TWI350122B - Ceramic heater and manufacturing method thereof - Google Patents
Ceramic heater and manufacturing method thereofInfo
- Publication number
- TWI350122B TWI350122B TW095139238A TW95139238A TWI350122B TW I350122 B TWI350122 B TW I350122B TW 095139238 A TW095139238 A TW 095139238A TW 95139238 A TW95139238 A TW 95139238A TW I350122 B TWI350122 B TW I350122B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- ceramic heater
- heater
- ceramic
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005323967A JP2007134088A (ja) | 2005-11-08 | 2005-11-08 | セラミックスヒーターおよびセラミックスヒーターの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200735690A TW200735690A (en) | 2007-09-16 |
| TWI350122B true TWI350122B (en) | 2011-10-01 |
Family
ID=37547500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095139238A TWI350122B (en) | 2005-11-08 | 2006-10-24 | Ceramic heater and manufacturing method thereof |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7329842B2 (zh) |
| EP (1) | EP1784050B1 (zh) |
| JP (1) | JP2007134088A (zh) |
| KR (1) | KR101299496B1 (zh) |
| TW (1) | TWI350122B (zh) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101299495B1 (ko) * | 2005-12-08 | 2013-08-29 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 세라믹스 히터, 히터 급전 부품 및 세라믹스 히터의제조방법 |
| JP2009123577A (ja) * | 2007-11-16 | 2009-06-04 | Ulvac Japan Ltd | 基板加熱装置 |
| JP2009301796A (ja) * | 2008-06-11 | 2009-12-24 | Shin-Etsu Chemical Co Ltd | セラミックスヒーター及びその製造方法 |
| US20110259869A1 (en) * | 2008-11-14 | 2011-10-27 | Penny Hlavaty | Cooking apparatus with non-metal plates |
| JP5894401B2 (ja) * | 2011-09-12 | 2016-03-30 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | ポスト型セラミックスヒータおよびその製造方法 |
| JP5996519B2 (ja) * | 2013-03-13 | 2016-09-21 | 信越化学工業株式会社 | セラミックヒーター |
| JP5911179B2 (ja) * | 2013-08-21 | 2016-04-27 | 信越化学工業株式会社 | 立体形状のセラミックスヒーター |
| US10154542B2 (en) | 2015-10-19 | 2018-12-11 | Watlow Electric Manufacturing Company | Composite device with cylindrical anisotropic thermal conductivity |
| CN107059112B (zh) * | 2017-04-14 | 2023-12-08 | 南京晶能半导体科技有限公司 | 半导体级硅单晶炉底部加热器 |
| KR101989855B1 (ko) * | 2017-04-18 | 2019-06-17 | 주식회사 아모센스 | 궐련형 전자담배장치용 발열히터 |
| JP2019060819A (ja) * | 2017-09-28 | 2019-04-18 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板 |
| US11083050B2 (en) | 2017-11-21 | 2021-08-03 | Watlow Electric Manufacturing Company | Integrated heater and method of manufacture |
| US10681778B2 (en) * | 2017-11-21 | 2020-06-09 | Watlow Electric Manufacturing Company | Integrated heater and method of manufacture |
| TWI724951B (zh) * | 2018-05-22 | 2021-04-11 | 美商瓦特洛威電子製造公司 | 一體式加熱器及製造方法 |
| US12142498B2 (en) * | 2018-09-28 | 2024-11-12 | Kyocera Corporation | Ceramic structure and wafer system |
| US11856659B2 (en) * | 2018-10-30 | 2023-12-26 | Kyocera Corporation | Board-like structure and heater system |
| US12273965B2 (en) * | 2018-11-19 | 2025-04-08 | Niterra Co., Ltd. | Holding device and method of manufacturing holding device |
| CN113271692B (zh) * | 2021-04-29 | 2023-01-17 | 苏州极限深灰光电科技有限公司 | 陶瓷发热体、方法、红外加热管及设备 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5343022A (en) * | 1992-09-29 | 1994-08-30 | Advanced Ceramics Corporation | Pyrolytic boron nitride heating unit |
| JP2984164B2 (ja) * | 1993-03-26 | 1999-11-29 | 日本碍子株式会社 | 半導体製造用サセプター |
| JPH10189227A (ja) * | 1996-12-27 | 1998-07-21 | Shin Etsu Chem Co Ltd | 加熱ユニットおよびその接続方法 |
| JP3560456B2 (ja) * | 1997-12-11 | 2004-09-02 | 信越化学工業株式会社 | 複層セラミックスヒータ |
| JP3477062B2 (ja) * | 1997-12-26 | 2003-12-10 | 京セラ株式会社 | ウエハ加熱装置 |
| JP3914377B2 (ja) * | 2000-07-17 | 2007-05-16 | 信越化学工業株式会社 | 静電吸着機能を有するウエーハ加熱装置 |
| JP4521107B2 (ja) * | 2000-10-17 | 2010-08-11 | 株式会社ブリヂストン | ヒータ及び半導体製造装置 |
| JP2002313531A (ja) * | 2001-04-17 | 2002-10-25 | Toshiba Ceramics Co Ltd | 面状セラミックスヒーター及び製造方法 |
| JP2002313539A (ja) * | 2001-04-17 | 2002-10-25 | Toshiba Ceramics Co Ltd | 面状セラミックスヒーター及びその製造方法 |
| US20040074898A1 (en) * | 2002-10-21 | 2004-04-22 | Mariner John T. | Encapsulated graphite heater and process |
| JP2004220966A (ja) | 2003-01-16 | 2004-08-05 | Ngk Insulators Ltd | ヒーターおよびその製造方法 |
| JP4602662B2 (ja) * | 2003-12-01 | 2010-12-22 | 株式会社ブリヂストン | セラミックヒータユニット |
| JP2004253799A (ja) | 2004-02-16 | 2004-09-09 | Ibiden Co Ltd | 半導体製造・検査装置 |
-
2005
- 2005-11-08 JP JP2005323967A patent/JP2007134088A/ja active Pending
-
2006
- 2006-09-08 KR KR1020060086782A patent/KR101299496B1/ko not_active Expired - Fee Related
- 2006-10-24 TW TW095139238A patent/TWI350122B/zh not_active IP Right Cessation
- 2006-10-31 EP EP06255610.5A patent/EP1784050B1/en not_active Not-in-force
- 2006-11-01 US US11/590,812 patent/US7329842B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1784050B1 (en) | 2015-09-02 |
| EP1784050A3 (en) | 2008-09-24 |
| US20070102419A1 (en) | 2007-05-10 |
| KR101299496B1 (ko) | 2013-08-29 |
| EP1784050A2 (en) | 2007-05-09 |
| KR20070049543A (ko) | 2007-05-11 |
| TW200735690A (en) | 2007-09-16 |
| JP2007134088A (ja) | 2007-05-31 |
| US7329842B2 (en) | 2008-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |