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TWI367698B - Flexible circuit board - Google Patents

Flexible circuit board

Info

Publication number
TWI367698B
TWI367698B TW095112843A TW95112843A TWI367698B TW I367698 B TWI367698 B TW I367698B TW 095112843 A TW095112843 A TW 095112843A TW 95112843 A TW95112843 A TW 95112843A TW I367698 B TWI367698 B TW I367698B
Authority
TW
Taiwan
Prior art keywords
circuit board
flexible circuit
flexible
board
circuit
Prior art date
Application number
TW095112843A
Other languages
English (en)
Other versions
TW200642540A (en
Inventor
Hiroji Hoshino
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200642540A publication Critical patent/TW200642540A/zh
Application granted granted Critical
Publication of TWI367698B publication Critical patent/TWI367698B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW095112843A 2005-04-12 2006-04-11 Flexible circuit board TWI367698B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005114393A JP4584006B2 (ja) 2005-04-12 2005-04-12 可撓性回路基板

Publications (2)

Publication Number Publication Date
TW200642540A TW200642540A (en) 2006-12-01
TWI367698B true TWI367698B (en) 2012-07-01

Family

ID=37078345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112843A TWI367698B (en) 2005-04-12 2006-04-11 Flexible circuit board

Country Status (4)

Country Link
US (1) US7402756B2 (zh)
JP (1) JP4584006B2 (zh)
CN (1) CN1849035B (zh)
TW (1) TWI367698B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100894277B1 (ko) * 2006-09-15 2009-04-21 엘지전자 주식회사 휴대 단말기
KR101249779B1 (ko) * 2009-12-08 2013-04-03 엘지디스플레이 주식회사 연성 인쇄 회로 기판 및 이를 포함하는 백라이트 유닛과 액정 표시 장치
CN201657501U (zh) * 2010-01-29 2010-11-24 比亚迪股份有限公司 一种线路板金手指
CN104175634B (zh) * 2013-05-25 2016-04-27 宸鸿科技(厦门)有限公司 软性电路板及其使用方法
US10186347B2 (en) * 2015-06-29 2019-01-22 Kyocera Document Solutions Inc. Flexible flat cable and image forming apparatus
US9786790B2 (en) 2015-12-10 2017-10-10 Industrial Technology Research Institute Flexible device
CN108241240B (zh) * 2018-02-08 2021-05-14 上海天马微电子有限公司 一种显示面板以及显示装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191753U (ja) * 1983-06-06 1984-12-19 株式会社ニコン フレキシブルプリント基板の接続構造
US4772936A (en) * 1984-09-24 1988-09-20 United Technologies Corporation Pretestable double-sided tab design
JP2914795B2 (ja) * 1991-09-02 1999-07-05 キヤノン株式会社 両面フレキシブルプリント配線板
JP3251079B2 (ja) * 1992-12-28 2002-01-28 ソニー株式会社 Ｆｐｃのコネクター用端子部
JPH0837351A (ja) 1994-07-21 1996-02-06 Amp Japan Ltd フレキシブル回路板ハーネス装置及びそれに使用されるフレキシブル回路板
US6525718B1 (en) * 1997-02-05 2003-02-25 Sharp Kabushiki Kaisha Flexible circuit board and liquid crystal display device incorporating the same
JPH1154219A (ja) * 1997-08-05 1999-02-26 Tokai Rubber Ind Ltd 電気コネクタおよびそれに用いる接続ガイド
KR100485967B1 (ko) * 1998-04-09 2005-05-03 세이코 엡슨 가부시키가이샤 압착 접속 기판, 액정 장치 및 전자 기기
JP2001094225A (ja) 1998-04-09 2001-04-06 Seiko Epson Corp 圧着接続基板、液晶装置及び電子機器
JP3565069B2 (ja) * 1998-12-28 2004-09-15 ソニーケミカル株式会社 両面フレキシブルプリント基板の製造方法
JP2002094203A (ja) 2000-09-11 2002-03-29 Nec Yonezawa Ltd フレキシブル回路板および同用コネクタ
US6483713B2 (en) * 2001-11-20 2002-11-19 St. Jude Children's Research Hospital Multilayered board comprising folded flexible circuits
KR100491179B1 (ko) * 2001-11-21 2005-05-24 마츠시타 덴끼 산교 가부시키가이샤 박형 회로기판 및 박형 회로기판의 제조방법
JP2003249734A (ja) * 2002-02-25 2003-09-05 Nec Saitama Ltd 積層配線基板及びその製造方法
CN2645405Y (zh) * 2003-09-26 2004-09-29 比亚迪股份有限公司 双面柔性印刷电路板
JP4551776B2 (ja) * 2005-01-17 2010-09-29 日本圧着端子製造株式会社 両面ｆｐｃ

Also Published As

Publication number Publication date
JP2006294906A (ja) 2006-10-26
TW200642540A (en) 2006-12-01
US7402756B2 (en) 2008-07-22
JP4584006B2 (ja) 2010-11-17
CN1849035B (zh) 2010-12-22
US20060226861A1 (en) 2006-10-12
CN1849035A (zh) 2006-10-18

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