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TWI368996B - Method for manufacturing thin film transistor - Google Patents

Method for manufacturing thin film transistor

Info

Publication number
TWI368996B
TWI368996B TW096141623A TW96141623A TWI368996B TW I368996 B TWI368996 B TW I368996B TW 096141623 A TW096141623 A TW 096141623A TW 96141623 A TW96141623 A TW 96141623A TW I368996 B TWI368996 B TW I368996B
Authority
TW
Taiwan
Prior art keywords
thin film
film transistor
manufacturing thin
manufacturing
transistor
Prior art date
Application number
TW096141623A
Other languages
English (en)
Other versions
TW200837959A (en
Inventor
Naho Itagaki
Tatsuya Iwasaki
Toru Den
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200837959A publication Critical patent/TW200837959A/zh
Application granted granted Critical
Publication of TWI368996B publication Critical patent/TWI368996B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)
  • Dram (AREA)
  • Liquid Crystal (AREA)
TW096141623A 2006-11-21 2007-11-05 Method for manufacturing thin film transistor TWI368996B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006314243A JP5116290B2 (ja) 2006-11-21 2006-11-21 薄膜トランジスタの製造方法

Publications (2)

Publication Number Publication Date
TW200837959A TW200837959A (en) 2008-09-16
TWI368996B true TWI368996B (en) 2012-07-21

Family

ID=38894020

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096141623A TWI368996B (en) 2006-11-21 2007-11-05 Method for manufacturing thin film transistor

Country Status (7)

Country Link
US (1) US8084307B2 (zh)
EP (1) EP2084749A1 (zh)
JP (1) JP5116290B2 (zh)
KR (1) KR101052421B1 (zh)
CN (1) CN101548388B (zh)
TW (1) TWI368996B (zh)
WO (1) WO2008062720A1 (zh)

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JP5213458B2 (ja) 2008-01-08 2013-06-19 キヤノン株式会社 アモルファス酸化物及び電界効果型トランジスタ
JP5219529B2 (ja) * 2008-01-23 2013-06-26 キヤノン株式会社 電界効果型トランジスタ及び、該電界効果型トランジスタを備えた表示装置
JP2009206508A (ja) * 2008-01-31 2009-09-10 Canon Inc 薄膜トランジスタ及び表示装置
JP5305730B2 (ja) * 2008-05-12 2013-10-02 キヤノン株式会社 半導体素子の製造方法ならびにその製造装置
JP2010056541A (ja) * 2008-07-31 2010-03-11 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
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JP5480554B2 (ja) * 2008-08-08 2014-04-23 株式会社半導体エネルギー研究所 半導体装置
JP5627071B2 (ja) 2008-09-01 2014-11-19 株式会社半導体エネルギー研究所 半導体装置の作製方法
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TWI489628B (zh) * 2009-04-02 2015-06-21 Semiconductor Energy Lab 半導體裝置和其製造方法
JP5564331B2 (ja) * 2009-05-29 2014-07-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5507133B2 (ja) * 2009-07-03 2014-05-28 富士フイルム株式会社 ボトムゲート構造の薄膜トランジスタの製造方法
KR102365458B1 (ko) * 2009-07-03 2022-02-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
JP5458102B2 (ja) * 2009-09-04 2014-04-02 株式会社東芝 薄膜トランジスタの製造方法
CN105609566B (zh) * 2009-09-16 2018-10-26 株式会社半导体能源研究所 半导体器件及其制造方法
CN105448937A (zh) * 2009-09-16 2016-03-30 株式会社半导体能源研究所 晶体管及显示设备
KR101730347B1 (ko) 2009-09-16 2017-04-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR102111468B1 (ko) * 2009-09-24 2020-05-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
KR101693544B1 (ko) * 2009-09-24 2017-01-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
WO2011043182A1 (en) * 2009-10-05 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Method for removing electricity and method for manufacturing semiconductor device
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WO2011048923A1 (en) * 2009-10-21 2011-04-28 Semiconductor Energy Laboratory Co., Ltd. E-book reader
CN104465318B (zh) * 2009-11-06 2018-04-24 株式会社半导体能源研究所 制造半导体器件的方法
CN102598279B (zh) * 2009-11-06 2015-10-07 株式会社半导体能源研究所 半导体装置
KR102220606B1 (ko) 2009-11-06 2021-03-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
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KR20170072965A (ko) * 2009-11-13 2017-06-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 스퍼터링 타겟 및 그 제조방법, 및 트랜지스터
JP5657878B2 (ja) * 2009-11-20 2015-01-21 株式会社半導体エネルギー研究所 トランジスタの作製方法
KR20230172618A (ko) 2009-11-27 2023-12-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작방법
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KR101435970B1 (ko) * 2010-03-26 2014-08-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치를 제작하는 방법
KR20130054275A (ko) * 2010-04-23 2013-05-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
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JP5189674B2 (ja) * 2010-12-28 2013-04-24 出光興産株式会社 酸化物半導体薄膜層を有する積層構造、積層構造の製造方法、薄膜トランジスタ及び表示装置
JP5743064B2 (ja) * 2011-02-17 2015-07-01 株式会社Ｊｏｌｅｄ 薄膜トランジスタおよびその製造方法、並びに表示装置
KR101843871B1 (ko) * 2011-03-11 2018-04-02 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
US9412623B2 (en) * 2011-06-08 2016-08-09 Cbrite Inc. Metal oxide TFT with improved source/drain contacts and reliability
US8679905B2 (en) * 2011-06-08 2014-03-25 Cbrite Inc. Metal oxide TFT with improved source/drain contacts
JP6016532B2 (ja) * 2011-09-07 2016-10-26 株式会社半導体エネルギー研究所 半導体装置
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KR20130111873A (ko) 2012-04-02 2013-10-11 단국대학교 산학협력단 박막 트랜지스터 표시판 제조 방법
CN104321967B (zh) * 2012-05-25 2018-01-09 株式会社半导体能源研究所 可编程逻辑装置及半导体装置
KR20130137851A (ko) 2012-06-08 2013-12-18 삼성디스플레이 주식회사 산화물 반도체의 전구체 조성물, 산화물 반도체를 포함하는 박막 트랜지스터 기판, 그리고 산화물 반도체를 포함하는 박막 트랜지스터 기판의 제조 방법
TWI607510B (zh) * 2012-12-28 2017-12-01 半導體能源研究所股份有限公司 半導體裝置及半導體裝置的製造方法
CN103985639B (zh) * 2014-04-28 2015-06-03 京东方科技集团股份有限公司 一种薄膜晶体管及其制备方法、显示基板、显示装置
TWI611463B (zh) * 2016-06-29 2018-01-11 友達光電股份有限公司 金屬氧化物半導體層的結晶方法及半導體結構
KR102458660B1 (ko) 2016-08-03 2022-10-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
KR101914835B1 (ko) * 2016-11-18 2018-11-02 아주대학교산학협력단 금속산화물 이종 접합 구조, 이의 제조방법 및 이를 포함하는 박막트랜지스터
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Also Published As

Publication number Publication date
JP5116290B2 (ja) 2013-01-09
US20090269880A1 (en) 2009-10-29
US8084307B2 (en) 2011-12-27
CN101548388A (zh) 2009-09-30
JP2008130814A (ja) 2008-06-05
KR20090086602A (ko) 2009-08-13
CN101548388B (zh) 2010-11-17
EP2084749A1 (en) 2009-08-05
TW200837959A (en) 2008-09-16
KR101052421B1 (ko) 2011-07-28
WO2008062720A1 (en) 2008-05-29

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