunctional monomer is within the above range, the workability can be improved and the thermal properties of the coating can be improved due to the adjusted viscosity.
單官能基或多官能基單體可為一單官能基之(甲基)丙烯酸酯或多官能基之(甲基)丙烯酸酯之單體，例如：多官能基之二－或三－(甲基)丙烯酸酯單體。The monofunctional or polyfunctional monomer may be a monofunctional (meth) acrylate or a polyfunctional (meth) acrylate monomer, for example: a polyfunctional group of two or three - (A) Base) acrylate monomer.
單官能基(甲基)丙烯酸酯或多官能基(甲基)丙烯酸酯之單體可為：2－羥基乙基(甲基)丙烯酸酯、2－羥基丙基(甲基)丙烯酸酯、四氫糠基(甲基)丙烯酸酯(tetrahydrofurfuryl(metha)acrylate)、丁氧基乙基(甲基)丙烯酸酯、乙基二乙二醇(甲基)丙烯酸酯、2－乙基己基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯、苯氧基乙基(甲基)丙烯酸酯、雙環戊二烯(甲基)丙烯酸酯、聚乙二醇(甲基)丙 烯酸酯、聚丙二醇(甲基)丙烯酸酯、甲基三二乙二醇(甲基)丙烯酸酯(methyltriethylene diglycol(metha)acrylate)、異莰基(甲基)丙烯酸酯、N－乙烯基砒喀烷酮(N－vinyl pyrrolidone)、N－乙烯基己內醯胺、二丙酮丙烯醯胺、異丁氧基甲基(甲基)丙烯醯胺、N,N－二甲基(甲基)丙烯醯胺、三級辛基(甲基)丙烯醯胺、二甲基氨基乙基(甲基)丙烯酸酯、丙烯醯基嗎福林(acryloyl morpholine)、雙環戊烯基(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、1,4－丁二醇二(甲基)丙烯酸酯、1,6－己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、三羥甲基丙烷三氧乙基(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、雙環癸烷二甲醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、雙環戊烷二(甲基)丙烯酸酯、或雙環戊二烯二(甲基)丙烯酸酯等。較佳地，單官能基(甲基)丙烯酸酯或多官能基(甲基)丙烯酸酯之單體為：2－羥基乙基(甲基)丙烯酸酯、2－羥基丙基(甲基)丙烯酸酯、聚丙二醇(甲基)丙烯酸酯、異莰基(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、或三羥甲基丙烷三(甲基)丙烯酸酯等。其可以單獨或至少二者之結合的方式來使用。然而，單官能基或多官能基單體並不限於此。The monofunctional (meth) acrylate or polyfunctional (meth) acrylate monomer may be: 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, four Tetrahydrofurfuryl (metha) acrylate, butoxyethyl (meth) acrylate, ethyl diethylene glycol (meth) acrylate, 2-ethylhexyl (methyl) Acrylate, cyclohexyl (meth) acrylate, phenoxyethyl (meth) acrylate, dicyclopentadiene (meth) acrylate, polyethylene glycol (methyl) propyl Ethyl ester, polypropylene glycol (meth) acrylate, methyltriethylene diglycol (meth) acrylate, isodecyl (meth) acrylate, N-vinyl fluorene N-vinyl pyrrolidone, N-vinyl caprolactam, diacetone acrylamide, isobutoxymethyl (meth) acrylamide, N, N-dimethyl (methyl) Acrylamide, tertiary octyl (meth) acrylamide, dimethylaminoethyl (meth) acrylate, acryloyl morpholine, dicyclopentenyl (meth) acrylate , trimethylolpropane tri (meth) acrylate, neopentyl alcohol tri (meth) acrylate, neopentyl alcohol tetra (meth) acrylate, ethylene glycol di (meth) acrylate, four Ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(methyl) Acrylate, neopentyl glycol di(meth)acrylate, trimethylolpropane trioxyethyl (meth) acrylate, tricyclodecane dimethanol di(meth) acrylate, dicyclodecane dimethanol Di(meth)propene Esters, tripropylene glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, dicyclopentadiene or di (meth) acrylate. Preferably, the monofunctional (meth) acrylate or polyfunctional (meth) acrylate monomer is: 2-hydroxyethyl (meth) acrylate, 2-hydroxy propyl (meth) acrylate Ester, polypropylene glycol (meth) acrylate, isodecyl (meth) acrylate, triethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, or trimethylolpropane tri (Meth) acrylate, etc. It can be used alone or in combination of at least two. However, the monofunctional or polyfunctional monomer is not limited thereto.
光起始劑係利用光來啟動活性寡聚物與單官能基或多官能 基單體間的光化學反應。在這裡，光可為紫外線及電子射線之其中一者。Photoinitiators use light to initiate reactive oligomers with monofunctional or polyfunctional Photochemical reaction between the monomers. Here, light can be one of ultraviolet rays and electron rays.
以100重量份數之該組合物計，光起始劑之含量可為1至10重量份數。此時，若光起始劑之含量係於上述範圍內，則可控制反應速率，因而增加形成於根據本發明所製得之用於形成圖案之模製薄膜中之凹板印刷圖案的撓性，並可避免凹板印刷圖案的剝落及其對基板附著力的降低。The photoinitiator may be included in an amount of from 1 to 10 parts by weight based on 100 parts by weight of the composition. At this time, if the content of the photoinitiator is within the above range, the reaction rate can be controlled, thereby increasing the flexibility of the intaglio printing pattern formed in the molded film for patterning prepared according to the present invention. And the peeling of the gravure printing pattern and the reduction of the adhesion to the substrate can be avoided.
光起始劑可為至少一選自以下群組之自由基起始劑：苯甲基縮酮、安息香醚、苯乙酮衍生物、酮肟(ketoxime)醚類、二苯基酮、及以苯并(benzo)或硫雜氧葱酮(thioxantone)為基質之化合物；至少一選自以下群組之陽離子起始劑：鎓鹽(onium salts)、二茂鐵鹽(ferrocenium salts)、及重氮鹽；或其混合物。尤其，若光係紫外光，則可使用以下光起始劑。The photoinitiator may be at least one radical initiator selected from the group consisting of benzyl ketal, benzoin ether, acetophenone derivative, ketoxime ether, diphenyl ketone, and a benzo or thioxantone-based compound; at least one cationic starter selected from the group consisting of onium salts, ferrocenium salts, and heavy a nitrogen salt; or a mixture thereof. In particular, if the light is ultraviolet light, the following photoinitiator can be used.
舉例而言，光起始劑可為：1－羥基環己基苯基丙酮、2,2－二甲氧基－2－苯基－苯乙酮、氧葱酮(xanthone)、苯甲醛、蒽醌(anthraquinone)、3－甲基苯乙酮、4－氯二苯基酮、4,4’－二甲氧基二苯基酮、4,4’－二氨基二苯基酮、安息香丙基醚、安息香乙基醚、1－(4－異丙基酚)－2－羥基－2－甲基丙烷－1－酮、或硫雜氧葱酮(thioxanthone)等，但並不限於此。可以單獨或至少二者之結合的方式利用可自市面購得之Irgacure 184、369、651、819、907、1700、及1800(賽百特用化學品公司，Ciba Specialty Chemicals Corp.)；Darocure 1173及1116(默克公司，Merck Corp.)；以及Ubecyl－936(UCB化學品公司，UCB Chemicals, Inc.)等。For example, the photoinitiator can be: 1-hydroxycyclohexylphenylacetone, 2,2-dimethoxy-2-phenyl-acetophenone, xanthone, benzaldehyde, hydrazine (anthraquinone), 3-methylacetophenone, 4-chlorodiphenyl ketone, 4,4'-dimethoxydiphenyl ketone, 4,4'-diaminodiphenyl ketone, benzoin propyl ether And, but not limited to, benzoin ethyl ether, 1-(4-isopropylphenol)-2-hydroxy-2-methylpropan-1-one, or thioxanthone. Commercially available Irgacure 184, 369, 651, 819, 907, 1700, and 1800 (Ciba Specialty Chemicals Corp.); Darocure 1173 may be utilized, either alone or in combination of at least two. And 1116 (Merck, Merck Corp.); and Ubecyl-936 (UCB Chemicals, UCB Chemicals, Inc.) and so on.
同時，以100重量份數之該組合物計，本發明之用於形成一圖案之該模製薄膜組合物可更包含一0.01至3重量份數之添加劑。若添加劑之含量係於上述範圍內，則模製薄膜與最終產物間具極佳分離性(detachability)及極佳附著力，且即使模製薄膜暴露於高溫及高濕度下，亦不會發生白化(whitening)。Meanwhile, the molded film composition for forming a pattern of the present invention may further comprise 0.01 to 3 parts by weight of the additive, based on 100 parts by weight of the composition. If the content of the additive is within the above range, the molded film and the final product have excellent detachability and excellent adhesion, and even if the molded film is exposed to high temperature and high humidity, whitening does not occur. (whitening).
添加劑可為以氟為基質之添加劑及以矽為基質之添加劑之至少一者。以氟為基質之添加劑及以矽為基質之添加劑可為：一活性單體或一具一矽基之活性寡聚物，例如：包含矽基之乙烯化合物、包含矽基之(甲基)丙烯酸酯化合物、包含(甲基)丙烯酰氧基(acryloxy)之有機矽氧烷、或矽化聚丙烯酸酯；一活性單體或一具一氟基之活性寡聚物，例如：包含氟烷基之乙烯化合物、包含氟烷基之(甲基)丙烯酸酯化合物、或氟化聚丙烯酸酯；一具一矽基或一氟基之樹脂，例如：聚雙甲基矽氧烷及一氟聚合物；以及一具一矽基或一氟基之表面活性劑或油，例如：二甲基矽油，但並不限於此。可再將一具流動性、滑動性(slidability)、及調平(leveling)特性之抗靜電劑加入組合物中，作為一添加劑。抗靜電劑可為帶負電荷之抗靜電劑。The additive may be at least one of a fluorine-based additive and a ruthenium-based additive. The fluorine-based additive and the ruthenium-based additive may be: an active monomer or a fluorene-based active oligomer, for example, a vinyl compound containing a mercapto group, a (meth)acrylic acid containing a mercapto group. An ester compound, an organic siloxane having a (meth)acryloyloxy group, or a deuterated polyacrylate; an active monomer or a living oligomer having a monofluoro group, for example, comprising a fluoroalkyl group a vinyl compound, a fluoroalkyl group-containing (meth) acrylate compound, or a fluorinated polyacrylate; a fluorenyl or fluoro group-containing resin such as polydimethylsiloxane and a fluoropolymer; And a surfactant or oil having a mono- or fluoro group, such as dimethyl hydrazine, but is not limited thereto. An antistatic agent having fluidity, slidability, and leveling properties can be added to the composition as an additive. The antistatic agent can be a negatively charged antistatic agent.
本發明之另一實施態樣中，可利用用於形成圖案之模製薄膜組合物來製造一用於形成圖案之模製薄膜。In another embodiment of the present invention, a molded film for forming a pattern can be fabricated using a molded film composition for forming a pattern.
根據本發明，一具均勻線寬之凹板印刷圖案，或者，任意地形成於利用用於形成圖案之模製薄膜組合物所製得之模製薄膜中的凹板印刷圖案。若利用用於形成圖案之模製薄膜製造半 導體裝置、電子裝置、光電裝置、磁裝置、顯示器裝置、微電機系統、或光學透鏡薄片(例如：稜鏡薄片及扁豆狀透鏡薄片)等時，可於基板上形成一具極佳均勻性之微圖案(micropattern)。According to the present invention, a gravure printing pattern having a uniform line width, or an embossed printing pattern arbitrarily formed in a molding film obtained by using the molding film composition for forming a pattern. If half of the molded film used to form the pattern is used Conductor device, electronic device, photoelectric device, magnetic device, display device, micro motor system, or optical lens sheet (for example, enamel sheet and lentil lens sheet), etc., can form an excellent uniformity on the substrate Micropattern.
尤其，利用本發明用於形成圖案之模製薄膜，於一安裝於顯示器裝置中的薄片上形成圖案時，可均勻地於薄片上形成一微圖案，因此可避免當將薄片安裝於顯示器裝置中時，由於形成於薄片上之圖案的變形所造成的亮度降低。In particular, with the molding film for forming a pattern of the present invention, a pattern can be uniformly formed on the sheet when a pattern is formed on a sheet mounted in the display device, thereby preventing the sheet from being mounted in the display device. At the time, the brightness due to the deformation of the pattern formed on the sheet is lowered.
下文中將參考以下實施例及比較例更為詳細地描述本發明。以下實施例僅用於例示之目的，而非用於限制本發明之範疇。Hereinafter, the present invention will be described in more detail with reference to the following examples and comparative examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.
將下述本發明之一實施態樣之模製薄膜組合物塗佈於一厚度為188微米之聚酯薄膜上，使模製薄膜組合物之厚度為約35微米，以形成一用於形成圖案之扁豆狀模製薄膜。使用一高壓汞燈(500微焦耳/平方公尺)作為紫外線。The molded film composition of one embodiment of the present invention described below was coated on a polyester film having a thickness of 188 μm so that the thickness of the molded film composition was about 35 μm to form a pattern for forming Lentil-like molded film. A high pressure mercury lamp (500 microjoules per square meter) was used as the ultraviolet light.
除將下述之模製薄膜組合物塗佈於一厚度為188微米之聚酯薄膜上之外，以與實施例1相同之方式製造一厚度為約35微米之扁豆狀模製薄膜。A lentil-shaped molded film having a thickness of about 35 μm was produced in the same manner as in Example 1 except that the molded film composition described below was applied onto a polyester film having a thickness of 188 μm.
當旋轉實施例1及比較例1所製得之模製薄膜以製造最終產物時，以紫外線(約500微焦耳/平方公尺)重覆地照射該些模製薄膜。若重覆使用比較例1所製得之模製薄膜約50次，則該模製薄膜的圖案就會變形，因而使最終產物之亮度降低逾1%。然而，實施例1所製得之本發明之一實施態樣之模製薄膜具極佳的熱阻，即使在與比較例1相同之條件下，重覆使用模製薄膜超過約300次，模製薄膜亦不會變形，因此最終產物 之亮度亦不會降低。When the molded films obtained in Example 1 and Comparative Example 1 were rotated to produce a final product, the molded films were repeatedly irradiated with ultraviolet rays (about 500 μJoules/m 2 ). If the molded film obtained in Comparative Example 1 was repeatedly used about 50 times, the pattern of the molded film was deformed, thereby lowering the brightness of the final product by more than 1%. However, the molded film of one embodiment of the present invention obtained in Example 1 had excellent heat resistance, and even under the same conditions as in Comparative Example 1, the molded film was repeatedly used more than about 300 times, and the mold was used. The film will not deform, so the final product The brightness will not decrease.
儘管已以例示性實施態樣詳細描述本發明，但熟悉此項技術者將了解在未背離本發明之精神與範疇下，可針對本發明之形式及細節進行不同改變。本發明之範疇係以下述申請專利範圍定義。Although the present invention has been described in detail with reference to the embodiments of the present invention, it will be understood that The scope of the invention is defined by the scope of the following claims.
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020070076984A KR100902550B1 (en) | 2007-07-31 | 2007-07-31 | Mold film composition for pattern formation and mold film for pattern formation produced thereby |
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| TW200925781A TW200925781A (en) | 2009-06-16 |
| TWI382278B true TWI382278B (en) | 2013-01-11 |
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| KR (1) | KR100902550B1 (en) |
| CN (1) | CN101711375A (en) |
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| KR102452035B1 (en) | 2017-04-14 | 2022-10-11 | 삼성디스플레이 주식회사 | Composition for soft mold and soft mold manufactured by using the composition |
| KR102297307B1 (en) * | 2020-08-18 | 2021-09-02 | 황진상 | Preparation method of embossing release film for semiconductor package mold, and embossing release film thereof |
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| KR20000021804A (en) * | 1998-09-30 | 2000-04-25 | 장용균 | Compositions hardened by ultraviolet compositions and surface protected film thereof |
| KR20020020599A (en) * | 2000-09-09 | 2002-03-15 | 황성호 | Composition of Radiation Curable Silicone Materials |
| JP2003345006A (en) | 2002-05-29 | 2003-12-03 | Nippon Synthetic Chem Ind Co Ltd:The | Photosensitive resin composition |
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| WO2009017320A2 (en) | 2009-02-05 |
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| CN101711375A (en) | 2010-05-19 |
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