TWI366666B - Thermocouple circuit and method and system for forming same - Google Patents

Thermocouple circuit and method and system for forming same

Info

Publication number: TWI366666B
Authority: TW; Taiwan
Prior art keywords: forming same; thermocouple circuit; thermocouple; circuit; forming
Prior art date: 2006-12-21

Application number

TW096148858A

Other languages

English (en)

Other versions

TW200900669A (en

Inventor

Martin Adelsberg Lee

Michael Drosdak John

Richard Grzesik Paul

A Knutson Trudy

Myron Lineman David

Barry Reiman Kevin

Original Assignee

Corning Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-12-21

Filing date

2007-12-19

Publication date

2012-06-21

2007-12-19 Application filed by Corning Inc filed Critical Corning Inc

2009-01-01 Publication of TW200900669A publication Critical patent/TW200900669A/zh

2012-06-21 Application granted granted Critical

2012-06-21 Publication of TWI366666B publication Critical patent/TWI366666B/zh

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/021—Particular circuit arrangements
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
- G01K15/005—Calibration
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Health & Medical Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Chemical & Material Sciences (AREA)
Analytical Chemistry (AREA)
Biochemistry (AREA)
General Health & Medical Sciences (AREA)
Immunology (AREA)
Pathology (AREA)
Measuring Temperature Or Quantity Of Heat (AREA)

TW096148858A 2006-12-21 2007-12-19 Thermocouple circuit and method and system for forming same TWI366666B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US87626806P	2006-12-21	2006-12-21

Publications (2)

Publication Number	Publication Date
TW200900669A TW200900669A (en)	2009-01-01
TWI366666B true TWI366666B (en)	2012-06-21

Family

ID=39636252

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW096148858A TWI366666B (en)	2006-12-21	2007-12-19	Thermocouple circuit and method and system for forming same

Country Status (6)

Country	Link
US (1)	US7828480B2 (zh)
JP (1)	JP5172858B2 (zh)
KR (1)	KR101456311B1 (zh)
CN (1)	CN101568825B (zh)
TW (1)	TWI366666B (zh)
WO (1)	WO2008088433A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101286346B1 (ko) *	2007-10-24	2013-07-15	헤라우스 일렉트로-나이트 인터내셔날 엔. 브이.	열전쌍 연장용 와이어
JP5493205B2 (ja) *	2009-06-17	2014-05-14	独立行政法人物質・材料研究機構	熱電対とそれを利用した測温器
US8821013B2 (en)	2010-10-28	2014-09-02	Corning Incorporated	Thermocouples with two tabs spaced apart along a transverse axis and methods
DE102012205303A1 (de) *	2012-03-30	2013-10-02	Robert Bosch Gmbh	Temperaturfühler und Verfahren zum Erfassen einer Temperatur einer Batteriezelle
JP5503717B1 (ja) *	2012-11-30	2014-05-28	双葉電子工業株式会社	温度検出体、温度センサ及び温度検出体の製造方法
JP6752556B2 (ja) *	2015-07-31	2020-09-09	株式会社フルヤ金属	熱電対の取り付け構造及び熱電対の取り付け方法
JP6152463B1 (ja) *	2016-07-29	2017-06-21	株式会社フルヤ金属	熱電対
CN107300425B (zh) *	2017-07-06	2019-12-20	北京大学	一种温度传感器以及温度测量方法
US11499873B2 (en)	2020-06-17	2022-11-15	Xerox Corporation	System and method for determining a temperature differential between portions of an object printed by a 3D printer
US11478991B2 (en) *	2020-06-17	2022-10-25	Xerox Corporation	System and method for determining a temperature of an object
US11498354B2 (en)	2020-08-26	2022-11-15	Xerox Corporation	Multi-layer imaging blanket
US11767447B2 (en)	2021-01-19	2023-09-26	Xerox Corporation	Topcoat composition of imaging blanket with improved properties
US12449315B2 (en)	2022-11-01	2025-10-21	Foreman Instrumentation & Controls, Inc.	Modified thermocouple assembly
CN116295895A (zh) *	2023-03-20	2023-06-23	西安热工研究院有限公司	一种判断热电偶补偿导线及连接插头温度补偿性能的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04104541U (ja) *	1991-02-18	1992-09-09	日本鋼管株式会社	金属板の表面温度測定器
JPH071578U (ja) *	1992-04-16	1995-01-10	株式会社岡崎製作所	熱電対コネクタ
JPH0933360A (ja) *	1995-07-24	1997-02-07	Nippon Avionics Co Ltd	熱電対の接続構造
JP3483544B2 (ja) *	2000-12-13	2004-01-06	株式会社東海ヒット	透明面温度センサ及び透明面温度制御装置
US20020088640A1 (en) *	2001-01-09	2002-07-11	Schuh William C.	Temperature sensor, leadwire and method
JP2002270074A (ja) *	2001-03-07	2002-09-20	Uchihashi Estec Co Ltd	温度ヒューズの溶断温度測定方法
US6983223B2 (en) *	2003-04-29	2006-01-03	Watlow Electric Manufacturing Company	Detecting thermocouple failure using loop resistance
US7084342B2 (en) *	2003-06-17	2006-08-01	Watlow Electric Manufacturing Co.	Semi-compensated pins for cold junction compensation
US7131768B2 (en) *	2003-12-16	2006-11-07	Harco Laboratories, Inc.	Extended temperature range EMF device
US7044638B2 (en) *	2004-05-24	2006-05-16	Rosemount Aerospace, Inc.	Multi-element thermocouple
US7513686B2 (en) *	2006-02-27	2009-04-07	Advanced Micro Devices, Inc.	Circuit lid with a thermocouple
KR101286346B1 (ko) *	2007-10-24	2013-07-15	헤라우스 일렉트로-나이트 인터내셔날 엔. 브이.	열전쌍 연장용 와이어

2007
- 2007-11-07 CN CN2007800478702A patent/CN101568825B/zh not_active Expired - Fee Related
- 2007-11-07 WO PCT/US2007/023437 patent/WO2008088433A1/en not_active Ceased
- 2007-11-07 KR KR1020097015231A patent/KR101456311B1/ko not_active Expired - Fee Related
- 2007-11-07 JP JP2009542766A patent/JP5172858B2/ja not_active Expired - Fee Related
- 2007-12-19 TW TW096148858A patent/TWI366666B/zh not_active IP Right Cessation
- 2007-12-20 US US12/004,263 patent/US7828480B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
JP2010513922A (ja)	2010-04-30
JP5172858B2 (ja)	2013-03-27
CN101568825B (zh)	2012-02-08
WO2008088433A1 (en)	2008-07-24
CN101568825A (zh)	2009-10-28
KR101456311B1 (ko)	2014-11-03
KR20090102814A (ko)	2009-09-30
US20080175304A1 (en)	2008-07-24
US7828480B2 (en)	2010-11-09
TW200900669A (en)	2009-01-01

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Legal Events

Date	Code	Title	Description
2022-03-21	MM4A	Annulment or lapse of patent due to non-payment of fees