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TWI370250B - Probe assembly and inspection apparatus - Google Patents

Probe assembly and inspection apparatus

Info

Publication number
TWI370250B
TWI370250B TW097132189A TW97132189A TWI370250B TW I370250 B TWI370250 B TW I370250B TW 097132189 A TW097132189 A TW 097132189A TW 97132189 A TW97132189 A TW 97132189A TW I370250 B TWI370250 B TW I370250B
Authority
TW
Taiwan
Prior art keywords
inspection apparatus
probe assembly
probe
assembly
inspection
Prior art date
Application number
TW097132189A
Other languages
Chinese (zh)
Other versions
TW200925615A (en
Inventor
Tomoaki Kuga
Syuji Naraoka
Takao Yasuta
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of TW200925615A publication Critical patent/TW200925615A/en
Application granted granted Critical
Publication of TWI370250B publication Critical patent/TWI370250B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Liquid Crystal (AREA)
TW097132189A 2007-11-06 2008-08-22 Probe assembly and inspection apparatus TWI370250B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007288389A JP2009115585A (en) 2007-11-06 2007-11-06 Probe assembly and inspection device

Publications (2)

Publication Number Publication Date
TW200925615A TW200925615A (en) 2009-06-16
TWI370250B true TWI370250B (en) 2012-08-11

Family

ID=40645857

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097132189A TWI370250B (en) 2007-11-06 2008-08-22 Probe assembly and inspection apparatus

Country Status (4)

Country Link
JP (1) JP2009115585A (en)
KR (1) KR20090046679A (en)
CN (1) CN101430344B (en)
TW (1) TWI370250B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5491790B2 (en) * 2009-07-27 2014-05-14 株式会社日本マイクロニクス Probe device
JP5491789B2 (en) * 2009-07-27 2014-05-14 株式会社日本マイクロニクス Probe device
JP5406790B2 (en) * 2009-08-04 2014-02-05 株式会社日本マイクロニクス Probe unit and test apparatus using the same
KR101168953B1 (en) * 2009-08-04 2012-07-30 가부시키가이샤 니혼 마이크로닉스 Probe unit and testing apparatus using the same
JP5690105B2 (en) * 2009-11-26 2015-03-25 株式会社日本マイクロニクス Probe device
CN102081110B (en) * 2009-11-26 2014-03-26 日本麦可罗尼克斯股份有限公司 Probe device
JP2012058223A (en) * 2010-09-10 2012-03-22 Isao Kimoto Probe assembly
CN102486481B (en) * 2010-12-01 2014-08-06 励威电子股份有限公司 High-frequency vertical elastic probe structure
CN102565470B (en) * 2010-12-03 2014-06-04 日本麦可罗尼克斯股份有限公司 Probe assembly
CN102062961A (en) * 2011-01-20 2011-05-18 圣仁电子科技(沈阳)有限公司 Probe device for detecting plane display panel
CN115436675A (en) 2021-06-04 2022-12-06 迪科特测试科技(苏州)有限公司 Testing device and probe assembly thereof
TWI771085B (en) * 2021-06-29 2022-07-11 美科樂電子股份有限公司 Probe base structure
TWI829074B (en) * 2021-06-29 2024-01-11 美科樂電子股份有限公司 Probe holder structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3762444B2 (en) * 1993-08-24 2006-04-05 信昭 鈴木 Circuit board inspection probe and its mounting structure
JP3866815B2 (en) * 1996-03-27 2007-01-10 セイコーエプソン株式会社 LIQUID CRYSTAL PANEL SUBSTRATE, ITS MANUFACTURING METHOD, LIQUID CRYSTAL DEVICE, AND ELECTRONIC DEVICE
JP3958875B2 (en) * 1998-07-24 2007-08-15 株式会社日本マイクロニクス Prober and probe needle contact method
JP2002365308A (en) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp Vertical blade type probe, vertical blade type probe unit and vertical blade type probe card using the same
CN1244818C (en) * 2003-03-04 2006-03-08 友达光电股份有限公司 test device
KR100766296B1 (en) * 2006-02-23 2007-10-11 주식회사 파이컴 Probe blocks and probe assemblies having them
CN100428003C (en) * 2006-10-25 2008-10-22 友达光电股份有限公司 Liquid crystal display panel and probes for testing it

Also Published As

Publication number Publication date
CN101430344A (en) 2009-05-13
JP2009115585A (en) 2009-05-28
TW200925615A (en) 2009-06-16
CN101430344B (en) 2011-08-31
KR20090046679A (en) 2009-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees