TWI345593B - Flow-formed chamber component having a textured surface - Google Patents

Description

1345593 IX. Description of the Invention: Field of the Invention The present invention relates to a method of fabricating an element for a substrate processing chamber, and more particularly to a method of forming an element having a textured surface by flow formation. [Prior Art]

In processing substrates such as semiconductor wafers and displays, a substrate is placed in a processing chamber and exposed to an energized gas to deposit or etch material on the substrate. During this process, processing residues are created and may deposit on the inner surface of the processing chamber. For example, in a sputter deposition process, a material deposited by a target to be deposited on a substrate is also deposited on the surface of other components in the processing chamber, such as a deposition ring, a shadow ring, or a chamber wall. Lining and focusing ring. In the subsequent processing cycle, the deposited processing residue may "strip j from the surface of the processing chamber and drop and contaminate the substrate. In order to reduce the contamination of the substrate by the processing residue, the surface of the component in the processing chamber may be textured. The residue adsorbs to the textured surface and inhibits the processing residue from peeling off and avoids contaminating the substrate in the processing chamber. Traditionally, an element having a textured surface is fabricated in a multi-step process. In the first process step, the component is fabricated. An external or integral structure, for example, a piece of metal can be cut into a desired structure by computer numerical control (CNC). Thereafter, a second process is used to form a textured surface on the machined component. For example, The surface texture processing may include grinding, bead blasting or polishing, or a combination of the above. In one case, a 5 1345 593 textured surface may be formed by directing an electromagnetic energy beam onto one of the surfaces of an element. Forming depressions and protrusions for treating the deposits to be well adsorbed. One embodiment of this surface is a Lavacoat plus surface, which can In such PoPi〇lkowski, who owned US Patent Publication case 2003-0173526, No. (3 years 2 billion square September 18 announcement, March 13, 2002 application): and

U.S. Patent No. 6,812,471 to Popiolkowski et al., the entire disclosure of which is incorporated herein by reference. The surface of the φ LaVaC〇atTM contains at least depressions and protrusions which allow the treatment residue to be adsorbed there to reduce contamination of the substrate during substrate processing. However, conventional processes for making textured elements are often expensive because multiple process steps are required to form the element and its textured surface. Manufacturing costs hinder a large number of implementations of procedural components, even though the components provide a number of processing advantages. The cost of traditional manufacturing processes is at least in part due to the complex multi-step process procedures used in these processes, as well as expensive manufacturing equipment. For example, component manufacturing machinery, such as the generation of electromagnetic energy beams 2 instruments, are very expensive and can significantly increase the manufacturing cost of the texture element. • When the cleaning process for refurbishing surface texture elements erodes the component after several cleaning cycles At the time, the manufacturing time and cost of components become a further problem. Once the residue has accumulated on the textural element, a cleaning process is usually performed to remove the residue and the element is refurbished for reuse, for example, 'repeated with a solution containing at least HN〇3 or HF. The texture _ piece will eventually corrode the textured surface of the component, and it is often necessary to replace the etched component with a new one. Therefore, the cost of manufacturing new textured surface components can disadvantageously increase the associated cost of operating the processing chamber. 6 1345593

Therefore, there is a need to provide a method of fabricating a textured chamber component that is less expensive and efficient than conventional manufacturing processes. There is a further need for an element having a textured surface that is well adhered to the processing residue. [Embodiment] A substrate processing chamber contains at least a plurality of elements that can be used in a substrate in an energized gas. One or more of the elements include a surface such that the processing deposits produced during substrate processing 117 can be applied to the surface of the element to reduce contamination of the treated substrate by the treated deposit to the textured surface of the processing chamber element. The treatment deposit may comprise deposits comprising, for example, deposits comprising at least one of the following: niobium, niobium, titanium, magnesia, copper, cranes, and gasification cranes. The textured surface 20 of the selected processing chamber component 22 and the component itself are formed by a flow forming device suitable for use in textured surface elements, for example, the apparatus and apparatus shown in Figures 1 and 1 The flow forming device applies a pressure to a preform 24 to plastically deform the material of the body and flow through a mandrel 26 to provide the overall appearance of element 22. The mandrel 26 can be adjusted as needed to form a predetermined texture pattern on the surface 20 of the preform 24 that is in contact with the core 4. In other words, the mandrel 26 may include a textured surface 28 . Under application, plastic deformation of the component material can mold the surface of the preform 24 to conform to the texture of the mandrel surface 28, thereby allowing at least a portion of the cardioid pattern to be transferred to the final processing chamber component 2 2 . By providing a special design to create the desired surface texture pattern 3 4 ''''''''''' Metal group, outside and process. Preform Required b 26 Example Pressure 20, Axis Forming Process 7 1345593

Effectively and repeatedly forming an element 22 that not only has the desired overall shape but also the desired surface texture pattern 34. The preform 24 has a pre-selected ruler and shape that can be used with the desired final element 22. Preforms suitable for use in a flow forming process may be, for example, a conical, cylindrical, tubular, and other shape that may be molded and conformed to the mandrel 26. Traditionally, the preform has a nominal axis that is aligned with the axis of symmetry of the mandrel 26. The preform 24 is made thick enough so that the wall of the member 22 can achieve a desired final thickness after being shaped by the flow forming process. Example Λ The thickness of the preform wall 36 is greater than the thickness of the component wall by a calculated amount, in other words, at least 5%, to achieve the desired final thickness of the wall of the final component 22, the preform is relatively high. Made of ductile metal, plastically deformed under pressure, and does not substantially cause cracks in the metal. Suitable gold eyebrows can comprise at least one of the following: ·, stainless steel, titanium, and related alloys. The method of forming the preform 24 can be by compression molding, press forming, CNC cutting, press forming, and other metal forming methods known to those skilled in the art. In the flow forming process, the pre-variant 24 includes at least an inner surface S which can be attached to at least a portion of the textured surface 28 of the mandrel 26 and which can be on the surface 28 of the mandrel 26. The mandrel 26 is an element of a flow forming device, and the flow forming device 52 includes at least other portions suitable for the formation of the element 22. The first end 40 of the preform 24 may be a semi-closed end that may be held by a bearing 56 and/or a tailstock 42. 'The 56 and/or the tailstock 42 can apply a hydraulic pressure to pre-form The body 2 is formed into a shape, and its shape is opposite to the wall 36. It can be either split copper or deepened. I 20 > Place 52 or close the bearing at 8 1345593. The mandrel 26 will typically rotate about its longitudinal axis 44, for example, by rotating a mandrel 26 and a preform 24 by a motor (not shown). A pressurizing means 46, such as a pressure roller 48, can be applied to an outer surface 50 of the preform 24 to plastically deform the preform material and flow axially along the surface 28 of the mandrel 26.

In the particular embodiment shown, the pressure roller 48 is moved toward the first end 40 of the preform 24 to move the preform material toward the mandrel 26 in a direction away from the first end 40 of the preform 24. The preform material is compressed and shaped under pressure applied above its yield strength to flow the material along the axial direction of the surface 28 of the mandrel 26. Thus, the pressure roller 4 8 reduces the thickness of the wall 36 of the preform 24 and extends the length of the wall 36 of the preform 24 by flowing the preform material along the mandrel 26. The pressure applied to the outer surface 50 is sufficiently high to plastically deform and flow the preform material without substantially causing cracking or cracking of the material. The applied pressure will vary with the material properties being formed. The mandrel and the roller are arranged at a defined distance, which may be a constant distance or a variable distance to establish a relationship between the inner and outer surfaces of the finished portion. In one aspect, the pressure roller 48 can include at least a circular roller that is adapted to be rotated in a direction parallel or anti-parallel to the direction of rotation of the mandrel 26 by a motor (not shown). And thus a radial force can be applied to the outer surface 50 of the preform 24. The pressure roller 48 can also include at least a forward beveled edge 54 that exerts an axial force on the outer surface 50 of the preform 24 to urge the preform material through the surface 28 of the mandrel 26 in the axial direction. In one aspect, a plurality of pressure rollers 48 are spaced apart on the periphery of the preform 24, and the pressure rollers 48 9 1345593 are also axially and radially spaced apart so as to be on the outer surface of the preform. Apply pressure on a number of different areas.

The mandrel 26 for the flow forming process can be adjusted as desired to provide the overall profile and surface texture pattern 34 required for the final flow forming element 22. For example, the mandrel 26 can include at least an axial length suitable for the desired length of the component wall 36. The mandrel 26 may also include a textured surface 28, as desired, which is suitable for forming the surface texture pattern 34 required for the inner surface 20 of an element 22. For example, the mandrel 26 can include at least one textured surface 28 having a mandrel surface pattern 58 that is an inverted or mirror image of the desired surface texture pattern 34 of the process chamber component 22. The surface texture pattern 34 formed on the surface 20 of the element 2 2 is the result of applying pressure during the flow forming process that presses the preform material against the mandrel surface 28 such that the element 2 2 The inner surface substantially presents the contour of the mandrel surface 28. For example, for the mandrel surface 28 comprising the relief protrusion 60a and the recess 60b, the preform material can be pressed and flow into the recess 60b in the mandrel surface 28 to form on the surface of the element 22. The corresponding inverted image feature 30 including the protrusion 3 Ob is included as shown in FIG. The preform material may also flow along the protrusions 60 a on the mandrel surface 28 to form a corresponding inversion feature 30 comprising the recess 30 in the element surface 20. The features 60 provided on the mandrel surface 28 can be selected according to the desired surface texture pattern 34, and can include, for example, protrusions 60a and recesses 60b' that include at least one of: ridges, holes, Ridges, grooves, and other features that component surface 20 may require. In one aspect, the mandrel 26 even includes the protrusion 60a and the recess 10 1345593 in the region of the mandrel surface 28, the size and spacing of the recess 60b being different from the size of the mandrel surface 28 in different regions and distributed. Flowing the forming element 22 on the mandrel 26 allows the surface 20 of the element 22 having a predetermined size and overall shape to be formed, and a desired surface texture pattern 34 can be simultaneously formed on the surface of the element 22, thus providing an effective and Improved process chamber component 22 manufacturing.

In one aspect, an element 2 2 is formed by flowing over a mandrel 26 having staggered projections 62a and recesses 62b to provide an improved surface texture pattern 34, such as that shown in FIG. Show. The staggered protrusions 62a and recesses 62b form an inverted image surface pattern 34 in the surface 20 of the element 22, the inverted image surface pattern 34 comprising corresponding protrusions 64a and recesses 64b to allow the substrate 104 to be The processing residue generated during processing is adsorbed to the surface 20 of the texturing element 22 to reduce contamination of the substrate 104 caused by the residue. The protrusion 62a in the mandrel surface 28 can comprise, for example, a ridge or ridge having a height of at least about 0.005 to 0.050 inches as measured by an average surface height A of the mandrel surface 28. The width of the projection 62a at its one-half height may be between about 0.07 and 0.070 inches. The depth of the recess 62b of the mandrel surface 28 comprises less than about 0.005 to 0.050 inches below the average surface height 吋, and the width of the recess 62b at its one-half depth is between about 0.002 and 0.130 inches. The size of the projection 64b and the recess 64a formed in the surface 20 of the flow forming member 22 substantially corresponds to the size of the mandrel projection 62a and the recess 62b. In one aspect, the textured surface 28 includes at least a surface cross-section that is substantially lacking an acute angle and a sharp edge, such as shown in Figure 3. The sine curve π 1345593

The cross section includes at least a cross-sectional profile similar to a sine wave and has a wavelength and amplitude of a sinusoidal cross-section selected according to the desired component characteristics. The sinusoidal cross-section provides a smoothly varying surface and has staggered projections 62a and recesses 62b to enhance the adsorption process residue and to reduce cracking or fracture of the deposit residue that may occur due to sharp or sudden surface transitions. In a suitable sinusoidal surface cross-section, the peak-to-crest distance between adjacent protrusions 62a is between about 0·0 15 and 0.18 inches, and the amplitude is between about 0.005 and 0.050 inches. In one aspect, the mandrel surface 28 includes at least a first sinusoidal cross-section and a second sinusoidal cross-section, the first sinusoidal cross-section surrounding the at least one portion of the mandrel. The shaft 44, as shown in Fig. 3, extends longitudinally along the axis 44 of the mandrel 26, as shown in Fig. 1. In the ideal case, the textured surface 28 is substantially lacking the acute angle 66 and the sharp edges, and instead it substantially comprises the fillet 66 and the rounded edges.

The mandrel 26 can also be specially designed to form a complex and substantially non-linear surface texture pattern 34 to provide improved results in the processing of the substrate 104. This complex surface pattern makes it difficult to remove the flow forming element 2 2 from the mandrel 26 after the flow forming process. For example, for a surface pattern 34 that does not allow element 22 to be slid or twisted by mandrel 26, removal of element 22 from mandrel 26 is very challenging. This surface pattern 34, which itself is not easily twisted or slid by the mandrel 26, includes the surface pattern 34 of the staggered protrusions 64b and recesses 64a because the mandrel and element projections 62a, 64b can be locked to the mandrel and the element recess 62b. , 64a. In general, surface pattern 34 does not include a line extending to at least one end 40 of element 22 12 1345593

If the sex or spiral depression is 30 a, it can be challenged when it is removed from the mandrel 26. In one aspect, the at least partially foldable mandrel 26 is adapted to produce such a complex surface pattern such that the element 2 2 can be easily removed from the mandrel 26 in the flow forming process. For example, the mandrel 26 can include a hollow inner section 70 into which a portion of 26 can be folded after the flow forming process to provide a mandrel circumference and improve The simplicity of the element 2 2 is removed by the mandrel 26. In other words, the mandrel 26 can be hinged or otherwise constructed such that the heart folds over itself. In yet another aspect, the table of mandrels 26! The upper projection 60a, such as the sinusoidal transverse projection 62a, can be retracted into the hollow inner section of the mandrel after formation so that the shaft surface 28 "releases" the element 2 2 . Thus, the modified mandrel 26 forms a complex surface pattern 34 on the element 22 that is substantially lacking in linear or spiral depressions extending along the inner surface 20 of the inner member 22, and is not limited to a linear or spiral surface pattern. In another aspect, the flow forming element 22 can be removed from the mandrel 26 by heating the element by a suitable heat source. The element 2 2 expands such that its inner surface 20 is disengaged from the height of the projection 64b and the recess on the mandrel 26, and is unwrapped, and the heat required to remove the element from the mandrel 26 rises with the mandrel 26. The thermal expansion coefficients of the depth component materials of 64b and recess 64a are different. Figure 4 illustrates an embodiment of a component 2 2 fabricated by a flow forming process. Element 2 2 includes at least one mask 120, which for example applies to deposition chamber 106. The element 22 is formed by a preform 24, and the preform 24 faces, and then at least the mandrel is smaller. For example, the axis can be & 28 flow from the heart to the length of the body, and to the foot 64a 22 > and the actual one at least 13 1345593

The cylindrical side wall 362 is included to press the mast to the desired mask wall length and thickness during the flow forming process. The inner surface 20 having the mask 120 contains the desired surface texture pattern 34 (wherein the processing residue is adsorbed thereto to reduce staining of the treated substrate. Thus, the flow forming method can be provided in a single processing step The overall shape and surface texture of the element 22 is due to a more efficient and repeatable formation of the element 22. The 20 elements 22 of different aspects formed by the flow forming method are used in a substrate processing chamber 106, 5. An exemplary embodiment of a plate processing chamber in the drawing. The processing chamber 106 is part of a plurality of locations (not shown here) having a cluster of processing chambers interconnected by arm mechanisms. A mechanism can transport the substrate 104a between the processing chambers 106. In the embodiment, the processing chamber 1 〇6 includes at least a sputtering deposition chamber 'also a physical vapor deposition or PVD processing chamber capable of splashing material On the substrate 1 0 4 a, for example, one or more of the following materials: button, titanium, titanium nitride, copper, tungsten, and tungsten nitride, and aluminum, etc. The treatment less includes the outer cover wall 118 and can be encircled a processing area 109 and including a plurality of side walls 164, a lower wall 166 and a top wall 168. A support ring 130 is placed between the wall 164 and the top wall 168 to support 7 other processing chamber walls may include one or more masks 120 for external and sputtering The process chamber 106 includes at least one substrate support member 112 to deposit the substrate in the chamber 106. The substrate support member 4 can be electronically floated on the side wall 36 of the component 22 (not shown), In addition, the textured surface is provided to show that the basement platform is shown by a robotic arm. It is actually deposited as a condensed sputum, chamber 106 to the cover wall 11 8 at the side wall 168 ° • Cover wall 1 1 8 support splash floating or can be wrapped 14 1345593

Electrode 170, which can be biased by a power source such as an RF power supply. The substrate support member 114 can also support other wafers 1〇4 shUtter discs 1〇4b, and protect the upper surface 134 of the branch member 114 when the substrate 1〇4a is absent. In operation, a substrate carrying inlet in the side wall 1M of one of the processing chambers 106 (here > introduces the substrate 10a into the processing chamber 1〇6, and places the substrate i〇4a on the 'bovine 114. The conveying substrate can be raised or lowered by the supporting lifting and contracting device to raise or lower the supporting member 114, and the substrate is raised or lowered by the lifting/lowering finger assembly (not shown here). π, like a deposition ring 128, which covers the upper surface 134 of the support member 114 to inhibit corrosion of the support member 4. In the aspect, at least partially surrounds the substrate 104a to protect the support member HA. The portion covered by 〇4a. The cover ring 环绕 26 surrounds and covers the deposition ring 1 28 and reduces the deposition of particles on both the deposition ring 128 and the fly 141. 〃 via-gas delivery system 112 a process gas, such as a body 'introduction into the processing chamber 106, 'the gas delivery system ι 2 includes a rolling stock supply' which contains - or a plurality of gas sources 1 74, which may be individually fed to a conduit 176, the conduit 176 has a gas control valve 1 78, such as a mass flow controller, in which a gas at a rate. The conduit 176 can feed the gas to the official (not shown here), and the gas can be mixed therein to form a desired 172, for example, at time, placed in the branch, and The profit can be as low as 126 or at least one ring 128 is supported by the substrate portion of the support member.

Gas composition. The mixing manifold can feed gas to a gas distributor having one or more gas outlets 182 in the processing chamber 106. This may include an inert gas such as argon or helium that is capable of actively impacting and sputtering the target material from the target. The process gas may also contain at least a gas, such as one or more of the following: an oxygen-containing gas and a f-containing material capable of reacting with the sputtered material to form a layer on the substrate 10a. The used process gas can be discharged via a venting device 122 and discharged from the processing chamber 106, the exhaust device comprising _ or a plurality of exhaust gases that can receive the used process gas and vent the used gas The conduit 1 8 6 has a throttle valve 1 8 8 for controlling the pressure of the gas in the process. The exhaust conduit 186 can feed one or more exhaust gases 3 conventionally, setting the pressure of the sputtering gas in the processing chamber 106 to a gas pressure level. The sputtering processing chamber 106 further includes at least one sputtering target 124, the target facing one surface 105 of the substrate 10a and including at least a material to be sputtered on the silicon material, for example, at least one of the following groups: The gas can be separated from the processing chamber 106 by an annular insulating ring 133, and the target is connected to a power supply 192. The target can include at least one target backing plate having one of the target edges 125 in the exposure chamber 106. The sputter processing chamber 106 also has a cover 120 to protect one of the walls 118 of the processing chamber 106 from contact with the spatter. The mask 120 may include at least one wall-like cylindrical profile having lower mask portions 120a, 120b that protect the area below the processing chamber 106. In the embodiment shown in Fig. 4, the mask 120 has a reaction between the gas and the target, and the gas 1 is formed into a film by-product 埠 184 which is sent to a chamber 106 艮 190 ° below the material 124 to the substrate group. The electrical spacer 124 is processed to have a glazing material above and has an upper portion 120a of the assembly 16 1345593 to the support ring 〇3〇 and a lower portion l2〇b fitted to the cover ring i26. A trip shield 14 can also be provided which includes at least one clamp ring for uncoupling the upper and lower mask portions 1 20 a, b together. Alternative mask configurations, such as internal and external masks, can also be utilized. In one aspect, one or more of the power supply 192, the susceptor 124, and the mask 120 can act as a gas energyizer 116 that can energize the sputtering gas to splatter the material from the sputum 124. The power supply 1 92 can apply a bias to the target 1 24 relative to the mask 1 20 . The electric field generated by the applied voltage in the processing chamber 106 can energize the sputtering gas to form a plasma that can positively impact and strike the target 124 to sputter material from the target 124 and transfer to The substrate 1"". The support n4 having the electrode 170 and the supporting electrode power supply 172 may also be part of the gas energyizer 116, which may quantify and accelerate the ionized material splashed by the target 124. Towards the substrate 1〇4& In addition, a gas energization coil 135 can be provided that is powered by a power supply 192 and placed in the processing chamber 106 to provide enhanced energized gas characteristics, such as improved energyization. The gas density β may be supported by a coil support 137 connected to the mask 12 or another wall in the process chamber 106. The process chamber 1 〇6 may be controlled by a controller 丨94, the control The device includes at least one code having an instruction set for operating a plurality of components of the processing chambers 1 to 6 to process the substrate 104a in the processing chambers 1 to 6. For example, the controller 194 may include at least - Substrate a positioning instruction set operable to one or more of the substrate support 114 and the substrate transport device to position the substrate 1〇4a in the processing chamber 106; a gas flow control command set operable to control the flow control valve 178 Setting the sputtering gas to the processing chamber 1〇6; _ gas pressure control command set, which can operate the exhaust throttle valve 丨88 to maintain the pressure in the processing chamber 1, a gas energizer control instruction set, which can Operating gas month b quantizer 116 to set a degree of energy for energizing a gas; a temperature control command set that can be used to control the temperature in process chambers 1〇6; and a process monitoring instruction set that can be used to monitor process chamber 1 The process in 〇6.

The processing chamber component 22 of the textured surface 20 can include, for example, a messy transport system 112, a substrate flapper 114, a processing kit 139, a gas energyifier 116, a process enclosure wall ns and a mask 120, or a process Different process areas such as the gas exhaust unit 122 of the chamber 1〇6. For example, the processing chamber component 22 having the textured surface 20 can include a processing enclosure wall

118, a processing chamber mask 120, a dry material 124, a dry material edge 125, a processing kit 139 one of the components (such as at least one of a cover ring 126 and a deposition ring 1 2 8), The support ring 13 3 绝缘, the insulating ring 丨 3 2, a coil 1 3 5, a coil support member 137, a shutter piece 104b, a sandwich mask 141, and a portion of the substrate support member 11 4 . For example, a textured surface component may include Applied Materials' product numbers 0020-50007, 0020-50008, 0020-50010, 0020-50012, 0020-50013, 0020-48908, 0021- 23852, 0020-48998, 0020 -52149, 0020-51483, 0020-49977, 0020-52151, 0020-48999, 0020-48042 and 01 9 0- 1 4 8 1 8 from Applied Materials, Santa Clara, California. This list of components is merely exemplary, and other components or components from other types of processing chambers may also have textured surfaces; therefore, the invention should not be 18 1345593

Limited to the components listed or shown here. The invention is described herein with reference to certain preferred embodiments of the invention; however, other embodiments are possible. For example, flow formation can be used in other types of applications, for example, those skilled in the art can appreciate that it can be used as an element of an etch chamber. Other flows can also be used to form the configuration, and can also be presented in addition to the styles specifically described herein. Moreover, it will be readily apparent to those skilled in the art that the parameters of the examples can be used to apply the equivalent steps of the flow forming methods described herein. Therefore, the spirit and scope of the appended claims are not to be construed as the description of the preferred embodiments. BRIEF DESCRIPTION OF THE DRAWINGS The above features, aspects, and points of the present invention can be further understood by referring to the description of the embodiments of the invention. However, it will be understood that each of these features is generally available in the invention, and is not limited to the ones illustrated in the particular circle, and includes any combination of these features, wherein the drawings are as follows '· Figure 1A is a portion A side elevational cross-sectional view showing a specific embodiment of a device for performing a motion forming process; FIG. 1B is another view of the device of FIG. 1A in the same position during a flow forming process; Partial side cross-sectional view showing a textured inner surface formed by flow formation; Figure 3 is a partial front cross-sectional view showing a flow sleeve for flow forming the device Photocopying limit

Lifan and a preferred embodiment of a textured surface that is superior to the first-class process of the present invention, 19 1345593; Figure 4 is a partial side view showing a mask implementation formed by a flow forming process And FIG. 5 is a partial side cross-sectional view showing a specific embodiment of a processing chamber having one or more flow forming elements.

[Main component symbol description] 20 Inner surface 22 Element 24 Preform 26 Mandrel 28 Textured surface 30a Inverted feature 30b Protrusion 34 Style 36 Element wall 40 First end 42 Tailstock 44 Vertical axis 46 Pressurizing device 48 Pressure roller 50 Outer surface 52 device 56 bearing 5 8 surface pattern 60 embossing protrusion 60 recess 62 alternating protrusion 62 recess 64 recess 6 6 corner 64 corresponding protrusion 70 hollow inner section 104 substrate 105 surface 106 processing chamber 109 processing area 112 gas transport system 114 substrate support 116 gas energyifier 118 housing wall 20 1345593

120 Mask 122 Exhaust device 124 Sputter target 125 Target edge 126 Cover ring 128 Deposition ring 130 Support ring 132 Insulation ring 134 Upper surface 135 Gas energized coil 137 Coil support 139 Treatment kit 14 1 Sandwich mask 164 Sidewall 166 Lower wall 168 Top wall 170 Electrode 172 Power supply 174 Gas source 176 Conduit 178 Valve 180 Gas distributor 182 Gas out D 184 Exhaust 埠 186 Exhaust duct 188 Immediate valve 190 Exhaust pump 192 Power supply 194 Controller

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Claims (1)

1345593 X. Patent Application Range: 1. A method of manufacturing an element for a substrate processing chamber, the method comprising at least: (a) providing a preform having inner and outer surfaces; (b) providing a texture The mandrel of the surface, the textured feature of the textured surface contains at least a plurality of cyclically and staggered protrusions and depressions: (c) contacting the inner surface of the preform with the textured surface of the mandrel; and (d) applying a pressure to the preform sufficient to plastically deform the preform and cause the preform The inner surface flows over the textured surface of the mandrel to form a textured inner surface element comprising a textured feature pattern. 2. The method of claim 1, wherein the step (d) comprises forming a textured inner surface element and the inner surface of the texture lacks a linear or spiral extending along a length of the inner surface of the texture. Depression. 3. The method of claim 1, wherein the step (b) comprises providing a mandrel having a pattern of staggered protrusions and depressions, the protrusions and depressions having at least one of the following features: (i) The height of the protrusions is between about 0.005 and 0.050 inches; (ii) the width of the protrusions at the height of one-half is between 0.007 and 0.070 inches; 22 1345593 (iii) the depressions The depth is between about 0.005 and 0.050 inches; (iv) the width of the depressions at a depth of one-half is between about 〇·〇〇2 to 0·1 3 0 inches; and (ν) the protrusions and The pattern of depressions contains a sinusoidal cross section. 4. The method of claim 1, wherein the step (b) comprises providing a mandrel having at least one of the following characteristics: (i) a textured surface comprising a plurality of textured features that are substantially lacking acute and sharp edges; and (i i) that the mandrel is at least partially foldable. 5. The method of claim 1, wherein the step (a) comprises providing a preform having a rounded side wall and the cylindrical side wall comprising the inner and outer surfaces. 6. The method of claim 1, wherein in the step (d), the element is heated and the inner surface of the element is expanded beyond the height of the protrusion of the mandrel from the mandrel Remove the component. 7. The method of claim 1, wherein the step (d) comprises at least applying a pressure on the preform by pressing a rotating roller on an outer surface of the preform. The method of claim 1, wherein the preform comprises at least one of the following: aluminum, copper, stainless steel, titanium, and alloys of the foregoing. 9. An element for a substrate processing chamber formed by the method of claim 1, wherein the element comprises at least one of: a processing chamber wall, a processing chamber mask, a target Material, a target edge, a component of a processing kit, a cover ring, a deposition ring, a land, an insulating ring, a coil, a coil support, a shutter, a sandwich mask, And a substrate support. twenty four