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TWI372434B - Temperature cycle test apparatus and method for heating flip chip structure using the same - Google Patents

Temperature cycle test apparatus and method for heating flip chip structure using the same

Info

Publication number
TWI372434B
TWI372434B TW097103479A TW97103479A TWI372434B TW I372434 B TWI372434 B TW I372434B TW 097103479 A TW097103479 A TW 097103479A TW 97103479 A TW97103479 A TW 97103479A TW I372434 B TWI372434 B TW I372434B
Authority
TW
Taiwan
Prior art keywords
same
test apparatus
flip chip
cycle test
temperature cycle
Prior art date
Application number
TW097103479A
Other languages
Chinese (zh)
Other versions
TW200933774A (en
Inventor
Chi Sheng Chung
Yi Shao Lai
Chang Lin Yeh
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW097103479A priority Critical patent/TWI372434B/en
Publication of TW200933774A publication Critical patent/TW200933774A/en
Application granted granted Critical
Publication of TWI372434B publication Critical patent/TWI372434B/en

Links

TW097103479A 2008-01-30 2008-01-30 Temperature cycle test apparatus and method for heating flip chip structure using the same TWI372434B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097103479A TWI372434B (en) 2008-01-30 2008-01-30 Temperature cycle test apparatus and method for heating flip chip structure using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097103479A TWI372434B (en) 2008-01-30 2008-01-30 Temperature cycle test apparatus and method for heating flip chip structure using the same

Publications (2)

Publication Number Publication Date
TW200933774A TW200933774A (en) 2009-08-01
TWI372434B true TWI372434B (en) 2012-09-11

Family

ID=44866062

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097103479A TWI372434B (en) 2008-01-30 2008-01-30 Temperature cycle test apparatus and method for heating flip chip structure using the same

Country Status (1)

Country Link
TW (1) TWI372434B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8378480B2 (en) * 2010-03-04 2013-02-19 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy wafers in 3DIC package assemblies

Also Published As

Publication number Publication date
TW200933774A (en) 2009-08-01

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