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TWI349344B - Package-on-package structure and method for making the same - Google Patents

Package-on-package structure and method for making the same

Info

Publication number
TWI349344B
TWI349344B TW096120683A TW96120683A TWI349344B TW I349344 B TWI349344 B TW I349344B TW 096120683 A TW096120683 A TW 096120683A TW 96120683 A TW96120683 A TW 96120683A TW I349344 B TWI349344 B TW I349344B
Authority
TW
Taiwan
Prior art keywords
package
making
same
package structure
Prior art date
Application number
TW096120683A
Other languages
Chinese (zh)
Other versions
TW200849503A (en
Inventor
Wei Chung Wang
Meng Jen Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW096120683A priority Critical patent/TWI349344B/en
Publication of TW200849503A publication Critical patent/TW200849503A/en
Application granted granted Critical
Publication of TWI349344B publication Critical patent/TWI349344B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
TW096120683A 2007-06-08 2007-06-08 Package-on-package structure and method for making the same TWI349344B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096120683A TWI349344B (en) 2007-06-08 2007-06-08 Package-on-package structure and method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096120683A TWI349344B (en) 2007-06-08 2007-06-08 Package-on-package structure and method for making the same

Publications (2)

Publication Number Publication Date
TW200849503A TW200849503A (en) 2008-12-16
TWI349344B true TWI349344B (en) 2011-09-21

Family

ID=44824166

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096120683A TWI349344B (en) 2007-06-08 2007-06-08 Package-on-package structure and method for making the same

Country Status (1)

Country Link
TW (1) TWI349344B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455215B (en) * 2009-06-11 2014-10-01 日月光半導體製造股份有限公司 Semiconductor package and method of manufacturing same
TWI411075B (en) 2010-03-22 2013-10-01 日月光半導體製造股份有限公司 Semiconductor package and method of manufacturing same
US8941222B2 (en) 2010-11-11 2015-01-27 Advanced Semiconductor Engineering Inc. Wafer level semiconductor package and manufacturing methods thereof
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
TWI491014B (en) * 2012-08-31 2015-07-01 矽品精密工業股份有限公司 Method of forming semiconductor stack unit and semiconductor package
US20170040266A1 (en) 2015-05-05 2017-02-09 Mediatek Inc. Fan-out package structure including antenna

Also Published As

Publication number Publication date
TW200849503A (en) 2008-12-16

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