第09810丨470號專利申請案 中文說明書替換本(101年7'月）斗日 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種低溫測試裝置，特別係關於一種採 用液壓式載台承接探針或測試卡之低溫測試裝置。 【先前技術】 積體電路元件已經成為各種電子設備不可或缺的核心 。例如，在攝氏零度以下溫度行駛之汽車的行車系統或在 攝氏零度以下之高空航行之飛機的通訊系統。這些系統中 的積體電路必須在此種低溫環境正常運作，不能因溫度變 異而失效。為了檢測積體電路元件可否在低溫環境下（例如 攝氏零度以下）正常運作，必須將積體電路元件置放於相同 或更低溫之測試室下進行測試。 一奴而言，晶圓上的積體電路元件必須先行測試其電 氣特性，藉以判定積體電路元件是否良好。良好的積體電 路將被選出以進行後續之封裝製程，而不良品將被捨棄以 避免增加額外的封裝成本。完成封裝之積體電路元件必須 再進行另一次電性測試以筛選出封裝不良品，進而提升最 終成品良率。換言之，龍f路元件在製造㈣財，必 須進行數次的電氣特性測試。 目别產業界的作法為設定待測元件與測試機具（例如 ’測試卡、探針及手動載台）之位置mm室與環 境隔離並湘液態氮將測試室冷卻至測試 溫測試。在測試過財，必 冉進仃低 ^ 須鞛由手動載台移動待測元件 …、使得㈣卡之探針得㈣料㈣龍電路元 第098101470號專利申請案 中文說明書替換本(101年7月）斗曰 件或接觸同—積體電路元件之不同接塾。 ’々而，藉由手動載台移動待測元件或測試卡，必須開 啟測D式至’使得處於低溫之測試室與外部高溫環境相通， 導致低溫之測試室内發生水氣凝結現象，影響待測元件所 處之實際溫度’而且破壞欲將溫度降低至凝結溫度之冷卻 機制°此外’凝結之水滴或冰塊若掉落於測試室之機具上 亦可能造成機具短路。再者，在將測試室與週遭環境再 人隔離後，測忒室之溫度將再次冷卻至測試溫度，其可能 造成探針與晶圓因冷卻收縮而偏移，造成不良接觸。 為了解決此一問題，研發人員嘗試使用電動載台代替 手動載台以避免開啟測試室。然而，使用電動載台承載待 測7L件或測試卡（探針）將導致電動載台與待測元件或測試 卡（探針）相當靠近，而電動載台之馬達運作時之電磁雜訊深 沐地影響了測試結果之準確性。因此，使用電動載台代替 手動載台在低溫測試實務上顯然並不可行。再者，電動載 Q之操作需要電力供應及控制軟體，但目前產業上使用之 手動載台並無如此配備。 US ό，257,319揭示一種積體電路測試機台，其可在低溫 或高溫環境下進行積體電路元件之電性測試。然而，us 6,257,319僅揭示如何產生低溫或高溫測試環境，並未揭示 解決前述問題之技術手段。 【發明内容】 本發明提供一種採用液壓式載台承接探針或測試卡之 ，第098101470號專利申請案 中文說明書替換本(101年7月）4·Β 低溫測試裝置’其不需開啟測試室即可調整位置以避免發 生水氣凝結現象’且不需電動載台以避免馬達運作時之電 磁雜訊影響測試結果之準確性。 本發明之低溫測試裝置之一實施例，包含一殼體、設 置於該殼體内之一元件承座、設置於該殼體上之一平台、 設置於該平台上之一液壓式載台、設置於該平台上之一蓋 體、以及設置於該殼體外之一液壓控制器。該液壓式載台 係被建構以承接至少一探針，該元件承座係被建構以承接 一待測元件，該蓋體係被建構以形成一封閉室且該液壓式 載台及該元件承座係位於該封閉室内，該液壓控制器係被 建構以控制該液壓式載台之運作。 本發明之低溫測試裝置之一實施例，包含一殼體、設 置於該殼體内之一元件承座、設置於該殼體上之一平台、 設置於該平台上之一液壓式載台、設置於該平台上之一蓋 體、以及设置於該殼體外之一液壓控制器β該液壓式載台 係被建構以承接至少一測試卡，該元件承座係被建構以承 接一待測元件，該蓋體係被建構以形成一封閉室且該液壓 式載台及該元件承座係位於該封閉室内，該液壓控制器係 被建構以控制該液壓式載台之運作 本案揭示之實施例係藉由該蓋體（具有透明窗）形成該 封閉至，因此不需開啟該封閉室即可藉由該蓋體之透明窗 觀察該探針（或該測試卡之探針）與該待測元件之相對位置 。此外，本案揭示之實施例使用該液壓式載台承接該探針（ 1374282 .· <· ‘ 第⑽8101470號專利申請案 中文說明書替換本(101年7月）斗良 或。以試卡）g)此不需開啟該封閉室即可藉由該液壓式載 ^調整該探針（或該測試卡之探針）之位置，俾便避免發生水 孔凝、現象。再者，本案揭示之實施例捨棄習知之電動载 ；ϋ &用該液屋式載台承接該探針（或該測試卡），因而得以 避免電動載台之馬達運轉時產生之電磁雜訊影響測試結果 之準確性 上文已相S廣泛地概述本發明之技術特徵及優點，俾 使下文之本發明詳細描述得以獲得較佳瞭解。構成本發明 之申凊專利範圍標的之其它技術特徵及優點將描述於下文 。本發明所屬技術領域中具有通常知識者應瞭解，可相當 容易地利用下文揭示之概念與特定實施例可作為修改或設 計其它結構或製程而實現與本發明相同之目的。本發明所 屬技術領域令具有通常知識者亦應瞭解，這類等效建構無 法脫離後附之申請專利範圍所界定之本發明的精神和範圍 〇 【實施方式】 圖1例示本發明一實施例之低溫測試裝置1〇(^該低溫 測試裝置100包含一殼體40、設置於該殼體4〇内之載台川 、设置於該殼體40内且被建構以承接一待測元件（例如，半 導體元件）62之元件承座60、設置該元件承座6〇中且被建構 以控制該元件承座60之溫度的一溫控元件（例如，加熱器 、設置於該殼體40内之一平台50、設置於該平台5〇上之至 少一液壓式載台30、設置於該平台50上之一蓋體42、以及 8 第098101470號專利申請案 中文說明書替換本(101年7月）4曰 设置於該殼體40外部之一液壓控制器8〇。該蓋體42係被建 構以形成一封閉室48，該液壓式載台30及該元件承座60係 位於該封閉室48内。 在本發明之一實施例中，該液壓式載台30係被建構以 承接至少一探針54，該液壓式載台30包含一固定部32以及 設置於該固定部32上之一可動部34。該固定部32係設置於 該平台50上，而該可動部34包含一載具（例如探針固持器）52 ，其被建構以固持該探針54。在本發明之一實施例中，該 探針54係經由一電連接器（或襯套）58及導線66A、66B耦接 於一測試機台110，該電連接器58係設置於該蓋體42上。 在本發明之一實施例中，該液壓控制器8〇可藉由至少 一液體管路90控制該液壓式載台3〇之運作。例如，該液壓 控制器80可設置於該蓋體42上，且使用者可旋轉調整旋鈕 82而藉由該液壓管路9〇控制該液壓式載台3〇之運作。該液 壓管路90係經由一襯套（或液體連接器）94耦接該液壓式載 台30與該液壓控制器8〇，該液體連接器94係設置於該蓋體 42 上。 ^ 在本發明之一實施例中，該蓋體42包含一透明窗44， 其係由玻璃或塑膠構成。此外，該低溫測試裝置】〇〇可另勺 含一影像擷取元件46 ’其被建構以經由該蓋體42之透明窗 44擷取該探針54與該待測元件62之對位影像，俾便使用者 參考而藉由該液壓式載台30調整該探針54之位置。 圖2例示本發明另一實施例之低溫測試裝置2〇〇。玆低 1374.282 ,· ,* 第098101470號專利申請案 中文說明書替換本(101年7月）斗已 溫測試裝置200包含一殼體40、設置於該殼體40内之載台70 、設置於該殼體40内且被建構以承接一待測元件（例如，半 導體元件）62之元件承座60、設置該元件承座60中且被建構 以控制該元件承座60之溫度的一溫控元件（例如，加熱器）64 、設置於該殼體40内之一平台50、設置於該平台50上之至 少一液壓式載台30'設置於該平台50上之一蓋體42、以及 設置於該殼體40外部之一液壓控制器80。該蓋體42係被建 構以形成一封閉室48，該液壓式載台30及該元件承座60係 位於該封閉室48内。 在本發明之一實施例中，該液壓式載台30係被建構以 承接至少一測試卡10，該液壓式載台30包含一固定部32以 及設置於該固定部32上之一可動部34。該固定部32係設置 於該平台50上，而該可動部34包含一載具（例如測試卡固持 器）56，其被建構以固持該測試卡10。在本發明之一實施例 中，該測試卡10係經由一電連接器（或襯套）58及導線66Α、 66Β耦接於一測試機台110，該電連接器58係設置於該蓋體 42上。 在本發明之一實施例中，該液壓控制器80可設置於該 蓋體42上，且可藉由至少一液體管路90控制該液壓式載台 30之運作。例如，該液壓控制器80可設置於該蓋體42上， 且使用者可旋轉調整旋鈕82以藉由該液壓管路90控制該液 壓式載台30之運作。該液壓管路90可經由一襯套（或液體連 接器）94耦接該液壓式載台30與該液壓控制器80，該襯套94 10 1374282 .. 第098101470號專利申請案 中文說明書替換本(101年7月）4θ 係設置於該蓋體42上。 在本發明之一實施例中，該測試卡1〇包含一基板12、 設置於該基板12上之一支撐件14、設置於該支撐件丨4上之 複數根探針16、以及連接該等探針16及導線26之導通孔2〇 。該等探針16係藉由環氧樹脂24固定於該支撐件14上。該 蓋體42包含一透明窗44，其係由玻璃或塑膠構成。此外， 該低溫測試裝置1〇〇可另包含一影像擷取元件46，其被建構 以經由該蓋體42之透明窗44摘取該探針54與該待測元件62 之對位影像，俾便使用者參考而藉由該液壓式載台3〇調整 該探針54之位置。 本案揭示之實施例係藉由該蓋體（具有透明窗44)42形 成該封閉室48 ’因此不需開啟該封閉室48即可藉由該蓋體 42之透明窗44觀察該探針54(或該測試卡1〇之探針16)與該 待測元件62之相對位置。此外，本案揭示之實施例使用該 液壓式載台30承接該探針54(或該測試卡1〇)，因此不需開啟 該封閉室48即可藉由該液壓式載台3〇調整該探針54(或該 測試卡10之探針16)之位置，俾便避免發生水氣凝結現象。 再者，本案揭示之實施例捨棄習知之電動載台，改用該液 壓式載台30承接該探針54(或該測試卡1〇)，因而得以避免電 動載台之馬達運轉時產生之電磁雜訊影響測試結果之準確 性。 本發明之本發明之技術内容及技術特點已揭示如上， 而本發明所屬技術領域中具有通常知識者應瞭解，在不 11 1374.282 ,· 第098101470號專利申請案 中文說明書替換本(1〇1年7月）4曰 背離後附申請專利範圍所界定之本發明精神和範圍内，本 發明之教示及揭示可作種種之替換及修飾。例如，上文揭 示之許多製程可以不同之方法實施或以其它製程予以取代 ’或者採用上述二種方式之組合。 此外，本案之權利範圍並不侷限於上文揭示之特定實 施例的製程、機台、製造、物質之成份、裝置、方法或步 驟。本發明所屬技術領域中具有通常知識者應瞭解，基於 本發明教示及揭示製程、機台、製造、物質之成份、裝置 、方法或步驟，無論現在已存在或日後開發者，其與本案 實施例揭示者係以實質相同的方式執行實質相同的功能， 而達到實質相同的結果，亦可使用於本發明。因此，以下 之申請專利範圍係用以涵蓋用以此類製程、機台、製造、 物質之成份、裝置、方法或步驟。 【圖式簡要說明】 藉由參照前述說明及下列圖式，本發明之技術特徵及 優點得以獲得完全瞭解。 圖1例示本發明一實施例之低溫測試裝置；以及 圖2例示本發明另一實施例之低溫測試裝置。 【主要元件符號說明】 ~ 10 測試卡 12 基板 14 支撐件 20 導通孔 12 1374.282 第098101470號專利申請案 t文說明書替換本(101年7月）4曰 24 環氧樹脂 26 導線 30 液壓式載台 32 固定部 34 可動部 40 殼體 42 蓋體 44 透明窗 46 影像擷取元件 48 封閉室 50 平台 52 載具 54 探針 56 載具 58 電連接器 60 元件承座 62 待測元件 64 溫控元件 66A 導線 66B 導線 70 載台 13 1374282 第098101470號專利申請案 中文說明書替換本(101年7月） 80 液壓控制器 82 調整旋鈕 90 液壓管路 94 襯套 100 低溫測試裝置 110 測試機台 200 低溫測試裝置 14Japanese Patent Application No. 098, 470, 470, 470, 470, 470, 470, 00, 00, 00, 00, 00, 00, 00, 00, 00, 00, 00 The platform accepts a low temperature test device for the probe or test card. [Prior Art] Integrated circuit components have become an indispensable core of various electronic devices. For example, the driving system of a car traveling at temperatures below zero degrees Celsius or the communication system of an aircraft flying at altitudes below zero degrees Celsius. The integrated circuits in these systems must operate normally in such a low temperature environment and must not fail due to temperature variations. In order to detect whether an integrated circuit component can operate normally in a low temperature environment (for example, below zero degrees Celsius), the integrated circuit components must be placed under the same or lower temperature test chamber for testing. In the case of a slave, the integrated circuit components on the wafer must first be tested for their electrical characteristics to determine if the integrated circuit components are good. A good integrated circuit will be selected for subsequent packaging processes, and defective products will be discarded to avoid additional packaging costs. The completed packaged circuit components must be subjected to another electrical test to screen for defective packages, which in turn improves the final yield. In other words, the Long F component is required to perform several electrical characteristics tests in manufacturing (4). It is the practice of the industry to set the location of the device under test and the test equipment (eg, 'test card, probe and manual stage') to be isolated from the environment and the liquid nitrogen to cool the test chamber to the test temperature test. In the test of the fortune, it must be reduced to low ^ must be moved by the manual stage to test the component ..., so that (four) card probe (four) material (four) Long circuit element No. 098101470 patent application replacement Chinese manual (July 101) The different parts of the bucket member or the same-integrated circuit component. '々,, by moving the device under test or the test card by the manual stage, the D-type must be turned on to make the test chamber in the low temperature communicate with the external high-temperature environment, causing condensation in the test chamber at low temperature, affecting the test. The actual temperature at which the component is located and destroys the cooling mechanism that is intended to reduce the temperature to the condensation temperature. In addition, the 'condensed water droplets or ice cubes falling on the machine in the test chamber may also cause the tool to be short-circuited. Furthermore, after the test chamber is isolated from the surrounding environment, the temperature of the chamber will be cooled again to the test temperature, which may cause the probe and wafer to shift due to cooling shrinkage, resulting in poor contact. To solve this problem, the developer tried to use an electric stage instead of a manual stage to avoid opening the test chamber. However, using the motorized stage to carry the 7L piece or test card (probe) to be tested will result in the electric stage being fairly close to the component under test or the test card (probe), and the electromagnetic noise of the motor of the motorized stage is deep. Mudi affects the accuracy of the test results. Therefore, the use of an electric stage instead of a manual stage is obviously not feasible in the practice of low temperature testing. Furthermore, the operation of the electric load Q requires power supply and control software, but the manual stage used in the industry is not equipped as such. US ό, 257, 319 discloses an integrated circuit test machine that performs electrical testing of integrated circuit components in a low temperature or high temperature environment. However, us 6,257,319 only reveals how to create a low temperature or high temperature test environment, and does not reveal a technical means to solve the aforementioned problems. SUMMARY OF THE INVENTION The present invention provides a hydraulic loading platform for receiving a probe or a test card, and the Chinese manual of the Japanese Patent Application No. 098101470 is replaced by a Chinese version (July 101). 4. The low temperature testing device does not need to open the testing room. The position can be adjusted to avoid condensation of water and water and the electric stage is not required to avoid the electromagnetic noise when the motor is running, which affects the accuracy of the test results. An embodiment of the cryogenic testing device of the present invention comprises a housing, a component holder disposed in the housing, a platform disposed on the housing, and a hydraulic loading platform disposed on the platform. a cover body disposed on the platform and a hydraulic controller disposed outside the housing. The hydraulic stage is configured to receive at least one probe that is configured to receive a component to be tested, the cover system being configured to form a closed chamber and the hydraulic stage and the component holder Located within the enclosed chamber, the hydraulic controller is configured to control the operation of the hydraulic stage. An embodiment of the cryogenic testing device of the present invention comprises a housing, a component holder disposed in the housing, a platform disposed on the housing, and a hydraulic loading platform disposed on the platform. a cover body disposed on the platform, and a hydraulic controller β disposed outside the housing. The hydraulic stage is constructed to receive at least one test card, the component holder being constructed to receive a component to be tested The cover system is constructed to form a closed chamber and the hydraulic stage and the component holder are located in the enclosed chamber, the hydraulic controller is constructed to control the operation of the hydraulic stage. The cover is formed by the cover (having a transparent window), so that the probe (or the probe of the test card) and the device to be tested can be observed through the transparent window of the cover without opening the closed chamber. Relative position. In addition, the embodiment disclosed in the present invention uses the hydraulic stage to receive the probe (1374282 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this way, the position of the probe (or the probe of the test card) can be adjusted by the hydraulic load without opening the closed chamber, so that the phenomenon of water hole condensation can be avoided. Furthermore, the embodiment disclosed in the present disclosure discards the conventional electric load; ϋ & accepts the probe (or the test card) with the liquid-cell stage, thereby avoiding electromagnetic noise generated when the motor of the electric stage is operated </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Other technical features and advantages of the subject matter of the claims of the present invention will be described below. It is to be understood by those of ordinary skill in the art that the present invention may be practiced in the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; It is also to be understood by those skilled in the art that the invention is not limited to the spirit and scope of the invention as defined by the appended claims. FIG. 1 illustrates an embodiment of the invention. The low temperature testing device 100 includes a housing 40, a carrier disposed in the housing 4, and is disposed in the housing 40 and configured to receive an element to be tested (eg, a component holder 60 of the semiconductor component 62, a temperature control component (for example, a heater disposed in the housing 40) disposed in the component holder 6 and configured to control the temperature of the component holder 60 a platform 50, at least one hydraulic stage 30 disposed on the platform 5, a cover 42 disposed on the platform 50, and a replacement of the Chinese manual (No. 101,101,470) The hydraulic controller 8 is disposed outside the housing 40. The cover 42 is constructed to form a closed chamber 48 in which the hydraulic stage 30 and the component holder 60 are located. In an embodiment of the invention, the liquid The stage 30 is configured to receive at least one probe 54. The hydraulic stage 30 includes a fixing portion 32 and a movable portion 34 disposed on the fixing portion 32. The fixing portion 32 is disposed on the platform 50. The movable portion 34 includes a carrier (e.g., a probe holder) 52 that is configured to hold the probe 54. In one embodiment of the invention, the probe 54 is via an electrical connector ( The bushing 58 and the wires 66A, 66B are coupled to a test machine 110, and the electrical connector 58 is disposed on the cover 42. In an embodiment of the invention, the hydraulic controller 8 The operation of the hydraulic stage 3 is controlled by at least one liquid line 90. For example, the hydraulic controller 80 can be disposed on the cover 42 and the user can rotate the adjustment knob 82 by the hydraulic line 9 The operation of the hydraulic stage 3 is controlled. The hydraulic line 90 is coupled to the hydraulic stage 30 and the hydraulic controller 8 via a bushing (or liquid connector) 94. The liquid connector 94 The cover 42 is disposed on the cover 42. ^ In an embodiment of the invention, the cover 42 includes a transparent window 44 It is composed of glass or plastic. In addition, the low temperature testing device can be further provided with an image capturing member 46' which is configured to capture the probe 54 and the waiting via the transparent window 44 of the cover 42 The positional image of the measuring element 62 is adjusted by the user to adjust the position of the probe 54 by the hydraulic stage 30. Fig. 2 illustrates a low temperature testing device 2 according to another embodiment of the present invention. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 An element holder 60 that is constructed to receive a component to be tested (eg, semiconductor component) 62, a temperature control component disposed in the component holder 60 and configured to control the temperature of the component holder 60 (eg, a heater 48, a platform 50 disposed in the housing 40, at least one hydraulic stage 30' disposed on the platform 50, and a cover 42 disposed on the platform 50, and disposed on the housing 40 external hydraulic controller 80. The cover 42 is constructed to form a closed chamber 48 in which the hydraulic stage 30 and the component holder 60 are located. In an embodiment of the present invention, the hydraulic stage 30 is configured to receive at least one test card 10, and the hydraulic stage 30 includes a fixing portion 32 and a movable portion 34 disposed on the fixing portion 32. . The securing portion 32 is disposed on the platform 50, and the movable portion 34 includes a carrier (e.g., test card holder) 56 that is configured to hold the test card 10. In an embodiment of the present invention, the test card 10 is coupled to a test machine 110 via an electrical connector (or bushing) 58 and wires 66, 66, and the electrical connector 58 is disposed on the cover. 42. In an embodiment of the invention, the hydraulic controller 80 can be disposed on the cover 42 and the operation of the hydraulic stage 30 can be controlled by at least one liquid line 90. For example, the hydraulic controller 80 can be disposed on the cover 42 and the user can rotate the adjustment knob 82 to control the operation of the hydraulic stage 30 by the hydraulic line 90. The hydraulic line 90 can be coupled to the hydraulic stage 30 and the hydraulic controller 80 via a bushing (or liquid connector) 94. The bushing 94 10 1374282 .. Patent Application No. 098101470 (July 101) The 4θ system is disposed on the lid body 42. In an embodiment of the present invention, the test card 1 includes a substrate 12, a support member 14 disposed on the substrate 12, a plurality of probes 16 disposed on the support member 4, and a connection The probe 16 and the via hole 2 of the wire 26 are. The probes 16 are secured to the support member 14 by an epoxy resin 24. The cover 42 includes a transparent window 44 which is constructed of glass or plastic. In addition, the low temperature testing device 1 can further include an image capturing component 46 configured to extract the alignment image of the probe 54 and the component to be tested 62 through the transparent window 44 of the cover 42. The position of the probe 54 is adjusted by the hydraulic stage 3〇 by the user's reference. The embodiment disclosed in the present disclosure forms the closed chamber 48' by the cover (having a transparent window 44) 42. Therefore, the probe 54 can be viewed by the transparent window 44 of the cover 42 without opening the closed chamber 48 ( Or the relative position of the probe 16) of the test card to the device under test 62. In addition, the embodiment disclosed in the present disclosure uses the hydraulic stage 30 to receive the probe 54 (or the test card 1), so that the hydraulic stage 3 can be adjusted without opening the closed chamber 48. The position of the needle 54 (or the probe 16 of the test card 10) prevents the condensation of water and moisture. Furthermore, the embodiment disclosed in the present disclosure discards the conventional electric stage, and the hydraulic stage 30 is used to receive the probe 54 (or the test card 1), thereby avoiding electromagnetic generated when the motor of the electric stage is operated. The noise affects the accuracy of the test results. The technical content and technical features of the present invention of the present invention have been disclosed above, and those having ordinary knowledge in the technical field to which the present invention pertains should understand that the Chinese manual of the patent application No. 11 1374.282, No. 098101470 is replaced by the Chinese manual (1, 1 year). The teachings and disclosures of the present invention can be variously substituted and modified within the spirit and scope of the present invention as defined by the appended claims. For example, many of the processes disclosed above may be implemented in different ways or replaced by other processes' or a combination of the two. Moreover, the scope of the present invention is not limited to the particular process, machine, manufacture, compositions, means, methods or steps of the particular embodiments disclosed. Those of ordinary skill in the art to which the present invention pertains will appreciate that the present invention and the embodiments of the present invention, based on the teachings and disclosures of the process, the machine, the manufacture, the composition, the device, the method, or the steps of the present invention, whether present or future developers The revealer performs substantially the same function in substantially the same manner, and achieves substantially the same result, and can also be used in the present invention. Accordingly, the following claims are intended to cover such <RTI ID=0.0> </ RTI> </ RTI> <RTIgt; </ RTI> processes, machines, manufactures, compositions, devices, methods or steps. BRIEF DESCRIPTION OF THE DRAWINGS The technical features and advantages of the present invention will be fully understood by referring to the description and the appended claims. Fig. 1 illustrates a low temperature test apparatus according to an embodiment of the present invention; and Fig. 2 illustrates a low temperature test apparatus according to another embodiment of the present invention. [Main component symbol description] ~ 10 Test card 12 Substrate 14 Support member 20 Via 12 1374.282 Patent application No. 098101470 Replacement of this manual (July 101) 4曰24 Epoxy 26 Lead 30 Hydraulic stage 32 Fixing part 34 Movable part 40 Housing 42 Cover body 44 Transparent window 46 Image capturing element 48 Closed chamber 50 Platform 52 Carrier 54 Probe 56 Carrier 58 Electrical connector 60 Component socket 62 Element under test 64 Temperature control element 66A wire 66B wire 70 stage 13 1374282 Patent Application No. 098101470 Replacement of this specification (July 101) 80 Hydraulic controller 82 Adjustment knob 90 Hydraulic line 94 Bushing 100 Low temperature test device 110 Test machine 200 Low temperature test Device 14