TWI370147B - Modified polyimide resin and curable resin composition - Google Patents
Modified polyimide resin and curable resin compositionInfo
- Publication number
- TWI370147B TWI370147B TW094131178A TW94131178A TWI370147B TW I370147 B TWI370147 B TW I370147B TW 094131178 A TW094131178 A TW 094131178A TW 94131178 A TW94131178 A TW 94131178A TW I370147 B TWI370147 B TW I370147B
- Authority
- TW
- Taiwan
- Prior art keywords
- modified polyimide
- resin composition
- curable resin
- polyimide resin
- curable
- Prior art date
Links
- 229920001721 polyimide Polymers 0.000 title 1
- 239000009719 polyimide resin Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/69—Polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
- C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
- C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3819—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen
- C08G18/3842—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring
- C08G18/3844—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring containing one nitrogen atom in the ring
- C08G18/3846—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring containing one nitrogen atom in the ring containing imide groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
- C08G18/807—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with nitrogen containing compounds
- C08G18/8077—Oximes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004263343 | 2004-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200619269A TW200619269A (en) | 2006-06-16 |
| TWI370147B true TWI370147B (en) | 2012-08-11 |
Family
ID=36036556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094131178A TWI370147B (en) | 2004-09-10 | 2005-09-09 | Modified polyimide resin and curable resin composition |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7687113B2 (zh) |
| JP (1) | JP5321560B2 (zh) |
| KR (1) | KR101165653B1 (zh) |
| CN (1) | CN1980970B (zh) |
| TW (1) | TWI370147B (zh) |
| WO (1) | WO2006028289A1 (zh) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006123804A1 (en) * | 2005-05-16 | 2006-11-23 | Showa Denko K.K. | Carboxyl group-containing polyurethane, heat-curable resin composition and uses thereof |
| JPWO2007043425A1 (ja) * | 2005-10-07 | 2009-04-16 | 日本化薬株式会社 | イミドウレタン樹脂、それを含む感光性樹脂組成物及びその硬化物 |
| JP4485504B2 (ja) * | 2006-09-19 | 2010-06-23 | ニッタ株式会社 | 画像形成装置用ベルト |
| JP5208399B2 (ja) * | 2006-10-24 | 2013-06-12 | ニッタ株式会社 | ポリイミド樹脂 |
| US20100132989A1 (en) * | 2007-04-19 | 2010-06-03 | Kan Fujihara | Novel polyimide precursor composition and use thereof |
| WO2011008870A1 (en) * | 2009-07-14 | 2011-01-20 | The University Of Akron | Electromagnetic processing line |
| US8574720B2 (en) * | 2009-08-03 | 2013-11-05 | E.I. Du Pont De Nemours & Company | Matte finish polyimide films and methods relating thereto |
| US9631054B2 (en) | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US8541108B2 (en) * | 2010-09-27 | 2013-09-24 | Xerox Corporation | Fuser member |
| KR101775570B1 (ko) | 2010-12-20 | 2017-09-07 | 삼성전자주식회사 | 폴리이미드 전구체 조성물, 폴리이미드의 제조 방법, 상기 제조 방법에 따라 제조한 폴리이미드 및 상기 폴리이미드를 포함하는 필름 |
| US8754114B2 (en) | 2010-12-22 | 2014-06-17 | Incyte Corporation | Substituted imidazopyridazines and benzimidazoles as inhibitors of FGFR3 |
| US20140066571A1 (en) * | 2011-03-11 | 2014-03-06 | Ube Industries, Ltd. | Polyimide precursor and polyimide |
| US8791227B1 (en) | 2012-04-20 | 2014-07-29 | The United States Of America As Represented By The Secretary Of The Air Force | Crosslinked aromatic polyimides and methods of making the same |
| US8962890B1 (en) | 2012-04-20 | 2015-02-24 | The United States Of America As Represented By The Secretary Of The Air Force | Multifunctional crosslinkers for shape-memory polyimides, polyamides and poly(amide-imides) and methods of making the same |
| WO2013183293A1 (ja) * | 2012-06-07 | 2013-12-12 | 三井化学株式会社 | ポリイミド樹脂組成物、フィルム、接着剤、及び部品 |
| PE20190736A1 (es) | 2012-06-13 | 2019-05-23 | Incyte Holdings Corp | Compuestos triciclicos sustituidos como inhibidores del receptor del factor de crecimiento de fibroblastos (fgfr) |
| WO2014026125A1 (en) | 2012-08-10 | 2014-02-13 | Incyte Corporation | Pyrazine derivatives as fgfr inhibitors |
| US9085661B1 (en) | 2012-10-26 | 2015-07-21 | The United States Of America As Represented By The Secretary Of The Air Force | Photomechanically active copolyimides derived from an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride |
| US9266892B2 (en) | 2012-12-19 | 2016-02-23 | Incyte Holdings Corporation | Fused pyrazoles as FGFR inhibitors |
| CN103030763B (zh) * | 2012-12-28 | 2014-12-10 | 青岛海洋新材料科技有限公司 | 一种聚酰亚胺改性聚异氰脲酸酯泡沫体及其制备方法 |
| KR102269032B1 (ko) | 2013-04-19 | 2021-06-24 | 인사이트 홀딩스 코포레이션 | Fgfr 저해제로서 이환식 헤테로사이클 |
| US9139696B1 (en) | 2014-03-28 | 2015-09-22 | The United States Of America, As Represented By The Secretary Of The Air Force | Aromatic diamines containing three ether-linked-benzonitrile moieties, polymers thereof, and methods of making the same |
| CN103929874B (zh) * | 2014-04-09 | 2017-04-19 | 中国科学院微电子研究所 | 一种pcb线路板铜线路加工方法 |
| US9644071B1 (en) | 2014-09-05 | 2017-05-09 | The United States Of America As Represented By The Secretary Of The Air Force | Bis(azobenzene) diamines and photomechanical polymers made therefrom |
| US10851105B2 (en) | 2014-10-22 | 2020-12-01 | Incyte Corporation | Bicyclic heterocycles as FGFR4 inhibitors |
| MA41551A (fr) | 2015-02-20 | 2017-12-26 | Incyte Corp | Hétérocycles bicycliques utilisés en tant qu'inhibiteurs de fgfr4 |
| US9580423B2 (en) | 2015-02-20 | 2017-02-28 | Incyte Corporation | Bicyclic heterocycles as FGFR4 inhibitors |
| ES2895769T3 (es) | 2015-02-20 | 2022-02-22 | Incyte Corp | Heterociclos bicíclicos como inhibidores de FGFR |
| US10239254B1 (en) | 2015-08-07 | 2019-03-26 | The United States Of America As Represented By The Secretary Of The Air Force | Method of fabricating shape memory films |
| US10294255B1 (en) | 2015-08-07 | 2019-05-21 | The United States Of America As Represented By The Secretary Of The Air Force | Multifunctional crosslinking agent, crosslinked polymer, and method of making same |
| KR101966736B1 (ko) * | 2015-09-15 | 2019-04-09 | 주식회사 엘지화학 | 변성 폴리이미드 및 이를 포함하는 경화성 수지 조성물 |
| TWI567110B (zh) * | 2015-12-04 | 2017-01-21 | 張綺蘭 | 樹脂組合物、以及包含此樹脂組合物之絕緣基材及電路板 |
| AR111960A1 (es) | 2017-05-26 | 2019-09-04 | Incyte Corp | Formas cristalinas de un inhibidor de fgfr y procesos para su preparación |
| SI3788047T1 (sl) | 2018-05-04 | 2024-11-29 | Incyte Corporation | Trdne oblike inhibitorja fgfr in postopki priprave le-teh |
| SG11202010882XA (en) | 2018-05-04 | 2020-11-27 | Incyte Corp | Salts of an fgfr inhibitor |
| WO2020185532A1 (en) | 2019-03-08 | 2020-09-17 | Incyte Corporation | Methods of treating cancer with an fgfr inhibitor |
| KR102054611B1 (ko) * | 2019-03-13 | 2019-12-10 | 주식회사 엘지화학 | 변성 폴리이미드 및 이를 포함하는 경화성 수지 조성물 |
| US11591329B2 (en) | 2019-07-09 | 2023-02-28 | Incyte Corporation | Bicyclic heterocycles as FGFR inhibitors |
| WO2021067374A1 (en) | 2019-10-01 | 2021-04-08 | Incyte Corporation | Bicyclic heterocycles as fgfr inhibitors |
| US11607416B2 (en) | 2019-10-14 | 2023-03-21 | Incyte Corporation | Bicyclic heterocycles as FGFR inhibitors |
| US11566028B2 (en) | 2019-10-16 | 2023-01-31 | Incyte Corporation | Bicyclic heterocycles as FGFR inhibitors |
| EP4069696A1 (en) | 2019-12-04 | 2022-10-12 | Incyte Corporation | Tricyclic heterocycles as fgfr inhibitors |
| WO2021113462A1 (en) | 2019-12-04 | 2021-06-10 | Incyte Corporation | Derivatives of an fgfr inhibitor |
| WO2021146424A1 (en) | 2020-01-15 | 2021-07-22 | Incyte Corporation | Bicyclic heterocycles as fgfr inhibitors |
| WO2022221170A1 (en) | 2021-04-12 | 2022-10-20 | Incyte Corporation | Combination therapy comprising an fgfr inhibitor and a nectin-4 targeting agent |
| WO2022261159A1 (en) | 2021-06-09 | 2022-12-15 | Incyte Corporation | Tricyclic heterocycles as fgfr inhibitors |
| WO2022261160A1 (en) | 2021-06-09 | 2022-12-15 | Incyte Corporation | Tricyclic heterocycles as fgfr inhibitors |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5121460B2 (zh) * | 1971-12-23 | 1976-07-02 | ||
| FR2514772B1 (fr) * | 1981-10-19 | 1985-09-06 | Inst Francais Du Petrole | Compositions reactives de polyimides thermostables presentant une solubilite elevee et leurs utilisations |
| US4996268A (en) * | 1986-07-01 | 1991-02-26 | National Starch And Chemical Investment Holding Corporation | Carbinol-containing polyimide oligomers terminated with epoxide-reactive groups |
| JP2678934B2 (ja) * | 1989-01-20 | 1997-11-19 | 宇部興産株式会社 | 熱硬化性樹脂組成物およびその硬化物 |
| JPH04212206A (ja) * | 1990-03-27 | 1992-08-03 | Hitachi Ltd | 絶縁塗料、ハンダ付け可能な絶縁電線、該絶縁電線の製造方法および該絶縁電線を用いたフライバックトランス |
| US5254659A (en) * | 1990-03-27 | 1993-10-19 | Hitachi, Ltd. | Insulating coating composition, solderable insulated wires, production process of the insulated wires and flyback transformers using the insulated wires |
| JPH07330856A (ja) * | 1994-06-10 | 1995-12-19 | Sekisui Chem Co Ltd | 熱可塑性ポリウレタン及びその製造方法 |
| JP3603472B2 (ja) * | 1996-05-14 | 2004-12-22 | Jsr株式会社 | 液晶配向剤および液晶表示素子 |
| JP4016226B2 (ja) * | 1998-01-14 | 2007-12-05 | 味の素株式会社 | 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物 |
| JP3299197B2 (ja) * | 1998-09-30 | 2002-07-08 | 第一工業製薬株式会社 | 熱硬化性水系金属用防錆塗料 |
| JP4137323B2 (ja) * | 1999-11-18 | 2008-08-20 | 日本化薬株式会社 | 樹脂組成物、ソルダ−レジスト樹脂組成物及びこれらの硬化物 |
| JP4794719B2 (ja) * | 2000-06-23 | 2011-10-19 | 古河電気工業株式会社 | 自己融着性絶縁電線 |
| JP2002194081A (ja) * | 2000-12-25 | 2002-07-10 | Mitsubishi Rayon Co Ltd | 熱可塑性弾性体 |
| JP3846856B2 (ja) * | 2001-11-14 | 2006-11-15 | 日本化薬株式会社 | アルカリ水溶液可溶性ウレタン化エポキシカルボキシレート化合物及びそれを用いた感光性樹脂組成物並びにその硬化物 |
| JP4650176B2 (ja) * | 2004-09-10 | 2011-03-16 | 宇部興産株式会社 | ポリブタジエンを含んだ変性ポリイミド樹脂、その組成物及び硬化絶縁膜 |
-
2005
- 2005-09-09 WO PCT/JP2005/017078 patent/WO2006028289A1/en not_active Ceased
- 2005-09-09 US US11/658,314 patent/US7687113B2/en not_active Expired - Fee Related
- 2005-09-09 CN CN2005800227832A patent/CN1980970B/zh not_active Expired - Fee Related
- 2005-09-09 TW TW094131178A patent/TWI370147B/zh not_active IP Right Cessation
- 2005-09-09 KR KR1020067022509A patent/KR101165653B1/ko not_active Expired - Fee Related
-
2010
- 2010-10-04 JP JP2010224580A patent/JP5321560B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5321560B2 (ja) | 2013-10-23 |
| TW200619269A (en) | 2006-06-16 |
| WO2006028289A1 (en) | 2006-03-16 |
| KR20070050006A (ko) | 2007-05-14 |
| CN1980970B (zh) | 2010-05-26 |
| US20080311303A1 (en) | 2008-12-18 |
| CN1980970A (zh) | 2007-06-13 |
| US7687113B2 (en) | 2010-03-30 |
| KR101165653B1 (ko) | 2012-07-17 |
| JP2011052220A (ja) | 2011-03-17 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |