1374308 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種背光模組組裝結構以及背光模組 之製造方法。 【先前技術】 電腦、電視及行動電話等各種電子產品廣泛地應用液 晶顯示器（Liquid Crystal Display，LCD)。背光模組 (backlight module)是液晶顯示器重要組成元件之一。 而具有輕量、薄型、低耗電等特色的侧光式結構背光模 組，更是常使用於手機、個人數位助理(pDA)、筆記型電 腦之液晶顯示器中。 型冷陰極螢光燈管(c〇ld Cathode Fluorescent Lamp; CCFL)發光源為擺在侧邊之單支光源，導光板採射出成 型無印刷式設計，一般常用於18吋以下中小尺寸的背光 模組，其側邊入射的光源設計，擁有輕量、薄型、窄框 化、低耗電的特色。由於冷陰極螢光燈管係以線材與電 源模組電連接，因此，線材之理線為使用冷陰極螢光燈 管之背光模組組裝時須考慮之課題。 如圖1所示之習知技術，習知底殼10具有習知内底 面11以及習知側邊13。習知框件50在線材301兩側設 置有位移限制結構51 ’以限制線材301往左右之位移。 < S ) 6 =體而言’L型冷陰極螢光燈管之線材3〇1係設置於習知 框件50之位移限制.結構51所形成之習知線材定位槽15 :。習知線材定位槽15麵f知框件5()之二位移限制 、；：構51所形成，因此佔有較多的空間。其中，習知線材 〇位槽15連同習知框件5〇之二位移限制結構51在内之 寬度為di。 另-方面’在組裝習知之背光模組時，係先將圖工所 不之習知框件50翻轉使f知線材定位槽15朝上，裝入 線材30卜並與_光學膜組一同套上習知底殼ι〇後， 再翻轉回原方向，而後再放上光學面板。其中，光 學膜級_包含光學膜片_、導光板63〇及反射板65〇。 組裝程中之翻轉動作易減低生產效率。以上所述背光 模組組裝結構及製造方法皆有改進的空間。 【發明内容】 本發明之目的纽提供賴她裝結構 少背光模組之漏光。 本發明之另-目的在於提供一種背光模組組裝結 構，可減少組裝背光模組膠框時膠框與線材之干涉。 本發明之另-目的在於提供一種背光模組二裝結 構，具有較便捷之組裝流程。 、° 本發明之另一目的在於提供一種背光模組製造方 法，可減少背光模組框件組裝程序之時間，進而增加產 本發明之背級組喊結構包含底殼、線材位移限制 裝置以及框件。底殼具有内底面以及側邊。線材位移限 制褒置係設置於紐之喊面上，且與側邊形成線材定 位槽。框件係設置於線材定位槽上方。齡具有第一側 翼結構，第一侧翼結構係相對設置於線材位移限制裝置 上方。 背光模組製造方法包含提供上述具有内底面以及側 邊之底殼；形絲材轉限雜置於底殼之内底面上， 且與側邊形祕材定簡；組裝絲歡於底殼之内底 面上’使光學模組設置於底殼巾減於線材定位槽之另 -側之内底面上；將光學模組具有之線材設置於線材定 位槽内’赚繼材之位H及雜件置放於線材定 位槽上以限制線材之位移。 因此，使用本發明所提供之背光模組組裝結構，可減 少組裝時膠框與線材之干涉，提升組裝流程之便利性， 進而增加產能。 【實施方式】 如圖2a所示本發明之背光模組組裝結構900之實施 例爆炸圖，背光模組組裝結構咖包含底殼⑽、線材位 移限制裝置300以及框件5〇〇。底殼1〇〇具有内底面11〇 以及側邊130。底殼·較佳係為金屬、金屬合金或金屬 化σ物線材位移限制裝置300係設置於底殼loo之内 f面110上’且與側邊130形成線材定位槽150。具體而 言’線材位移限制裝置300包含如圖2a所示自底殼100 沖壓形成之舌片結構。其中，底殼100 因沖壓形成之孔 洞101可⑽晴帶等方式加贿蔽，避免漏光。在不 同實施例+’線材位移限概置可另外成型於底殼 100上、鎖附於底殼⑽上或如圖2b所示與底殼議為 -體成型。在此特別說明的是，自底殼100沖壓形成、 另外成型於底殼100上、鎖附於底殼100上或與底殼議 為-體成型之舌片結構，除了當作線材位移限制褒置· 用來固定或關線材的移動外，亦可絲支撐組裝在其 上方之其他物件’該些物件可關如是雜或玻璃等物 件。 如圖3a所示，背光模組組裝結構900係可進一步與 外殼200、光學面板400與光學臈組6〇〇組配如圖北之 立翻。線材位移限制裝置_較佳係為金屬、金屬合 金或金屬化合物。騎定_ 3QQ之寬度可依與光學膜 組600連接之線材3〇1之直徑而對應調整，較佳係介於 〇. 9公f與2公釐之間。其中，由於線材3〇1 一般係為金 屬線外披覆塑谬材質。因此，線材3()1與線材定位槽3〇〇 接觸之部分可設置保護件，以減少被線材定位槽^摩 擦損耗。保護件較佳但不限為熱縮套管，且不限於部分 設置’亦可設置於線材301之全段。 刀 圖3b中AA之局部剖面圖如圖4a所示。在較佳實施 例中’光學膜組600包含光學膜片610、導光板630及反 射板650。在較佳實施例中，光學膜片610係至少包含擴 散膜片、増益暝片或偏振膜片其中之一，然而在其他實 施例中’光學祺片610包含之膜片數量與種類可依需求 調整。框件5〇〇係設置於線材定位槽150上方。在較佳 實施例中，框件500係為高分子材料。然而在不同實施 例中，棍件5〇〇可以為金屬、金屬合金或金屬化合物。 如圖4a所示，框件5〇〇具有第一側翼結構51〇，係為 框件500内部之一圈凸緣，向框件500中心突出，相對 紅於線材位移限制裝置綱上方。具體而言，框件5〇〇 …構510係受到位移限制裝置3〇〇之支撐 使框件500可搭設於線材定位槽150上方，藉以限制! 材301往上之位移，而線材3〇1往左右之位移則由線本 位移限制裝置300及底殼100所共同限制。 換言之，她於如圖i之習知框件5〇需在線材3〇 設置有位移限制結構51，以限制線材301往左右之伯 ^本發明之背光模組組裝結構刪則如圖#所示藉由 和⑽右之位移係由線材位移限姆置300及底 而框件_僅需用以限制往上 ^移。舰’如則簡4a分浙示之錢出，可使 s 500無須成置如習知裡件5〇之位移限制結構^，減 1374308 • 少容置線材301所需之空間，並且進-步可使用面積較 大之光學膜組600。由於在使用相同尺寸的面板4〇〇時， 較大之光學膜組600可減少背光模組之漏光狀況，因此， 本發明之背光模組組裝結構亦可減少背光模組之漏 ' 光狀況。 如圖4b所示之實施例，框件5〇〇進一步具有第二側 翼結構520。其中’第二侧翼結構52〇係相對設置於底殼 • 100之側邊130上方。換言之，第二侧翼結構520係由底 殼100之側邊130所支撐。由於框件5〇〇之第一側翼結 構510及第二側翼結構520可分別受到線材位移限制裝 置300及側邊130的支樓，故在此實施例中，框件_ 可更穩固地設置於線材定位槽15〇上方。 如圖4c所示之較佳實施例，框件5〇〇進一步具有卡 合結構530，供與線材定位槽15〇卡合。具體而言，卡合 結構530係可伸入於線材定位槽15〇中，藉以進一步充 • 填線材定位槽150之線材3〇1以外空間，二更穩固鱗 線材301定位於線材定位槽15〇中。另一方面，亦可藉 此使框件500可更穩固地設置於線材定位槽15〇上方。曰 如圖5所示本發明之背光模組製造方法流程圖，本發 • 明之背光模組製造方法包含： 步驟1001為提供如圖4c具有内底面110以及側邊13〇 之底殼100。 步驟1003為形成線材位移限制裝置3〇〇於底殼議 11 之内底面110上，且與側邊110形成線材定位槽15〇。在 較佳實施例中，線材位移限制裝置3〇〇係為自底殼1〇〇 沖獅成之舌結構。其中，對於底殼因沖壓形成 之孔洞101’可進一步於步驟l〇03a以貼附膠帶等方式加 以遮蔽，避免漏光。在不同實施例中，線材位移限制裝 置300可另外成型於底殼100上，或與底殼1〇〇為一體 成型。 步驟1005為組裝如圖4C所示之光學模組6〇〇於底殼 之内底面110上。具體而言，係使光學模組6〇〇設置於 底殼1〇〇中相對於線材定位槽150之另一側之内底面11〇 上。 步驟1007為將如圖4c所示之光學模組600具有之線 材301没置於線材定位槽15〇内，以限制線材ι5〇之位 移。其中，可進一步於步驟1〇〇7a在線材3〇1與線材定 位槽300接觸之部分設置保護件，以減少被線材定位槽 300摩擦損耗。保護件較佳但不限為熱縮套管，且不限於 部分設置，可設置於線材3〇1之全段。 步驟1009為將如圖4c所示之框件500置放於線材定 位槽150上以限制線材301之位移。其中，框件500具 有第-侧翼結構51Q，當將框件關置放於線材定位槽 150上時’係將第一側翼結構510置放於線材位移限制裝 置300上以支撐框件。 在較佳實施例中，框件500可進-步具有第二側翼結 構520。當將框件500置放於線材定位槽上150時，係將 第二侧翼結構520置放於侧邊130上以支撐框件5〇〇。框 件500進一步具有卡合結構530’當將框件500置放於線 材定位槽150上時，係利用卡合結構530與線材定位槽 150卡合。 本發明之背光模組製造方法進一步包含步驟1〇〇9&將 光學面板400置放於框件500上，以及步驟i〇〇9b將外 殼200置放於光學面板4〇〇上，並與底殼1〇〇套合。具 體而§ ’光學面板400係位於光學模組600上方，且由 框件5〇0之第一侧單結構5丨〇所支撐。 如步驟1001至步驟l〇〇9b所述，在本發明之背光模 組製造方法流程中並無習知技術之翻轉動作。因此，可 簡化組裝流程，進而增加產能。 本發明已由上述相關實施例加以描述，然而上述實施 例僅為實施本發明之範例。必需指出的是，已揭露之實 施例並非用以限制本發明之範圍。相反地，包含於申請 專利範圍之精神及範圍之修改及均等設置均包含於本發 明之範圍内。 【圖式簡單說明】 圖1為習知技術示意圖； 圖2a為本發明實施例爆炸圖； 圖2b為本發明具有不同實施例爆炸圖； 1374308 圖3a為本發明背光模組組裝結構可進一步與外殼、光學 面板與光學膜組組配爆炸圖。 圖3b為本發明背光模組組裝結構可進一步與外殼、光學 面板與光學膜組組配立體圖。 圖4a為本發明實施例侧視示意圖； 圖4b為本發明不同實施例側視示意圖； 圖4c為本發明較佳實施例側視示意圖；1374308 IX. Description of the Invention: [Technical Field] The present invention relates to a backlight module assembly structure and a method of manufacturing the backlight module. [Prior Art] Liquid crystal displays (LCDs) are widely used in various electronic products such as computers, televisions, and mobile phones. A backlight module is one of the important components of a liquid crystal display. The side-light structure backlight module with light weight, thin shape and low power consumption is often used in mobile phones, personal digital assistants (pDA), and notebook computers. The light source of the c〇ld Cathode Fluorescent Lamp (CCFL) is a single light source placed on the side. The light guide plate is formed into a non-printing design, and is generally used for a medium and small size backlight module below 18 inches. The group, the light source of the incident side, has the characteristics of light weight, thin shape, narrow frame, and low power consumption. Since the cold cathode fluorescent lamp is electrically connected to the power module by the wire, the wire is required to be considered when assembling the backlight module using the cold cathode fluorescent lamp. As is known in the art, as shown in Fig. 1, the conventional bottom case 10 has a conventional inner bottom surface 11 and a conventional side edge 13. The frame member 50 is provided with a displacement restricting structure 51' on both sides of the wire 301 to restrict the displacement of the wire 301 to the left and right. <S) 6 = Body The wire 3〇1 of the L-type cold cathode fluorescent lamp is disposed in the displacement limit of the conventional frame member 50. The conventional wire positioning groove 15 formed by the structure 51: The conventional wire positioning groove 15 has a displacement limit of the frame member 5 (), and the structure 51 is formed, so that it occupies more space. The width of the conventional wire clamp groove 15 together with the conventional frame member 5〇 displacement limiting structure 51 is di. In another aspect, when assembling a conventional backlight module, the conventional frame member 50 is turned over so that the wire positioning groove 15 faces upward, and the wire 30 is loaded and assembled with the _ optical film group. After learning the bottom case, flip it back to the original direction and then put the optical panel. Among them, the optical film level _ includes an optical film _, a light guide plate 63 〇, and a reflection plate 65 〇. The flipping action in the assembly process is easy to reduce the production efficiency. The above-mentioned backlight module assembly structure and manufacturing method have room for improvement. SUMMARY OF THE INVENTION The object of the present invention is to provide light leakage from a backlight module that is less than her. Another object of the present invention is to provide a backlight module assembly structure, which can reduce the interference between the plastic frame and the wire when assembling the plastic frame of the backlight module. Another object of the present invention is to provide a two-package structure of a backlight module, which has a convenient assembly process. Another object of the present invention is to provide a backlight module manufacturing method, which can reduce the time for assembling a backlight module frame assembly, thereby increasing the back-stage group shouting structure of the present invention, including a bottom case, a wire displacement limiting device, and a frame. Pieces. The bottom case has an inner bottom surface and side edges. The wire displacement limit is set on the face of the button and forms a wire positioning groove with the side. The frame member is disposed above the wire positioning groove. The age has a first side wing structure, and the first side wing structure is oppositely disposed above the wire displacement limiting device. The backlight module manufacturing method comprises the above-mentioned bottom case having an inner bottom surface and a side edge; the wire material is limited to be placed on the inner bottom surface of the bottom case, and is fixed with the side shape secret material; On the inner bottom surface, the optical module is disposed on the inner bottom surface of the other side of the wire positioning groove; the wire of the optical module is disposed in the wire positioning groove, and the position and the miscellaneous parts of the material are obtained. Placed on the wire positioning groove to limit the displacement of the wire. Therefore, by using the assembled structure of the backlight module provided by the invention, the interference between the plastic frame and the wire during assembly can be reduced, the convenience of the assembly process can be improved, and the productivity can be increased. [Embodiment] As shown in Fig. 2a, an exploded view of an embodiment of a backlight module assembly structure 900 of the present invention includes a bottom case (10), a wire displacement limiting device 300, and a frame member 5A. The bottom case 1〇〇 has an inner bottom surface 11〇 and a side edge 130. The bottom case, preferably a metal, metal alloy or metallized sigma wire displacement limiting device 300, is disposed within the bottom casing loo, and forms a wire positioning groove 150 with the side edge 130. Specifically, the wire displacement limiting device 300 includes a tongue structure stamped from the bottom case 100 as shown in Fig. 2a. Among them, the bottom case 100 can be bribed by means of a hole 101 formed by punching to avoid light leakage. In the different embodiment +' wire displacement limit can be additionally formed on the bottom case 100, attached to the bottom case (10) or as shown in Figure 2b. Specifically, the tongue piece 100 is formed by stamping from the bottom case 100, is formed on the bottom case 100, is attached to the bottom case 100, or is formed into a body-formed tongue structure, except as a wire displacement limitation. In addition to the movement of the wire to fix or close the wire, it can also support other objects assembled above it. 'These items can be closed to objects such as miscellaneous or glass. As shown in FIG. 3a, the backlight module assembly structure 900 can be further combined with the outer casing 200, the optical panel 400, and the optical cymbal group 6 如图. The wire displacement limiting device is preferably a metal, a metal alloy or a metal compound. The width of the riding _ 3QQ can be adjusted according to the diameter of the wire 3〇1 connected to the optical film group 600, preferably between 公. 9 ng and 2 mm. Among them, since the wire 3〇1 is generally made of a metal wire, it is covered with a plastic material. Therefore, a portion of the wire 3() 1 in contact with the wire positioning groove 3A can be provided with a protective member to reduce the friction loss of the wire positioning groove. The protective member is preferably, but not limited to, a heat-shrinkable sleeve, and is not limited to a partial arrangement' and may be disposed in the entire length of the wire 301. Knife A partial cross-sectional view of AA in Figure 3b is shown in Figure 4a. In the preferred embodiment, the optical film set 600 includes an optical film 610, a light guide plate 630, and a reflective plate 650. In a preferred embodiment, the optical film 610 includes at least one of a diffusion film, a smear film, or a polarizing film. However, in other embodiments, the number and type of the film included in the optical 316 may be required. Adjustment. The frame member 5 is disposed above the wire positioning groove 150. In the preferred embodiment, the frame member 500 is a polymeric material. However, in various embodiments, the stick member 5 can be a metal, a metal alloy or a metal compound. As shown in Fig. 4a, the frame member 5 has a first side wing structure 51A, which is a ring flange inside the frame member 500, which protrudes toward the center of the frame member 500, and is relatively red above the wire displacement restricting device. Specifically, the frame member 5 is supported by the displacement limiting device 3 so that the frame member 500 can be placed above the wire positioning groove 150, thereby limiting the upward displacement of the material 301, and the wire 3〇1 The displacement to the left and right is limited by the line displacement limiting device 300 and the bottom case 100. In other words, she is provided with a displacement limiting structure 51 in the wire frame 3 of the conventional frame member 5 as shown in Fig. i to limit the wire member 301 to the left and right. The backlight module assembly structure of the present invention is deleted as shown in Fig. By and (10) the right displacement is set by the wire displacement limit 300 and the bottom frame _ only need to limit the upward movement. If the ship's '4' is divided into Zhejiang, the s 500 does not need to be placed as the displacement limit structure of the 〇 里 里 , , , , , , , 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 374 An optical film set 600 having a larger area can be used. Since the larger optical film group 600 can reduce the light leakage condition of the backlight module when the panel of the same size is used, the backlight module assembly structure of the present invention can also reduce the leakage condition of the backlight module. In the embodiment shown in Figure 4b, the frame member 5 further has a second side wing structure 520. Wherein the second side wing structure 52 is disposed opposite the side edge 130 of the bottom case 100. In other words, the second side wing structure 520 is supported by the side edges 130 of the bottom case 100. Since the first side wing structure 510 and the second side wing structure 520 of the frame member 5 can be respectively received by the wire displacement limiting device 300 and the side wall 130, in this embodiment, the frame member _ can be more stably disposed on The wire positioning groove 15 is above. As shown in the preferred embodiment of Figure 4c, the frame member 5 further has a snap-fit structure 530 for engagement with the wire positioning slot 15''. Specifically, the engaging structure 530 can extend into the wire positioning groove 15〇 to further fill the space outside the wire 3〇1 of the wire positioning groove 150, and the second stable scale wire 301 is positioned in the wire positioning groove 15〇. in. On the other hand, the frame member 500 can also be more stably disposed above the wire positioning groove 15A. As shown in FIG. 5, a method for manufacturing a backlight module of the present invention, the backlight module manufacturing method of the present invention comprises: Step 1001 is to provide a bottom case 100 having an inner bottom surface 110 and side edges 13A as shown in FIG. 4c. Step 1003 is to form a wire displacement limiting device 3 on the inner bottom surface 110 of the bottom case 11 and form a wire positioning groove 15〇 with the side edge 110. In the preferred embodiment, the wire displacement limiting device 3 is a tongue structure formed from the bottom case. Here, the hole 101' formed by punching the bottom case may be further shielded by attaching a tape or the like in the step 103a to avoid light leakage. In various embodiments, the wire displacement limiting device 300 can be additionally formed on the bottom casing 100 or integrally formed with the bottom casing 1 . Step 1005 is to assemble the optical module 6 shown in FIG. 4C on the inner bottom surface 110 of the bottom case. Specifically, the optical module 6 is disposed on the inner bottom surface 11 of the bottom case 1 相对 with respect to the other side of the wire positioning groove 150. In step 1007, the wire 301 of the optical module 600 shown in FIG. 4c is not placed in the wire positioning groove 15〇 to limit the displacement of the wire ι5〇. Wherein, a protective member may be further disposed in the portion where the wire 3〇1 is in contact with the wire positioning groove 300 in the step 1〇〇7a to reduce the friction loss of the wire positioning groove 300. The protective member is preferably, but not limited to, a heat-shrinkable sleeve, and is not limited to a partial arrangement and may be disposed in the entire length of the wire 3〇1. Step 1009 is to place the frame member 500 as shown in FIG. 4c on the wire positioning groove 150 to limit the displacement of the wire 301. Wherein, the frame member 500 has a first-wing structure 51Q. When the frame member is placed on the wire positioning groove 150, the first wing structure 510 is placed on the wire displacement restricting device 300 to support the frame member. In the preferred embodiment, the frame member 500 can further have a second side flap structure 520. When the frame member 500 is placed on the wire positioning groove 150, the second side wing structure 520 is placed on the side edge 130 to support the frame member 5''. The frame member 500 further has a snap-fit structure 530' that engages with the wire positioning slot 150 by the snap-fit structure 530 when the frame member 500 is placed on the wire positioning slot 150. The backlight module manufacturing method of the present invention further comprises the steps 1〇〇9& placing the optical panel 400 on the frame member 500, and the step i〇〇9b placing the outer casing 200 on the optical panel 4〇〇, and the bottom The shell is sleeved. The optical panel 400 is located above the optical module 600 and is supported by the first side single structure 5丨〇 of the frame member 5〇0. As described in step 1001 to step 〇〇9b, there is no flipping action of the prior art in the flow of the backlight module manufacturing method of the present invention. As a result, the assembly process can be simplified and the productivity can be increased. The present invention has been described by the above-described related embodiments, but the above embodiments are merely examples for implementing the present invention. It is to be understood that the disclosed embodiments are not intended to limit the scope of the invention. On the contrary, modifications and equivalents of the spirit and scope of the invention are included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional technology; FIG. 2a is an exploded view of an embodiment of the present invention; FIG. 2b is an exploded view of a different embodiment of the present invention; The outer casing, the optical panel and the optical film assembly are combined with an explosion map. FIG. 3b is a perspective view of the assembly structure of the backlight module of the present invention, which can be further combined with the outer casing, the optical panel and the optical film assembly. Figure 4a is a side elevational view of a different embodiment of the present invention; Figure 4b is a side elevational view of a preferred embodiment of the present invention;
圖5為本發明背光模組製造方法流程示意圖。FIG. 5 is a schematic flow chart of a method for manufacturing a backlight module according to the present invention.
【主要元件符號說明】 10習知底殼 13習知側邊 50習知框件 100底殼 110内底面 150線材定位槽 300線材位移限制裝置 400光學面板 510第一側翼結構 530卡合結構 610光學膜片 650反射板 1001步驟 11習知内底面 15習知線材定位槽 51位移限制結構 101孔洞 130側邊 200外殼 301線材 500框件 520第二側翼結構 600光學膜組 630導光板 900背光模組組裝結構 1003步驟 14 1374308 1003a步驟 1007步驟 1009步驟 1009b步驟 1005步驟 1007a步驟 1009a步驟 15[Main component symbol description] 10 conventional bottom case 13 conventional side 50 conventional frame member 100 bottom case 110 inner bottom surface 150 wire positioning groove 300 wire displacement limiting device 400 optical panel 510 first side wing structure 530 engagement structure 610 optical Diaphragm 650 Reflector 1001 Step 11 Conventional Inner Bottom 15 Conventional Wire Locating Groove 51 Displacement Restriction Structure 101 Hole 130 Side 200 Housing 301 Wire 500 Frame 520 Second Flanking Structure 600 Optical Film Group 630 Light Guide 900 Backlight Module Assembly Structure 1003 Step 14 1374308 1003a Step 1007 Step 1009 Step 1009b Step 1005 Step 1007a Step 1009a Step 15