TWI340229B - Heat dissipation fin, heat dissipation module and method for assembling the same - Google Patents
Heat dissipation fin, heat dissipation module and method for assembling the sameInfo
- Publication number
- TWI340229B TWI340229B TW097134173A TW97134173A TWI340229B TW I340229 B TWI340229 B TW I340229B TW 097134173 A TW097134173 A TW 097134173A TW 97134173 A TW97134173 A TW 97134173A TW I340229 B TWI340229 B TW I340229B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- assembling
- same
- fin
- module
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title 2
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49373—Tube joint and tube plate structure
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097134173A TWI340229B (en) | 2008-09-05 | 2008-09-05 | Heat dissipation fin, heat dissipation module and method for assembling the same |
| US12/554,284 US20100059207A1 (en) | 2008-09-05 | 2009-09-04 | Fin, thermal module, and method for assembling the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097134173A TWI340229B (en) | 2008-09-05 | 2008-09-05 | Heat dissipation fin, heat dissipation module and method for assembling the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201011246A TW201011246A (en) | 2010-03-16 |
| TWI340229B true TWI340229B (en) | 2011-04-11 |
Family
ID=41798202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097134173A TWI340229B (en) | 2008-09-05 | 2008-09-05 | Heat dissipation fin, heat dissipation module and method for assembling the same |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100059207A1 (en) |
| TW (1) | TWI340229B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110290450A1 (en) * | 2010-05-31 | 2011-12-01 | Asia Vital Components Co., Ltd. | Heat Dissipation Module |
| US20120043057A1 (en) * | 2010-08-19 | 2012-02-23 | Chun-Ming Wu | Heat-dissipating module |
| TWD148360S1 (en) * | 2011-12-30 | 2012-07-21 | 奇鋐科技股份有限公司 | Heat pipe |
| US20140131013A1 (en) * | 2012-11-15 | 2014-05-15 | Chin-Hsing Horng | Low-profile heat pipe |
| US10215499B2 (en) * | 2015-08-07 | 2019-02-26 | Asia Vital Components Co., Ltd. | Heat dissipation device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3851875B2 (en) * | 2003-01-27 | 2006-11-29 | 株式会社東芝 | Cooling device and electronic equipment |
| CN1960615A (en) * | 2005-11-03 | 2007-05-09 | 富准精密工业(深圳)有限公司 | Heating radiator |
-
2008
- 2008-09-05 TW TW097134173A patent/TWI340229B/en active
-
2009
- 2009-09-04 US US12/554,284 patent/US20100059207A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20100059207A1 (en) | 2010-03-11 |
| TW201011246A (en) | 2010-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2343332A4 (en) | Heat conducting sheet, manufacturing method thereof, and heat radiator that utilizes same | |
| EP2357366A4 (en) | Heat exchange module for vehicle and vehicle with same | |
| EP2377174A4 (en) | High temperature, high efficiency thermoelectric module | |
| EP2369269A4 (en) | Heat exchanger and method for manufacturing same | |
| EP2713136B8 (en) | Heat exchanger | |
| EP2140208B8 (en) | Heat exchanger | |
| EP2366206A4 (en) | Antenna heat fins | |
| TWI368722B (en) | Heat dissipation structure | |
| TWI318861B (en) | Heat dissipation module employing twin-fan | |
| EP2215420A4 (en) | Plane type heat exchanger | |
| EP2246655A4 (en) | Heat exchanger | |
| TWI340229B (en) | Heat dissipation fin, heat dissipation module and method for assembling the same | |
| EP2324316A4 (en) | Radiator module | |
| GB2425170B (en) | Heat exchangers | |
| GB2436669B (en) | Heat Exchanger Module | |
| TWI365520B (en) | Heat dissipation package for heat generation element | |
| TWI348885B (en) | Heat dissipation module | |
| EP2106520A4 (en) | Heat exchanger fin | |
| TWI367718B (en) | Heat dissipating device and heat dissipating method | |
| GB0809104D0 (en) | Heat exchangers | |
| TWI349347B (en) | Heat dissipating device, chip including the same, and heat dissipating method for chip | |
| TWI316173B (en) | Liquid-cooling heat sink | |
| TWI340317B (en) | Heat dissipation device | |
| TWI316386B (en) | Heat dissipation device | |
| TWM354318U (en) | Heat pipe structure and heat dissipation module thereof |