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TWI349964B - Exhaust equipment, substrate process equipment installed the exhaust equipment and method of exhausting - Google Patents

Exhaust equipment, substrate process equipment installed the exhaust equipment and method of exhausting

Info

Publication number
TWI349964B
TWI349964B TW097107727A TW97107727A TWI349964B TW I349964 B TWI349964 B TW I349964B TW 097107727 A TW097107727 A TW 097107727A TW 97107727 A TW97107727 A TW 97107727A TW I349964 B TWI349964 B TW I349964B
Authority
TW
Taiwan
Prior art keywords
equipment
exhaust
exhaust equipment
exhausting
substrate process
Prior art date
Application number
TW097107727A
Other languages
Chinese (zh)
Other versions
TW200845179A (en
Inventor
Jung Park
Original Assignee
Psk Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psk Inc filed Critical Psk Inc
Publication of TW200845179A publication Critical patent/TW200845179A/en
Application granted granted Critical
Publication of TWI349964B publication Critical patent/TWI349964B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H01J37/32844—Treating effluent gases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Separating Particles In Gases By Inertia (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Drying Of Semiconductors (AREA)
TW097107727A 2007-03-06 2008-03-05 Exhaust equipment, substrate process equipment installed the exhaust equipment and method of exhausting TWI349964B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070021833A KR100851236B1 (en) 2007-03-06 2007-03-06 Exhaust system, substrate processing apparatus including same, and exhaust method

Publications (2)

Publication Number Publication Date
TW200845179A TW200845179A (en) 2008-11-16
TWI349964B true TWI349964B (en) 2011-10-01

Family

ID=39833600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107727A TWI349964B (en) 2007-03-06 2008-03-05 Exhaust equipment, substrate process equipment installed the exhaust equipment and method of exhausting

Country Status (4)

Country Link
JP (1) JP2008212927A (en)
KR (1) KR100851236B1 (en)
CN (1) CN101261456A (en)
TW (1) TWI349964B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10605373B2 (en) 2015-09-11 2020-03-31 Cooler Master Co., Ltd. Pressure relief device and liquid cooling system

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100690625B1 (en) * 2004-08-27 2007-03-13 주식회사 젠트로 Building finishing materials and gas transportation ducts using the same
KR101048813B1 (en) * 2008-10-29 2011-07-12 세메스 주식회사 Substrate Processing Unit Collecting Chemical Liquid Fume
CN103094159B (en) * 2011-10-31 2016-02-24 细美事有限公司 Substrate processing apparatus and substrate processing method using same
JP5958398B2 (en) * 2013-03-25 2016-08-02 トヨタ自動車株式会社 Exhaust gas recirculation device for internal combustion engine
CN103966663A (en) * 2014-05-12 2014-08-06 上海先进半导体制造股份有限公司 Semiconductor device
CN104264212A (en) * 2014-10-13 2015-01-07 李静 Single crystal furnace pipeline
JP6371738B2 (en) * 2015-05-28 2018-08-08 株式会社東芝 Deposition equipment
CN109003913B (en) * 2017-06-06 2021-02-26 长鑫存储技术有限公司 Vacuum system and semiconductor device having the same
JP7025874B2 (en) * 2017-09-25 2022-02-25 株式会社Subaru EGR device
JP7109211B2 (en) * 2018-03-06 2022-07-29 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
JP7036642B2 (en) * 2018-03-23 2022-03-15 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing device and its exhaust method
CN112447556A (en) * 2019-09-03 2021-03-05 芝浦机械电子装置株式会社 Liquid mist recovery device and substrate processing device
CN111945221A (en) * 2020-08-03 2020-11-17 西安奕斯伟硅片技术有限公司 Flow guider and epitaxial wafer manufacturing equipment

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144720A (en) * 1980-04-14 1981-11-11 Hitachi Ltd Removing apparatus for dust flowing through pipe line
JPS60114570A (en) * 1983-11-25 1985-06-21 Canon Inc Evacuating system for plasma cvd device
JPH02170981A (en) * 1988-12-21 1990-07-02 Fujitsu Ltd Cvd device
JPH02142679U (en) * 1989-04-26 1990-12-04
US6194628B1 (en) * 1995-09-25 2001-02-27 Applied Materials, Inc. Method and apparatus for cleaning a vacuum line in a CVD system
JPH11329978A (en) * 1998-05-19 1999-11-30 Kokusai Electric Co Ltd Semiconductor manufacturing equipment
KR100447031B1 (en) * 2001-03-23 2004-09-07 삼성전자주식회사 Method of forming tungsten silicide film
KR20030081592A (en) * 2002-04-12 2003-10-22 삼성전자주식회사 Equipment for removing a by-product of exhast line in semiconductor product device
KR100762714B1 (en) * 2006-10-27 2007-10-02 피에스케이 주식회사 Apparatus for processing a substrate using plasma, a method for supplying plasma and a method for processing a substrate by supplying plasma
KR100796980B1 (en) * 2007-01-17 2008-01-22 피에스케이 주식회사 Substrate Processing Apparatus and Method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10605373B2 (en) 2015-09-11 2020-03-31 Cooler Master Co., Ltd. Pressure relief device and liquid cooling system

Also Published As

Publication number Publication date
KR100851236B1 (en) 2008-08-20
JP2008212927A (en) 2008-09-18
CN101261456A (en) 2008-09-10
TW200845179A (en) 2008-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees