TWI350001B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TWI350001B TWI350001B TW096122236A TW96122236A TWI350001B TW I350001 B TWI350001 B TW I350001B TW 096122236 A TW096122236 A TW 096122236A TW 96122236 A TW96122236 A TW 96122236A TW I350001 B TWI350001 B TW I350001B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006216950A JP2008042073A (en) | 2006-08-09 | 2006-08-09 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200814313A TW200814313A (en) | 2008-03-16 |
| TWI350001B true TWI350001B (en) | 2011-10-01 |
Family
ID=39085504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096122236A TWI350001B (en) | 2006-08-09 | 2007-06-21 | Semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2008042073A (en) |
| CN (1) | CN100585872C (en) |
| TW (1) | TWI350001B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5587622B2 (en) * | 2010-01-27 | 2014-09-10 | ルネサスエレクトロニクス株式会社 | Reverse conduction type IGBT |
| JP5526811B2 (en) | 2010-01-29 | 2014-06-18 | 富士電機株式会社 | Reverse conducting insulated gate bipolar transistor |
| JP2014103376A (en) | 2012-09-24 | 2014-06-05 | Toshiba Corp | Semiconductor device |
| US9461116B2 (en) | 2012-12-06 | 2016-10-04 | Institute of Microelectronics, Chinese Academy of Sciences | Method of formation of a TI-IGBT |
| CN103594467B (en) * | 2013-11-27 | 2016-06-22 | 杭州士兰集成电路有限公司 | Power semiconductor of integrated fly-wheel diode and forming method thereof |
| CN103872053B (en) * | 2013-12-17 | 2017-05-17 | 上海联星电子有限公司 | TI-IGBT device |
| CN115763554A (en) * | 2022-11-10 | 2023-03-07 | 安徽瑞迪微电子有限公司 | Micro-trench gate IGBT device and manufacturing method thereof |
| CN115985941B (en) * | 2023-03-21 | 2023-06-23 | 上海埃积半导体有限公司 | Longitudinal RC-IGBT structure and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62109365A (en) * | 1985-11-07 | 1987-05-20 | Fuji Electric Co Ltd | semiconductor equipment |
| JPH053205A (en) * | 1991-01-25 | 1993-01-08 | Fuji Electric Co Ltd | Insulated gate bipolar transistor |
| JPH11204789A (en) * | 1998-01-08 | 1999-07-30 | Sanken Electric Co Ltd | Insulating gate type transistor |
| JP4566470B2 (en) * | 2001-07-17 | 2010-10-20 | 三菱電機株式会社 | Insulated gate bipolar transistor |
-
2006
- 2006-08-09 JP JP2006216950A patent/JP2008042073A/en active Pending
-
2007
- 2007-06-21 TW TW096122236A patent/TWI350001B/en active
- 2007-07-19 CN CN200710130434A patent/CN100585872C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101123270A (en) | 2008-02-13 |
| JP2008042073A (en) | 2008-02-21 |
| CN100585872C (en) | 2010-01-27 |
| TW200814313A (en) | 2008-03-16 |
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