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TWI368671B - Substrate holding apparatus, substrate holding method, and substrate processing apparatus - Google Patents

Substrate holding apparatus, substrate holding method, and substrate processing apparatus

Info

Publication number
TWI368671B
TWI368671B TW093140194A TW93140194A TWI368671B TW I368671 B TWI368671 B TW I368671B TW 093140194 A TW093140194 A TW 093140194A TW 93140194 A TW93140194 A TW 93140194A TW I368671 B TWI368671 B TW I368671B
Authority
TW
Taiwan
Prior art keywords
substrate holding
substrate
processing apparatus
holding method
substrate processing
Prior art date
Application number
TW093140194A
Other languages
English (en)
Other versions
TW200526810A (en
Inventor
Masahiko Sekimoto
Seiji Katsuoka
Naoki Dai
Teruyuki Watanabe
Takahiro Ogawa
Kenichi Suzuki
Kenichi Kobayashi
Yasuyuki Motoshima
Ryo Kato
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003431346A external-priority patent/JP2005191304A/ja
Priority claimed from JP2003432480A external-priority patent/JP4463543B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200526810A publication Critical patent/TW200526810A/zh
Application granted granted Critical
Publication of TWI368671B publication Critical patent/TWI368671B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Chemically Coating (AREA)
TW093140194A 2003-12-25 2004-12-23 Substrate holding apparatus, substrate holding method, and substrate processing apparatus TWI368671B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003431346A JP2005191304A (ja) 2003-12-25 2003-12-25 基板保持装置及び基板保持方法、並びに基板処理装置
JP2003432480A JP4463543B2 (ja) 2003-12-26 2003-12-26 基板保持装置及び基板保持方法、並びに基板処理装置

Publications (2)

Publication Number Publication Date
TW200526810A TW200526810A (en) 2005-08-16
TWI368671B true TWI368671B (en) 2012-07-21

Family

ID=34742126

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093140194A TWI368671B (en) 2003-12-25 2004-12-23 Substrate holding apparatus, substrate holding method, and substrate processing apparatus

Country Status (5)

Country Link
US (3) US7886685B2 (zh)
EP (1) EP1697967A1 (zh)
KR (1) KR101076820B1 (zh)
TW (1) TWI368671B (zh)
WO (1) WO2005064642A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7886685B2 (en) * 2003-12-25 2011-02-15 Ebara Corporation Substrate holding apparatus, substrate holding method, and substrate processing apparatus
US8420537B2 (en) * 2008-05-28 2013-04-16 International Business Machines Corporation Stress locking layer for reliable metallization
US9087777B2 (en) * 2013-03-14 2015-07-21 United Test And Assembly Center Ltd. Semiconductor packages and methods of packaging semiconductor devices
JP6986917B2 (ja) * 2017-10-04 2021-12-22 東京エレクトロン株式会社 基板液処理装置
US11541493B2 (en) * 2019-06-19 2023-01-03 Adnanotek Corp. Multi-axis mechanism device
KR102835056B1 (ko) * 2020-08-25 2025-07-18 주식회사 제우스 기판처리장치 및 기판처리방법
TWI821679B (zh) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 基板處理裝置及基板處理方法
KR102826478B1 (ko) * 2020-08-25 2025-06-30 주식회사 제우스 기판처리장치 및 기판처리방법
CN112869608B (zh) * 2021-02-24 2022-12-06 江苏中兴水务有限公司 一种具有油污清洁剂用厨房清洁器
KR20220135184A (ko) * 2021-03-26 2022-10-06 주식회사 제우스 기판처리장치 및 이의 제어방법
KR20220144989A (ko) 2021-04-21 2022-10-28 주식회사 제우스 기판세정장치
CN113681403B (zh) * 2021-10-27 2022-02-08 徐州凯越照明有限公司 一种led灯具打磨工艺及设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5590870A (en) * 1995-06-02 1997-01-07 Advanced Machine & Engineering Co. Universal holding system for a contoured workpiece
JP3641115B2 (ja) * 1997-10-08 2005-04-20 大日本スクリーン製造株式会社 基板処理装置
EP1163488A1 (en) * 1999-03-22 2001-12-19 Sensys Instruments Corporation Method and apparatus for wafer metrology
JP4108941B2 (ja) * 2000-10-31 2008-06-25 株式会社荏原製作所 基板の把持装置、処理装置、及び把持方法
JP2002212786A (ja) 2001-01-17 2002-07-31 Ebara Corp 基板処理装置
JP2002299208A (ja) * 2001-03-30 2002-10-11 Shin Etsu Handotai Co Ltd 露光装置
DE20206490U1 (de) * 2002-04-24 2002-07-18 J. Schmalz GmbH, 72293 Glatten Blocksauger
US6547559B1 (en) * 2002-05-20 2003-04-15 Veeco Instruments, Inc. Clamping of a semiconductor substrate for gas-assisted heat transfer in a vacuum chamber
US6824613B2 (en) * 2002-05-30 2004-11-30 Ebara Corporation Substrate processing apparatus
US20050158478A1 (en) 2002-06-06 2005-07-21 Seiji Katsuoka Substrate processing apparatus and substrate processing method
US7087117B2 (en) 2002-11-15 2006-08-08 Ebara Corporation Substrate processing apparatus and substrate processing method
US7886685B2 (en) * 2003-12-25 2011-02-15 Ebara Corporation Substrate holding apparatus, substrate holding method, and substrate processing apparatus
US8181948B2 (en) * 2008-06-12 2012-05-22 John Blick Tilt machining device and method

Also Published As

Publication number Publication date
US8777198B2 (en) 2014-07-15
TW200526810A (en) 2005-08-16
WO2005064642A1 (en) 2005-07-14
EP1697967A1 (en) 2006-09-06
US20070070575A1 (en) 2007-03-29
US7886685B2 (en) 2011-02-15
US20120141246A1 (en) 2012-06-07
US20110094442A1 (en) 2011-04-28
US8141513B2 (en) 2012-03-27
KR101076820B1 (ko) 2011-10-25
KR20060124658A (ko) 2006-12-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees