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TWI347348B - Anisotropic conductive adhesive and connecting method of electrodes using the same - Google Patents

Anisotropic conductive adhesive and connecting method of electrodes using the same

Info

Publication number
TWI347348B
TWI347348B TW095107393A TW95107393A TWI347348B TW I347348 B TWI347348 B TW I347348B TW 095107393 A TW095107393 A TW 095107393A TW 95107393 A TW95107393 A TW 95107393A TW I347348 B TWI347348 B TW I347348B
Authority
TW
Taiwan
Prior art keywords
electrodes
same
conductive adhesive
anisotropic conductive
connecting method
Prior art date
Application number
TW095107393A
Other languages
Chinese (zh)
Other versions
TW200632068A (en
Inventor
Misao Konishi
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of TW200632068A publication Critical patent/TW200632068A/en
Application granted granted Critical
Publication of TWI347348B publication Critical patent/TWI347348B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Adhesive Tapes (AREA)
TW095107393A 2005-03-04 2006-03-06 Anisotropic conductive adhesive and connecting method of electrodes using the same TWI347348B (en)

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KR (1) KR101298829B1 (en)
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KR100888404B1 (en) * 2007-06-22 2009-03-13 삼성전기주식회사 Conductive paste, printed circuit board using the same, and manufacturing method thereof
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WO2010004793A1 (en) * 2008-07-11 2010-01-14 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive film
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JP5614440B2 (en) * 2011-10-26 2014-10-29 日立化成株式会社 Circuit component and manufacturing method thereof
WO2013171918A1 (en) * 2012-05-15 2013-11-21 京セラ株式会社 Piezoelectric actuator, piezoelectric vibration device, and mobile terminal
JP5972844B2 (en) * 2012-09-18 2016-08-17 デクセリアルズ株式会社 Anisotropic conductive film, method for manufacturing anisotropic conductive film, method for manufacturing connected body, and connection method
JP6151412B2 (en) * 2012-09-18 2017-06-21 デクセリアルズ株式会社 Anisotropic conductive film, method for manufacturing anisotropic conductive film, method for manufacturing connected body, and connection method
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JP6289831B2 (en) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 Manufacturing method of conductive adhesive film, conductive adhesive film, and manufacturing method of connector
CN204130702U (en) * 2014-05-23 2015-01-28 西安中兴新软件有限责任公司 Connect parts and the wireless access terminal of AGPS module and mainboard
JP2016072239A (en) * 2014-09-30 2016-05-09 デクセリアルズ株式会社 Anisotropic conductive film, and connection method
DE102015112967A1 (en) * 2015-08-06 2017-02-09 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component and optoelectronic component
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KR102126679B1 (en) * 2016-08-18 2020-06-25 주식회사 엘지화학 Method for manufacturing conductor with network structure
KR101800367B1 (en) 2016-08-24 2017-11-28 한국기계연구원 Method of transferring a micro-device and Micro-device substrate manufactured by the same
CN108574158B (en) * 2017-03-14 2020-10-09 群创光电股份有限公司 Display device and method for manufacturing the same
DE102017210704A1 (en) * 2017-06-26 2018-12-27 Siemens Aktiengesellschaft Electrical assembly and method for its manufacture
TW201910126A (en) * 2017-08-16 2019-03-16 日商Ｄｉｃ股份有限公司 Follow and follow method
JP7085919B2 (en) * 2018-06-29 2022-06-17 リンテック株式会社 Mounting device and mounting method
JP7736427B2 (en) * 2020-08-26 2025-09-09 松本油脂製薬株式会社 Conductive paste composition and its use, and resin particles used in the conductive paste composition
JP7676839B2 (en) * 2021-03-15 2025-05-15 日産化学株式会社 Manufacturing method of laminate and manufacturing method of semiconductor substrate
JP2023079632A (en) * 2021-11-29 2023-06-08 デクセリアルズ株式会社 CONNECTED STRUCTURE AND CONNECTED STRUCTURE MANUFACTURING METHOD

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KR20070116808A (en) 2007-12-11
JPWO2006093315A1 (en) 2008-08-07
JP4891895B2 (en) 2012-03-07
CN101146885A (en) 2008-03-19
KR101298829B1 (en) 2013-08-23
CN102277096A (en) 2011-12-14
TW200632068A (en) 2006-09-16
HK1116511A1 (en) 2008-12-24
CN101146885B (en) 2012-09-05

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