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TWI366575B - Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin - Google Patents

Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin

Info

Publication number
TWI366575B
TWI366575B TW095108892A TW95108892A TWI366575B TW I366575 B TWI366575 B TW I366575B TW 095108892 A TW095108892 A TW 095108892A TW 95108892 A TW95108892 A TW 95108892A TW I366575 B TWI366575 B TW I366575B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
novel
production method
cured article
resin composition
Prior art date
Application number
TW095108892A
Other languages
English (en)
Other versions
TW200700452A (en
Inventor
Ichirou Ogura
Kunihiro Morinaga
Kazuo Arita
Yutaka Sato
Original Assignee
Dainippon Ink & Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals filed Critical Dainippon Ink & Chemicals
Publication of TW200700452A publication Critical patent/TW200700452A/zh
Application granted granted Critical
Publication of TWI366575B publication Critical patent/TWI366575B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW095108892A 2005-03-18 2006-03-16 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin TWI366575B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005079223 2005-03-18
JP2005097866 2005-03-30

Publications (2)

Publication Number Publication Date
TW200700452A TW200700452A (en) 2007-01-01
TWI366575B true TWI366575B (en) 2012-06-21

Family

ID=37023669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108892A TWI366575B (en) 2005-03-18 2006-03-16 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin

Country Status (5)

Country Link
US (2) US7718741B2 (zh)
CN (1) CN101495533B (zh)
MY (1) MY143372A (zh)
TW (1) TWI366575B (zh)
WO (1) WO2006101008A1 (zh)

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* Cited by examiner, † Cited by third party
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US7718741B2 (en) * 2005-03-18 2010-05-18 Dainippon Ink And Chemicals, Inc. Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
JP4285491B2 (ja) * 2006-02-28 2009-06-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、新規フェノール樹脂、及び半導体封止材料
JP5463859B2 (ja) * 2009-11-06 2014-04-09 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、新規フェノール樹脂、プリプレグ、及び回路基板
US9545668B2 (en) * 2009-11-27 2017-01-17 Tokusen Kogyo Co., Ltd. Fine metal particle-containing composition
EP2589625B1 (en) 2010-07-02 2016-10-26 DIC Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, printed circuit board, and build-up film
US20130184377A1 (en) * 2010-07-30 2013-07-18 Dic Corporation Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating material
SG188663A1 (en) 2010-09-29 2013-05-31 Dainippon Ink & Chemicals Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
SG191949A1 (en) * 2011-01-20 2013-08-30 Mitsubishi Gas Chemical Co Resin composition, prepreg and laminate
JP5716963B2 (ja) * 2011-07-22 2015-05-13 Dic株式会社 ポリヒドロキシ化合物、エポキシ樹脂、熱硬化性樹脂組成物、その硬化物及び半導体封止材料
JP5987262B2 (ja) * 2012-08-16 2016-09-07 Dic株式会社 硬化性樹脂組成物、硬化物、及びプリント配線基板
JP5987261B2 (ja) * 2012-08-16 2016-09-07 Dic株式会社 硬化性樹脂組成物、硬化物、及びプリント配線基板
TWI572665B (zh) * 2012-10-17 2017-03-01 Dainippon Ink & Chemicals 活性酯樹脂、環氧樹脂組成物、其硬化物、預浸體、 電路基板以及積層膜
CN105121495A (zh) 2013-02-15 2015-12-02 英派尔科技开发有限公司 酚类环氧化合物
WO2014200486A1 (en) 2013-06-13 2014-12-18 Empire Technology Development Llc Multi-functional phenolic resins
US10000046B2 (en) * 2013-10-07 2018-06-19 Rohr, Inc. Methods for creating thick laminate structures
EP3077364A4 (en) 2013-12-02 2017-11-08 Empire Technology Development LLC Novel gemini surfactants and their use
JP6402968B2 (ja) * 2014-03-03 2018-10-10 Dic株式会社 （メタ）アクリロイル基含有樹脂、（メタ）アクリロイル基含有樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
JP6476559B2 (ja) * 2014-03-07 2019-03-06 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
JP6476558B2 (ja) * 2014-03-07 2019-03-06 Dic株式会社 酸基含有（メタ）アクリレート樹脂、酸基含有（メタ）アクリレート樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
TWI685540B (zh) * 2014-12-15 2020-02-21 日商迪愛生股份有限公司 熱硬化性樹脂組成物、其硬化物、及用於其之活性酯樹脂
JP6886583B2 (ja) * 2016-12-26 2021-06-16 Dic株式会社 ポリアリーレンスルフィド樹脂組成物、成形品及び製造方法
JP6896591B2 (ja) * 2017-11-14 2021-06-30 Ｅｎｅｏｓ株式会社 プリプレグ、繊維強化複合材料及び成形体
CN110128780B (zh) * 2018-02-08 2023-07-14 衡所华威电子有限公司 一种低介电常数环氧树脂组合物
CN113227192A (zh) * 2018-12-27 2021-08-06 住友电木株式会社 密封用树脂组合物、半导体装置和半导体装置的制造方法
RU2749277C1 (ru) * 2019-12-25 2021-06-07 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Способ получения лаковых полимерных композиций для окраски консервной тары
WO2022118723A1 (ja) * 2020-12-03 2022-06-09 Dic株式会社 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム

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* Cited by examiner, † Cited by third party
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GB1054930A (zh) * 1963-05-01 Ciba Ltd
JPH02227418A (ja) 1989-02-28 1990-09-10 Dainippon Ink & Chem Inc エポキシ樹脂組成物およびそれにより封止された半導体
EP0467826A3 (en) * 1990-06-26 1992-10-07 Ciba-Geigy Ag Linear polymers
JPH04359919A (ja) * 1991-06-07 1992-12-14 Yuka Shell Epoxy Kk エポキシ樹脂、同樹脂の製造法及び同樹脂組成物
JP3196141B2 (ja) 1991-11-14 2001-08-06 東都化成株式会社 エポキシ樹脂組成物
JP3146320B2 (ja) 1991-11-18 2001-03-12 東都化成株式会社 エポキシ樹脂組成物
JP2669247B2 (ja) 1992-02-13 1997-10-27 信越化学工業株式会社 熱硬化性樹脂組成物
JP3125059B2 (ja) 1992-04-28 2001-01-15 新日鐵化学株式会社 電子部品封止用エポキシ樹脂組成物
JPH06263839A (ja) 1993-03-16 1994-09-20 Dainippon Ink & Chem Inc エポキシ樹脂の製造法、エポキシ樹脂組成物及び半導体封止材料
JPH07304846A (ja) 1994-05-09 1995-11-21 Yuka Shell Epoxy Kk エポキシ樹脂組成物
JP3587570B2 (ja) 1994-10-20 2004-11-10 三井化学株式会社 ベンジル化ポリフェノール、そのエポキシ樹脂、それらの製造方法および用途
JP3214266B2 (ja) 1994-11-01 2001-10-02 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3579959B2 (ja) 1995-04-17 2004-10-20 大日本インキ化学工業株式会社 半導体封止材料
JP4713753B2 (ja) * 2001-03-29 2011-06-29 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びその硬化物
JP3953854B2 (ja) 2002-03-22 2007-08-08 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物
JP2004059714A (ja) * 2002-07-29 2004-02-26 Mitsubishi Chemicals Corp エポキシ樹脂及びそれを用いたエポキシ樹脂組成物
JP4661033B2 (ja) 2003-06-27 2011-03-30 Ｄｉｃ株式会社 エポキシ樹脂組成物、半導体封止材料及び半導体装置
US7718741B2 (en) 2005-03-18 2010-05-18 Dainippon Ink And Chemicals, Inc. Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
JP5245199B2 (ja) 2005-03-18 2013-07-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、その製造方法、及び新規フェノール樹脂
JP4285491B2 (ja) * 2006-02-28 2009-06-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、新規フェノール樹脂、及び半導体封止材料

Also Published As

Publication number Publication date
MY143372A (en) 2011-04-29
US8084567B2 (en) 2011-12-27
US7718741B2 (en) 2010-05-18
CN101495533A (zh) 2009-07-29
US20090069490A1 (en) 2009-03-12
US20100056747A1 (en) 2010-03-04
TW200700452A (en) 2007-01-01
WO2006101008A1 (ja) 2006-09-28
CN101495533B (zh) 2012-02-29

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