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TWI366201B - Ceramic component and method of manufacturing the same - Google Patents

Ceramic component and method of manufacturing the same

Info

Publication number
TWI366201B
TWI366201B TW096114228A TW96114228A TWI366201B TW I366201 B TWI366201 B TW I366201B TW 096114228 A TW096114228 A TW 096114228A TW 96114228 A TW96114228 A TW 96114228A TW I366201 B TWI366201 B TW I366201B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
ceramic component
ceramic
component
Prior art date
Application number
TW096114228A
Other languages
English (en)
Other versions
TW200807455A (en
Inventor
Kwang-Hwi Choi
Sung-Soo Jo
Sun-Ki Kim
Original Assignee
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joinset Co Ltd filed Critical Joinset Co Ltd
Publication of TW200807455A publication Critical patent/TW200807455A/zh
Application granted granted Critical
Publication of TWI366201B publication Critical patent/TWI366201B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1006—Thick film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Thermistors And Varistors (AREA)
TW096114228A 2006-07-19 2007-04-23 Ceramic component and method of manufacturing the same TWI366201B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060067611A KR100821274B1 (ko) 2006-07-19 2006-07-19 칩 세라믹 전자부품

Publications (2)

Publication Number Publication Date
TW200807455A TW200807455A (en) 2008-02-01
TWI366201B true TWI366201B (en) 2012-06-11

Family

ID=38956952

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096114228A TWI366201B (en) 2006-07-19 2007-04-23 Ceramic component and method of manufacturing the same

Country Status (4)

Country Link
US (1) US7791450B2 (zh)
KR (1) KR100821274B1 (zh)
TW (1) TWI366201B (zh)
WO (1) WO2008010642A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603347B (zh) * 2015-04-08 2017-10-21 Wafer resistance terminal electrode structure

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009023846B4 (de) * 2009-02-03 2024-02-01 Tdk Electronics Ag Varistorkeramik, Vielschichtbauelement umfassend die Varistorkeramik, Herstellungsverfahren für die Varistorkeramik
KR101041626B1 (ko) 2009-03-10 2011-06-15 조인셋 주식회사 표면실장용 칩 부품
KR101018935B1 (ko) * 2009-03-19 2011-03-02 오영주 어레이 구조를 갖는 표면실장형 고압 세라믹 커패시터
CN103247362B (zh) * 2013-04-17 2016-02-03 隆科电子(惠阳)有限公司 一种电子陶瓷元件的卑金属复合电极及其制备方法
KR20140148105A (ko) * 2013-06-21 2014-12-31 삼성전기주식회사 박막형 커먼모드 필터 및 그 제조방법
CN103632784B (zh) * 2013-11-23 2016-04-13 华中科技大学 一种叠层片式热压敏复合电阻器及其制备方法
DE102014100469A1 (de) * 2013-11-29 2015-06-03 Epcos Ag Elektronisches Bauelement und Verwendung desselben
KR20150135909A (ko) * 2014-05-26 2015-12-04 삼성전기주식회사 복합 전자부품, 제조방법, 그 실장 기판 및 포장체
KR101664443B1 (ko) * 2014-09-24 2016-10-10 주식회사 아모센스 무수축 바리스터 기판 및 그 제조 방법과 이를 이용한 led 패키지
JP6338011B2 (ja) * 2015-03-04 2018-06-06 株式会社村田製作所 基板埋め込み用ｎｔｃサーミスタおよびその製造方法
KR102561933B1 (ko) * 2016-02-25 2023-08-01 삼성전기주식회사 Ntc 써미스터용 조성물 및 이를 이용한 ntc 써미스터
JP2017174911A (ja) * 2016-03-22 2017-09-28 株式会社村田製作所 複合電子部品および抵抗素子
TWI628678B (zh) * 2016-04-21 2018-07-01 Tdk 股份有限公司 電子零件
KR101965685B1 (ko) * 2016-07-26 2019-04-04 한밭대학교 산학협력단 높은 내전압용 고전력 세라믹 칩 저항소자 및 그 조립방법
JP6937176B2 (ja) 2017-06-16 2021-09-22 太陽誘電株式会社 電子部品、電子装置、及び電子部品の製造方法
KR20200060067A (ko) * 2018-11-22 2020-05-29 삼성전기주식회사 바리스터
JP7279574B2 (ja) * 2019-08-09 2023-05-23 株式会社村田製作所 電子部品及び電子部品の製造方法
CN114303045A (zh) * 2019-09-20 2022-04-08 Tdk电子股份有限公司 传感器设备和用于制造传感器设备的方法
JP2021136323A (ja) * 2020-02-27 2021-09-13 株式会社村田製作所 積層セラミック電子部品
KR102812671B1 (ko) * 2020-07-28 2025-05-26 주식회사 아모센스 세라믹기판 및 그 제조방법, 이를 포함하는 파워모듈
TWI891855B (zh) * 2021-07-22 2025-08-01 信昌電子陶瓷股份有限公司 晶片電阻器基材層和電阻層的強化結合方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191047A (ja) * 1992-01-13 1993-07-30 Fujitsu Ltd 多層セラミック回路基板の製造方法
JP3414123B2 (ja) * 1996-04-26 2003-06-09 松下電器産業株式会社 粒界絶縁型積層セラミック素子の製造方法
TW487742B (en) * 1999-05-10 2002-05-21 Matsushita Electric Industrial Co Ltd Electrode for PTC thermistor, manufacture thereof, and PTC thermistor
JP3440883B2 (ja) * 1999-06-10 2003-08-25 株式会社村田製作所 チップ型負特性サーミスタ
JP3555563B2 (ja) * 1999-08-27 2004-08-18 株式会社村田製作所 積層チップバリスタの製造方法および積層チップバリスタ
JP4292901B2 (ja) * 2002-08-20 2009-07-08 株式会社村田製作所 バリスタ
JP4483237B2 (ja) 2003-09-02 2010-06-16 株式会社村田製作所 積層セラミック電子部品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603347B (zh) * 2015-04-08 2017-10-21 Wafer resistance terminal electrode structure

Also Published As

Publication number Publication date
WO2008010642A1 (en) 2008-01-24
US20090108984A1 (en) 2009-04-30
KR100821274B1 (ko) 2008-04-10
KR20080008127A (ko) 2008-01-23
TW200807455A (en) 2008-02-01
US7791450B2 (en) 2010-09-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees