TWI378980B - Adhesive composition and optical member - Google Patents
Adhesive composition and optical member Download PDFInfo
- Publication number
- TWI378980B TWI378980B TW97130927A TW97130927A TWI378980B TW I378980 B TWI378980 B TW I378980B TW 97130927 A TW97130927 A TW 97130927A TW 97130927 A TW97130927 A TW 97130927A TW I378980 B TWI378980 B TW I378980B
- Authority
- TW
- Taiwan
- Prior art keywords
- acrylate
- meth
- group
- binder composition
- acrylic acid
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 109
- 230000003287 optical effect Effects 0.000 title claims description 71
- 230000001070 adhesive effect Effects 0.000 title claims description 38
- 239000000853 adhesive Substances 0.000 title claims description 37
- -1 halogen halide Chemical class 0.000 claims description 145
- 239000011230 binding agent Substances 0.000 claims description 82
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 60
- 229920001577 copolymer Polymers 0.000 claims description 28
- 239000000178 monomer Substances 0.000 claims description 28
- 239000002216 antistatic agent Substances 0.000 claims description 20
- 150000008040 ionic compounds Chemical class 0.000 claims description 20
- 229910052736 halogen Inorganic materials 0.000 claims description 17
- 150000002367 halogens Chemical class 0.000 claims description 16
- 150000003839 salts Chemical class 0.000 claims description 12
- 150000002148 esters Chemical class 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- BGKZULDOBMANRY-UHFFFAOYSA-N sulfanyl prop-2-enoate Chemical compound SOC(=O)C=C BGKZULDOBMANRY-UHFFFAOYSA-N 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- 239000000052 vinegar Substances 0.000 claims description 8
- 235000021419 vinegar Nutrition 0.000 claims description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 5
- DAWJJMYZJQJLPZ-UHFFFAOYSA-N 2-sulfanylprop-2-enoic acid Chemical class OC(=O)C(S)=C DAWJJMYZJQJLPZ-UHFFFAOYSA-N 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 4
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 3
- 125000004018 acid anhydride group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 3
- DDKMFQGAZVMXQV-UHFFFAOYSA-N (3-chloro-2-hydroxypropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CCl DDKMFQGAZVMXQV-UHFFFAOYSA-N 0.000 claims description 2
- JTCVKNUSIGHJRG-UHFFFAOYSA-N 1,1,1,2,3,3,3-heptafluoropropan-2-yl prop-2-enoate Chemical compound FC(F)(F)C(F)(C(F)(F)F)OC(=O)C=C JTCVKNUSIGHJRG-UHFFFAOYSA-N 0.000 claims description 2
- HBZFBSFGXQBQTB-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F HBZFBSFGXQBQTB-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 125000006226 butoxyethyl group Chemical group 0.000 claims description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 3
- 159000000009 barium salts Chemical class 0.000 claims 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims 1
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 claims 1
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 claims 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 claims 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- CRZWYPKLKBCKDW-UHFFFAOYSA-N [Ru].C(C(=C)C)(=O)O Chemical compound [Ru].C(C(=C)C)(=O)O CRZWYPKLKBCKDW-UHFFFAOYSA-N 0.000 claims 1
- FXFPHNDKVMTINC-UHFFFAOYSA-N [bromo(phenyl)methyl] prop-2-enoate Chemical compound C=CC(=O)OC(Br)C1=CC=CC=C1 FXFPHNDKVMTINC-UHFFFAOYSA-N 0.000 claims 1
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims 1
- 238000005553 drilling Methods 0.000 claims 1
- KZLJTMAAQZRRKG-UHFFFAOYSA-N ethoxymethyl prop-2-eneperoxoate Chemical compound CCOCOOC(=O)C=C KZLJTMAAQZRRKG-UHFFFAOYSA-N 0.000 claims 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 125000005842 heteroatom Chemical group 0.000 claims 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 claims 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 claims 1
- FDYOHAQXWFSVKS-UHFFFAOYSA-N prop-2-enenitrile;ruthenium Chemical compound [Ru].C=CC#N FDYOHAQXWFSVKS-UHFFFAOYSA-N 0.000 claims 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920005601 base polymer Polymers 0.000 description 51
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 37
- 239000012790 adhesive layer Substances 0.000 description 36
- 239000000758 substrate Substances 0.000 description 32
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 24
- 239000010410 layer Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- IBPADELTPKRSCQ-UHFFFAOYSA-N 9h-fluoren-1-yl prop-2-enoate Chemical compound C1C2=CC=CC=C2C2=C1C(OC(=O)C=C)=CC=C2 IBPADELTPKRSCQ-UHFFFAOYSA-N 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 239000003431 cross linking reagent Substances 0.000 description 11
- 239000012948 isocyanate Substances 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 9
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 239000007822 coupling agent Substances 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- JSMYHXFFKXKZRN-SBMIAAHKSA-N (2s,3s,4s)-3-(carboxymethyl)-4-(2-hydroxyphenyl)pyrrolidine-2-carboxylic acid Chemical compound OC(=O)C[C@@H]1[C@@H](C(O)=O)NC[C@@H]1C1=CC=CC=C1O JSMYHXFFKXKZRN-SBMIAAHKSA-N 0.000 description 4
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 229940125904 compound 1 Drugs 0.000 description 4
- 229940125782 compound 2 Drugs 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000011056 performance test Methods 0.000 description 4
- MCTWTZJPVLRJOU-UHFFFAOYSA-O 1-methylimidazole Chemical compound CN1C=C[NH+]=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-O 0.000 description 3
- VBHXIMACZBQHPX-UHFFFAOYSA-N 2,2,2-trifluoroethyl prop-2-enoate Chemical compound FC(F)(F)COC(=O)C=C VBHXIMACZBQHPX-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 101000837845 Homo sapiens Transcription factor E3 Proteins 0.000 description 3
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Substances CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 102100028507 Transcription factor E3 Human genes 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 3
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- MNSWITGNWZSAMC-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-yl prop-2-enoate Chemical compound FC(F)(F)C(C(F)(F)F)OC(=O)C=C MNSWITGNWZSAMC-UHFFFAOYSA-N 0.000 description 2
- ZXMGHDIOOHOAAE-UHFFFAOYSA-N 1,1,1-trifluoro-n-(trifluoromethylsulfonyl)methanesulfonamide Chemical class FC(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)F ZXMGHDIOOHOAAE-UHFFFAOYSA-N 0.000 description 2
- NRKYWOKHZRQRJR-UHFFFAOYSA-N 2,2,2-trifluoroacetamide Chemical compound NC(=O)C(F)(F)F NRKYWOKHZRQRJR-UHFFFAOYSA-N 0.000 description 2
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 2
- GMDZOEQOTJOQIL-UHFFFAOYSA-N 2,4-bis[4-(dibutylamino)-2-hydroxyphenyl]cyclobutane-1,3-dione Chemical compound OC1=CC(N(CCCC)CCCC)=CC=C1C1C(=O)C(C=2C(=CC(=CC=2)N(CCCC)CCCC)O)C1=O GMDZOEQOTJOQIL-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 229940126214 compound 3 Drugs 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N ethyl trimethyl methane Natural products CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 150000004687 hexahydrates Chemical class 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- LCPDWSOZIOUXRV-UHFFFAOYSA-N phenoxyacetic acid Chemical compound OC(=O)COC1=CC=CC=C1 LCPDWSOZIOUXRV-UHFFFAOYSA-N 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- GRKDVZMVHOLESV-UHFFFAOYSA-N (2,3,4,5,6-pentabromophenyl)methyl prop-2-enoate Chemical compound BrC1=C(Br)C(Br)=C(COC(=O)C=C)C(Br)=C1Br GRKDVZMVHOLESV-UHFFFAOYSA-N 0.000 description 1
- NVZPQTZRLIOPFA-UHFFFAOYSA-N (2,4,6-tribromophenyl)methyl prop-2-enoate Chemical compound BrC1=CC(Br)=C(COC(=O)C=C)C(Br)=C1 NVZPQTZRLIOPFA-UHFFFAOYSA-N 0.000 description 1
- KHFCCLZEYOOFDD-UHFFFAOYSA-N (2,6-dibromophenyl)methyl prop-2-enoate Chemical compound BrC1=CC=CC(Br)=C1COC(=O)C=C KHFCCLZEYOOFDD-UHFFFAOYSA-N 0.000 description 1
- DOYSIZKQWJYULQ-UHFFFAOYSA-N 1,1,2,2,2-pentafluoro-n-(1,1,2,2,2-pentafluoroethylsulfonyl)ethanesulfonamide Chemical class FC(F)(F)C(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)C(F)(F)F DOYSIZKQWJYULQ-UHFFFAOYSA-N 0.000 description 1
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- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- PHFDTSRDEZEOHG-UHFFFAOYSA-N hydron;octan-1-amine;chloride Chemical compound Cl.CCCCCCCCN PHFDTSRDEZEOHG-UHFFFAOYSA-N 0.000 description 1
- 150000004693 imidazolium salts Chemical class 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229960001428 mercaptopurine Drugs 0.000 description 1
- VVYRXJYXVTWNCH-UHFFFAOYSA-L methane tetrabutylazanium sulfate Chemical compound C.[O-]S([O-])(=O)=O.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC VVYRXJYXVTWNCH-UHFFFAOYSA-L 0.000 description 1
- GVXHSMAJJFVLGD-UHFFFAOYSA-N methyl 5-chloro-7-(trifluoromethyl)thieno[3,2-b]pyridine-3-carboxylate Chemical compound C1=C(Cl)N=C2C(C(=O)OC)=CSC2=C1C(F)(F)F GVXHSMAJJFVLGD-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- YYYGSQOZWZQGSM-UHFFFAOYSA-N n-methyl-1-(oxiran-2-yl)methanamine Chemical compound CNCC1CO1 YYYGSQOZWZQGSM-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- YPJUNDFVDDCYIH-UHFFFAOYSA-N perfluorobutyric acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(F)(F)F YPJUNDFVDDCYIH-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- DHGFMVMDBNLMKT-UHFFFAOYSA-N propyl 3-oxobutanoate Chemical compound CCCOC(=O)CC(C)=O DHGFMVMDBNLMKT-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- XBMKBXSYVCYTFB-UHFFFAOYSA-N pyridine;sulfane Chemical compound S.C1=CC=NC=C1 XBMKBXSYVCYTFB-UHFFFAOYSA-N 0.000 description 1
- VFDOIPKMSSDMCV-UHFFFAOYSA-N pyrrolidine;hydrobromide Chemical compound Br.C1CCNC1 VFDOIPKMSSDMCV-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-N sodium polysulfide Chemical compound [Na+].S HYHCSLBZRBJJCH-UHFFFAOYSA-N 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- UXQPRXPNOJXOQO-UHFFFAOYSA-N sulfuric acid;hydrobromide Chemical compound Br.OS(O)(=O)=O UXQPRXPNOJXOQO-UHFFFAOYSA-N 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 1
- WTEXQPWIUJQYJQ-UHFFFAOYSA-M tetrabutylazanium;2,2,2-trifluoroacetate Chemical compound [O-]C(=O)C(F)(F)F.CCCC[N+](CCCC)(CCCC)CCCC WTEXQPWIUJQYJQ-UHFFFAOYSA-M 0.000 description 1
- WGYONVRJGWHMKV-UHFFFAOYSA-M tetrabutylazanium;benzoate Chemical compound [O-]C(=O)C1=CC=CC=C1.CCCC[N+](CCCC)(CCCC)CCCC WGYONVRJGWHMKV-UHFFFAOYSA-M 0.000 description 1
- PUZYNDBTWXJXKN-UHFFFAOYSA-M tetraethylazanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CC[N+](CC)(CC)CC PUZYNDBTWXJXKN-UHFFFAOYSA-M 0.000 description 1
- YQIVQBMEBZGFBY-UHFFFAOYSA-M tetraheptylazanium;bromide Chemical compound [Br-].CCCCCCC[N+](CCCCCCC)(CCCCCCC)CCCCCCC YQIVQBMEBZGFBY-UHFFFAOYSA-M 0.000 description 1
- SYZCZDCAEVUSPM-UHFFFAOYSA-M tetrahexylazanium;bromide Chemical compound [Br-].CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC SYZCZDCAEVUSPM-UHFFFAOYSA-M 0.000 description 1
- VRKHAMWCGMJAMI-UHFFFAOYSA-M tetrahexylazanium;iodide Chemical compound [I-].CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC VRKHAMWCGMJAMI-UHFFFAOYSA-M 0.000 description 1
- QBVXKDJEZKEASM-UHFFFAOYSA-M tetraoctylammonium bromide Chemical compound [Br-].CCCCCCCC[N+](CCCCCCCC)(CCCCCCCC)CCCCCCCC QBVXKDJEZKEASM-UHFFFAOYSA-M 0.000 description 1
- SPALIFXDWQTXKS-UHFFFAOYSA-M tetrapentylazanium;bromide Chemical compound [Br-].CCCCC[N+](CCCCC)(CCCCC)CCCCC SPALIFXDWQTXKS-UHFFFAOYSA-M 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- MEJYOZOPFBOWNM-UHFFFAOYSA-N triethyl(heptyl)azanium Chemical compound CCCCCCC[N+](CC)(CC)CC MEJYOZOPFBOWNM-UHFFFAOYSA-N 0.000 description 1
- WGYXSYLSCVXFDU-UHFFFAOYSA-N triethyl(propyl)azanium Chemical compound CCC[N+](CC)(CC)CC WGYXSYLSCVXFDU-UHFFFAOYSA-N 0.000 description 1
- PUVAFTRIIUSGLK-UHFFFAOYSA-M trimethyl(oxiran-2-ylmethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1CO1 PUVAFTRIIUSGLK-UHFFFAOYSA-M 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
1378980 六、發明說明: 相關申請 • 本申請主張2〇〇7年8月14日提交給JPO的日本專利 申請Nos. 2007-211538和2007年8月14日提交給JPO的 5 日本專利申請Nos. 2007-211539的優先權,藉由引用將其 全部内容併入本文。 【發明所屬之技術領域】 胃本發明涉及黏合劑組成物及光學元件。 10 【先前技術】 平板顯示器通常層疊有藉由黏合劑層結合在一起的各 種光學膜。而且,這樣的光學膜通常具有釋放膜(release film)和/或表面保護膜以防止其出現劃痕和/或污染。 15 平板顯示面板在其表面處容易發生靜電放電。如果發 生表面放電,則平板顯示面板的顯示側可吸引灰塵。 • 靜電放電也可影響平面顯示面板中半導體基體的顯示 電路和/或液晶顯示面板中液晶分子的取向,結果可能導致 . 顯示器故障。 :20 因此,平面顯示面板需要抗靜電性。然而,如果每個 分離地形成抗靜電層和黏合劑層,導致生產能力的劣化, 則需要替代方法以形成抗靜電層。 此外,如果光學膜的黏合劑層包含抗靜電劑,那麼黏 合劑層就具有抗靜電性能並因此不需要另外的抗靜電層。 4 1378980 然而’當將黏合劑組成物施加於基體諸如光學片以形成黏 合劑層時,黏合劑層偶爾會抑制光學片的光學性能和/或賦 予光學片不足的抗靜電作應。 5 【發明内容】 本發明旨在解決與傳統技術相關的上述問題,因此本 發明的一個目的是提供黏合劑組成物,其可用於形成具有 鲁有利抗靜電性能的黏合劑層而不劣化塗敷有黏合劑層的光 學片的光學性能。 10 本發明的另一個目的是提供包含上述黏合劑組成物的 光學元件。 為實現上述目的,本發明採用以下技術結構。 本發明的黏合劑組成物包含:(A)共聚物,在共聚物 單元中包含(al)至少一種或兩種或更多種具有鹵族元素 15 的(甲基)丙烯酸酯,其選自具有鹵族元素的丙婦酸酯和 具有鹵族元素的甲基丙浠酸醋,和(a2)至少一種或兩種 • 或更多種(甲基)丙烯酸酯,其選自丙烯酸酯和曱基丙烯 酸酯;以及(B)包含離子化合物的抗靜電劑。 在根據本發明的黏合劑組成物中,丙烯酸醋和/或甲基 2〇 丙烯酸酯可包括H2C=C(Rl)COO(R2)(其中,R1是Η或 CH3,R2 是至少一種選自 CH2CF3、CH2(CF2)2H、 CH2(CF2)4H 、CH2CH2(CF2)6F 、CH2CH22(CF2)8F 、 CH2CH2(CF2)i〇F、CH2CH2(CF2)12F、CH(CF3)2、CF(CF3)2、 CH2CH(0H)CH2C1 、 CH2C6Br6 、 CH2C6H3Br3 和 5 1378980 CH2C6H4Br2)。 黏合劑組成物也較佳地包含交聯形式的共聚物。 本發明的光學元件包括光學片,其一侧或兩側塗敷有 上述黏合劑組成物。 5 【實施方式】 以下,將更詳細地描述本發明的較佳實施方案。 黏合劑組成物 10 根據本發明一個示例性實施方案的黏合劑組成物可包 含共聚物(以下稱為“基礎聚合物”),該共聚物藉由共聚具 有鹵族元素的丙烯酸酯和/或甲基丙烯酸酯與其他丙烯酸 酯和/或曱基丙烯酸酯來製備;以及基本上包含離子化合物 的抗靜電劑。 15 包含於組成物中的基礎聚合物較佳地使用交聯劑交 聯。由於將抗靜電劑加入到基礎聚合物,所以當黏合劑組 # 成物施加於基體諸如光學片以形成黏合劑層時,黏合劑層 表現出例如lxio8至1χ1013(Ω/[Ι]),更佳地lxio8至lxio11 (Ω/口)的表面電阻。 20 抗靜電劑 用於根據本發明的黏合劑組成物中的抗靜電劑可包含 離子化合物。離子化合物可選自與通常用於製備黏合劑組 成物的有機溶劑相容的並且如果將該離子化合物加入到基 6 1378980 礎聚合物時能保持黏合劑組成物的透明性的特定化合物。 而且,當黏合劑組成物施加於基體諸如光學片以形成 黏合劑層時,離子化合物選自賦予黏合劑層不大於1χ1〇12 (Ω/d)的特定表面電阻的特定化合物。 5 離子化合物可包括至少一種選自咪唑鑌鹽、吡啶錆 烧基銨鹽、烷基吡咯烷鑌鹽、和烷基鱗鹽。1378980 VI. Description of the Invention: Related Applications • This application claims Japanese Patent Application No. 2007-211538 filed on Jan. 14, 2007, and Japanese Patent Application No. No. 5, filed on Jan. 14, 2007. The priority of 2007-211539, the entire contents of which is incorporated herein by reference. TECHNICAL FIELD OF THE INVENTION The present invention relates to a binder composition and an optical element. 10 [Prior Art] Flat panel displays are usually laminated with various optical films bonded together by a layer of adhesive. Moreover, such optical films typically have a release film and/or a surface protective film to prevent scratching and/or contamination thereof. 15 Flat panel display panels are prone to electrostatic discharge at their surface. If a surface discharge occurs, the display side of the flat panel display panel can attract dust. • Electrostatic discharge can also affect the orientation of the liquid crystal molecules in the display circuit of the semiconductor substrate and/or the liquid crystal display panel in the flat display panel. As a result, the display may malfunction. :20 Therefore, flat display panels require antistatic properties. However, if each of the antistatic layer and the adhesive layer are separately formed, resulting in deterioration of productivity, an alternative method is required to form an antistatic layer. Furthermore, if the adhesive layer of the optical film contains an antistatic agent, the adhesive layer has antistatic properties and thus does not require an additional antistatic layer. 4 1378980 However, when a binder composition is applied to a substrate such as an optical sheet to form a binder layer, the binder layer occasionally inhibits the optical properties of the optical sheet and/or imparts an insufficient antistatic effect to the optical sheet. 5 SUMMARY OF THE INVENTION The present invention is directed to solving the above problems associated with the conventional art, and it is therefore an object of the present invention to provide a binder composition which can be used to form an adhesive layer having a favorable antistatic property without deteriorating coating. Optical properties of optical sheets with a layer of adhesive. Another object of the present invention is to provide an optical element comprising the above binder composition. To achieve the above object, the present invention employs the following technical structure. The binder composition of the present invention comprises: (A) a copolymer comprising (al) at least one or two or more (meth) acrylate having a halogen element 15 selected from the group consisting of a propyl acrylate of a halogen element and a methyl propyl acrylate having a halogen element, and (a2) at least one or two or more (meth) acrylates selected from the group consisting of acrylates and sulfhydryl groups Acrylate; and (B) an antistatic agent comprising an ionic compound. In the binder composition according to the present invention, the acrylic vinegar and/or the methyl 2-oxime acrylate may include H2C=C(Rl)COO(R2) (wherein R1 is ruthenium or CH3, and R2 is at least one selected from the group consisting of CH2CF3 , CH2(CF2)2H, CH2(CF2)4H, CH2CH2(CF2)6F, CH2CH22(CF2)8F, CH2CH2(CF2)i〇F, CH2CH2(CF2)12F, CH(CF3)2, CF(CF3)2 , CH2CH(0H)CH2C1, CH2C6Br6, CH2C6H3Br3 and 5 1378980 CH2C6H4Br2). The binder composition also preferably comprises a copolymer in crosslinked form. The optical element of the present invention comprises an optical sheet coated with one or both sides of the above binder composition. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in more detail. Adhesive Composition 10 The adhesive composition according to an exemplary embodiment of the present invention may comprise a copolymer (hereinafter referred to as "base polymer") which copolymerizes an acrylate having a halogen element and/or a The acrylate is prepared with other acrylates and/or mercapto acrylates; and an antistatic agent that substantially comprises an ionic compound. The base polymer contained in the composition is preferably crosslinked using a crosslinking agent. Since the antistatic agent is added to the base polymer, when the binder group is applied to a substrate such as an optical sheet to form a binder layer, the binder layer exhibits, for example, lxio8 to 1χ1013 (Ω/[Ι]), Surface resistance of good ground lxio8 to lxio11 (Ω/port). 20 Antistatic Agent The antistatic agent used in the binder composition according to the present invention may contain an ionic compound. The ionic compound may be selected from specific compounds which are compatible with the organic solvent commonly used in the preparation of the binder composition and which maintain the transparency of the binder composition if the ionic compound is added to the base polymer. Moreover, when the binder composition is applied to a substrate such as an optical sheet to form a binder layer, the ionic compound is selected from a specific compound which imparts a specific surface resistance of not more than 1 χ 1 〇 12 (Ω/d) to the binder layer. The ionic compound may include at least one member selected from the group consisting of an imidazolium salt, a pyridinium sulfonium salt, an alkylpyrrolidinium salt, and an alkyl quaternary salt.
10 1510 15
咪唾鑕鹽的實例包括但不限於:丨,3_二曱基咪唑鏽氯 化物,1-丁基_2,3-二甲基咪唑錆氣化物;丨_丁基_3甲基咪 唑銪溴化物;1-丁基_3_曱基咪唑鏘氣化物;丨_丁基_3_曱基; 1-T^-l-(3,3,4,4,5,5,6,6,7,7,8,8,8-^ 三氟辛基)-咪唑鑌六氟磷酸鹽;丨_乙基_3_曱基咪唑鑌溴化 物;1-乙基-3-甲基咪唾鑌氣化物;乙基_3_甲基咪唑錆六 氟磷酸鹽;1-乙基-3-甲基咪唑鑌碘化物;卜乙基-2,3-二甲 基咪唑錆氣化物;1-曱基咪唑鑌氯化物;丨,^三甲基咪唑 鑌曱基硫酸鹽;i-甲基_3_ ( 3,3,4,5,5,6,6,7,7,8,8,8_十2氟辛 $)-咪唑鏑六氟磷酸鹽;丨_芳基_3_甲基咪唑鏽氣化物卜=基-3-甲基㈣鑌氣化物;”基^甲基㈣鏽六氣鱗酸 ,1-苄基-3-曱基咪唾鑽四氟蝴酸鹽等。 0比唆鏑鹽的實例包括但不限於: 、自儿, ...... Α 丫丞吡啶鏆 溴化物,i-丁基-4-曱基吡啶鑌漠化物;丨_ 丁基|曱基吡啶 鑌氣化物;U丁基吡啶鑷演化物;u丁基吡啶鑷氣:物. 1-丁基t定鏽六氟鱗酸鹽;l乙基吼㈣漠化物丄比 唆鑌氯化物等。 烷基銨鹽的實例包括但不限於:環己基三曱基銨雙(三 7 137*8980 氟曱烷磺醯基)亞胺鹽,四正丁基銨氯化物;四丁基銨溴 化物;三丁基曱基銨甲基硫酸鹽;四丁基銨雙(三氟曱基 磺醯基)亞胺鹽;四乙基銨三氟甲烷磺酸鹽;四丁基銨苯 曱酸鹽;四丁基銨甲烷硫酸鹽;四丁基銨九氟丁烷磺酸鹽; 5 四正丁基銨六氟磷酸鹽;四丁基銨三氟乙酸鹽;四己基銨 四氟硼酸鹽;四己基銨溴化物;四己基銨碘化物;四辛基 銨氯化物;四辛基銨溴化物;四庚基銨溴化物;四戊基銨 溴化物;正十六烷基三曱基銨六氟磷酸鹽等。 烷基吡咯烷鑌鹽的實例包括但不限於:1-丁基-1-曱基 10 吡咯烷鑌溴化物;1-丁基-1-甲基吡咯烷鏽氯化物;1-丁基 -1-甲基吡咯烷鑕四氟硼酸鹽等。 最後,烷基鱗鹽的實例包括但不限於:四丁基鱗溴化 物;四丁基鱗氯化物;四丁基鱗四氟硼酸鹽;四丁基鱗曱 烷磺酸鹽;四丁基鱗對曱苯磺酸鹽;三丁基十六烷基鱗溴 15 化物等。 同時,離子化合物較佳地包括含氮鎖鹽、含硫鐵鹽和/ • 或含磷的鹽。離子化合物的實例包括但不限於:1-丁基吡 啶錆四氟硼酸鹽;1-丁基吡啶錆六氟磷酸鹽;1-丁基-3-甲 基吡啶鑌四氟硼酸鹽;1-丁基-3-甲基吼啶鑌三氟甲烷磺酸 2〇 鹽;1-丁基-3-曱基吡啶鑌雙(三氟曱烷磺醯基)亞胺鹽; 1-丁基-3-曱基吡啶鑌雙(五氟乙烷磺醯基)亞胺鹽;1-己 基吡啶鑌四氟硼酸鹽;2-曱基-1-二氫吡咯四氟硼酸鹽;1-乙基-2-苯基吲哚四氟硼酸鹽;1,2-二曱基吲哚四氟硼酸 鹽;1-乙基咔唑(carbzole)四氟硼酸鹽;1-乙基-3-甲基咪 8 ft四氟硼酸鹽;乙基_3_甲基咪唑鏘乙酸鹽;1_乙基_3_ 豳;1'\ ^翁一氟乙酸鹽;乙基_3_曱基咪唑鑌七氟丁酸 二, 土 ·3~甲基咪唑錆三氟甲烷磺酸鹽;1-乙基_3_曱基 ^坐,全氣丁細酸鹽;卜乙基_3曱基_謂二氰蕴胺; 土 3 f基咪唑鑌雙(三氟甲烷磺醯基)亞胺鹽;丨_乙 甲f!"唑鑷雙(五氟乙烷磺醯基)亞胺鹽;卜乙基_3-、,^上鎢一(二氟曱貌續醯基)亞胺鹽;丁基曱基 味=鏽四I顯鹽;κ丁基_3_甲基味哇鎮六氣乙酸鹽;^ ς 3曱基咪唑鎢三氟乙酸鹽]丁基冬七氟丁酸鹽;1 — 入二_3_甲基咪唑鑄三氟甲烷磺酸鹽;1-丁基-3-曱基咪唑鑷 丁烷磺酸鹽;卜丁基冬甲基咪唑鑌雙(三氟甲烷磺: =)亞胺鹽;1_己基_3_甲基咪唑鏘溴化物;己基-夂甲基 米坐鈿氯化物;卜己基甲基咪唑鑰四氟硼酸鹽;己基 卞甲基°米續六I鱗酸鹽;1·己基-3-甲基咪顿三氣曱^ 飧酸鹽;1_辛基―3·甲基咪唑錯四氟硼酸鹽;1-辛基-3-甲基 ^峻鑽六_酸鹽;丨_己基_2,3_二曱基㈣錯四氣蝴酸 2,1,2-二曱基_3_丙基咪唑鑌雙(三氟甲烷磺醯基)亞胺 鹽;1-甲基吡唑鏘四氟硼酸鹽;3_甲基吡唑鏽四氟硼酸鹽; 四己基銨雙(三氟甲烷磺醯基)亞胺鹽;二烯丙基二甲基 録四氟棚酸鹽,二烯丙基二甲基錢三氟曱院績酸鹽;二歸 丙基二甲基銨雙(三氟甲烷磺醯基)亞胺鹽;二烯丙基二 甲基銨雙(五氟乙烷磺醯基)亞胺鹽;N,N_二乙基甲基 N (2-甲氧基乙基)銨四氟蝴酸鹽;n,n_二乙基_义甲基_凡 (2_甲氧基乙基)銨三氟甲烷磺酸鹽;N,N_二乙基_N_甲基 137*8980 -N-(2-甲氡基乙基)銨雙(三氟曱烷磺醯基)亞胺鹽;N,N-二乙基-N-曱基-N- (2-甲氧基乙基)敍雙(五亂乙烧續酿 基)亞胺鹽;縮水甘油基三曱基銨三氟曱烷磺酸鹽;縮水 甘油基三甲基銨雙(三氟曱烷磺醯基)亞胺鹽;縮水甘油 5 基三甲基銨雙(五氟乙烷磺醯基)亞胺鹽;1-丁基吡啶鑌 (三氟曱烷磺醯基)三氟乙醯胺;1-丁基-3-曱基吡啶鑌(三 氟甲烷磺醯基)三氟乙醯胺;1-乙基-3-曱基咪唑鑌(三氟 $ 曱烷磺醯基)三氟乙醯胺;二烯丙基二曱基銨(三氟曱烷 磺醯基)三氟乙醯胺;縮水甘油基三甲基銨(三氟曱烷磺 ίο 醯基)三氟乙醯胺;N,N-二曱基-N-乙基-N-丙基銨雙(三 氟曱烷磺醯基)亞胺鹽;N,N-二曱基-N-乙基-N-丁基銨雙 (三氟曱烷磺醯基)亞胺鹽;N,N-二曱基-N-乙基-N-戊基銨 雙(三氟甲烷磺醯基)亞胺鹽;N,N-二曱基-N-乙基-N-己 基銨雙(三氟曱烷磺醯基)亞胺鹽;N,N-二曱基-N-乙基-N-15 庚基銨雙(三氟甲烷磺醯基)亞胺鹽;Ν,Ν-二甲基-N-乙基 -Ν-壬基銨雙(三氟曱烷磺醯基)亞胺鹽;Ν,Ν-二甲基-Ν,Ν-• 二丙基銨雙(三氟甲烷磺醯基)亞胺鹽;Ν,Ν-二曱基-Ν- 丙基-Ν-丁基銨雙(三氟甲烷磺醯基)亞胺鹽;Ν,Ν-二曱基 -Ν-丙基-Ν-戊基銨雙(三氟曱烷磺醯基)亞胺鹽;Ν,Ν-二 20 曱基-Ν-丙基-Ν-己基銨雙(三氟曱烷磺醯基)亞胺鹽;Ν,Ν- 二曱基-Ν-两基-Ν-庚基銨雙(三氟甲烷磺醯基)亞胺鹽; Ν,Ν-二曱基-Ν-丁基-Ν-己基銨雙(三氟曱烷磺醯基)亞胺 鹽;Ν,Ν-二曱基-Ν-丁基-Ν-庚基銨雙(三氟曱烷磺醯基) 亞胺鹽;Ν,Ν-二甲基-Ν-戊基-Ν-己基銨雙(三氟曱烷磺醯 10 1378980 基)亞胺鹽;Ν,Ν-二甲.基-N,N-二己基銨雙(三氟甲烷磺醯 基)亞胺鹽;三甲基庚基銨雙(三氟甲烷磺醯基)亞胺鹽; N,N-二乙基-N-曱基-N-丙基銨雙(三氟曱烷磺醯基)亞胺 鹽;N,N-二乙基-N-甲基-N-戊基銨雙(三氟甲烷磺醯基) 5 亞胺鹽;N,N-二乙基-N-甲基-N-庚基銨雙(三氟曱烷磺醯 基)亞胺鹽;N,N-二乙基-N-丙基-N-戊基銨雙(三氟曱烷 磺醯基)亞胺鹽;三乙基丙基銨雙(三氟曱烷磺醯基)亞 胺鹽;三乙基戊基銨雙(三氟甲烷磺醯基)亞胺鹽;三乙 基庚基銨雙(三氟曱烷磺醯基)亞胺鹽;Ν,Ν-二丙基-N-10 曱基-Ν-乙基銨雙(三氟甲烷磺醯基)亞胺鹽;Ν,Ν-二丙基 -Ν-曱基-Ν-戊基銨雙(三氟曱烷磺醯基)亞胺鹽;Ν,Ν-二 丙基-Ν- 丁基-Ν-己基銨雙(三氟曱烷磺醯基)亞胺鹽;Ν,Ν-二丙基-Ν,Ν-二己基銨雙(三氟曱烷磺醯基)亞胺鹽;Ν,Ν-二丁基-Ν-甲基-Ν-戊基銨雙(三氟甲烷磺醯基)亞胺鹽; 15 Ν,Ν-二丁基-Ν-甲基-Ν-己基銨雙(三氟曱烷磺醯基)亞胺 鹽;三辛基曱基銨雙(三氟甲烷磺醯基)亞胺鹽;Ν-曱基 1 -Ν-乙基-Ν-丙基-Ν-戊基銨雙(三氟曱烷磺醯基)亞胺鹽等。 基礎聚合物(共聚物)(Α) 20 用於根據本發明的黏合劑組成物中的基礎聚合物包含 共聚物,該共聚物藉由共聚(al)含鹵族元素的丙稀酸酯 和/或曱基丙烯酸酯(以下稱為“含ig族元素的(甲基)丙 烯酸酯”)和(a2)丙烯酸酯和/或甲基丙烯酸酯(以下稱 為“(曱基)丙烯酸酯”)來製備。 11 1378980 含鹵族元素的(甲基)丙烯酸酯(al)的量較佳地為 基礎聚合物總重量的0.1至15 wt%。 如果(al)的置小於0.1重量% ( ,那麼黏合 劑組成物可能不能表現出足夠改善的抗靜電效果。 使用包含上述範圍内的含鹵族元素的(曱基)丙烯酸 酯(al)的基礎聚合物(A)時’從製造的角度來看,黏 合劑組成物也具有經濟優勢。 這樣的含鹵族元素的(曱基)丙烯酸酯(al)可包括 例如 H2C=C (Rl) COO (R2)(其中,R1 是 η 或 CH3, R2 是至少一種選自 CH2CF3、ch2 (cf2) 2h、ch2 (cf2) 4H、ch2ch2 ( cf2 ) 6f、ch2ch22 ( cf2 ) 8f、ch2ch2 ( cf2 ) i〇F、CH2CH2 ( CF2 ) 12F、CH ( CF3) 2、CF ( CF3 ) 2、CH2CH (OH ) CH2a、CH2C6Br6、CH2C6H3Br3 和 CH2C6H4Br2 )。 含鹵族元素的(曱基)丙烯酸酯(al)的具體實例可 包括但不限於:(曱基)丙豨酸2,2,2-三氟乙酯;丙烯酸 2,2,3,3-四氤丙酯;(甲基)丙烯酸ih,1H,5H-八氟戊酯;(甲 基)丙烯酸六氟-2-丙酯;丙烯酸七氟-2-丙酯;曱基丙烯酸 2-(全氟辛基)乙酯;2-丙晞酸 3,3,4,4,5,5,6,6,7,7,8,8,8-十 三氟辛基酯;2-丙烯酸 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-十七氟辛酯 ; 2- 丙烯酸 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-二十一氟十 二 烷基酯 ; 2- 丙烯酸 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,14,14,14-二十五氟十四烷基酯;甲基丙烯酸3-氯-2-羥丙酯;丙烯酸 12 五溴苄酯;丙烯酸2,4,6-三溴苄酯;丙烯酸2,6-二溴苄酯等。 作為基礎聚合物(A)的另一個主要組分,基礎聚合 物中包含的(甲基)丙烯酸酯(a2)的量較佳地為基礎聚 合物總重量的50至99.1 wt.%。(曱基)丙烯酸酯(a2)可 以單獨使用或作為其兩種或更多種的組合使用。 (甲基)丙豨酸酯(a2)的較佳實例可包括:(甲基) 丙婦酸甲醋、(甲基)丙烯酸乙酯、(f基)丙烯酸正丁醋、 (曱基)丙烯酸叔丁酯、(甲基)丙烯酸異丁酯、(甲基)丙 烯酸己酯、(T基)丙烯酸2_乙基己酯、(甲基)丙烯酸正 辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲 基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯 酸異癸S旨、(甲基)丙烯酸正十二絲3旨、(甲基)丙稀酸 正十二烷基酯、(甲基)丙烯酸正十四烷基酯、(甲基)丙 烯酸甲氧基乙S旨、(甲基)丙稀酸乙氧基乙酯、(甲基)丙 烯酸丁氧基乙S旨、(甲基)丙婦酸環己醋、(甲基)丙婦酸 叔丁基環己醋、(甲基)丙婦酸苯氧基乙醋、(甲基)丙婦 酸壬基苯氧基聚乙二醇酯、(曱基)丙烯酸苄酯、(曱基) 丙婦酸異冰片基(iSGbGnyl) g旨曱基)丙烯酸四氯糠醋 等’但不僅限於上述實例。 用於光學元件的黏合劑組成物中包含的基礎聚合物較 佳地包含丙職正T自旨作為主要成份以表現出高的黏合 性。 考慮到與離子化合物極好的相容性和根據本發明的黏 合劑組成物的高的黏合性,基礎聚合物較佳地是包含至少 1378980 一種(甲基)丙烯酸酯作為主要組分的丙烯酸聚合物。 基礎聚合物較佳地具有1,000,000至2,000,000範圍内 的重均分子量。在該範圍内,黏合劑組成物具有足夠的黏 合性以形成光學元件(或光學構件)的黏合劑層。可藉由 5 凝膠滲透色譜基於聚苯乙烯轉換估計重均分子量。 此外,基礎聚合物的Tg較佳地不高於0°c,更佳地為 -100至-5°C,最佳地-80至-10°c。當Tg不超過0°c時,包 含離子化合物的基礎聚合物可表現出優異的黏合性。 除了上述的(甲基)丙烯酸酯(al)和(甲基)丙烯 10 酸酯(a2)之外,基礎聚合物還可包含其他組分。該其他 組分可包括例如:用於增加内聚和/或熱阻的組分諸如包含 磺酸基的單體、包含磷酸酯基的單體、包含氰基的單體、 乙烯基酯、芳族乙烯基化合物等;或具有用於增強黏合性 或作為交聯反應起點的官能團的組分諸如包含羧基的單 15 體、包含酸酐基圑的單體、包含羥基的單體、包含醯胺基 的單體、包含胺基的單體、包含環氧基團的單體、II-丙烯 醯基嗎啉、乙烯基醚等。其他組分可包括至少一種或兩種 或更多種上述組分的組合。 不限制包含續酸基單體的實例,其包括苯乙烯續酸、 20 芳基磺酸、2-(甲基)丙烯醯胺-2-甲基丙烷磺酸、(曱基) 丙烯醯胺丙烷磺酸、(曱基)丙烯酸磺基丙酯、(曱基)丙 稀酿氧基萘續酸等。 包含磷酸酯基團的單體可藉由2-羥乙基丙烯醯基磷酸 酯舉例說明。 14 137*8980 包含氰基的單體可藉由丙烯腈舉例說明。 一種示例性的乙烯基酯是乙酸乙烯酯。 芳族乙烯基化合物也可藉由笨乙烯舉例說明。 不限制包含羧基的單體,其包括:(曱基)丙烯酸、(甲 5 基)丙烯酸羧乙酯、(曱基)丙烯酸羧戊酯、衣康酸、馬來 酸、富馬酸、巴豆酸、丙婦酸2_叛乙g旨等。 包含酸酐基團的單體可包括例如馬來酸酐、衣康酸酐 φ 等。 包含羥基的單體包括但不限制:(曱基)丙烯酸2_羥 10 乙酯、(曱基)丙烯酸2-羥丙酯、(曱基)丙烯酸4_羥丁酯、 (曱基)丙烯酸6-羥己酯、(曱基)丙烯酸8_羥辛酯、(甲 基)丙烯酸10-羥癸酯、(曱基)丙烯酸12_羥基十二烷基 酯、丙烯酸(4-羥甲基環己基)甲酯、N_羥甲基(曱基) 丙烯醯胺、N-羥乙基(曱基)丙烯醯胺、乙烯基醇、烯丙 15 基醇、2_羥乙基乙烯基醚、4-羥丁基乙烯基醚、二甘醇單 乙烯基醚等。 ® 包含醯胺基的單體可包括例如丙烯醯胺、二乙基丙烯 醯胺等。 包含胺基的單體可包括例如(甲基)丙烯酸N,N_二甲 20 基胺基乙醋、(甲基)丙烯酸N,N-二曱基胺基丙酯等。 包含環氧基的單體可包括例如(甲基)丙烯酸縮水甘 油酯、芳基縮水甘油基醚等。 乙烯基醚的一實例是乙婦基乙基醚。 可以藉由通常用於合成丙烯酸類聚合物的聚合方法得 15 1378980 到基礎聚合物,所述聚合方法諸如溶液聚合、乳液聚合、 本體聚合、懸浮聚合等。 交聯劑 5 藉由適當地交聯基礎聚合物,尤其是作為所述基礎聚 合物的主要組分的丙烯酸聚合物,根據本發明的一個較佳 實施方案的黏合劑組成物可產生具有改善的熱阻的黏合劑 層。尤其是,交聯方法可包括將化合物加入丙烯醯基聚合 物中作為交聯反應的合適起點,該化合物具有能夠與羧 10 基、羥基、胺基、醯胺等中的任一種反應的官能團,所述 化合物例如是異氰酸酯化合物、環氧化合物、氮雜環丙烧 化合物、金屬螯合物等。簡言之,可使用期望的交聯劑進 行該交聯方法。 不具體限制異氰酸酯化合物的實例,其可包括:芳族 15 異氰酸酯諸如曱苯二異氰酸酯、二異氰酸二曱苯酯等;脂 環族異氰酸酯諸如異佛爾酮二異氰酸酯;和脂肪族異氰酸 酯諸如1,6-己二異氰酸酯。其中,關於希望的内聚性,尤 其較佳的是異氰酸酯化合物和/或環氧化合物。這些化合物 可單獨使用或作為其兩種或更多種的組合使用。 20 更具體地,異氰酸酯化合物的較佳實例包括但不限 於:低脂肪族多異氰酸酯諸如二異氰酸亞丁酯、1,6-己二 異氰酸酯等;脂環族異氰酸酯諸如二異氰酸亞環戊基酯、 二異氰酸亞環己基酯、異佛爾酮二異氰酸酯等;芳族二異 氰酸g旨諸如2,4-曱苯二異氰酸酯、4,4’-二苯甲烷二異氰酸 16 1378980 5Examples of the sodium sulfonium salt include, but are not limited to, hydrazine, 3 - dimercaptoimidazole rust chloride, 1-butyl 2,3-dimethylimidazolium hydride; hydrazine _ butyl -3-methylimidazolium Bromide; 1-butyl_3_mercaptoimidazolium vapor; 丨_butyl_3_indenyl; 1-T^-l-(3,3,4,4,5,5,6,6 ,7,7,8,8,8-^trifluorooctyl)-imidazolium hexafluorophosphate; 丨_ethyl_3_decyl imidazolium bromide; 1-ethyl-3-methyl Helium gasification; ethyl_3_methylimidazolium hexafluorophosphate; 1-ethyl-3-methylimidazolium iodide; bethyl-2,3-dimethylimidazolium vapor; 1-mercapto Imidazolium chloride; hydrazine, trimethylimidazolium sulfate; i-methyl _3_ (3,3,4,5,5,6,6,7,7,8,8,8_10 2 fluorooctane $)-imidazolium hexafluorophosphate; 丨_aryl_3_methylimidazole rust gas hydride = benzyl-3-methyl (tetra) fluorene; "methyl" (tetra) rust hexahydrate , 1-benzyl-3-mercaptopurine tetrahydrofolate, etc. Examples of 0-pyridyl salts include, but are not limited to: , from children, ... Α 丫丞pyridinium bromide, I-butyl-4-mercaptopyridinium as a deserter; 丨 _ butyl | mercaptopurine oxime; U butyl pyridine Evolution; u-butylpyridinium: material. 1-butyl t-rust hexafluorophosphate; l ethyl hydrazine (tetra) desert hydrazine hydrazine chloride, etc. Examples of alkyl ammonium salts include, but are not limited to : cyclohexyltrimethylammonium bis(tris-7 137*8980 fluorodecanesulfonyl)imide salt, tetra-n-butylammonium chloride; tetrabutylammonium bromide; tributylsulfonium ammonium methyl sulfate Tetrabutylammonium bis(trifluoromethylsulfonyl)imide salt; tetraethylammonium trifluoromethanesulfonate; tetrabutylammonium benzoate; tetrabutylammonium methane sulfate; tetrabutyl Ammonium nonafluorobutane sulfonate; 5 tetra-n-butylammonium hexafluorophosphate; tetrabutylammonium trifluoroacetate; tetrahexylammonium tetrafluoroborate; tetrahexylammonium bromide; tetrahexylammonium iodide; Octyl ammonium chloride; tetraoctyl ammonium bromide; tetraheptyl ammonium bromide; tetraamyl ammonium bromide; n-hexadecyltriammonium hexafluorophosphate, etc. Examples of alkyl pyrrolidinium salts Including but not limited to: 1-butyl-1-mercapto 10 pyrrolidinium bromide; 1-butyl-1-methylpyrrolidine rust chloride; 1-butyl-1-methylpyrrolidinium tetrafluoro Borate, etc. Finally Examples of alkyl squarate salts include, but are not limited to, tetrabutyl sulphate bromide; tetrabutyl squarate; tetrabutyl squarate; tetrabutyl sulfonate; tetrabutyl fluorene a benzenesulfonate; a tributylhexadecyl bromide 15 or the like. Meanwhile, the ionic compound preferably includes a nitrogen-containing lock salt, a sulfur-containing iron salt, and/or a phosphorus-containing salt. Examples of the ionic compound include Not limited to: 1-butylpyridinium tetrafluoroborate; 1-butylpyridinium hexafluorophosphate; 1-butyl-3-methylpyridinium tetrafluoroborate; 1-butyl-3-methyl Acridine trifluoromethanesulfonate 2 sulfonium salt; 1-butyl-3-mercaptopyridinium bis(trifluorodecanesulfonyl)imide salt; 1-butyl-3-mercaptopyridinium bis ( Pentafluoroethanesulfonyl)imide salt; 1-hexylpyridinium tetrafluoroborate; 2-mercapto-1-dihydropyrrole tetrafluoroborate; 1-ethyl-2-phenylindole tetrafluoro Borate; 1,2-dimercaptopurine tetrafluoroborate; 1-ethylcarbazole tetrafluoroborate; 1-ethyl-3-methylimidine 8 ft tetrafluoroborate; ethyl _3_methylimidazolium acetate; 1_ethyl_3_ 豳; 1'\^ Weng-fluoroacetate; Ethyl_3_nonylimidazolium heptafluorobutyric acid II, earth·3~methylimidazolium trifluoromethanesulfonate; 1-ethyl_3_indenyl group, full gas butyrate; _3 曱 _ _ dicyandiamide; soil 3 f-based imidazolium bis(trifluoromethanesulfonyl) imide salt; 丨_乙甲 f!" oxazolidine bis(pentafluoroethanesulfonyl) Imine salt; b ethyl _3-,, ^ Tungsten mono(difluoromethane fluorenyl) imide salt; butyl fluorenyl taste = rust four I salt; κ butyl _3_ methyl odor wow town Hexaacetate; ^ ς 3 mercaptoimidyl tungsten trifluoroacetate] butyl winter heptafluorobutyrate; 1 - bis-3-methylimidazole cast trifluoromethanesulfonate; 1-butyl-3 - mercapto imidazolium sulfonate; butyl butyl methyl imidazolium bis(trifluoromethanesulfonate: =) imide salt; 1-hexyl _3_methylimidazolium bromide; hexyl-hydrazine methyl rice sit Bismuth chloride; hexylmethylimidazole key tetrafluoroborate; hexyl hydrazine methyl glutinous hexahydrate hexate I; hexyl-3-methyl milton three gas 曱 ^ citrate; 1 _ octyl -3 ·Methylimidazolium tetrafluoroborate; 1-octyl-3-methyl^Junxian hexa-acid salt; 丨_hexyl_2,3_diindolyl (four) Butyric acid 2,1,2-dimercapto_3_propylimidazolium bis(trifluoromethanesulfonyl)imide salt; 1-methylpyrazolium tetrafluoroborate; 3-methylpyrazole rust Tetrafluoroborate; tetrahexylammonium bis(trifluoromethanesulfonyl)imide salt; diallyldimethyl tetrafluoro succinate, diallyldimethyl dimethyl trifluorophosphate Di-n-dimethyldimethylammonium bis(trifluoromethanesulfonyl)imide salt; diallyldimethylammonium bis(pentafluoroethanesulfonyl)imide salt; N,N_II Methyl N (2-methoxyethyl) ammonium tetrafluoromethaneate; n, n-diethyl-yimethyl-van (2-methoxyethyl) ammonium trifluoromethanesulfonate; N,N-Diethyl_N_methyl137*8980-N-(2-Methylylethyl)ammonium bis(trifluorodecanesulfonyl)imide salt; N,N-diethyl- N-fluorenyl-N-(2-methoxyethyl) ruthenium (five sulphur-burning) imine salt; glycidyl trimethylammonium trifluorosulfonate; glycidyl Methylammonium bis(trifluorodecanesulfonyl)imide salt; glycidyl 5-yltrimethylammonium bis(pentafluoroethanesulfonyl)imide salt; 1-butylpyridinium (trifluoro) Alkylsulfonyl)trifluoroacetamide; 1-butyl-3-mercaptopyridinium (trifluoromethanesulfonyl)trifluoroacetamide; 1-ethyl-3-indolyl imidazolium (trifluoro $decanesulfonyl)trifluoroacetamide; diallyldimethylammonium (trifluorodecanesulfonyl)trifluoroacetamide; glycidyltrimethylammonium (trifluoromethanesulfonate) N,N-dimercapto-N-ethyl-N-propylammonium bis(trifluorodecanesulfonyl)imide salt; N,N-dimercapto-N -ethyl-N-butylammonium bis(trifluorodecanesulfonyl)imide salt; N,N-dimercapto-N-ethyl-N-amylammonium bis(trifluoromethanesulfonyl) Imine salt; N,N-dimercapto-N-ethyl-N-hexyl ammonium bis(trifluorodecanesulfonyl)imide salt; N,N-dimercapto-N-ethyl-N- 15 heptyl ammonium bis(trifluoromethanesulfonyl)imide salt; hydrazine, hydrazine-dimethyl-N-ethyl-fluorenyl-nonyl ammonium bis(trifluorodecanesulfonyl)imide salt; , Ν-dimethyl-hydrazine, hydrazine-• dipropylammonium bis(trifluoromethanesulfonyl)imide salt; hydrazine, hydrazine-dimercapto-fluorenyl-propyl-hydrazine-butylammonium bis (three Fluoromethanesulfonyl)imide salt; hydrazine, hydrazine-dimercapto-fluorenyl-propyl-hydrazine- Amyl ammonium bis(trifluorodecanesulfonyl)imide salt; hydrazine, hydrazine-di-20 fluorenyl-fluorenyl-propyl-hydrazino-hexyl ammonium bis(trifluorodecanesulfonyl)imide salt; , Ν-dimercapto-fluorenyl-diyl-hydrazine-heptyl ammonium bis(trifluoromethanesulfonyl)imide salt; hydrazine, hydrazine-dimercapto-fluorenyl-butyl-hydrazino-hexyl ammonium bis (three Fluorane, sulfonyl) imide; hydrazine, hydrazine-dimercapto-fluorenyl-butyl-heptyl-heptyl ammonium bis(trifluorodecanesulfonyl) imide; hydrazine, hydrazine-dimethyl -Ν-pentyl-fluorenyl-hexyl ammonium bis(trifluorodecanesulfonate 10 1378980) imine salt; hydrazine, hydrazine-dimethyl-yl-N,N-dihexyl ammonium bis(trifluoromethanesulfonyl) Imino salt; trimethylheptyl ammonium bis(trifluoromethanesulfonyl)imide salt; N,N-diethyl-N-mercapto-N-propylammonium bis(trifluorodecanesulfonate) N,N-diethyl-N-methyl-N-pentyl ammonium bis(trifluoromethanesulfonyl) 5 imine salt; N,N-diethyl-N-methyl -N-heptyl ammonium bis(trifluorodecanesulfonyl)imide salt; N,N-diethyl-N-propyl-N-pentyl ammonium bis(trifluorodecanesulfonyl)imide a salt; triethylpropylammonium bis(trifluorodecanesulfonyl)imide salt; Ethyl amyl ammonium bis(trifluoromethanesulfonyl)imide salt; triethylheptyl ammonium bis(trifluorodecanesulfonyl)imide salt; hydrazine, hydrazine-dipropyl-N-10 hydrazine Ν-Ν-ethylammonium bis(trifluoromethanesulfonyl)imide salt; hydrazine, hydrazine-dipropyl-fluorenyl-fluorenyl-fluorenyl-amyl ammonium bis(trifluorodecanesulfonyl)imide Salt; hydrazine, hydrazine-dipropyl-hydrazine-butyl-hydrazino-hexyl ammonium bis(trifluorodecanesulfonyl)imide salt; hydrazine, hydrazine-dipropyl-hydrazine, hydrazine-dihexylammonium bis ( Trifluorodecanesulfonyl)imide salt; hydrazine, hydrazine-dibutyl-hydrazine-methyl-hydrazine-amylammonium bis(trifluoromethanesulfonyl)imide salt; 15 hydrazine, hydrazine-dibutyl Ν-Ν-methyl-Ν-hexyl ammonium bis(trifluorodecanesulfonyl)imide salt; trioctyl decyl ammonium bis(trifluoromethanesulfonyl)imide salt; fluorenyl-fluorenyl 1 - Ν-ethyl-Ν-propyl-hydrazine-amyl ammonium bis(trifluorodecanesulfonyl)imide salt and the like. Base polymer (copolymer) (Α) 20 The base polymer used in the binder composition according to the present invention comprises a copolymer which copolymerizes (al) a halogen-containing acrylate and/or Or methacrylate (hereinafter referred to as "ig group-containing (meth) acrylate") and (a2) acrylate and/or methacrylate (hereinafter referred to as "(indenyl) acrylate") preparation. 11 1378980 The amount of the (meth) acrylate (al) containing a halogen element is preferably from 0.1 to 15% by weight based on the total weight of the base polymer. If the setting of (al) is less than 0.1% by weight (the binder composition may not exhibit a sufficiently improved antistatic effect). The basis of using a halogen-containing (fluorenyl) acrylate (al) containing the above-mentioned range is used. In the case of the polymer (A), the binder composition also has an economic advantage from the viewpoint of production. Such a halogen-containing (mercapto) acrylate (al) may include, for example, H2C=C (Rl) COO ( R2) (wherein R1 is η or CH3, and R2 is at least one selected from the group consisting of CH2CF3, ch2 (cf2) 2h, ch2 (cf2) 4H, ch2ch2 (cf2) 6f, ch2ch22 (cf2) 8f, ch2ch2 (cf2) i〇F , CH2CH2 (CF2) 12F, CH (CF3) 2, CF (CF3) 2, CH2CH (OH) CH2a, CH2C6Br6, CH2C6H3Br3 and CH2C6H4Br2). Specific examples of (mercapto) acrylates (al) containing halogen elements may be Including but not limited to: (fluorenyl) 2,2,2-trifluoroethyl acrylate; 2,2,3,3-tetrapropyl acrylate; ih,1H,5H-octafluoro(meth)acrylate Amyl ester; hexafluoro-2-propyl (meth)acrylate; heptafluoro-2-propyl acrylate; 2-(perfluorooctyl)ethyl methacrylate; 2-propionic acid 3, 3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl ester; 2-acrylic acid 3,3,4,4,5,5,6,6, 7,7,8,8,9,9,10,10,10-heptadecafluorooctyl ester; 2-acrylic acid 3,3,4,4,5,5,6,6,7,7,8,8 , 9, 9, 10, 10, 11, 11, 12, 12, 12-tetrafluorododecyl ester; 2-acrylic acid 3,3,4,4,5,5,6,6,7, 7,8,8,9,9,10,10,11,11,12,12,13,13,14,14,14-pentafluorotetradecyl ester; 3-chloro-2 methacrylate -hydroxypropyl ester; 12 pentabromobenzyl acrylate; 2,4,6-tribromobenzyl acrylate; 2,6-dibromobenzyl acrylate, etc. As another main component of the base polymer (A), the basis The amount of the (meth) acrylate (a2) contained in the polymer is preferably from 50 to 99.1 wt.% based on the total weight of the base polymer. (Mercapto) acrylate (a2) may be used alone or as two kinds thereof A combination of more or more. Preferred examples of (meth)propionate (a2) may include: (meth) propyl acetoacetate, ethyl (meth) acrylate, (f-) acrylic acid Butane vinegar, tert-butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, 2-ethyl (T-) acrylate Ester, n-octyl (meth)acrylate, isooctyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-decyl (meth)acrylate, (methyl) Acrylic isophthalic acid S, (meth)acrylic acid twelfth wire, n-dodecyl (meth) acrylate, n-tetradecyl (meth) acrylate, (meth) acrylate Methoxy Ethyl, ethoxyethyl (meth) acrylate, butoxy Ethyl (meth) acrylate, (methyl) propyl acetoacetate, (methyl) propyl acrylate Tert-butylcyclohexanoic acid, (meth)propionic acid phenoxyacetic acid, (methyl) propyl phenoxy phenoxy polyethylene glycol ester, benzyl (meth) methacrylate, (fluorenyl) Isopropyl isobornyl (iSGbGnyl) g is a hydrazino group, tetrachloroguanidine vinegar, etc. 'but is not limited to the above examples. The base polymer contained in the binder composition for an optical element preferably contains C-president T as a main component to exhibit high adhesion. In view of excellent compatibility with ionic compounds and high adhesion of the binder composition according to the present invention, the base polymer is preferably an acrylic acid polymerization comprising at least 1,378,980 (meth) acrylate as a main component. Things. The base polymer preferably has a weight average molecular weight in the range of from 1,000,000 to 2,000,000. Within this range, the binder composition has sufficient adhesion to form an adhesive layer of the optical element (or optical member). The weight average molecular weight can be estimated based on polystyrene conversion by 5 gel permeation chromatography. Further, the Tg of the base polymer is preferably not higher than 0 ° C, more preferably -100 to -5 ° C, most preferably -80 to -10 ° C. When the Tg does not exceed 0 ° C, the base polymer containing an ionic compound can exhibit excellent adhesion. In addition to the above (meth) acrylate (al) and (meth) propylene 10 acid ester (a2), the base polymer may contain other components. The other components may include, for example, components for increasing cohesion and/or thermal resistance such as a monomer containing a sulfonic acid group, a monomer containing a phosphate group, a monomer containing a cyano group, a vinyl ester, and a aryl group. a vinyl group compound or the like; or a component having a functional group for enhancing adhesion or as a starting point of a crosslinking reaction, such as a mono 15 group containing a carboxyl group, a monomer containing an acid anhydride group, a monomer containing a hydroxyl group, and a mercapto group Monomer, amine group-containing monomer, epoxy group-containing monomer, II-propenylmorpholine, vinyl ether, and the like. Other components may include at least one or a combination of two or more of the above components. Examples of the acid-receptive monomer are not limited, and include styrene acid, 20 arylsulfonic acid, 2-(methyl) propylene decylamine-2-methylpropane sulfonic acid, (mercapto) acrylamide propylene amide Sulfonic acid, sulfopropyl (meth) acrylate, (mercapto) propylene oxy naphthalene acid, and the like. The monomer containing a phosphate group can be exemplified by 2-hydroxyethyl acryloyl phosphate. 14 137*8980 A monomer containing a cyano group can be exemplified by acrylonitrile. An exemplary vinyl ester is vinyl acetate. The aromatic vinyl compound can also be exemplified by stupid ethylene. The monomer containing a carboxyl group is not limited, and includes: (mercapto)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (mercapto)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid , B for women's acid 2 _ rebellion B g and so on. The monomer containing an acid anhydride group may include, for example, maleic anhydride, itaconic anhydride φ, and the like. The hydroxyl group-containing monomer includes, but is not limited to, (nonyl)acrylic acid 2-hydroxyl ethyl ester, (hydroxy) 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (mercapto)acrylic acid 6 -Hydroxyhexyl ester, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxydodecyl (meth)acrylate, acrylic acid (4-hydroxymethylcyclohexyl) Methyl ester, N-hydroxymethyl (fluorenyl) acrylamide, N-hydroxyethyl (decyl) acrylamide, vinyl alcohol, allyl 15 alcohol, 2-hydroxyethyl vinyl ether, 4 - hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, and the like. The monomer containing a guanamine group may include, for example, acrylamide, diethyl acrylamide, and the like. The monomer containing an amine group may include, for example, N,N-dimethylaminoacetate (meth)acrylate, N,N-didecylaminopropyl (meth)acrylate, and the like. The monomer containing an epoxy group may include, for example, glycidyl (meth)acrylate, aryl glycidyl ether, and the like. An example of a vinyl ether is ethyl ethoxylate. The base polymer can be obtained by a polymerization method generally used for synthesizing an acrylic polymer such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, and the like. Crosslinking Agent 5 The adhesive composition according to a preferred embodiment of the present invention can be improved by appropriately crosslinking the base polymer, especially the acrylic polymer which is a main component of the base polymer. Thermally resistive adhesive layer. In particular, the crosslinking method may comprise adding a compound to the acrylonitrile-based polymer as a suitable starting point for a crosslinking reaction having a functional group capable of reacting with any one of a carboxyl group 10, a hydroxyl group, an amine group, a decylamine or the like. The compound is, for example, an isocyanate compound, an epoxy compound, an aziridine compound, a metal chelate compound or the like. Briefly, the crosslinking process can be carried out using the desired crosslinking agent. Examples of the isocyanate compound are not particularly limited, and may include: an aromatic 15 isocyanate such as indole diisocyanate, dinonylphenyl diisocyanate or the like; an alicyclic isocyanate such as isophorone diisocyanate; and an aliphatic isocyanate such as 1 , 6-hexamethylene diisocyanate. Among them, an isocyanate compound and/or an epoxy compound are particularly preferable in terms of desired cohesiveness. These compounds may be used singly or in combination of two or more kinds thereof. More specifically, preferred examples of the isocyanate compound include, but are not limited to, a low aliphatic polyisocyanate such as butylene diisocyanate, hexamethylene diisocyanate or the like; an alicyclic isocyanate such as cyclopentylene diisocyanate Base ester, cyclohexyl diisocyanate, isophorone diisocyanate, etc.; aromatic diisocyanate g such as 2,4-nonyl diisocyanate, 4,4'-diphenylmethane diisocyanate 16 1378980 5
10 酯、二異氰酸二曱苯酯等;和異氰酸酯加合物諸如三經甲 基丙烷/甲笨二異氰酸酯三聚體加合物(商品 名:CORONATE L)、三羥甲基丙烷/1,6-已二異氛酸醋三聚 體加合物(商品名:CORONATE HL)、異氰脲酸酯(異氰 脲酸酯類)(商品名:CORONATE HX),其全部由Nipp〇n Polyurethane Industrial Co.,Ltd.生產。 環氧化合物包括例如N,N,N’N,-四縮水甘油基間二甲 苯二胺(商品名:TETRAD-X)、l,3-雙(N,N_二縮水甘油 基胺曱基)環己烷(商品名:TETRAD-C )等,其都由 Mitsubishi Chemicals 生產。 1510 esters, dinonylphenyl diisocyanate, etc.; and isocyanate adducts such as trimethylpropane / methyl diisocyanate trimer adduct (trade name: CORONATE L), trimethylolpropane / 1 , 6-diisoacetoic acid vinegar trimer adduct (trade name: CORONATE HL), isocyanurate (isocyanurate) (trade name: CORONATE HX), all of which are Nipp〇n Produced by Polyurethane Industrial Co., Ltd. The epoxy compound includes, for example, N,N,N'N,-tetraglycidyl metaxylenediamine (trade name: TETRAD-X), 1,3-bis(N,N-diglycidylamine fluorenyl) Cyclohexane (trade name: TETRAD-C), etc., all produced by Mitsubishi Chemicals. 15
這些交聯劑可單獨使用或作為其兩種或更多種的組合 使用。考慮交聯劑和待交聯的基礎聚合物之間的平衡,並 且更佳地考慮光學元件的用途,可合適地確定交聯劑的 量。為了藉由丙烯酸黏合劑的内聚性得到基礎聚合物的高 熱阻性,通常可以以相對於100 f量份(wt份)的基礎 聚合物不小於讀wt.份的量,將交聯劑力认到基礎聚合 物中。或者,考慮到撓性和/或黏合性,相對於100被份 的基礎聚合物,與基礎聚合物相結合的交聯綱量較佳地 為5 wt.份成更少。 20 包含於根據本教明的黏合劑級成物 有就凝膠分率(gdfraet崎)而言M 如果凝膠分率在錄圍之内’那麼基礎聚合物可改善黏合 劑組成物的黏合性。當在25°C浸於乙酸乙自旨—天時,可藉 由基於初重和浸潰並乾雜合劑組成物之後的重量的^ 17 1378980 等式估計凝膠分率: 凝膠分率=浸潰並乾燥之後的重量/初重X100 混合比率 5 抗靜電劑(B)與基礎聚合物(A)和抗靜電劑(B) 的組合的總重量的比率較佳地為0.01至5 wt%,更佳地 0.05至2 wt%。比率小於0.01 wt%時,黏合劑組成物不具 Φ 有令人滿意的抗靜電效果。如果比率為0.01至5 wt%,則 本發明的黏合劑組成物從製備觀點來看還具有經濟優勢。 10 其他組分 根據本發明實施方案的黏合劑組成物根據其應用還可 包含本領域已知的不同形式的多種添加劑,諸如粉末、顆 粒和/或箔,不具體限制添加劑,其包括:例如,增稠劑、 15 表面潤滑劑、流平劑、抗氧化劑、腐蚀抑制劑、光穩定劑、 紫外吸收劑、阻聚劑、砍烷偶聯劑、無機或有機填料、金 • 屬粉末、顏料等。 黏合劑組成物的製備 20 用於製備根據本發明的一個示例性實施方案的黏合劑 組成物的方法可藉由以下兩種方法舉例說明: 所述方法之一是:例如,在有機溶劑中,將作為基礎 聚合物的原料的不同類型的單體混合在一起,該有機溶劑 具有約120 °c或更小的沸點,例如為乙酸乙酯、曱苯、丙 18 酮、己烷、醇,隨後藉由向其中加入聚合引發劑以引發單 體的承合並產生基礎聚合物。所得基礎聚合物可 以以溶解 和/或溶脹在有機溶劑中的溶液狀態得到。 然後,將包含離子化合物的抗靜電劑加入包含基礎聚 5 合物的有機溶劑中’並與所述基礎聚合物均勻地混合。 之後’製備的混合物與交聯劑混合以交聯基礎聚合 物,如果必要的話,在此之後加入至少一種選自習用添加 劑的諸如石夕烧偶聯劑。結果,以作為最終產物製備了本發 明的黏合劑組成物。 10 $合劑組成物易於用於藉由將黏合劑組成物施加於基 體並乾燥塗敷的基體來形成黏合劑層。 所述方法的另-個是:例如,在有機溶劑諸如乙酸乙 酉曰中,將作為基礎聚合物原料的不同類型的單體混合在一 起,同呀,向其中加入包含離子化合物的抗靜電劑。還向 15 混合物中加入聚合引發劑以引發單體的聚合,因此得到包 含抗靜電劑的基礎聚合物。類似於所述第—方法,可以以 溶解和/或令脹在有機溶劑中的溶液狀態得到所得基礎聚 合物。 之後,將父聯劑加入到包含在有機溶劑中的基礎聚合 20 物和抗靜電劑的所得溶液中,以交聯基礎聚合物,如果必 要,隨後加入至/種選自習用添加劑的諸如矽烷偶聯 劑。結果,以作為最終產物製備了本發明的點合劑組成物。 類似第-方法,當將黏合劑組成物施加於基體隨後乾 燥塗敷的基體時’該黏合劑組成物可形成黏合劑層。 5 抗靜2所揭示的,關於本發明的黏合劑組成物的製備, 可在製縣礎聚合物之後加人到基礎聚合物中, 合抗靜電劑可在基礎聚合物的製備期間加人到基礎聚 ^中。為了獲得抗靜電劑和基礎聚合物的均勻混合物, 几靜電聚合物較佳地可溶於有機溶劑諸如乙酸乙醋中。These crosslinking agents may be used singly or in combination of two or more kinds thereof. The amount of the crosslinking agent can be suitably determined in consideration of the balance between the crosslinking agent and the base polymer to be crosslinked, and more preferably considering the use of the optical member. In order to obtain the high thermal resistance of the base polymer by the cohesiveness of the acrylic adhesive, the crosslinking agent force can usually be used in an amount of not less than the read wt. parts relative to 100 f parts by weight of the base polymer. Recognized in the base polymer. Alternatively, in view of flexibility and/or adhesion, the crosslinking amount combined with the base polymer is preferably 5 wt. parts to less with respect to 100 parts by weight of the base polymer. 20 Included in the binder grade according to the present teachings, in terms of gel fraction (gdfraet smear), M. If the gel fraction is within the range of the footprint, then the base polymer improves the adhesion of the binder composition. . When immersed in acetic acid at 25 ° C, the gel fraction can be estimated by the equation of 1 17 1378980 based on the weight of the initial weight and the impregnated and dry hybrid composition: Gel fraction = dip Weight/earth weight X100 mixing ratio after collapse and drying 5 The ratio of the total weight of the combination of the antistatic agent (B) and the base polymer (A) and the antistatic agent (B) is preferably 0.01 to 5 wt%, more Goodly 0.05 to 2 wt%. When the ratio is less than 0.01 wt%, the binder composition does not have Φ and has a satisfactory antistatic effect. If the ratio is from 0.01 to 5 wt%, the binder composition of the present invention has an economic advantage from the viewpoint of preparation. 10 Other Components The adhesive composition according to an embodiment of the present invention may further comprise various additives in various forms known in the art, such as powders, granules and/or foils, depending on the application thereof, without specifically limiting the additives, including: for example, Thickener, 15 surface lubricant, leveling agent, antioxidant, corrosion inhibitor, light stabilizer, UV absorber, polymerization inhibitor, chopping coupling agent, inorganic or organic filler, gold powder, pigment, etc. . Preparation of Binder Composition 20 A method for preparing a binder composition according to an exemplary embodiment of the present invention can be exemplified by the following two methods: One of the methods is, for example, in an organic solvent, Different types of monomers are used as raw materials for the base polymer having a boiling point of about 120 ° C or less, such as ethyl acetate, toluene, propylene 18 ketone, hexane, alcohol, followed by The base polymer is produced by injecting a polymerization initiator thereto to initiate the combination of the monomers. The resulting base polymer can be obtained in a solution state which dissolves and/or swells in an organic solvent. Then, an antistatic agent containing an ionic compound is added to the organic solvent containing the base polymer' and uniformly mixed with the base polymer. Thereafter, the prepared mixture is mixed with a crosslinking agent to crosslink the base polymer, and if necessary, at least one selected from a conventional additive such as a sulphur coupling agent. As a result, the binder composition of the present invention was prepared as a final product. The 10 $ composition is readily used to form a layer of adhesive by applying a binder composition to the substrate and drying the coated substrate. Another method of the method is, for example, mixing together different types of monomers as a base polymer raw material in an organic solvent such as ethyl acetate, and adding an antistatic agent containing an ionic compound thereto. A polymerization initiator was also added to the mixture to initiate polymerization of the monomer, thus obtaining a base polymer containing an antistatic agent. Similar to the first method, the resulting base polymer can be obtained in a state of a solution which dissolves and/or swells in an organic solvent. Thereafter, the parent binder is added to the resulting solution of the base polymer 20 and the antistatic agent contained in the organic solvent to crosslink the base polymer, and if necessary, subsequently added to a species such as a decane couple selected from conventional additives. Joint agent. As a result, the dot composition of the present invention was prepared as a final product. Similar to the first method, when the binder composition is applied to the substrate and then the coated substrate is dried, the binder composition can form a binder layer. 5 Antistatic 2 discloses that the preparation of the adhesive composition of the present invention can be added to the base polymer after the base polymer, and the antistatic agent can be added during the preparation of the base polymer. The base is in the ^. In order to obtain a homogeneous mixture of the antistatic agent and the base polymer, several of the electrostatic polymers are preferably soluble in an organic solvent such as ethyl acetate.
根據本發明的一個示例性實施方案的光學元件包括光 予片和使用本發明的黏合劑組成物形成的黏合劑層,該黏 合劑層以3至200 μιη的典型厚度,較佳地1〇至1〇〇 μιη 的各度施加於光學片的一側或兩側的每一側。通常藉由將 黏合劑層直接施加於光學片,將黏合劑層塗敷在光學片 上。或者,黏合劑層可首先施加於其他基體(諸如釋放襯 板(release liner))並然後轉移至光學片。 黏合劑層的施加和塗敷可藉由用於製造黏合帶的習用 方法進行’所述方法包括例如輥塗、凹版塗敷、反轉塗敷 (reverse coating )、輥刷、喷塗、氣刀塗敷(airknife coating )、缝塗(die coating )等。 本發明中使用的光學片不具體限制,只要其可適用於 製造不同的顯示器即可,其可包括例如偏光鏡、相襯板 (phase contrast plate )、亮度增強板、防眩光板等。而且, 光學片也可包括至少兩個光學層的層疊物,諸如偏光鏡和 相襯板的層疊物、使用兩個或更多個相襯板形成的層疊 物、偏光鏡和亮度增強板或防眩光板的層疊物等。 20 1^78980 10 15An optical element according to an exemplary embodiment of the present invention includes a photo-preform and an adhesive layer formed using the adhesive composition of the present invention, the adhesive layer having a typical thickness of 3 to 200 μm, preferably 1 Torr to Each degree of 1 〇〇 μηη is applied to one side or both sides of the optical sheet. The adhesive layer is usually applied to the optical sheet by directly applying the adhesive layer to the optical sheet. Alternatively, the adhesive layer can be applied first to other substrates, such as a release liner, and then transferred to an optical sheet. The application and application of the adhesive layer can be carried out by a conventional method for manufacturing an adhesive tape. The method includes, for example, roll coating, gravure coating, reverse coating, roll brushing, spraying, air knife. Airknife coating, die coating, and the like. The optical sheet used in the present invention is not particularly limited as long as it is applicable to manufacture of different displays, and may include, for example, a polarizing mirror, a phase contrast plate, a brightness enhancement plate, an anti-glare plate, and the like. Moreover, the optical sheet may also comprise a laminate of at least two optical layers, such as a laminate of polarizers and phase contrast plates, a laminate formed using two or more phase contrast plates, a polarizer and a brightness enhancement plate or A laminate of glare sheets, and the like. 20 1^78980 10 15
20 在光學片上形成的黏合劑層(即黏合劑組成物)表現 出 1 至 15 (N/25mm)、更佳地 5 至 1〇 (N/25mm)的 黏合強度。認為1至15 ( N/25 mm )的黏合強度足以實 現對於光學元件有利的黏合劑層。可根據對於黏合帶和黏 合片已知的測試方法JIS Z0237測量和評估黏合強度。更 具體地,將具有黏合劑層的光學元件置於在23 °C下50% RH的環境中7天之後,將光學元件切割為25mm的寬度。 然後將切割的樣品黏接於玻璃片用於在下和5 kg/Cm2的壓力下高壓釜處理2〇分鐘。隨後,根據jis ZC^37,使用拉伸試驗機用以下條件對樣品的黏合性進行 測。里.剝離速度為0.3 m/分鐘,剝離角度為18〇。,溫度為 23°C,5〇%RH的環境’以評價黏合劑層的黏合性。 本發明的黏合劑組成物包含基礎聚合物和包含離子化 靜電劑’所述基礎聚合物可藉由共聚含鹵族元素 酸醋與(甲基)丙她旨來製備。因此, 點-劑㈣的(甲基)丙稀酸賴和,或抗靜電劑的 么==,則本發明的黏合劑組成物更能用於製 有八有極好抗靜電性能的黏合劑層。 成』月示例性實施方案的黏合劑組 期望薄層電為1χ1〇8至W。11剛的 明示例性實施方==極好的抗靜電性能。根據本發 含於(甲基)丙〜族元素所S電== 21 1378980 度負電性的並使得離子化合物易於在黏合劑層中遷移。 另外,根據本發明示例性實施方案的黏合劑組成物較 佳地用於形成具有高透明性和防止塗敷有該黏合劑層的光 學片污染和/或腐蝕能力的黏合劑層,由此不會使該片的光 5 學性能劣化。因此,本發明的黏合劑組成物適於形成用於 光學元件的黏合劑層。 而且,根據本發明示例性實施方案的黏合劑組成物表 I 現出極好的透明性,所述黏合劑組成物中的基礎聚合物包 含至少一種(曱基)丙烯酸酯作為主要組分。 10 基礎聚合物的重均分子量為1,000,000至2,000,000, 凝膠分率同樣為50至80%。因此,如果使用黏合劑組成 物作為光學元件的黏合劑層,則黏合劑層具有足以較佳地 應用於光學元件的改善黏合性。 如果含有矽烷偶聯劑的黏合劑組成物用於形成光學元 15 件的黏合劑層,則在碎烧偶聯劑和待塗覆的基體表面上的 官能團之間形成化學鍵。這導致黏合劑層和基體之間的介 • 面處的黏合強度的增強。因此,即使待塗覆基體和光學片 的熱膨脹係數顯著不同,應力也由於黏合劑層和基體之間 熱膨脹係數的差異而集中於黏合劑層和基體之間的介面 20 處,由此減小施加於光學片的應力。 較佳實施方案詳述 藉由以下實施例將更好地理解本發明,所述實施例不 應解釋為限制本發明的範圍。 22 复施例 首先’將詳鈿描述製備根據實施例1至11和比較例i 至7的黏合劑組成物的方法。此外,在下面的描述十,將 說月裝根據實施例1至Η和比較例1至7的光學元件的 方法’例如’其包括將黏合劑組成物施加於偏光鏡。對每 個製造的光學元件進行性能測試。 施例1鼓共聚物组成物的率偌 將98·49重量份的丙烯酸丁酯、1重量份的丙烯酸2-羥乙酯、0.5重量份的作為含鹵族元素的(曱基)丙烯酸酯 (al )的丙稀g文二氟乙g旨以及作為溶劑的120重量份的乙酸 乙酯置於配備有回流冷凝器和攪拌器的燒瓶中,並且在氮 氣氛下加熱到65。(:。向其中加入〇.〇4重量份的AIBN作 為聚合引發劑’並且在保持6 5的相同溫度的同時允許聚 合進行6小時。聚合完成之後,以〇 〇1重量份的量將離子 化合物即1-己基-3-曱基咪唑鑌六氟磷酸鹽加入到反應產 物中。為了控制產物的黏度,另外向其中加入28〇重量份 的乙酸乙酯。然後,冷卻產物到室溫,得到包含根據實施 例1的黏合劑組成物的共聚物組成物溶液(稱為“共聚物溶 液)。共聚物溶液中所述黏合劑組成物的濃度為約2〇 wt%,而共聚物溶液的黏度是4〇〇〇 mpas。表丄表示黏合 劑組成物中組分的混合比、共聚物溶液中黏合劑組成物的 濃度以及共聚物溶液的黏度。 1378980 藉由GPC測定基礎聚合物的重均分子量。結果示於表 ο 表120 The adhesive layer (i.e., the binder composition) formed on the optical sheet exhibits an adhesive strength of 1 to 15 (N/25 mm), more preferably 5 to 1 Torr (N/25 mm). It is believed that a bond strength of 1 to 15 (N/25 mm) is sufficient to achieve a layer of adhesive that is advantageous for optical components. The bonding strength can be measured and evaluated according to the known test method JIS Z0237 for adhesive tapes and adhesive sheets. More specifically, after the optical element having the adhesive layer was placed in an environment of 50% RH at 23 ° C for 7 days, the optical element was cut to a width of 25 mm. The cut sample was then bonded to a glass piece for autoclaving for 2 minutes at a lower pressure of 5 kg/cm2. Subsequently, the adhesion of the sample was measured using a tensile tester according to the following conditions according to jis ZC^37. The peeling speed was 0.3 m/min and the peeling angle was 18 〇. The temperature was 23 ° C, an environment of 5 % RH to evaluate the adhesion of the adhesive layer. The binder composition of the present invention comprises a base polymer and comprises an ionizing electrostatic agent. The base polymer can be prepared by copolymerizing a halogen-containing acid vinegar with (meth) propyl. Therefore, the dot-agent (iv) (meth)acrylic acid, or the antistatic agent ==, the adhesive composition of the present invention can be used to make eight adhesives having excellent antistatic properties. Floor. The adhesive group of the exemplary embodiment of the month is expected to have a thin layer of electricity of from 1 χ 1 〇 8 to W. 11 Illustrator of the exemplary implementation == excellent antistatic properties. According to the present invention, the (meth)propane-group element is electrically negative == 21 1378980 degrees negatively charged and makes the ionic compound easy to migrate in the binder layer. In addition, the adhesive composition according to an exemplary embodiment of the present invention is preferably used to form an adhesive layer having high transparency and preventing the contamination and/or corrosion resistance of the optical sheet coated with the adhesive layer, thereby not This will degrade the optical performance of the sheet. Therefore, the adhesive composition of the present invention is suitable for forming a binder layer for an optical element. Moreover, the adhesive composition table I according to the exemplary embodiment of the present invention exhibits excellent transparency, and the base polymer in the binder composition contains at least one (fluorenyl) acrylate as a main component. The base polymer has a weight average molecular weight of 1,000,000 to 2,000,000 and a gel fraction of 50 to 80%. Therefore, if a binder composition is used as the adhesive layer of the optical member, the adhesive layer has an adhesive property sufficient to be preferably applied to the optical member. If a binder composition containing a decane coupling agent is used to form the binder layer of the optical element 15, a chemical bond is formed between the calcining coupling agent and the functional group on the surface of the substrate to be coated. This results in an increase in the bond strength at the interface between the adhesive layer and the substrate. Therefore, even if the coefficient of thermal expansion of the substrate to be coated and the optical sheet are significantly different, the stress is concentrated at the interface 20 between the adhesive layer and the substrate due to the difference in thermal expansion coefficient between the adhesive layer and the substrate, thereby reducing the application. The stress on the optical sheet. The invention is better understood by the following examples, which are not to be construed as limiting the scope of the invention. 22 EXAMPLES First, the method of preparing the binder compositions according to Examples 1 to 11 and Comparative Examples i to 7 will be described in detail. Further, in the following description X, a method of mounting the optical elements according to Embodiments 1 to 1 and Comparative Examples 1 to 7 will be described, for example, which includes applying a binder composition to a polarizer. Performance testing was performed on each manufactured optical component. The ratio of the composition of the drum copolymer of Example 1 was 98.49 parts by weight of butyl acrylate, 1 part by weight of 2-hydroxyethyl acrylate, and 0.5 part by weight of (mercapto) acrylate as a halogen-containing element ( The propylene difluoride and the 120 parts by weight of ethyl acetate as a solvent were placed in a flask equipped with a reflux condenser and a stirrer, and heated to 65 under a nitrogen atmosphere. (: 〇. 〇 4 parts by weight of AIBN was added as a polymerization initiator' and the polymerization was allowed to proceed for 6 hours while maintaining the same temperature of 65. After the completion of the polymerization, the ionic compound was added in an amount of 1 part by weight. That is, 1-hexyl-3-mercaptoimidazolium hexafluorophosphate was added to the reaction product. To control the viscosity of the product, 28 parts by weight of ethyl acetate was additionally added thereto. Then, the product was cooled to room temperature to obtain inclusion. a copolymer composition solution (referred to as "copolymer solution") of the binder composition of Example 1. The concentration of the binder composition in the copolymer solution is about 2% by weight, and the viscosity of the copolymer solution is 4 〇〇〇 mpas. The expression indicates the mixing ratio of the components in the binder composition, the concentration of the binder composition in the copolymer solution, and the viscosity of the copolymer solution. 1378980 The weight average molecular weight of the base polymer was determined by GPC. The results are shown in the table ο Table 1
黏合劑组成物的 實施例 搆成比率 1 2 3 4 5 6 7 8 9 10 11 12 基礎 BA 98.49 92.9 77 82 91.95 99 93 86.3 78.2 87.3 90.2 93 聚合 2EHA 10 5 3 4 9 5 2 物 TFHA 0.5 2 0.1 1 S 10 (%) TFEM 5 HFPA 10 5 HFPM 15 5 3CHPM 5 HEA 1 1 2 1 1 1 4HBA 2 2 1 AA 1 1 0.8 0.7 0.8 0.7 0.8 離子 化合物1 0.01 0.05 0.1 1 2 1 化合 化合物2 0.1 1 物 化合物3 2 1 (%) 化合物4 2 1 總量(wt·%) 100 100 100 100 100 100 100 100 100 100 100 100 點度(mPa.s) 5000 4500 3000 3000 4000 5000 4000 3500 3000 3500 3500 4000 濃度(°/〇) 20 20 20 20 20 20 20 20 20 20 20 20 基礎聚合物的重 均分子量 1800000 1600000 1100000 1300000 1400000 1800000 1300000 1400000 1200000 1400000 1500000 1400000 BA :丙烯酸丁酯 2EHA :丙烯酸2-乙基己酯 TFEA :丙烯酸三氟乙酯 TFEM :甲基丙烯酸三氟乙酯 HFPA :丙烯酸六氟-2-丙酯 HFPM:甲基丙烯酸六氟-2-丙酯 3CHPM:曱基丙烯酸3-氯-2-羥丙酯 HEA :丙烯酸2-羥乙δ旨 4ΗΒΑ :丙烯酸4-羥丁酯 ΑΑ :丙烯酸 化合物1 :卜己基-3-甲基咪唑鑌六氟磷酸鹽(由TokyoCaseHndusdesLtd.,生產) 化合物2 : N-甲基-N-丙基呱啶銪雙(三氟曱坑項醯基)亞胺鹽(由Kanto Chemical Co.,Inc.,生產) 化合物3 : 1-乙基°比啶鑌溴化物(由T〇ky〇CaseiIndustriesLtd·,生產) 化合物4 :卜丁基-3-甲基吡啶鍩三氟甲饮祷酸鹽(由Toky〇CaseiIndustriesLtd.,生產) 24 1378980 10 |例2至12的先聚物組成物湓爷斤 X除了選自丙烯酸三氟乙酯、甲基丙婦酸三氣乙醋 烯酸六氟-2-丙酯、曱基丙烯酸六氟_2_丙酯、甲基丙曰 3-氯-2-羥丙酯中的任意一種作為含鹵族元素的基)丙 烯酸酯(al);選自丙烯酸丁酯 '丙烯酸孓乙基已酯:丙 酸2-羥乙酯、丙烯酸4-羥丁酯和丙烯酸中的至少二種和 作為落劑的乙酸乙酯混合在一起,同時,向其中加入選自 1-己基-3-f基咪唑鑌六氟磷酸鹽、N_曱基_N_丙基呱啶=雙 (二氟曱烷磺醯基)亞胺鹽、丨_乙基吡啶鑕溴化物和丨丁基 -3-甲基吡啶鑌三氟甲烷磺酸鹽中的任意一種 ς 15 合物之外,藉由與實施例i中描述的相同的方法製備根據 實施例2至12的包含黏合劑組成物的每種共聚物溶液。對 於包含根據實施例2至12的黏合劑組成物的每種所得共聚 物/谷液,表1示出黏合劑組成物中的組分的混合比、乓聚 物溶液中黏合劑組成物的濃度和共聚物溶液的黏度,以及 黏合劑組成物中基礎聚合物的重均分子量。 根據較例1至7的共聚物組成物溶液的擊免 20 除了選自丙烯酸丁醋、丙婦酸2_乙基己酉旨、丙稀酸2_ 羥乙酯、丙烯酸4-羥丁酯和丙烯酸中的至少一種與作為溶 劑的乙酸乙酯混合在一起,同時,向其中加入(或不加入) 選自丙烯酸二氟乙酯、甲基丙烯酸三氟乙酯、丙烯酸六氟 -2-丙醋中的任意-種作為含_族元素的(甲基)丙婦酸醋 (al)同時,向其中加入選自卜己基_3_曱基咪峻鏘六氟磷 25 1378980 酸鹽和N-曱基-N-丙基呱啶鑌雙(三氟曱烷磺醯基)亞胺 鹽中的任意一種作為離子化合物之外,藉由與實施例1中 描述的相同的方法製備根據比較例1至7的包含黏合劑組 成物的每種共聚物溶液。 對於根據比較例1至7的包含黏合劑組成物的每種所 得共聚物溶液,表2示出黏合劑組成物中的組分的混合 比、共聚物溶液中黏合劑組成物的濃度和共聚物溶液的黏 度,以及黏合劑組成物中基礎聚合物的重均分子量。 10 表2 黏合劑組成物的 構成比率 比較例 1 2 3 4 5 6 7 基礎聚合物 (wt.% ) BA 99 98.5 93 79 99.1 87.2 91.5 2EHA 10 10 4 TFEA 0.5 TFEM 5 HFPA 10 HEA 1 1 4HBA 2 2 AA 1 0.8 0.8 0.7 離子化合物 (wt.%) 化合物1 0.1 1.8 化合物2 1 總量(wt·%) 100 100 100 100 100 100 100 黏度(mPa.s) 5000 5000 4500 3000 5000 3000 4000 濃度(%) 20 20 20 20 20 20 20 基礎聚合物的重均分子量 1800000 1800000 1600000 1100000 1700000 1300000 1400000 BA :丙烯酸丁酯 2EHA :丙烯酸2-乙基己酯 TFEA :丙烯酸三氟乙酯 TFEM:甲基丙烯酸三氟乙酯 HFPA :丙烯酸六氟-2-丙酯 HEA:丙烯酸2-羥乙酯 4HBA :丙烯酸4-羥丁酯 AA :丙烯酸 化合物1 · 1-己基-3-甲基咪唾餚六氟磷酸鹽(由T〇ky〇 Casei Industries Ltd.,生產) 化合物2 : N-甲基-=-丙基呱啶鑌雙(三氟甲烷磺醯基)亞胺鹽(由cant〇 Chemical Co., _Inc.,生產) 26 1378980 根攄實施例1至12以及比較例1至7的光學元件的製造 向如表1和2所示的根據實施例1至12以及比較例1 至7的包含黏合劑組成物的100 wt%的每種共聚物溶液 中,分別加入三羥甲基丙烷/甲苯二異氰酸酯類交聯劑B 5 (Nippon Polyurethane Ind. Co.,Ltd.,商品名:CORONATE L)以及3-環氧丙氧基丙基曱基二乙氧基石夕燒作為石夕烧偶 聯劑 C (Shin,Etsu Chemical Co.,Ltd.,商品名:Shinetsu Silicone KBM-403 ),以達到表3和/或表4所列的混合比, 然後,均勻地混合以製備溶液狀態的黏合劑組成物。將黏 ίο 合劑組成物施加於PET釋放膜(由Mitsubishi Chemical Polyester Film Corp.,生產,商品名:MRF 38)以形成具有 25 μιη乾厚度的黏合劑層,在90°C下乾燥3分鐘以形成包 含黏合劑組成物的黏合劑層。將PET釋放膜和黏合劑層黏 接於偏光鏡(由Miguanlmaging生產,商品名:MLPH)以 15 製造根據實施例1至11以及比較例1至7的每一項的光學 元件。 對製造的光學元件進行性能測試以確定和分析多種性 月匕諸如黏合性、表面電阻、金屬腐姓性、漏光性、财久性、 基體黏附性、待塗敷基體的污染、低溫穩定性、再加工 20 (rework)性等。此外,也測量和/或確定其他特性,其包 括溶液中黏合劑組成物的濃度、黏合劑組成物的黏度以及 黏合劑組成物交聯之後的凝耀分率《當在25°C下浸在乙酸 乙酯中一天時,凝勝分率藉由基於黏合劑組成物的初重以 及浸潰並乾燥之後重量的下式計算:[凝膠分率=浸潰並乾 27 1378980 燥之後的重量/初重χ 100]。 根據以下方法進行性能測試: 性能測試方法 5 表面電阻 在將具有黏合劑層的光學元件在23°c下、在50%RH 環境中放置7天之後,在23°C下、在50%RH的環境中使 用微靜電計(得自 Kawaguchi Electric Works Co, Ltd.)測 量光學元件的表面電阻。 10 金屬腐I虫性 在將具有黏合劑層的光學元件在23°C下、在50%RH 環境中放置7天之後,將鋁箔黏接於黏合劑層的表面,並 且在60°C下、在90%RH的環境中放置2天,隨後觀察黏 15 合劑層的狀況。顯示鋁箔無變化的情況以“〇”表示,而顯 示鋁箔變白的其他情況以“χ”表示。 漏光十生 在將具有黏合劑層的光學元件在23°C下、在50%RH 20 環境中放置7天之後,將光學元件分別切割為120 mm(偏 光鏡的MD方向)x60 mm以及120 mm (偏光鏡的TD方 向)x60 mm的尺寸。將切割板黏接於玻璃基體的兩側並 然後在50°C和5 kg/cm2的壓力下進行高壓釜處理20分 鐘。將處理的玻璃基體在80°C下在正常環境中放置120小 28 1378980 時之後,觀察玻璃基體的外觀。顯示沒有漏光的情況以 “〇”表示,而顯示漏光的其他情況以“X”表示。 耐久性Example Composition Ratio of Binder Composition 1 2 3 4 5 6 7 8 9 10 11 12 Basis BA 98.49 92.9 77 82 91.95 99 93 86.3 78.2 87.3 90.2 93 Polymerization 2EHA 10 5 3 4 9 5 2 TFHA 0.5 2 0.1 1 S 10 (%) TFEM 5 HFPA 10 5 HFPM 15 5 3CHPM 5 HEA 1 1 2 1 1 1 4HBA 2 2 1 AA 1 1 0.8 0.7 0.8 0.7 0.8 Ionic compound 1 0.01 0.05 0.1 1 2 1 Compound 2 0.1 1 Compound 3 2 1 (%) Compound 4 2 1 Total amount (wt·%) 100 100 100 100 100 100 100 100 100 100 100 100 100 points (mPa.s) 5000 4500 3000 3000 4000 5000 4000 3500 3000 3500 3500 4000 Concentration (°/〇) 20 20 20 20 20 20 20 20 20 20 20 20 The weight average molecular weight of the base polymer is 1800000 1600000 1100000 1300000 1400000 1800000 1300000 1400000 1400000 1400000 1500000 1400000 BA : butyl acrylate 2EHA : 2-ethylhexyl acrylate TFEA: Trifluoroethyl acrylate TFEM: Trifluoroethyl methacrylate HFPA: Hexafluoro-2-propyl acrylate HFPM: Methyl propylene Hexafluoro-2-propyl ester 3CHPM: 3-chloro-2-hydroxypropyl methacrylate HEA: 2-hydroxyethyl acrylate acrylate 4 ΗΒΑ: 4-hydroxybutyl acrylate ΑΑ : Acrylic compound 1 : hexyl-3- Imidazolium hexafluorophosphate (manufactured by TokyoCase Hndusdes Ltd.) Compound 2: N-methyl-N-propyl acridine bis(trifluoroanthracene) anthracene salt (by Kanto Chemical Co., Inc. ., Production) Compound 3: 1-ethylh-pyridinium bromide (produced by T〇ky〇Casei Industries Ltd.) Compound 4: Bubutyl-3-methylpyridinium trifluoromethane hydrochloride (by Toky〇) CaseiIndustries Ltd., produced) 24 1378980 10 | The precursor composition of Examples 2 to 12 is selected from the group consisting of trifluoroethyl acrylate and methyl acetoacetate hexafluoro-2-propyl ethoxide. Any one of hexyl fluoro-2-propyl acrylate, methyl propyl hydrazine 3-chloro-2-hydroxypropyl ester as a halogen group-containing acrylate (al); selected from butyl acrylate 'acrylic acid Ethyl hexyl ester: at least two of 2-hydroxyethyl propionate, 4-hydroxybutyl acrylate and acrylic acid are mixed together with ethyl acetate as a falling agent, and simultaneously Adding 1-hexyl-3-f-imidazolium hexafluorophosphate, N_mercapto-N-propyl acridine = bis(difluorodecanesulfonyl)imide salt, 丨_ethylpyridinium Preparations according to Examples 2 to 12 were carried out in the same manner as described in Example i except for any one of bromide and indole-3-methylpyridinium trifluoromethanesulfonate. Each copolymer solution containing a binder composition. For each of the obtained copolymer/trough liquids containing the binder compositions according to Examples 2 to 12, Table 1 shows the mixing ratio of the components in the binder composition, and the concentration of the binder composition in the pong polymer solution. The viscosity of the copolymer solution and the weight average molecular weight of the base polymer in the binder composition. The scavenging 20 of the copolymer composition solution according to Comparative Examples 1 to 7 is selected from the group consisting of butyl acrylate, propylene glycol 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate, and acrylic acid. At least one of them is mixed with ethyl acetate as a solvent, and at the same time, added thereto (or not added) selected from difluoroethyl acrylate, trifluoroethyl methacrylate, hexafluoro-2-propionic acrylate Any as a kind of (meth) acetoacetate (al) containing a _ group element, and simultaneously adding a hexafluorophosphate 25 1378980 acid salt and N-fluorenyl group selected from the group consisting of Preparation of any of N-propyl acridine bis(trifluorodecanesulfonyl)imide salts as an ionic compound by the same method as described in Example 1 according to Comparative Examples 1 to 7. Each of the copolymer solutions containing the binder composition. For each of the obtained copolymer solutions containing the binder compositions according to Comparative Examples 1 to 7, Table 2 shows the mixing ratio of the components in the binder composition, the concentration of the binder composition in the copolymer solution, and the copolymer. The viscosity of the solution, as well as the weight average molecular weight of the base polymer in the binder composition. 10 Table 2 Composition ratio of binder composition Comparative Example 1 2 3 4 5 6 7 Base polymer (wt.%) BA 99 98.5 93 79 99.1 87.2 91.5 2EHA 10 10 4 TFEA 0.5 TFEM 5 HFPA 10 HEA 1 1 4HBA 2 2 AA 1 0.8 0.8 0.7 Ionic compound (wt.%) Compound 1 0.1 1.8 Compound 2 1 Total amount (wt·%) 100 100 100 100 100 100 100 Viscosity (mPa.s) 5000 5000 4500 3000 5000 3000 4000 Concentration (% 20 20 20 20 20 20 20 Weight average molecular weight of base polymer 1800000 1800000 1600000 1100000 1700000 1300000 1400000 BA : butyl acrylate 2EHA : 2-ethylhexyl acrylate TFEA : trifluoroethyl acrylate TFEM: trifluoroacrylate Ethyl ester HFPA: hexafluoro-2-propyl acrylate HEA: 2-hydroxyethyl acrylate 4HBA: 4-hydroxybutyl acrylate AA: Acrylic compound 1 · 1-hexyl-3-methyl bismuth hexafluorophosphate ( Produced by T〇ky〇Casei Industries Ltd.) Compound 2: N-methyl-=-propyl acridine bis(trifluoromethanesulfonyl)imide salt (by cant〇Chemical Co., _Inc., Production) 26 1378980 Roots Examples 1 to 1 2 and the optical elements of Comparative Examples 1 to 7 were produced into 100 wt% of each copolymer solution containing the binder composition according to Examples 1 to 12 and Comparative Examples 1 to 7 as shown in Tables 1 and 2. , respectively, a trimethylolpropane/toluene diisocyanate crosslinking agent B 5 (Nippon Polyurethane Ind. Co., Ltd., trade name: CORONATE L) and 3-glycidoxypropyl fluorenyl diethoxy Keshi Xialing is used as a coupling agent C (Shin, Etsu Chemical Co., Ltd., trade name: Shinetsu Silicone KBM-403) to achieve the mixing ratios listed in Table 3 and/or Table 4, and then uniformly The mixture was mixed to prepare a binder composition in a solution state. The adhesive composition was applied to a PET release film (manufactured by Mitsubishi Chemical Polyester Film Corp., trade name: MRF 38) to form a binder layer having a dry thickness of 25 μm, and dried at 90 ° C for 3 minutes to form. A layer of adhesive comprising a binder composition. The PET release film and the adhesive layer were bonded to a polarizing mirror (manufactured by Miguanlmaging, trade name: MLPH) to manufacture optical elements according to each of Examples 1 to 11 and Comparative Examples 1 to 7. Perform performance tests on manufactured optical components to determine and analyze various properties such as adhesion, surface resistance, metal rot, light leakage, longevity, matrix adhesion, contamination of the substrate to be coated, low temperature stability, Rework 20 (rework) and so on. In addition, other characteristics are also measured and/or determined, including the concentration of the binder composition in the solution, the viscosity of the binder composition, and the condensing fraction after crosslinking of the binder composition "When immersed at 25 ° C In one day of ethyl acetate, the gel fraction is calculated by the initial weight based on the binder composition and the weight after impregnation and drying: [gel fraction = impregnation and dry 27 1378980 weight/primary weight after drying χ 100]. Performance testing was performed according to the following method: Performance test method 5 Surface resistance after placing the optical element with the adhesive layer at 23 ° C for 7 days in a 50% RH environment, at 23 ° C at 50% RH The surface resistance of the optical element was measured using a microelectrometer (available from Kawaguchi Electric Works Co., Ltd.) in the environment. 10 Metal rot I insect properties After placing the optical element with the adhesive layer at 23 ° C for 7 days in a 50% RH environment, the aluminum foil was adhered to the surface of the adhesive layer, and at 60 ° C, Place in a 90% RH environment for 2 days, then observe the condition of the adhesive 15 layer. The case where the aluminum foil is not changed is indicated by "〇", and the other case where the aluminum foil is whitened is indicated by "χ". Light leakage After cutting the optical element with the adhesive layer at 23 ° C for 7 days in a 50% RH 20 environment, the optical element was cut to 120 mm (MD direction of the polarizer) x 60 mm and 120 mm, respectively. (TD direction of polarizer) x60 mm size. The cut sheets were bonded to both sides of the glass substrate and then autoclaved at 50 ° C and a pressure of 5 kg / cm 2 for 20 minutes. The appearance of the glass substrate was observed after placing the treated glass substrate at 120 ° C under normal conditions for 120 hours 28 1378980. The case where no light leakage is displayed is indicated by "〇", and the other case where light leakage is displayed is indicated by "X". Durability
5 在將具有黏合劑層的光學元件在23°C下、在50%RH 環境中放置7天後,將光學元件切割為120 mm (偏光鏡的 MD方向)x60 mm的尺寸。將切割板黏接於玻璃基體的一 | 側,然後在50°C和5 kg/cm2的壓力下進行高壓爸處理20 分鐘。將處理的玻璃基體在80°C下在正常環境中、然後在 ίο 60°C下在90%RH環境中放置120小時之後,觀察玻璃基 體的外觀。顯示切割板沒有起泡、浮起和/或分離的情況以 “〇”表示,而顯示切割板起泡、浮起和/或分離的其他情 況以“X”表示。 15 黏合性和基體黏附性 將具有黏合劑層的光學元件在23°C下、在50%RH環 • 境中放置7天之後,將光學元件切割為25mm的寬度,並 黏接於玻璃基體的一侧,然後在50°C和5kg/cm2的壓力下 進行高壓爸處理20分鐘。根據用於黏合帶和/或黏合片的 2〇 試驗方法的JIS Z0237,使用拉伸試驗機用以下條件測量 處理的玻璃基體的黏合性,剝離速度為0.3 m/分鐘、剝離 角度180°、在23°C下、50%RH的環境中。或者,也測量 基體(或偏光鏡)黏附性。黏合劑層沒有完全從偏光鏡除 去的情況以“〇”表示,黏合劑層完全從偏光鏡除去的其他 29 1378980 情況以“X”表示。 基體污染 如上所述測量黏合性之前和之後,嫁定玻璃基體的接 5 觸角。黏合性測量之前和之後接觸角沒有變化時玻璃基體 以“〇”表示,如果黏合性測量之前和之後接觸角發生變 化,則玻璃以“X”表示。根據是玻璃基體濕潤性的試驗方 ^ 法的JIS R3257進行接觸角的測量。 10 低溫穩定性 在將具有黏合劑層的光學元件在23°C下、在50%RH 環境中放置7天後,將光學元件切割為120 mm (偏光鏡的 MD方向)x60 mm的尺寸。將切割板黏接於玻璃基體的一 側並然後在50°C和5kg/cm2的壓力下進行高壓釜處理20 15 分鐘。在將處理的基體在-40°C下在正常環境中放置120小 時之後,觀察玻璃基體的外觀。顯示切割板沒有起泡、浮 # 起和/或分離或沒有沉澱的情況以表示,而顯示切割 板起泡、浮起和/或分離和/或沉澱的其他情況以“X”表示。 20 再加工性 在如上所述的黏合性測量期間,觀察剝離條件。發現 黏合劑層和基體之間介面破壞的情況以“〇”表示,而在基 體上發現内聚性損壞或DE (電沉積)的其他情況以“X” 表示。 30 1378980 表35 After placing the optical element with the adhesive layer at 23 ° C for 7 days in a 50% RH environment, the optical element was cut to a size of 120 mm (MD direction of the polarizer) x 60 mm. The cutting plate was adhered to the side of the glass substrate, and then subjected to high pressure dad treatment at 50 ° C and a pressure of 5 kg / cm 2 for 20 minutes. The appearance of the glass substrate was observed after the treated glass substrate was allowed to stand in a normal environment at 80 ° C for 120 hours in a 90% RH environment at ί ° 60 °C. The case where the cutting plate is not blistered, floated, and/or separated is indicated by "〇", and the other case where the cutting plate is foamed, floated, and/or separated is indicated by "X". 15 Adhesiveness and Substrate Adhesion The optical element with the adhesive layer was cut into a width of 25 mm and bonded to the glass substrate after being placed in a 50% RH atmosphere for 7 days at 23 °C. On one side, high pressure dad treatment was then carried out for 20 minutes at 50 ° C and a pressure of 5 kg/cm 2 . According to JIS Z0237 for the 2〇 test method for the adhesive tape and/or the adhesive sheet, the adhesion of the treated glass substrate was measured using a tensile tester under the following conditions, and the peeling speed was 0.3 m/min, and the peeling angle was 180°. In an environment of 23 ° C, 50% RH. Alternatively, the adhesion of the substrate (or polarizer) is also measured. The case where the adhesive layer is not completely removed from the polarizer is indicated by "〇", and the other 29 1378980 case in which the adhesive layer is completely removed from the polarizer is represented by "X". Matrix contamination Before and after measuring the adhesion as described above, the contact angle of the glass substrate was grafted. The glass matrix is indicated by "〇" when there is no change in the contact angle before and after the adhesion measurement, and the glass is indicated by "X" if the contact angle changes before and after the adhesion measurement. The contact angle was measured in accordance with JIS R3257, which is a test method for the wettability of a glass substrate. 10 Low Temperature Stability After placing the optical element with the adhesive layer at 23 ° C for 7 days in a 50% RH environment, the optical element was cut to a size of 120 mm (MD direction of the polarizer) x 60 mm. The cut sheet was bonded to one side of the glass substrate and then autoclaved at 50 ° C and a pressure of 5 kg / cm 2 for 20 15 minutes. After the treated substrate was allowed to stand in a normal environment at -40 ° C for 120 hours, the appearance of the glass substrate was observed. The case where the cutting plate is not blistered, floated and/or separated or not precipitated is shown, and other cases showing blistering, floating and/or separation and/or precipitation of the cutting plate are indicated by "X". 20 Reworkability The peeling conditions were observed during the adhesion measurement as described above. It was found that the interface damage between the adhesive layer and the substrate was represented by "〇", and the other case where cohesive damage or DE (electrodeposition) was found on the substrate was represented by "X". 30 1378980 Table 3
實施例 1 2 3 4 5 6 7 8 9 10 11 12 A.黏合劑組成物(重董 份) 100 100 100 100 100 100 100 100 100 100 100 100 B.交聯劑(重量份) 0.1 0.05 1 0.1 1 1.2 0.05 0.05 1.2 1.3 1.2 0.1 C.矽烷偶聯劑(重量份) 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0J 黏合劑組成物的黏度 (mPa.s) 4500 4000 2500 2500 3500 4500 3500 3000 2500 3000 3000 3500 黏合劑组成物的濃度 (wt.%) 18 18 18 18 18 18 18 18 18 18 18 18 黏合劑組成物的凝膠分率 r%) 70 68 75 69 74 76 65 64 73 73 72 70 性能測 試 表面電阻(Ω/ □) 1012 10" 109 10* 10" 10" 10'° 105 109 109 109 109 金屬腐蝕性 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 漏光性 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 对久性 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 黏合性 (N/25mm ) 4 5 8 6 6 7 5 4 6 7 4 6 基體黏附性 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 基體污染 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 低溫穩定性 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 再加工性 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 A:表丨所示的黏合劑组成物 B :三羥曱基丙烷/曱苯二異氣酸酯(NiPP〇nPo丨商品名:CORONATEL) C : 3-環氣丙氧基丙基甲基二乙氧基矽烷(Shin-Etsu Chemical Co.,Ltd.,商品名:Shinetsu Silicone KBM-403) 31 1378980 表4Example 1 2 3 4 5 6 7 8 9 10 11 12 A. Adhesive composition (heavy Dong) 100 100 100 100 100 100 100 100 100 100 100 100 B. Crosslinking agent (parts by weight) 0.1 0.05 1 0.1 1 1.2 0.05 0.05 1.2 1.3 1.2 0.1 C. decane coupling agent (parts by weight) 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 The viscosity of the binder composition (mPa.s) 4500 4000 2500 2500 3500 4500 3500 3000 2500 3000 3000 3500 Concentration of binder composition (wt.%) 18 18 18 18 18 18 18 18 18 18 18 18 Gel fraction r% of the binder composition 70 68 75 69 74 76 65 64 73 73 72 70 Performance Test Surface Resistance (Ω/ □) 1012 10" 109 10* 10"10" 10'° 105 109 109 109 109 Metal Corrosion 〇〇〇〇〇〇〇〇〇〇〇〇 Light Leakage 〇〇〇〇〇〇 〇〇〇〇〇〇 〇〇〇〇〇〇 〇〇〇〇〇〇〇〇〇〇〇〇 〇〇〇〇〇〇〇〇〇〇〇〇 ( (N/25mm ) 4 5 8 6 6 7 5 4 6 7 4 6 Matrix Adhesion 〇〇〇〇〇〇〇 〇〇〇〇〇 matrix pollution 〇〇〇〇〇〇〇〇〇〇〇〇 low temperature stability 〇〇〇〇〇〇〇〇〇〇〇〇Reworkability 〇〇〇〇〇〇〇〇〇〇〇〇A: Binder composition shown in Table B: Trihydroxy hydrazine propane / benzene benzene di Gas ester (NiPP〇nPo丨 trade name: CORONATEL) C : 3-cyclopropoxypropylmethyldiethoxydecane (Shin-Etsu Chemical Co., Ltd., trade name: Shinetsu Silicone KBM-403 ) 31 1378980 Table 4
比較例 1 2 3 4 5 6 7 A.黏合劑组成物(重量 份) 100 100 100 100 100 100 100 B.交聯劑(重量份) 0.1 0.1 0.05 1 1.2 1.2 0.05 C.矽烷偶聯劑(重量 份) 0.1 0.1 0.1 0.1 0.1 0.1 0.1 黏合劑組成物的黏度 (mPa.s) 4500 4500 4000 2500 4500 2500 3500 黏合劑組成物的濃度 (%) 18 18 18 18 18 18 18 黏合劑組成物的凝膠分 率 69 68 66 73 72 74 69 性能 測試 表面電阻(Ω/ □) 1015 1015 1015 1015 1014 1014 1013 金屬腐蝕性 〇 〇 〇 〇 〇 〇 〇 漏光性 〇 〇 〇 〇 〇 〇 〇 耐久性 〇 〇 〇 〇 〇 〇 〇 黏合性 (N/25mm) 4 4 5 8 7 6 4 基體黏附性 〇 〇 〇 〇 〇 〇 〇 基體污染 〇 〇 〇 〇 〇 〇 〇 低溫穩定性 〇 〇 〇 〇 〇 〇 〇 再加工性 〇 〇 〇 〇 〇 〇 〇 A:表2所示的黏合劑組成物 B :三經曱基丙院/甲苯二異氰酸6旨(Nippon Polyurethane Industry Co.,Ltd.,商品 名:CORONATE L) C:3-環氧丙氧基丙基甲基二乙氧基石夕统(Shin-Etsu Chemical Co.,Ltd,,商品名:Shinetsu Silicone KBM-403 ) 32 1378980 參考表3,發現根據實施例丨至12的光學元件的黏合 剎層具有不超過1〇12 (以口)的表面電阻,並因此表現出 優異的抗靜電性。而且,所有根據實施例丨至12的光學元 5 件在室溫下老化7天後均具有4至8 (N/25mm)的期望^ 黏5性。此外,根據實施例1的光學元件被證實就金屬腐 蝕性、漏光性、耐久性、基體黏附性、基體污染、低溫 定性和再加工性而言是有利的。 鲁 ^另一方面,參考表4,根據比較例1的沒有加入抗靜 1〇 電劑和含鹵族元素的(甲基)丙烯酸酯(al)的光學元件 表現出約,㈤口)喊面電阻’這使得它們表現出劣 於根據實施例1至12的光學元件的抗靜電性。 同樣地’根據比較例2至4的沒有加入抗靜電劑的每 個光學元件表現㈣1()15(Ω/[:])的表面電阻,這使得它 15 們表現出劣於根據實施例1至12的光學元件的抗靜電性。 同時,根據比較例5至7的沒有加入含_族元素的(甲 • 基)丙稀酸酯(al)的每個光學元件表現出約1013至10Η (Ω/口)的表面電阻’這使得它們表現出劣於根據實施例 1至12的光學元件的抗靜電性。 2〇 再次參考表3和4,可看出根據實施例1至12的光 . 帛7°件f有比根據崎m至7的光學元件更好的抗靜電 性,同時保持黏合劑層的其他的本徵性能基本上等同於根 據比較例1至7的光學元件的那些性能。 ^由上述結果’可清楚地理解本發明的黏合劑組成物有 效地用於形成具有優異抗靜電性的黏合劑層,而沒有劣化 33 1378980Comparative Example 1 2 3 4 5 6 7 A. Binder composition (parts by weight) 100 100 100 100 100 100 100 B. Crosslinking agent (parts by weight) 0.1 0.1 0.05 1 1.2 1.2 0.05 C. decane coupling agent (weight Part 0.1) 0.1 0.1 0.1 0.1 0.1 0.1 Viscosity of the adhesive composition (mPa.s) 4500 4500 4000 2500 4500 2500 3500 Concentration of the binder composition (%) 18 18 18 18 18 18 18 Gel of the binder composition Fraction 69 68 66 73 72 74 69 Performance Test Surface Resistance (Ω/ □) 1015 1015 1015 1015 1014 1014 1013 Metal Corrosion 〇〇〇〇〇〇〇 Light Leakage 〇〇〇〇〇〇〇 Durability 〇〇〇〇 〇〇〇Adhesiveness (N/25mm) 4 4 5 8 7 6 4 Matrix Adhesive 〇〇〇〇〇〇〇 Matrix Pollution 〇〇〇〇〇〇〇 Low Temperature Stability 〇〇〇〇〇〇〇 Reworkability 〇 〇〇〇〇〇〇A: Adhesive composition B shown in Table 2: Nippon Polyurethane Industry Co., Ltd., trade name: CORONATE L C :3-glycidoxypropylmethyldiethoxylate (Sh In-Etsu Chemical Co., Ltd., trade name: Shinetsu Silicone KBM-403) 32 1378980 Referring to Table 3, it was found that the bonding brake layer of the optical element according to the examples 丨 to 12 has no more than 1 〇 12 (by mouth) Surface resistance, and thus excellent antistatic properties. Moreover, all of the optical elements according to Examples 丨 to 12 had a desired adhesion of 4 to 8 (N/25 mm) after aging for 7 days at room temperature. Further, the optical element according to Example 1 was confirmed to be advantageous in terms of metal corrosion, light leakage, durability, matrix adhesion, matrix contamination, low temperature property, and reworkability. On the other hand, referring to Table 4, according to the optical element of Comparative Example 1 in which no antistatic agent and halogen group-containing (meth) acrylate (al) were added, the (f) mouth was shouted. The resistance 'this makes them appear to be inferior to the antistatic properties of the optical elements according to Examples 1 to 12. Similarly, each of the optical elements according to Comparative Examples 2 to 4 in which no antistatic agent was added exhibited a surface resistance of (4) 1 () 15 (Ω/[:]), which made them 15 inferior to those according to Example 1 The antistatic property of the optical element of 12. Meanwhile, each of the optical elements according to Comparative Examples 5 to 7 in which no (meth) acrylate (al) containing a group element was added exhibited surface resistance of about 1013 to 10 Å (Ω/□). They exhibited inferiority to the antistatic properties of the optical elements according to Examples 1 to 12. Referring again to Tables 3 and 4, it can be seen that the light according to Examples 1 to 12 has a better antistatic property than the optical element according to Saki m to 7, while maintaining the other layers of the adhesive layer. The intrinsic properties are substantially equivalent to those of the optical elements according to Comparative Examples 1 to 7. From the above results, it is clearly understood that the adhesive composition of the present invention is effectively used to form an adhesive layer having excellent antistatic properties without deterioration 33 1378980
塗敷有所述黏合劑層的光學片的光學性能。 而且,藉由將本發明的黏合劑組成物施加於光學片的 一側或兩側製造的本發明的光學元件具有有利的抗靜電 性,而沒有劣化光學片的光學性能。 34Optical properties of an optical sheet coated with the adhesive layer. Moreover, the optical element of the present invention produced by applying the adhesive composition of the present invention to one side or both sides of the optical sheet has an advantageous antistatic property without deteriorating the optical properties of the optical sheet. 34
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