TWI238257B - Insert kit and electronic device handling apparatus - Google Patents
Insert kit and electronic device handling apparatus Download PDFInfo
- Publication number
- TWI238257B TWI238257B TW92118823A TW92118823A TWI238257B TW I238257 B TWI238257 B TW I238257B TW 92118823 A TW92118823 A TW 92118823A TW 92118823 A TW92118823 A TW 92118823A TW I238257 B TWI238257 B TW I238257B
- Authority
- TW
- Taiwan
- Prior art keywords
- plug
- kit
- hook
- aforementioned
- guide
- Prior art date
Links
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
12382571238257
五、發明說明(1) 發明所屬之技術領域 本發明是有關電子元件 測試電子元件之狀態下,可 電子元件測試裝置來進行測 子元件移搬(handling)裂 插接套件(insert)在收納被 以將前述被測試電子元件供給 試,以及利用此插接套件之電 置。 先前技術: 造過程中,必須以電子元件測試 子元件的性能和機能等。作為該 :由電子元件移搬裝置、電子元 裝置所構成之電子元件測試裝置V. Description of the invention (1) The technical field to which the invention belongs The present invention relates to the testing of electronic components under electronic components, and the electronic component testing device can perform subcomponent handling and split insertion kits in the storage space. In order to supply the tested electronic components to the test, and use the electrical installation of the plug-in kit. Prior technology: During the manufacturing process, the performance and function of sub-components must be tested with electronic components. As this: an electronic component test device composed of an electronic component transfer device and an electronic component device
於半導體裝置等之製 裝置來測試1C元件等之電 電子元件測試裝置之一例 件連接裝置以及測試用主 乃為人所知。 而 等各種 將完成 移搬機 作為電 測試I C 元件連 而 方式來 之測試 上。由 接觸, =電子元件移搬裝置之—例:在施加 力於被測試IC元件,在裝設於插槽的同 之1C兀件按照測試之結果來分類收納稱 (—『)之U:元件移搬裝置也為人所知破又稱為 子2件連接裝置之一例:透過插槽以及測試頭使被 兀件和測試用主步罟λ击f > 、使被 接裝置也為人所連接(電氣性的連接)之1c 使用移搬機之1C元件的測試,例如:如下 ί:::隻被測試Ic元件,被搬送至設置有Ic插槽 此,,皮固定器所壓住,而裝設於ic插槽 C插槽的連接端子和被測試Ic元件的 被測試1C元件’透過IC插槽以及測試頭和測One example of an electronic and electronic component testing device for testing 1C devices in a manufacturing device such as a semiconductor device is known as a component connection device and a tester. And wait for various tests that will complete the transfer machine as an electrical test IC component. By contact, = electronic component transfer device—Example: When a force is applied to the IC component under test, the same 1C component installed in the slot is classified according to the test result. U: Component The moving device is also known as an example of a two-piece connection device: through the slot and the test head, make the device and the main step for testing 罟 λ hit f > and make the device connected Connection (electrical connection) 1c Test using the 1C component of the transfer machine, for example: as follows :: Only the Ic component to be tested is transported to the Ic slot provided with this, the leather holder is pressed, The connection terminal installed in the IC slot C slot and the IC component under test 1C component under test through the IC slot and the test head and test
1238257 一1 .............. 五、發明說明(2) 一 ' -- J置以電氣接連。而且,從測試主裝置透過纜線所提供至 μ试頭之測試信號施加於被測試〖c元件的同時,也將從被 測試ic元件所讀出的應答信號,透過測試頭送回測試用主 裝置,由此可以測出被測試丨C元件之電氣特性。 關於使用移搬機之IC元件測試裝置,被測試1(:元件被 =納於托盤中被送往移搬機内,在完成測試後,各丨c元件 按照各自之測試結果被換裝至各種類別之牦盤。用來收納 測試前及測試後之I c元件的托盤(以下稱之為「客製托 盤」)’和在移搬機内被循環搬送之托盤(以下以「測試 托盤」稱之。)之種類相異的情況時,會在測試的前後在 客製托盤和測試托盤之間進行丨C元件之載換。 [ 於測試托盤2裝置複數個被稱為插接套件之電子元件 收納體,,而被測試1C元件,被收納於裝置在測試托盤之插 接套件後被搬送至測試頭,在被收納於插接套件之狀態下. 被往測試頭壓附。若使用裝置複數個插接套件之測試托 盤’則可使多數個ic元件同時進行測試。 而插接套件,對應於被測試I c元件之封裝種類等有種 種之構造的物件。例如:如第1 9圖所示,於收納了⑽a型 ic元件等之面陣列型(area array)電子元件的插接套件 16之插接套件本體17形成元件導引部17]^,將被測試ic元¥ 件2V 引(guide)至導芯(guide core) 18,1C 元件2 經 由元件導引部1 7 1 a之導引被收納於導芯1 8。於導芯1 8的下 端’形成開口部丨82使1C元件2的外部端子22可以在插槽之 連接端子的方向露出,藉由開口部182的周緣部1(:元件2的1238257 1 1 ............. V. Description of the invention (2) A '-J is connected electrically. In addition, the test signal provided to the μ test head from the test host device through the cable is applied to the test device c, and the response signal read from the test IC device is returned to the test host through the test head. Device, from which the electrical characteristics of the C component under test can be measured. Regarding the IC component testing device using the transfer machine, tested 1 (: The component is placed in a tray and sent to the transfer machine. After the test is completed, each 丨 c component is reloaded into various categories according to the respective test results. The tray is used to store the IC components before and after the test (hereinafter referred to as "customized trays") and the trays that are circulated in the transfer machine (hereinafter referred to as "test trays"). When the types are different, the C component will be transferred between the custom tray and the test tray before and after the test. [The test tray 2 is equipped with a plurality of electronic component storage bodies called plug-in kits. , And the 1C component to be tested is stored in the device and is transferred to the test head after being inserted into the test kit in the test tray, and is stored in the state of the plug kit. It is pressed to the test head. If the device is used with multiple plugs The test tray of the connector kit allows multiple IC components to be tested at the same time. The connector kit corresponds to various types of structured objects such as the type of package of the IC component to be tested. For example, as shown in Figure 19, She stole ⑽ A-type IC components and other area array electronic component plug-in kits 16. The plug-in kit body 17 of the plug-in kit body 17 forms a component guide 17] ^, which will guide the tested IC element 2V to the guide core. (Guide core) 18, 1C element 2 is stored in the guide core 18 through the guide of the component guide 1 7 1 a. An opening is formed at the lower end of the guide core 8 丨 82 to make the external terminal 22 of the 1C element 2 It can be exposed in the direction of the connection terminal of the socket, and the peripheral edge portion 1 of the opening portion 182 (:
1238257 五、發明說明(3) ::端子φ ( IC tl件2之封裝本體的外面之内側,外部端 子22之配置面)被支持著。 -丛又於插接套件16 ’設置為防止被收納於導芯1 8之1 c :件2的掉出或位置錯開而設置閃鎖(latch)機構(例 如·特開200 1 -3351 8號公報)。此㈣機構包括問鎖 ,於閂鎖175的-端形成閂鎖部n5b,於此和第一臂部 5二:l75e相接連,於第—臂部md設置施力點i75a。於 417 5d,形成用來當作迴轉_心之貫穿孔,在 此=入插銷使得問鎖i 7 5导皮支持成可在插接套件本體i 7上 = 此閂鎖機構,在拌隨著拉桿片1 9朝插接套件本體1 7 t-i近的同時當從施力點175a輸入外力時,閃鎖部丨了“,如 弟19 U)圖所示,移動至覆蓋於被收納於導芯^之^元 件2的上面以防止1C元件2之掉出或是位置錯開之位置(閉 位置)’在另一方面’當伴隨著從拉桿片19之插接套件本 體17離開輸入施力點1753之外力解除時,閂鎖部i75b,如 第19 (b)圖所示,將從被收納於導芯18之1(:元件2的上面 閃開移動至可讓1(:元件2出入之位置(開位置)。 發明内容:1238257 V. Description of the invention (3) :: The terminal φ (the inside of the outer surface of the package body of the IC tl member 2 and the arrangement surface of the external terminal 22) is supported. -The plexi is set in the plug-in kit 16 'to prevent it from being accommodated in the guide core 1-8 1c: A latch mechanism is provided (for example, JP 200 1 -3351 No. 8 No. 2 in case of falling out or misalignment of the pieces 2) Bulletin). This mechanism includes an interlock, a latch portion n5b is formed at the -end of the latch 175, and is connected to the first arm portion 52: l75e, and a force application point i75a is set at the first arm portion md. At 417 5d, a through hole is formed to serve as the center of rotation. Here, the insertion pin makes the lock i 7 5 guide leather supportable on the plug kit body i 7 = this latch mechanism. When the lever piece 19 is approaching the plug-in kit body 1 7 ti and the external force is input from the force application point 175a, the flash lock portion is moved to cover the housing which is stored in the guide core as shown in the figure. ^ Of ^ the top of element 2 to prevent the 1C element 2 from falling out or staggered position (closed position) 'on the other hand' when leaving the input force point 1753 with the plug kit body 17 from the lever piece 19 When the external force is released, the latch portion i75b, as shown in FIG. 19 (b), will be moved away from the top of the guide core 18 (1 :: element 2 to a position where 1 (: element 2 can be accessed). (On position) Summary of the invention:
朴於插接套件1 6中,如第1 g圖所示,插接套件本體1 7和 導芯18形成為-體,無法進行導芯18之交換。插接套件16 可,納=1件之尺寸,是按照導芯18之構造而決定,若無 法交換,,18,則插接套件16可收納IC元件的尺寸就被限 制住,每當I c元件尺寸相異時就必須製作插接套件丨6。但As shown in FIG. 1 g, in the plug kit 16, the plug kit body 17 and the guide core 18 are formed as a single body, and the guide core 18 cannot be exchanged. The plug-in kit 16 is OK, and the size of 1 = 1 is determined according to the structure of the guide core 18. If it cannot be exchanged, 18, the size of the plug-in kit 16 that can accommodate IC components is limited. Whenever I c When the component sizes are different, a plug kit 6 must be made. but
12382571238257
五、發明說明(4) 疋插接套件1 6中除導芯1 8以外的構造,則和I c元件 寸無關可以使用幾乎是相同的東西,所以每當1(:元 尺 不同時就得製作插接套件是非常沒效率的。 尺寸 又,於插接套件1 6可以收納多種尺寸之[c元 下,可對應多尺寸1C元件之閂鎖機構,也就是,尊二f 部n5b的開閉量(開位置和閉位置之間的移動量)而=鎖 。,閂鎖部17“之開閉量,若能將閂鎖175的又迴轉之 角度變大則開閉量就會加大 '但是,如第 、轉 上,所以靠近插接套件本體17之拉桿片19,不僅作用7於5d 力=175a,也干涉到臂部175d、me,臂部md ^ 迴轉也因此被拉桿片19所限制住。若限制了臂$,e、 i75e的迴轉時,也同時限制了閃鎖部1?5b i 鎖部175b的迴轉角度無法變大。 将仏成^ 因此,本發明之第一目的,為提一— 離地裝設於插接套件本體。 /、 ¥心,以可以脫 又’本發明之第二目的,為提供一插接套 讓導芯脫離地裝置在此。 I體 了 又’本發明之第三目的,為提供一插接套 將導芯以可脫離地安裝在此,包括問鎖機構 之開閉量較大’可對應多樣之1(:元件。 又,本發明之第四目的,糸担 述插接套件本體之插接套:括上述導芯及上 置,包括該插接套件。 、供亚且提供-電子移搬裝V. Description of the invention (4) 的 The structure of the plug-in kit 16 other than the guide core 18 can be used with almost the same thing regardless of the size of the I c element, so whenever 1 (: It is very inefficient to make a plug-in kit. The size and the plug-in kit 16 can accommodate a variety of sizes [c element, which can correspond to the latch mechanism of multi-size 1C components, that is, the opening and closing of the second part f5 n5b (The amount of movement between the open position and the closed position) = lock. The amount of opening and closing of the latch portion 17 ", if the angle of rotation of the latch 175 can be increased, the amount of opening and closing will increase 'but, As above, turn up, so the lever piece 19 near the plug kit body 17 not only acts 7d at 5d, the force = 175a, but also interferes with the arms 175d, me, and the rotation of the arm md ^ is also restricted by the lever piece 19 If the rotation of the arms $, e, and i75e is restricted, the rotation angle of the flash lock portion 1-5b i lock portion 175b cannot be increased at the same time. Therefore, the first object of the present invention is to improve 1 — Installed on the body of the plug-in kit off the ground. /, ¥ heart, so that the second object of the present invention can be released A plug-in sleeve is provided to disengage the guide core here. The third object of the present invention is to provide a plug-in sleeve to detachably install the guide core here, including the opening and closing amount of the interlocking mechanism. Larger can correspond to a variety of 1 (: components. In addition, the fourth object of the present invention is to describe the plug socket of the plug kit body: including the above-mentioned guide core and the upper part, including the plug kit. And provide-electronic relocation
12382571238257
五、發明說明(5) 本體 徵0 為達成上述之目的,本發明所提供 、插接套件以及電子元件移搬裝置 之導芯、插接套件 ’包括以下之特 (1 )本發明相關之導芯(gui de cor 狀 之方式裝設於插接套件本體;其 衣 可使面陳列刑r 、 % Λ巴栝·支持部, 連接端ί a array電子元件的外部端子露出於 可支持前述面陣列型電子元件的外部端子 以可離脫:可以和前述插接· t發明中’所謂「插接套件」,意味著可以在收納 被測试電子凡件的狀態下,將該被測試電子元件供給電子 凡件測試裝置以進行測試之電子元件收納體;而「插接套 件本體」貝Ij是’可以在裝置了導芯的同日寺,將被測試電子 元件導引(guide )至所裝置之導芯,是插接套件之構成 構件’而「導芯」則是,可支持該被測試電子元件,將該 被測試電子元件供給至由電子元件測試裝置所進行之測 試’是插接套件之構成構件。又,關於「插接套件」、 插接套件本體」以及「導芯」之上述定義,並非用來限 定插接套件、插接套件本體以及導芯所包括之機能。 本發明相關之導芯被裝設於插接套件本體,在被裝設 於插接套件本體之導芯,透過插接套件本體被測試電子元 件可被導引(gU i de )。而且,被測試電子元件,透過導 芯之支持部的支持,使該外部端子露出於插槽之連接端子V. Description of the invention (5) Ontology feature 0 In order to achieve the above-mentioned object, the guide core and plug-in kit of the plug-in kit and the electronic component transfer device provided by the present invention include the following special features (1) The core (gui de cor-like way) is installed on the body of the plug-in kit; its clothing can expose the surface r, the support section, and the connection terminal. The external terminals of an array electronic component are exposed to support the aforementioned surface array. -Type electronic components' external terminals are detachable: they can be connected to the aforementioned plug-in. The so-called "plug-in kit" in the invention means that the electronic component under test can be supplied while the electronic component under test is stored. Electronic component testing device for testing electronic component storage body; and "plug kit body" Bei Ij is' can be installed in the same temple with the guide core, guide the test electronic component (guide) to the device's guide The core is a component of the plug-in kit, and the "lead core" is to support the electronic component under test, and supply the electronic component under test to the test performed by the electronic component test device. The components of the kit. The above definitions of “plug kit”, plug kit body ”and“ guide core ”are not intended to limit the functions included in the plug kit, plug kit body, and guide core. The relevant guide core is installed in the plug-in kit body, and in the guide core installed in the plug-in kit body, the tested electronic component can be guided through the plug-in kit body (gU i de). Moreover, the tested electronic The component, through the support of the guide core, exposes the external terminal to the connection terminal of the slot
1238257 五、發明說明(6) ί:被ίϊ電ΐ = 件在被導芯所支持的狀態下, 連,= 件卜部端子和插槽的連接端子相接 進行遠被測試電子元件的測試。 J發明相關之導芯的對象之電子元件,為面陣列型電 =:。在此,所指的「面陣列型電子元件」,意味著電 ί雷Ϊ之封裝本體的外面之外部端子(例如陣列狀)排列 兴出·二件’ 5亥種類並非特別被限定,代表之具體例可列 :pr (baU δΓΐά —y) .LGA (land grid array (pm grid array) . CSP (chip size package # & m C 70件。又,面陣列型電子元件之外部端子的形狀 、別限定之形狀,例如可以列舉出:球(ba i丨)、平 「; ^ nd )、銷(P 土 n )等形狀之外部端子。又,所謂 面2列型電子元件的外部端子面」,意味著面陣列型電 70的封裝本體的外面之中,外部端子所排列之面。 Α ΛΑ本發明相關之導芯支持部的構造,使面陣列型電子元 I =外部端子能向插槽之連接端子方向露出,尸、要能支持 ^列里電子元件的外部端子面即可沒有特別加以限定。 ^ k樣構造之具體例··包括開口部使面陣列型電子元件的 夕卜部端子向插槽的連接端子方向露出,透過開口部的周緣 來支持面陣列型電子元件之外部端子面的構造。 本發明相關之導芯包括掛鈎承受部之構造,使導芯可 在插接套件本體上可脫離地被裝置,只要能和插接套件本 上之掛鈎部可脫離地卡合,並非特別限定之構造。又, 掛鈎承叉部之位置及個數,只要能掛鈎部和掛鈎承受部之1238257 V. Description of the invention (6) ί: ϊ ϊ ΐ = The pieces are connected in the state supported by the guide core, = the pieces are connected to the terminals of the socket and the test of the electronic component under test is performed. The electronic component of the object related to the invention of the guide core of the invention J is a surface array type = :. Here, the "area array type electronic component" means that the external terminals (such as an array) on the outside of the package body of the electric lamp are arranged and formed. Two types are not particularly limited, and represent Specific examples can be listed: pr (baU δΓΐά —y). LGA (land grid array (pm grid array). CSP (chip size package # & m C 70 pieces. Also, the shape of the external terminals of the area array type electronic components, Shapes that are not limited include, for example, external terminals in the shape of a ball (ba i 丨), flat "; ^ nd), pins (P soil n), and the so-called external terminal surface of a 2-row type electronic component" , Means the surface on which the external terminals are arranged on the outside of the package body of the surface array type 70. Α ΛΑ The structure of the guide core support part of the present invention enables the area array type electronic element I = the external terminal can be directed to the slot. The direction of the connection terminal is exposed, and there is no particular limitation on the external terminal surface that can support the electronic components in the ^ column. ^ Specific examples of the k-like structure... Connection terminal side of the slot Exposed, supporting the structure of the external terminal surface of the surface array type electronic component through the periphery of the opening portion. The guide core related to the present invention includes a structure of a hook receiving portion, so that the guide core can be detachably mounted on the plug kit body, As long as it can be detachably engaged with the hook portion of the plug kit, the structure is not particularly limited. In addition, the position and number of the hook support fork portion are only required if the hook portion and the hook receiving portion can be engaged.
1238257 五、發明說明(7) 卡合使導芯裝設於插接套件本體的話,並無特別之限定。 例如:透過在支持部之周圍的對向位置各自設置一個以上 之掛钩承受部,可將本發明相關之導芯以安定的狀態裝設 於插接套件本體。 〜 本發明相關之導芯,透過插接套件本體之掛鈎部和導 芯之掛鈎承受部之卡合而裝設於插接套件本體,同時透過 插接套件本體之掛鈎部和導芯之掛鈎承受部之卡合的解除 而從插接套件本體脫離。因此,若利用本發明相關之導 芯’可製作一插接套件可以交換導迖。而且,於利用本發 明相關之導芯的插接套件,僅交換導芯,即可收納多樣尺 寸之電子元件。 * (2 )如(1 )所記載之導芯的較佳形態,其特徵在 於·别述導芯包括可讓前述掛鈎部進入之掛鈎進入孔,前 述掛钩承受部可以和進入前述掛鈎進入孔之前述掛鈎部卡 合。 本形態相關之導怒包括掛鈎進入孔,只要能讓插接套 件本體之掛鈎部能進入,並不特別限定該形狀、構造、大 =、位置等,可依照插接套件本體之掛鈎部的形狀、構 造、大小、位置等適宜地加以決定。掛鈎進入孔,例如: 可在被設置在支持部周圍之突緣的對向之位置各自設置一 個以上。 β 本形態相關之導芯中’掛鈎承受部所設置之位置,σ 要掛鈎承受部能和進入掛鈎進入孔之掛鈎產生卡合的話了1238257 5. Description of the invention (7) There is no particular limitation on the engagement of the guide core on the body of the plug-in kit. For example, by providing one or more hook receiving portions at opposite positions around the support portion, the guide core related to the present invention can be installed on the plug kit body in a stable state. ~ The guide core related to the present invention is installed on the plug kit body through the engagement of the hook portion of the plug kit body and the hook receiving portion of the guide core, and is supported by the hook portion of the plug kit body and the hook of the guide core. The engagement of the part is released and detached from the plug kit body. Therefore, if a guide core 'related to the present invention can be used to make a plug-in kit, the guide can be exchanged. Furthermore, in the plug-in kit using the guide core related to the present invention, it is possible to store electronic components of various sizes by simply replacing the guide core. * (2) The preferred form of the guide core as described in (1) is characterized in that the other guide core includes a hook entry hole through which the aforementioned hook portion can be entered, and the aforementioned hook receiving portion can and enter the aforementioned hook entry hole. The aforementioned hook portion is engaged. The anger related to this form includes a hook entry hole, as long as the hook part of the plug kit body can be accessed, the shape, structure, size, position, etc. are not particularly limited, and the shape of the hook part of the plug kit body can be followed , Structure, size, location, etc. are appropriately determined. For example, one or more hook access holes may be provided at opposite positions of the flanges provided around the support portion. β The position of the 'hook receiving part' in the guide core related to this form. σ It is necessary that the hook receiving part can engage with the hook entering the hook entry hole.
第11頁Page 11
12382571238257
並沒有特別加以限定。掛鈎承受部,例如··可以和掛鈎進 入孔的内側面相連續,設置於掛鈎進入孔的出口附近。 、於本形態相關之導芯中,掛鈎承受部被設置成可以和 進入掛鈎進入孔之掛鈎相卡合,可以將導芯接近插接套件 地裝置。由此,可以將電子元件從插接套件本體確實地引 導至導芯。 κ w (3 )如岫述(1 )或(2 )所述之導芯的較佳形態, f特徵在於:前述導芯包括導軸嵌插孔,讓導軸來嵌插以 進行相對於前述插槽之前述導芯的定位。 設置,將…於插槽側(例如 對於插槽;座= Ϊ於 峰之位置。由此,可以使被導芯所支 持之破測試電子元件相對於插槽能進行正確位置之設定, ,測4电子70件的外部端子和插槽的連接端子能確實地 接0 (4 )本發明相關之插接套件本體,如前述(1 y〜It is not particularly limited. The hook receiving portion may be continuous with the inside surface of the hook entry hole, for example, and may be provided near the exit of the hook entry hole. In the guide core related to this form, the hook receiving portion is arranged to be engaged with the hook entering the hook entry hole, and the guide core can be approached to the device of the plug-in kit. This allows the electronic component to be reliably guided from the plug-in kit body to the guide core. κ w (3) The preferred form of the guide core as described in (1) or (2) above, f is characterized in that: the aforementioned guide core includes a guide shaft inserting socket, and the guide shaft is inserted to perform relative to the foregoing Positioning of the aforementioned guide core of the slot. Set, on the slot side (for example, for the slot; seat = Ϊ the peak position. Thus, the correct position of the broken test electronic component supported by the guide core can be set relative to the slot. The 70 external electronic terminals and the connection terminals of the slot can be reliably connected with 0 (4) The plug kit body related to the present invention, as described above (1 y ~
5之任意項所述讓導芯以可拆裝之方式裝置 件本體,其特徵在於包括:電子元件導引部,包括:導 裝置口 ’纟置有前述導芯;及電子元件進入〇,連通前: 裝置口可將電子元件導向被裝設於前述導芯裝置口 雨逃導芯;以及掛鈎部,和前述導S所包括之掛鈎 以可離脫的方式卡合。According to any of 5, the guide core can be detachably installed on the component body, which is characterized in that it includes: an electronic component guide, including: the guide opening is provided with the aforementioned guide core; and the electronic component enters 〇, communicates Front: The device port can guide the electronic components to be installed on the guide core device and the escape escape guide core; and the hook portion is detachably engaged with the hook included in the guide S.
2192.5760-PF(Nl).ptd2192.5760-PF (Nl) .ptd
1238257 五、發明說明 於本發明相關之插接套件本體中,電子元件導引部, 包括導芯裝置口和電子元件進入口,導芯裝置口和電子元 件進入口為相連通,可以將從電子元件進入口所進入之電 子元件導引(guide)向被裝設於導芯裝置口之導公。 導芯被裝設於本發明相關之插接套件本體之導芯裝置 口,在被裝設於導芯裝置口之導芯,透過插接套件本體之 電子元件導引部之導引被測試電子元件被搬入於此。而 且,被測試電子元件,被由導芯所支持的狀態下,供給電 子元件測試裝置來進行測試。測試完畢之電子元件,妳由1238257 V. Description of the invention In the body of the plug-in kit related to the present invention, the electronic component guide includes a core guiding device port and an electronic component inlet, and the core guiding device port and the electronic component inlet are connected, and can be connected from the electronic The electronic component guide entered by the component inlet is directed to a guide provided at the core device opening. The guide core is installed at the core guide device port of the plug-in kit body related to the present invention, and the test core is guided by the electronic component guide of the plug-in kit body at the guide core installed at the guide core device port. Components are moved here. In addition, the electronic component to be tested is supplied to the electronic component testing device for testing while being supported by the guide core. After testing the electronic components, you
電子元件導引部之引導從電子元件進入口向插接套件本 外搬Λ。 本發明相關之插接套件本體之掛鈎部的構造,使導# 以能脫離的方式裝設於插接套件本體,只要能和導芯之^ 鈎承叉部以可拆裝之方式卡合,並不限定於特定之型式。 又,掛鈎部的位置及個數,可按照導芯所包括掛鈎承受部 的位置和個數適宜地決定。The guide of the electronic component guide is moved from the electronic component inlet to the plug-in unit in and out. The structure of the hook part of the related plug kit body of the present invention enables the guide # to be detachably installed on the plug kit body, as long as it can be detachably engaged with the ^ hook bearing fork portion of the guide core, It is not limited to a specific type. The position and number of hook portions can be appropriately determined according to the position and number of hook receiving portions included in the guide core.
關於本發明相關之插接套件本體,透過插接套件本 2钩部和導芯之掛钩承纟部之卡合將導芯I設於插接 件士體,同時,透過插接套件本體之掛鈎部和導芯之掛 ί =部之卡合的解除使導芯從插接套件本體脫離。因此 右=用本發明相關之插接套件本體的話,可以製作出可 ,導芯之插接套件。關於使用本發明相關之插接 J =套件,僅交換導芯,即可收納多樣尺寸之被=Regarding the plug-in kit body related to the present invention, the guide core I is set on the plug body through the engagement of the hook part of the plug-in kit 2 and the hook receiving part of the guide core, and at the same time, through the plug-in kit body, Disengagement of the hook between the hook portion and the guide core causes the guide core to be detached from the main body of the plug-in kit. Therefore, right = if the plug kit body related to the present invention is used, a plug kit with a guide core can be produced. Regarding the use of the plug J = kit related to the present invention, only the guide core can be exchanged to accommodate quilts of various sizes =
1238257 五、發明說明(10) (5 )前述(4 )所記載之插接套件本體的較佳形態, 其特徵在於:前述掛鈎部係被設計成於進入前述導芯之前 述掛钩進入孔的同時,在進入前述掛鈎進入孔的狀態下可 和前述掛鈎承受部產生卡合。1238257 V. Description of the invention (10) (5) The preferred form of the plug kit body described in (4) above, characterized in that the aforementioned hook portion is designed to enter the aforementioned hook entry hole of the guide core. At the same time, the hook can be engaged with the hook receiving portion in a state where the hook enters the hole.
本形態相關之插接套件本體所包括之掛鈎部,可以進 入導芯所包括之掛鈎進入孔,只要能在進入該掛鈎進入孔 的狀態下和掛鈎承受部產生卡合,該形狀、構造、大小、 位置等並沒有特別加以限定,可依照導芯之掛鈎進入孔以 及承受部之形狀、構造、大小、位置等加以適宜地決定。 與本形態相關之插接套件本體,設計成掛鈎部可在進 入掛钩進入孔之狀態下和掛鈎承受部相卡合,可使導芯接 近插接套件本體地裝置。由此,可以將電子元件由插接套 件本體確實地引導至導芯。The hook part included in the body of the plug-in kit related to this form can enter the hook entry hole included in the guide core, as long as it can be engaged with the hook receiving part in the state of entering the hook entry hole, the shape, structure and size The position and position are not particularly limited, and can be appropriately determined according to the shape, structure, size, and position of the hook entry hole of the guide core and the receiving portion. The plug kit body related to this form is designed so that the hook portion can be engaged with the hook receiving portion in the state of entering the hook entry hole, so that the guide core can approach the device of the plug kit body. Thereby, the electronic component can be surely guided from the plug-in sleeve body to the guide core.
又’當掛鈎承受部被設置於掛鈎進入孔之附近時,掛 鈎部會於露出於掛鈎進入孔的狀態下和掛鈎承受部相卡 合,即使在這樣的狀態下,只要掛鈎部從掛鈎進入孔的入 口進入和掛鈎承受部產生卡合的情況,也包含在「進入掛 钩進入孔的狀態和掛鈎部相卡合」的陳述。 所記載之插接套件本體的較 掛鈎部係被設計成可以朝和前 動0 (6)前述(4)或(5) 佳形態,其特徵在於:前述 述掛鈎承受部卡合之方向移 關於本形態相關之插接套件本體 透過使掛鈎部向掛Also, when the hook receiving portion is provided near the hook entry hole, the hook portion is engaged with the hook receiving portion in a state exposed to the hook entry hole. Even in such a state, as long as the hook portion enters the hole from the hook If the entrance of the hook and the hook receiving part are engaged, it is also included in the statement "the state of entering the hook entry hole and the hook part is engaged". The hook portion of the plug-in kit body described is designed to move forward (0) (6) to (4) or (5) above, and is characterized in that the direction in which the aforementioned hook receiving portion engages is about The plug kit body related to this form hangs the hook portion downward
1238257 五、發明說明(11) 銘J承受部的卡合方向移動,可使導怎裝設於插接套件本 體,同時’使掛夠朝與此相反之方向(和掛鈎承受部移動 之解除卡合之方向)移動,可使導芯從插接套件本體脫 離’對於導芯在插接套件本體之裝置及脫離(交換)可以 容易地加以進行。 (7 )前述(6 其特徵在於:前述 產生迴轉運動- 關於本形態之 在一定的轨道上移 钩承受部卡合之方 易地朝和此相反之 之方向)移動。由 脫離(交換)可以 (8 )前述(6 佳形態,其特徵在 前述掛鈎承受部卡 關於本形態相 彈性構件所被設置 部卡合之方向擠壓 作彈性構件,例如 )等之彈簧。 )所記載之插接套件本體的較佳形態, 掛钩部係被設計成可以以迴轉軸為中心 插接套件本體,掛鈎部以迴轉軸為中心# =,可以使掛鈎部確實且容易地朝和掛 二移動,同時也可以使掛鈎部確實且容 向(掛鈎部和掛鈎承受部之卡合解除 ☆對於插接套件本體,導芯之裝置及 谷易且確實地進行。 丄或上7)所記載之插接套件本體合的部係經由彈性構件被朝和 w万向擠壓。 關之插技太μ ,之位置等,〇 體,彈性構件之種類、 的話,祐Μ ^要將掛钩部向與掛鈎承受••可以使用ί別加以限定。被用來當 是用杻轉彈簧(toslon sprlng1238257 V. Description of the invention (11) The moving direction of the receiving part of the inscription J allows the guide to be installed in the body of the plug-in kit, and at the same time, 'hangs the card in the opposite direction (the release card that moves with the receiving part of the hook) (Moving direction), the guide core can be disengaged from the plug-in kit body. The device for the guide core in the plug-in kit body and the disengagement (exchange) can be easily performed. (7) The foregoing (6 is characterized in that the foregoing generates a turning motion-about this form of moving on a certain track The side where the hook receiving portion engages easily moves in the opposite direction). By detachment (exchange), (8) The aforementioned (6 best forms, characterized in that the aforementioned hook receiving portion is stuck in this form) The elastic member is pressed in the direction in which the elastic member is engaged as an elastic member, such as). In the preferred form of the plug-in kit body described in the above description, the hook portion is designed to be able to plug the kit body with the rotation axis as the center, and the hook portion is centered on the rotation axis # =, so that the hook portion can be reliably and easily moved toward You can also move the hanging part and make the hook part sure and tolerant at the same time (the engagement between the hook part and the hook receiving part is released. ☆ For the plug kit body, the guide core device and Gu Yi are surely performed. The part of the plug-in kit main body described is pressed toward the w-universal direction through the elastic member. The insertion technique of Guan Zhi is too μ, the position, etc., the type of the body, the elastic member, and so on. You must bear the hook part toward the hook. • You can use ί to limit it. Is used as a toslon sprlng
1238257 •--- 五、發明說明(12) 關於和本形態相關之插接 受部之卡合由於彈性摄杜 掛钩。P和掛鉤承 使導芯在插接套件上的浐^ f f的作用變得強固,可以 备什上的裝置成為安定的狀態。 (9 )前述(8 )所記載之插接 ::·前述插接套件本體包括限制器部iLfi徵在 制。 丨口方向之移動或是迴轉運動加以限 關於和本形態相關之插接 導芯的狀態下,掛鈎部也持阳ρ使在沒有安裝 和本形熊相關+ / 保持於限制器部。 受部相卡合時:使外:J J:::持:使掛鈎部和掛鈎承 部韓r㈣部朝和掛 外力的作用。在解除外力的作用後之=裝置口後,解除 ξ ϊ!!力使掛鈎部往和掛鈎承受部的ΐ:方由於彈性構 钩承受部之卡合方向移動或I迴轉運動兔掛釣部’往和掛 之前的階段和掛鈎承受部產生卡合,=限制器部所限制 之卡合方向移動或是迴轉運動為限制^ =住和掛鈎承受部 和掛鈎承受部產生卡合。 卩所限制的狀態下4 關於和本形怒相關之插接套件本體 造,只要能對掛鈎部 氧限制器部的 有特別之限定。又,限制運Ϊ;以限制,並沒 /、要不妨害到掛鈎 m一 2l92-5760-PF(Nl).ptd 第16頁 12382571238257 • --- 5. Description of the invention (12) The engagement of the receiving part related to this form is due to the elastic photography hook. P and the hook support make the role of the guide core on the plug kit strong, and the device can be stabilized. (9) The plug described in (8) above: The plug kit body includes a limiter iLfi.丨 Movement in the direction of the mouth or slewing motion is restricted. In the state of the plug-in guide core related to this form, the hook part also holds the ρ so that it is not attached to the shape bear + / and is held in the limiter part. When the receiving part is engaged: make the outer part: J J ::: hold: make the hook part and the hook receiving part han part to face and hang the external force. After releasing the action of the external force = after the opening of the device, release ξ ϊ !! The force moves the hook part toward the hook receiving part: the side moves due to the engaging direction of the elastic hook receiving part or the I-rotating movement rabbit hook fishing part ' Engagement with the hook receiving part before the stage of hanging, = the movement in the engaging direction restricted by the limiter part or the rotation movement is restricted ^ = engagement between the receiving part and the hook receiving part.限制 Restricted state 4 Regarding the body of the plug kit related to this form, as long as it can restrict the oxygen limiter part of the hook part. Also, restrict the operation; to restrict it, did not / did not hinder the hook m one 2l92-5760-PF (Nl) .ptd page 16 1238257
五、發明說明(13) 部和掛鈎承受部之卡合 並沒有特別加以限定。 UU )别述(9 )所述之插接套件本體的較佳形離’ 其特徵在於:前述插接套件本體包括夾 & ,部連結設置,承受爽具之擠壓,使心钩5. Description of the invention The engagement of the (13) part and the hook receiving part is not particularly limited. UU) the better shape of the plug-in kit body described in (9) above, characterized in that the plug-in kit body includes a clip &
則述掛鈎承受部之解除卡合的方向移動或是迴轉運動。D 關於和本形態相關之插接套件本體,夾具承受部的^ 狀、構造等,只要能受到夾具(j i g )之懕、 、〉 鈎承受部的卡合解除方向移動或是迴轉㈣ ::加以限定。夾具’例如…使包: 艰5:部之構造。人丹 關於和本形態相關之插接套件本體,夾呈 :掛=連接設置,可以和掛鈎部同時地移動=轉; 掛钩具承文部文到夾具而來之擠壓力時,掛鈎部朝和 ^ 7叉部之卡合解除方向移動或是迴轉運動。之後,告 力=而來之擠壓力解除時’掛鈎部由於彈性構件的擠i 因卜,用朝和掛鈎承受部之卡合方向移動或是迴轉運動。 具,山、和本形態想關之插接套件本體’使用夾具,可以六 進行導芯在插接套件本體之裝置以及脫離(交換), 皞(11)前述(1 〇)所記載之插接套件本體之較佳形 =丄其特徵在於:前述插接套件本體包括夾具進入孔;^ 具夾具2入’並設置前述夾具承受部’使進入前述夾 孔之W述夾具可以擠壓前述夾具承受部的方式,來Then, the direction of the hook receiving part's disengagement movement or rotation movement is described. D As for the body of the plug kit related to this form, the shape and structure of the jig receiving part, as long as it can be moved by the jig (ji), the hook receiving part can be disengaged or rotated ㈣ :: Add limited. The jig ’, for example, makes the package: Urgent 5: The structure of the Ministry. For the plug kit body related to this form, the clip is: hanging = connection setting, can move with the hook at the same time = turn; when the hook has the pressing force from the text to the clamp, the hook is facing And ^ 7 fork part of the disengagement direction movement or rotary motion. After that, when the pressing force = come from the release of the pressing force, the hook portion is moved or rotated by the engagement with the hook receiving portion due to the squeeze of the elastic member. It is possible to use the fixture to mount the main body of the plug kit according to this form, using the jig, it is possible to perform the device of the guide core on the plug kit body, and the detachment (replacement), 皞 (11) the plug described in (10) above. The preferred shape of the kit body = 丄 It is characterized in that: the aforementioned plug kit body includes a clamp access hole; ^ with the clamp 2 into 'and set the aforementioned clamp receiving portion' so that the said clamp entering the clamp hole can press the aforementioned clamp to bear Way, come
1238257 五、發明說明(14) 設置前述夾具承受部。 關於和本實施形態相關之插接套件本體,透過使炎具 進入夾具進入孔可以播壓夾具承受部,同時,透過使夾具 退出夾具進入孔可以解除對夾具承受部之擠壓。因此,於 本形態相關之插接套件本體,透過夾具向夾具進入孔之進 入退出,可以容易地進行導芯在插接套件本體之裝置以及 脫離(交換)。 (12 態 > 其特 述夾具進 承受部上 關於 保持於限 夾具進入 觸的面, 傾斜的同 爽具承受 承受部朝 受部之解 以及夾具 向移動或 具加諸於 的擠壓力 )所記 具承受 述夾具 前述夾 之插接 ,夾具 具體而 掛钩部 進入孔 在夾具 方向擠 的力量 朝掛鈎 。當夾 之擠壓 掛鈎承 載之插接 部被設置 承受部產 具承受部 套件本體 承受部被 言,夾具 和掛钩承 。進入失 承受部上 壓。由此 被加諸於 部和掛鈎 具由夾具 力被解除 受部之卡 套件本體 成,前述 生接觸, 〇 ,例如: 設計成可 承受部之 受部相卡 具進入孔 滑動的同 ,朝掛鈎 夾具承受 承受部之 進入孔退 ,掛鈎部 合方向移 )前述(11 徵在於:夾 入孔後和前 滑動以擠壓 本形態相關 制部的狀態 孔的進入。 被設計成朝 時橫切夾具 部相接觸, 炎具的行進 除卡合方向 承受部同時 是迴轉運動 夾具承受部 所作用往和 之較佳形 夾具進入前 在前述夾具 於掛鈎部被 遮住失具從 與夾具相接 合的方向在 之夾具,和 時,將夾具 部和掛钩承 部,掛鈎部 卡合解除方 出時,由失 被彈性構件 動或是迴轉1238257 V. Description of the invention (14) The aforementioned fixture receiving portion is provided. With regard to the plug-in kit body related to this embodiment, the jig receiving portion can be compressed by letting the jig into the jig entry hole, and the jig receiving portion can be released by pushing the jig out of the jig entry hole. Therefore, in the plug-in kit body related to this form, the fixture can be easily moved into and out of the plug-in kit body by inserting and withdrawing through the fixture into and out of the fixture inlet hole. (12 states) It specifically mentions that the surface of the clamp inlet and the receiving portion is limited to the contact surface of the clamp, and the inclined Tongshuang bearing receiving portion is resolved toward the receiving portion and the clamp is moved or has a pressing force. The recorder can withstand the insertion of the aforementioned clips of the clamp, the clamp is specific, and the force of the hook portion entry hole squeezes in the direction of the clamp toward the hook. When the pressing part of the clip is mounted on the hook, the receiving part is the product receiving part, the receiving part of the kit body, and the jig and the hook are supported. Press into the bearing section. As a result, the card body of the receiving part is added to the part and the hook device by the clamping force, and the aforementioned contact is made, for example, it is designed to be able to slide into the receiving hole of the receiving part phase of the receiving part, toward the hook. The clamp accepts the entry hole of the receiving part, and the hook part moves in the same direction.) The aforementioned (11 sign lies in: after clamping the hole and sliding forward to squeeze the entry of the state of the relevant part of the form. It is designed to cross-cut the clamp toward the time. The moving part of the flaming appliance is in addition to the engaging direction. The receiving part is also a rotary motion fixture receiving part. The better shape of the fixture is before the entrance. Before the fixture is covered by the hook, the fixture is hidden from the direction that the fixture is engaged with the fixture. When the clamps are in place, when the clamp part, the hook receiving part, and the hook part are released from the engagement, they are moved or lost by the elastic member.
2192-5760-PF(Nl).ptd 第18頁 12382572192-5760-PF (Nl) .ptd Page 18 1238257
運動。因此,關於本形態相關之插接套件本體,使 具,對於在插接套件本體上之導芯的裝置及脫離 f 可以容易且確實地進行。 、又換 . 岫述(4 )〜(1 2 )之任意項所記載之插接备 =體的較佳形態,前述插接套件其特 接套^ 朝前述插接套件本體之接近及遠離方㈣動之、又= 刖述驅動體之接说古而&从胡 勒體’向 志a、+. + 接近方向的作用而迴轉移動:問鎖部,在斗 ί:::元件導引部處於開啟狀態之開位置及代表前ΐ 於閉合狀態之閉位置之間迴轉移動;以及臂 移動產:ΐ:動Ϊ作用部之迴轉移動和前述閃鎖部之迴轉 用部,勺人二.,.則述驅動體處於最遠離時,前述驅動體作 於前述i i;ί j 5 2用部的迴轉中心·’位於比相對 體的位置ΠΓ,ΐ:離了向之垂直平面更接近前述駆動 位於相對“體作用部的迴轉中心線, 的物署.此这驅動體的接近达離方向之平行平面的附进 述驅動體,在移動時不會干涉到前述臂部。 設計成對接:件本體,驅動體,例如:被 的方向移動。在之電子元件進入面在接近及遠離 件本體的外面之中:子::進入面」《指’於插接套 被設置之外面,二私=子几件導引部之電子元件進入面所 元件進人面接進* 被设計成向插接套件本體之電子 進或疋退離方向移動之情況,驅動體的構motion. Therefore, with regard to the plug-in kit body related to this form, it is possible to easily and reliably perform the device of the guide core on the plug-in kit body and detachment f. , Yet another. The preferred form of the plug-in device = body described in any of (4) to (1 2), the special plug-in sleeve of the aforementioned plug-in kit ^ is close to and away from the main body of the plug-in kit. Thousands of movements, then = the description of the drive body, then the ancient and & from the Huler body 'Xiangzhi a, +. + Approaching the direction of rotation and movement: ask the lock, in the bucket ::: component guidance The part is in the open position and the front part represents the swivel movement between the closed position and the closed position; and the arm movement product: ΐ: the swivel movement of the movable part and the swivel part of the aforementioned flash lock part. When the driving body is farthest away, the aforementioned driving body is used for the aforementioned ii; ί j 5 2 The center of rotation of the user's part is located at the position of the opposite body ΠΓ, ΐ: It is closer to the aforementioned movement from the vertical plane toward the direction It is located at the center of rotation of the "body action part." This drive body is attached to the parallel plane of the approaching and departing direction, and does not interfere with the aforementioned arm when moving. Designed to be docked: pieces The main body, the driving body, for example: the direction of the quilt. Near and far from the outside of the body: Sub :: Entering surface "" refers to the outer surface where the connector is set, two private = electronic components of the guide part of the sub-portion. All components enter the surface. Designed to move in the direction of electronic advance or retreat of the plug kit body, the structure of the drive body
1238257 五、發明說明(16) 造、位置等被 之搬入及搬出 連通之開口部 元件之搬入及 插接套件内搬 内之裝置所施 動。驅動體, 朝離開插接套 插接套件本體 插接套件本體 時」。 關於和本 體例,可提出 用於驅動體作 如:也可以在 動體作用部也 關於本形 驅動體方向之 驅動體作用部 部,也可以受 是,遠離插接 關於本形 轉移動與閂鎖 驅動體向接近 調節成 。例如 ’使得 搬出。 入之際 之擠壓 為了能 件的方 的方向 之位置 ,不妨害電 :在驅動體 可以透過電 驅動體,例 ,受到由將 力,朝接近 在上述裝置 向移動,透 擠壓為佳。 的狀態稱之 子元件 設置和 子元件如,在 被測試 插接套 所施之 過彈簧又,當 為「驅 由電子 電子元 進入口 被測試 電子搬 件本體 擠壓力 等彈性 驅動體 動體之 元件進入口 件進入口相 來進行電子 電子元件向 入插接套件 之方向移 被解除之際 構件向離開 處於最遠離 最遠離 形態相 拉桿片 用部, 拉桿設 可以。 態相關 作用( ,以迴 到驅動 套件本 態相關 部之迴 驅動體 關之插接套件本體 (lever plate ) 也可以透過其他構 置大起部,使該突 ’當作驅動體之具 3拉桿片可直接作 件間接作用。例 起部直接作用於驅 之插接套件本體, 也就是,接近插接 轉軸為中心迴轉移 體向遠離驅動體方 體之力)而產生迴 之插接套件本體, 轉移動為連動,當 方向之作用而產生 受到驅動體向接近 套件本體之力)的 動。驅動體作用 向之作用(也就 轉移動。 驅動體作用部之迴 驅動體作用部受到 迴轉移動時,閂鎖 2192-5760-PF(Nl).ptd 第20頁 1238257 五、發明說明(17) 部會從開位 至開位置。 開啟狀態之 電子元件導 芯搬出之狀 於閉鎖狀態 過電子元件 導芯搬出之 由電子元件 子元件導引 位置時,因 (也就是, 以防止被裝 之電子元件 口的中央部 動的情況, 的情況,閂 位於電子元 於「開位置 置迴轉移動 I ilb ’「開 位置,而「 引部之導引 態。又,r 之位置,而 導引部之導 狀態。當閃 導弓丨部之導 部之導弓丨而 電子元件無 因為電子元 没於插接套 的掉出。問 附近和電了 閃鎖部的前 鎖部將會處 件導引部的 至閉位置, 位置」是指 開啟狀態」 可以搬入導 閉位置」是 「閉鎖狀態 引無法搬入 鎖部處於開 引而被搬入 被搬出導芯 法由電子元 件無法通過 件本體之導 鎖部的前端 元件導引部 端部位於導 於「閉位置 内側面附近 或是從閉位 ,電子元件 意謂著,電 芯之狀態以 指’電子元 」意謂著, 導芯之狀態 位置時,電 導芯,同時 。又5當閂 件導引部來 電子元件導 芯裝置口之 部,例如: 的内側面附 芯裝置口的 J ’而閂鎖 的情況,閃 置迴轉移動 導引部位於 子元件透過 及可以從導 件導引部位 電子元件透 以及無法從 子元件可以 也可以由電 鎖部處於閉 加以導引 引部),可 導芯所支持 在導芯裝置 之間迴轉移 中央部附近 部的如端部 鎖部將會處1238257 V. Description of the invention (16) The manufacturing, location, etc. are moved in and out of the connected openings. The components are moved in and the devices in the plugging kit are moved. The drive body is facing away from the connector sleeve. Regarding the example of the body, it can be proposed for the driving body to act as: it can also be the driving body acting portion in the direction of the driving body acting on the moving body acting portion, or it can be accepted, away from the plug about the movement and latch of this shape. The driving direction of the lock driving body is adjusted. For example, 'Move out. In the case of the entry, the direction of the direction of the energy element is not to hinder electricity: the drive body can pass through the electric drive body, for example, subject to the force, approaching the device in the direction of the above device, it is better to squeeze. The state of the device is called the sub-component setting and sub-components. For example, the spring-applied spring is applied to the tested socket, and it is the component that drives the moving body of the elastic body such as the pressing force of the electronic moving body being tested by the electronic electronic component inlet. Enter the mouthpiece to enter the mouthpiece to perform the movement of the electronic and electronic components in the direction of the plug-in kit. When the component is moved away from the part that is the farthest and farthest from the phase phase, the lever can be set. State-dependent action (, to return to The lever plate body (lever plate) of the relevant part of the drive kit in the state of the drive body can also be configured with a large raised portion, so that the protrusion can be used as a drive body, and the 3 lever rod can directly act as an indirect member. Example The starting part directly acts on the body of the plug-in kit, that is, the force of the plug-in kit near the plug-in rotating shaft as the center to move the body away from the square of the drive body), and then moves back to the linkage. The action causes the force of the driving body to approach the body of the kit). The driving body acts toward it (that is, it moves). The driving body works When the action part of the part is rotated, the latch 2192-5760-PF (Nl) .ptd Page 20 1238257 V. Description of the invention (17) The part will move from the open position to the open position. When the core is moved out of the electronic component guide in the locked state and guided by the electronic component sub-component, the position (i.e., to prevent the central part of the mounted electronic component port from moving) The element is placed in the “open position I ilb ', the open position, and the lead state of the lead. Also, the position of r, and the guide state of the guide. When the guide bow of the flashing bow丨 And the electronic component is not because the electronic element did not fall out of the socket. Ask the nearby and front lock section of the flash lock section will be the closed position of the part guide, the position "refers to the open state" can be carried in The "guided position" is "in the closed state, the lock cannot be moved in, the lock is in the open position, and it is carried in and out. The guide core method cannot be passed by the electronic component. side Nearby or from the closed position, the electronic component means that the state of the battery cell refers to the "electronic element", and when the state of the guide core is at the same time, the electric core is at the same time. 5 When the latch guide comes to the electronic component The part of the guide core device mouth, for example: In the case where the inner side of the core device is attached with J 'and the latch, the flashing rotary movement guide is located through the sub-component and can pass through the electronic component of the guide part of the guide. The sub-element can or can be guided by the electric lock part in the closed position), the guide core supports the transfer of the central part near the central part, such as the end lock part, between the core guide devices.
關於本形筚M t t 置時,閃鎖部:前套件本體’當閃鎖部位於閉 的導芯裝置口所;:Ϊ二:ΐ好能將被裝設於插接套件本 持部之方向擠麼為佳,= m子元件向導思的 位置,可以防止電早_ :電子70件被保持於導芯之既 冤子7L件之位置的錯離。例如:閂鎖部About this shape, when the flash lock is installed, the flash lock part: the front kit body 'When the flash lock part is located at the closed guide core device port;: Ϊ 二: ΐThe direction of the plug assembly can be installed It is better to squeeze, = m sub-elements can prevent the electric early_: 70 electronic parts are kept at the position of the guide core 7L pieces. Example: latch
2192-5760-PF(Nl).pic 第21頁 1238257 五、發明說明(18) -- 前端部 二,,由於將被裝設於插接套件本體之導芯裝置口的導 芯所支持之電子元件朝電子元件進入口於外面的擠壓,可 以:二電子元件之位置的錯離…當閃鎖部的前端部可 ^違被導3所支持之電子^件時的前端部 電°;=;牛;?觸使得閃鎖部之迴轉移動受到限制,雖然 = 鎖部的閉位置’和電子元 m元件導引部處於工相異的情。:只 置」之陳述。又,閃鎖二=位置皆包含於閉位 電子元件的尺寸而不同,;:‘丰會因被導Ί 狀態之位置皆包含☆「閉:;要=;件導引部 關於本形態相關之插」 軸以及閃鎖部之迴轉軸,:套件2 ’驅動作用部之迴轉 面,最好被設置成和驅動體]:接子元件導引部的内側 垂直。又,雖然驅動體运離方向相垂直或是略 轉中心線相異也可以,伸。i ^轉中心線和閂鎖部的迴 驅動體作用部的迴韓知4 = 還疋月b 致為佳(也就是, 由使兩者的迴轉鎖部的迴轉轴相同為佳)。經 易的機構來加以連動。在Ξ者轉:動可以透過簡 況,例如:可以透過劈 肀〜線呈一致的情 者之迴轉移動產生連動。、、σ驅動肢作用部和閂鎖部使兩 關於本形態相關之插辟 等被調節成不妨害電子元 _尽肢’臂部的構造、配置 出。臂部,例如:於驅件進人口之搬人及搬 動體處於最遠離時,被沿著電子元 2192-5760-PF(Nl).ptd 第22頁2192-5760-PF (Nl) .pic Page 21 1238257 V. Description of the invention (18)-Front part 2, because the electronics will be supported by the guide core installed in the guide core device port of the plug kit body Squeezing the component towards the entrance of the electronic component to the outside, can: the deviation of the position of the two electronic components ... When the front end of the flash lock part can ^ violate the electronic parts supported by the guide 3; ;Cattle;? Touching makes the rotary movement of the flash lock part restricted, although = the closed position of the lock part 'and the electronic element m component guide part are in a different situation. : Just set "statement. In addition, the flash lock two = the position is included in the size of the closed electronic components ;: 'Feng will be included in the position of the guided state ☆ "closed :; to =; pieces of the guide related to this form The "insert" axis and the rotation axis of the flash lock part are: the rotation surface of the driving part of the kit 2 'is preferably set to be perpendicular to the inside of the guide of the connector element. In addition, although the driving body's moving direction is perpendicular or slightly different from the center line, it may be extended. i ^ Turn the center line and the return of the latching part. Returning to the driver action part 4 = It is better to return the month b (that is, it is better to make the rotary shafts of both the rotary lock parts the same). The economic institutions are linked. Turning around the person: The movement can be done through a brief situation, for example: it can be linked by the rotation movement of the person who splits the line 肀 ~ line in a consistent situation. The sigma, sigma actuating limb action portion and the latching portion make adjustments related to this form so as not to hinder the structure and configuration of the arm of the electronic element ________. Arm, for example, when the moving person and moving body of the driving member are farthest away, it is moved along the electron element 2192-5760-PF (Nl) .ptd page 22
1238257 五、發明說明(19) 件導引部的内側面設置。 關於本形態相關之插接套件本體,於驅動體處於最遠 離時’驅動體作用部,包含驅動體作用部的迴轉中心線, 比相對於驅動體之接近遠離方向之垂直平面更接近驅動 體’受到向驅動體接近方向作用之驅動體作用部,包含驅 動體作用部的迴轉中心,朝向相對於驅動體之接近遠離方 向垂直之平面迴轉移動。當驅動體作用部像這樣迴轉移動 時,於驅動體在最遠離時的驅動體作用部,包含驅動體作 的迴轉中心線,愈接近相對於驅動體之接近遠離方向 二,平面的°舌,驅動體作用部的迴轉角度愈大。關於本 ϊίΐ目t插接套件本體,驅動體,包含驅動體作用部的 迴轉中心線,因位於相斜 、土 附$ & μ ^ 、接近返離驅動體平行之平面的 驅動體作用部的迴轉 動,和驅動體作用部之迴==閃鎖部之迴轉移 於本形態相關之插二=轉角度也跟著變大,所以關 大。因此,關於本形態相,閂鎖部的迴轉角度也變 閉量(開位置和閉位^之之=接套件本體,閂鎖部的開 寸之電子元件的掉出 < 是相動I )變大,可以防止多樣尺 疋位置之錯離。 又,因驅動體之移動 ^ 害到臂部之動作,驅動體 v到I部,驅動體不會妨 迴轉移動可以透過臂部確告用一之迴轉移動以及閂鎖部之 部能保有較大的開閉量。'也連動,由此,可以確保閂鎖 第23頁 ZI92·5孤齐(N】).pid 12382571238257 V. Description of the invention (19) The inner side of the guide part is provided. Regarding the plug kit body related to this form, when the driving body is farthest away, 'the driving body acting part, including the centerline of rotation of the driving body acting part, is closer to the driving body than a vertical plane relative to the driving body's approaching and distant direction' The driving body acting part which is acted on in the approaching direction of the driving body includes the rotation center of the driving body acting part, and rotates toward a plane perpendicular to the approaching and detaching direction of the driving body. When the driving body acting part rotates in this way, the driving body acting part when the driving body is farthest away includes the centerline of rotation made by the driving body, the closer it is to the direction of the driving body close to and away from direction 2, the plane of the tongue, The larger the turning angle of the driving body action portion. With regard to the main body of the plug-in kit of the present invention, the driving body, including the center of rotation of the driving body acting portion, is located at the phase of the oblique, soil attached, and close to the plane of the driving body acting portion parallel to the driving body. Turning back, and returning to the action part of the driving body == turning back of the flashing lock part is related to this form = turning angle also increases, so turn off. Therefore, with regard to this aspect, the rotation angle of the latch portion also changes the amount of closing (of the open position and the closed position ^ = the connector body, the opening of the electronic component of the latch portion falls out < is a phase action I) Larger can prevent the deviation of various sizes. In addition, because the movement of the driving body jeopardizes the movement of the arm, the driving body v to I, the driving body will not be affected by the rotational movement. The rotation of the driving body can be confirmed through the arm, and the part of the latch can be kept large. The amount of opening and closing. 'Also interlock, so that the latch can be ensured. Page 23 ZI92 · 5 Lone Qi (N)). Pid 1238257
五、發明說明(20) (14)前述(13)所述之插桩 其特徵在於:前述媒動體作件本體之較佳形態, 離前述驅動體的方向播:用部係透過彈性構件被朝向遠 關於本形態相關之插接套 插接套件本體之遠離方向移=本=缸當堪動體朝相對於 體的作用^ &胃n # t ^ τ,動體作用部受到彈性 J讣用朝驅動體之遢離方向移動,伴 和驅動體作用部的迴轉移勤。^ & 者驅動體的接近 部也和驅動體作二= = =移動,,閃鎖 u W将移勤相連動,侔腩莫艇毹辨认 ^,和閃鎖部的迴轉移動呈反向迴轉移動’也就是,於拌 =者ίΐ ί的接近閃鎖部由開位置朝閉位置迴轉移動的情 動,"奴者驅動體的離開閃鎖部從閉位置朝 遺著驅動體的接近閃鎖部由閉位置朝開位ϊί =迴轉移動。因此,關於本形態相關之插接套件 ’ ;由使驅動體相對於插接套件本體朝接近及遠離之方向 2,可以使從開位置朝閉位置迴轉移動之閃鎖部又再度迴 移動到開位置,或是從閉位置朝開位置迴轉移動之 又再度朝閉位置迴轉移動。 ▲ (15)如前述(13)或)u)項所述之插接套件本體 的較佳形態,其特徵在於:前述驅動體處於最遠離時,前 述驅動體作用部,位於前述驅動體的附近。 ^ 關於本形態相關之插接套件本體,驅動體作用於驅動 體作用部的同時移動距離變長,受到驅動體的作用驅動體 第24頁 2192*5760-FF(Nl).ptd 1238257 五、發明說明(21) 作用部之迴轉移動之迴轉角度也變大,與驅動體作用部之 迴轉移動連動產生迴轉移動之閂鎖部的迴轉角度也變 因此,關於本形態相關之插接套件本體,閂鎖部之 (開位置和閉位置之移動量)冑大,可以防止多種::: 電子兀件的掉出或是位置之錯離。 ' 传开」16iJ=)〜(15)所述之插接套件本體的較 體的^向2^ =:當受到前述驅動體朝接近前述驅動 體的方向之作用,則述驅動體作用部產生迴 使前述閂鎖部能從前述閉位置迴轉移開詈,二 :::體作用部的迴轉移動-…^ 關於本形態相關之插接套件本體,當將一 件搬入插接套件内•,使將該被測試電電子几 件内之裝置朝接近電子 沾=子兀件搬入插接套 置擠壓驅動體,若使. φ向移動,透過該裝 移動的話,可以使H體,接近電子元件進入面的方向 此’關於本形態相關之插開位置迴轉移動。因 件搬入插接套件本體内之搬入的私使將被測試電子元 :動相連動 '經由該裝置將被測試電:::鎖部的迴轉 内之際,π以使閃鎖部迴轉移:件搬入插接套件 置確實地將電子元件搬入插置,可以利用該裳 的 (1 6 )所記裁之插接套件本體 2l92-5760-mN:).ptd 第25頁 1238257 五、發明說明(22) 較,形態,,其特徵在於:前述驅動體作用部的迴轉中心線 和前述閂鎖部的迴轉中心線為一致。 關於本形態相關之插接套件本體,因驅動體作用部之 迴轉中心線和問鎖部之迴轉中心嫂炎 , 楼Μ @ & 口〒“線為一致,可以使閂鎖機 構的構成早純化。 08 )前述(17 )所記載之插接套件本體的較佳形 其特徵在於:前述驅動體處於最遠離時,前述驅動體 作用部和前述閂鎖部,句令俞、十、 蜗I 0 3則逃迴轉中心線,相對於和前 述驅動體之接近遠離方向垂直之羋而 ^ ^ 4 c y , <啡/7 U 土且之十面,位於相反側的位 置。 關於本形態相關之插接套件本體,在驅動體 置為閉位置。因此,當驅動體作用部從: = 動體方向之作用而迴轉移動時,閃鎖部 ^轉移動至開位置,可以使驅動體作用部之迴轉 移動和閂鎖部之迴轉移動相連動。 刖述(1 7 )或是(1 8 )所記載之插接套件本 體、、特徵在》:前述迴轉中心線位於前述電子元件進入 附近,於刖述驅動體處時最遠離時,前述問鎖部的前 包含前述迴轉中心線,相對於和前述驅動體之= 向平行之平® ’位於接近的位置,同時位於前述導 心裝置口的附近。 關於本形悲相關之插接套件本體,位於閉位置之閂鎖V. Description of the invention (20) (14) The cutting instrument described in the above (13) is characterized in that: the preferred form of the medium moving body is broadcast from the direction of the driving body: the part is penetrated by the elastic member Moving away from the direction of the body of the plug-in socket kit related to this form = this = the action of the cylinder when the moving body is moving toward the body ^ & stomach n # t ^ τ, the moving body is subject to elasticity J 讣By moving in the direction of the driving body, the companion and the moving part of the driving body return to the ground. ^ & The approach part of the drive body also makes two movements with the drive body. = = =, the flash lock u W will move the movement, and the boat will not recognize it ^, and the swing movement of the flash lock will be reversed. "Movement", that is, the emotional movement of the approaching flash lock portion from the open position to the closed position by Yu Zai = zhe ί ΐ, "The slave drive body leaves the flash lock portion from the closed position toward the legacy drive body. The part moves from the closed position to the open position. Therefore, with regard to the plug-in kit related to this form; by moving the drive body toward and away from the plug-in kit body 2, the flash lock portion that can be pivoted from the open position to the closed position can be moved back to the open position again. Position, or swivel from the closed position to the open position, and swivel again to the closed position. ▲ (15) The preferred form of the plug kit body according to the item (13) or (u) above, characterized in that: when the driving body is farthest away, the driving body action portion is located near the driving body . ^ Regarding the plug-in kit body related to this form, the driving body moves a longer distance while acting on the acting part of the driving body, and is acted upon by the driving body. Page 24 2192 * 5760-FF (Nl) .ptd 1238257 V. Invention Explanation (21) The swivel angle of the swivel movement of the action part also increases, and the swivel angle of the latch part that generates swivel movement in conjunction with the swivel movement of the drive body action part also changes. Therefore, regarding the plug kit body and latch related to this form, The lock (the amount of movement of the open position and the closed position) is large, which can prevent a variety of ::: The electronic element falls out or the position is misaligned. 'Passing on' 16iJ =) ~ (15) The ^ direction 2 ^ of the body of the plug-in kit body: When the aforementioned driving body acts in a direction close to the aforementioned driving body, the driving body acting portion is generated To enable the aforementioned latching portion to shift back and forth from the aforementioned closed position, two ::: rotary movement of the body action portion -... ^ Regarding the plug kit body related to this form, when one piece is moved into the plug kit ·, Move the device inside the tested electrical and electronic devices closer to the electronics. The sub-components are moved into the socket to squeeze the drive body. If you move the φ direction and move through the device, you can make the H body close to the electronics. The direction of the component's entry surface is revolved with respect to the insertion position related to this form. The private ambassador moved into the plug-in kit body due to the parts will be tested by the electronic element: the linkage will be tested through this device: : In the rotation of the lock part, π to transfer the flash lock part back: Pieces into the plug-in kit to reliably move the electronic components into the plug-in, you can use the plug-in kit body 2l92-5760-mN as described in (1 6): .ptd page 25 1238257 V. Description of the invention ( 22) The shape is characterized in that the rotation centerline of the driving body action portion and the rotation centerline of the latch portion are consistent. Regarding the plug kit body related to this form, the rotation centerline of the action part of the driving body and the rotation center of the interlocking part are the same, and the building M @ & 口 "line is the same, so that the structure of the latch mechanism can be purified early. 08) The preferred form of the plug kit body described in the above (17) is characterized in that when the driving body is farthest away, the driving body acting portion and the latching portion, sentence Lingyu, ten, snail I 0 3 escapes the centerline of rotation, which is opposite to the direction perpendicular to the driving body's approach and departure direction ^ ^ 4 cy, < Brown / 7 U soil and ten faces, located on the opposite side. Interpolation related to this form The connector body is set to the closed position on the driving body. Therefore, when the driving body acting portion is pivotally moved from the action of the moving body direction, the flash lock portion ^ is moved to the open position, so that the driving body acting portion can be rotated The movement is linked to the turning movement of the latch. The main body of the plug-in kit described in (1 7) or (1 8) is described in the following: The centerline of the rotation is located near the entry of the electronic component. Farthest when driving body The front of the interlocking part includes the center of rotation, and it is located close to the level of the driving body, which is parallel to the direction, and is located near the mouth of the centering device. Kit body, latch in closed position
第26頁 1238257 五、發明說明(23) 的七端部,包含迴轉中心線,位於接近相對於驅動體之 接近遠離方向平行之平面的同時,也位於導芯裝置口附近 的位置’拌隨著閂鎖部的迴轉移動閂鎖部之前端部的移動 距離變長’因此閂鎖部的開閉量變大。 (20 ) 較佳形態, 驅動體作用 相對於和前 反側的位置 關於本 動所描劃出 轉中心線為 呈水平之平 用部產生作 體作用部之 確實地連動 又,關 和臂部,若 的接近遠離 側即可。 關於本 最遠離時, 端部所包括 前述(1 7 )〜 其特徵在於: 部和前述臂部 述驅動體之接 (1 9 )所記載之插接套件本體的 前述驅動體處於最遠離時,前述 ,對於前述迴轉令心線為垂直, 近返離方向平行之平面,位於相 形態相關之插 將在驅動體和 突起部設置於 被置於臂部之突 月 〜大起部的前Page 26 1238257 V. The seventh end of the description of the invention (23), including the center of rotation, is located near a plane parallel to the direction of the drive body, and it is also located near the guide core device. The rotation of the latch portion moves the moving distance of the end portion before the latch portion becomes longer, so the amount of opening and closing of the latch portion increases. (20) In a preferred form, the position of the driving body relative to the position on the front and the reverse side is drawn with respect to the horizontal centerline drawn by the movement, and the flat-use portion which is horizontal is generated as a solid-action portion, and the arm is closed. , If it is close to the far side. When the distance is the farthest, the end portion includes the aforementioned (1 7) ~, which is characterized in that: when the drive body of the plug-in kit body described in the connection (1 9) between the drive portion and the drive body of the arm portion is at the farthest position, As mentioned above, for the plane of rotation that the heart line is vertical and the near-return direction is parallel, the interposition related to the phase shape will be provided in the driving body and the protruding part in front of the protruding moon placed on the arm ~ the front of the large rising part.
2192-5760-PF(Nl).?td 第27頁 形態相 驅動體 垂直, 面的相 用但對 迴轉移 ’由此 於本形 能滿足 方向為 關之插 作用部 因為位 反側, 臂部不 動以及 ,可以 態相關 「相對 水平」 接套件 的軌道 於相對 可以使 產生作 閂鎖部 確保閂 之插接 於迴轉 之條件 接套件 電子元 臂部, 本體, 和臂部 於驅動 驅動體 用,由 之迴轉 鎖部能 套件本 中心線 ,相對 拌隨著 的執道 體之接 之移動 此,可 移動可 有較大 體,驅 為垂直 於某平 本體,例如:於^ -^ 動體在 件進入面之間所存 驅動體的移 ’相對於迴 近遠離方向 對驅動體作 以使得驅動 以透過臂部 之開閉量。 動體作用部 ’在驅動體 面位於相反 12382572192-5760-PF (Nl).? Td Page 27 The morphological phase drive body is vertical, the phase phase is used but the transfer is reversed ', so that this shape can satisfy the direction of the interposition. Because the opposite side, the arm It can be fixed and related. The relative orbit of the adapter is relative to the condition that can be used as a latch to ensure that the latch is connected to the rotation. The adapter electronic arm, body, and arm are used to drive the drive body. As a result, the swivel lock can be installed on the centerline of the center, and can move relative to the follower body. This can be moved to have a larger body, which is driven perpendicular to a flat body, such as: ^-^ The movement of the driving body stored between the entry surfaces is performed on the driving body with respect to the approaching direction, so that the driving body passes through the opening and closing amount of the arm. Moving body action part ’is opposite to the driving body surface 1238257
五、發明說明(24) 端部成為驅動體作用部,驅動體作 轉中心蟯A, 驅動體作用。Μ口臂部,相對於迴 平面位於相反側。接近遠離方向為水平之 佳开」21L!述(4)〜(20)所述之插接套件本體的較 佳开…其特徵在於:為了使前 ?乂 涉前述插接奈桦太轉丁、门Μ < %助杜作用部能在不干 要 6 紅下Κ轉移動’於前述插接套件本體嗖 置可收容前述驅動體作用部之收容部。乩插接套件本體。又 電子=i=::之插接套件本體,收容部,例如:在 用部之凹部。 乂叹置可用來收容驅動體作 關於本形態相關之插接套 以被收容於插接矣杜士雕^ 件本體,因驅動體作用部可 ^^^^ίί^#,|§^^^"""Γ 動體作用部之迴;二=由此可以 I問鎖部有較大的迴轉移動。 (22 )本發明相關之插接套 述(1 )〜(3 )所記載之導—. ”特徵在於包括.刖 所記載之插接套件本體。,",以及前述⑷〜⑺) 關於本形態相關之插接套 )〜⑴所記載包括導芯:作件用本/’可以發揮前述(1 (…任意項所記載包括插接套?本體以= (23 )前述(22 )所記載 % <插接套件的較佳形態,其 2192-5760-PF(Nl).ptd 第28頁 1238257 五、發明說明(25) 特徵在於:前述插接套件係將被測試電子元件搬送至 元件測試裝置之測試頭的連接部,並: 於搬出托盤上。 哥冤千兀件敦設 於二子元件測5式裴置之測試頭的連接部,設置用 置被測試電子元件之測試頭 尤 斤 裝 測試。 幻β式頭,在此進灯破測試電子元件之 關於本形態相關之插接套件本體,可 行:被測試電子元件朝連接部被搬送、 ^效率也進 子元件的測試、以及測試—墓 連接部被測試電 又,由於在托盤上裳置複數的生”口,出。 複數個的電子元件的測試。 牛 k成可同時進行 (24 )本發明相關之電子元件移搬穿 於:於插接套件收納面陣列型電子w特徵在 列件的外部端子和插槽的連in相;Γ 以進仃則述面陣列型電子元件的測 2知子相連接, 置,·而前述插接套件是包括(2 ^凡件移搬裝 接套件。 4 )項所記載之插 關於本形態相關之電子元件移 (22)或“23)所記载之插接套Ϊ之:包括前述 實施方式: 以下,依據圖式說明本發明 第1圖是表示關於本發Ί ·。 之電子兀件測試裝置之-實 2192~S760-PF(Nl).ptd 第29頁 1238257 五、發明說明(26) 施例的IC測試裳置之 測試裝置之移搬機的 的方法之托盤的流程 之IC收納器之構造的 測試裝置之客製托盤 I C測試裝置之測試托 被使用於此I C測試裝 體圖,第8 (a)圖是 之本體部的上視圖; 圖;第9 (a )圖是表 第9 ( b )圖是第9 ( a 由被設置於此插接套 此插接套件本體之順 插接套件本體之上視 A-A剖面圖;第12 (a5. Description of the invention (24) The end part becomes the driving body acting part, and the driving body acts as the center of rotation 蛲 A, and the driving body acts. M mouth arm is located on the opposite side with respect to the gyrus. The close-away direction is horizontally good opening "21L! The better opening of the plug-in kit body described in (4) to (20) above ... It is characterized by: In order to make the front? Involved in the aforementioned connector, the Nerva spp. And the door M <% assisting action part can be moved at the same time as the 6 red and 'K' movements. 'The receiving part that houses the driving part action part is placed in the receiving part. .乩 Plug kit body. And the body of the plug-in kit of electronic = i = ::, the receiving part, for example, the recessed part of the in-use part. The sigh can be used to accommodate the driver as a plug socket related to this form to be contained in the body of the connector 矣 Dushi carving ^, because the driver's action part can be ^^^^ ίί ^ #, | § ^^^ " " " Γ The return of the moving body action part; Second = This can ask the lock part to have a large swivel movement. (22) The guides described in (1) to (3) of the plug sockets related to the present invention are characterized by including the plug kit body described in. 刖, ", and the aforementioned ⑷ ~ ⑺). Shape-related plug sets) ~ 记载 Included guide cores: Workbooks / 'can play the aforementioned (1 (…) Any item including plug-in sets? The main body is = (23)% of the above (22) < A preferred form of the plug-in kit, which is 2192-5760-PF (Nl) .ptd Page 28 1238257 V. Description of the invention (25) The feature is that the aforementioned plug-in kit transfers the electronic component to be tested to the component test device The connection part of the test head is also placed on the carrying tray. Brother is installed in the connection part of the test head of the type 5 Pei test of the two sub-components, and the test head of the test electronic component is installed. The magic β-type head is here to break the plug assembly body of the test electronic component related to this form, which is feasible: the tested electronic component is moved toward the connection part, the efficiency is also included in the test of the sub-component, and the test-tomb The connection part was tested again because The number of raw "mouth, out. Test of multiple electronic components. Niu Cheng can simultaneously carry out (24) the electronic components related to the present invention can be moved through: in the plug-in kit to store the surface array type electronic features. The external terminal and the connection phase of the socket are connected; the connection of the surface array type electronic component is described, and the above-mentioned plug-in kit includes (2 ^ all pieces of moving and mounting kit). 4) The plugs described in item (2) or the plugs described in (23) or "23) related to this form include the foregoing embodiments: The following is a description of the present invention with reference to the drawings About this hairpin .. of the electronic component testing device-real 2192 ~ S760-PF (Nl) .ptd Page 29 1238257 V. Description of the invention (26) Removal of the test device of the IC test dress of the embodiment The method of the flow of the tray, the structure of the tester structure of the IC container, the test tray of the custom tray IC test device is used in this IC test package, Figure 8 (a) is a top view of the main body; Figure; Figure 9 (a) is the table Figure 9 (b) Figure is the 9 (a by being installed here This plug-in connector on the package body of the package body along A-A sectional view of FIG; section 12 (a
全體側視圖;第2圖是表示關於此I C 立體圖;第3圖是表示處理被測試j c 圖;第4圖是表示關於此〗c測試裝置 立體圖;第5圖是表示被使用於此1C 的立體圖;第6圖是表示被使用於此 盤之部分分解立體圖;第7圖是表示 置與本發明相關之插接套件的分解iz 表示構成此插接套件之插接套件本楚 第8 (b )圖是第8 (a )圖之A — A剖面 不構成此插接套件之導芯的上視圖; )圖之A-A剖面圖;第10圖為說明經 件本體之掛鈎機構,將此導芯裝設紙 序的部分剖面圖;第11 (a )圖是此 圖;第1 1 ( b )圖是第11 ( a )圖之 )圖是表示關於被設置於此插接套科 本體之閂鎖機構,當閂鎖部處於閉位置時的剖面圖(相當 於第1 1 ( b )圖);第1 2 ( b )圖是表示此閂鎖機構處於開 位置時的剖面圖;第1 3圖是表示此I C元件測試裝置之測試 頭插槽附近的構造之分解立體圖;第14圖是表示此1C元件The overall side view; Fig. 2 is a perspective view showing the IC; Fig. 3 is a perspective view showing the test jc; Fig. 4 is a perspective view showing the test device; Fig. 5 is a perspective view showing the 1C. ; Figure 6 is a partially exploded perspective view showing a part used in this disc; Figure 7 is an exploded view showing a plug kit related to the present invention iz represents a plug kit constituting the plug kit 8 (b) The figure is the top view of section A—A of Figure 8 (a), which does not constitute the guide core of this plug-in kit;) Section AA of the figure; Figure 10 illustrates the hook mechanism of the warp body. Partial cross-sectional view of the paper sequence; Figure 11 (a) is this figure; Figure 1 1 (b) is Figure 11 (a) Figure 11 is a diagram showing the latches provided on the socket body Sectional view of the mechanism when the latch portion is in the closed position (equivalent to Fig. 1 (b)); Fig. 12 (b) is a sectional view showing the latch mechanism in the open position; Fig. 1 3 It is an exploded perspective view showing the structure near the test head socket of this IC component test device; FIG. 14 is a view showing this 1C component
測試裝置之測試頭插槽附近的構造之部分剖面圖;第1 5圖 是經由被設置於此插接套件本體之掛鈎機構來安裝此導芯 於此插接套件本體時,以及經由被設置於此插接套件本 體之掛鈎機構來將此導芯從此插接套件本體卸下時所使用 之夾具之側視圖。Partial cross-sectional view of the structure near the test head slot of the test device; Figures 15 and 15 show when the guide core is mounted on the plug-in kit body via a hook mechanism provided on the plug-in kit body, and via the The hook mechanism of the plug kit body is a side view of a clamp used when the guide core is removed from the plug kit body.
2192-5760-PF(Nl).ptd 第30頁 1238257 五、發明說明(27) 又’第3圖是用來理解與本實施例相關之丨C元件測試 裝置之被測試1C元件的處理方法之圖式,也有部分構件實 際上是被配置於上下方向但在此以平面的方式顯示。因 此’該機械性(三度空間)構造參照第2圖來加以說明。 首先,說明本實施例相關之丨c元件測試裝置的全體構 成。 如第1圖所示,本實施例相關之丨c元件測試裝置丨〇包 括:移搬機1、測試頭5與測試用主裝置6。移搬機i,將需 進行測試之電子元件的1C元件依次搬送至被設置於測試頭 5的上側連接部9之插槽’並將完成測試之I c元件依測試結 果分類收納於既定之托盤。i C元件測試裝置1 〇測試對象之 IC元件包括:B G A、L G A、P G A、C S Ρ等之面陣列型I c元件。 連接部9之插槽,透過測試頭5以及纜線7和測試用主 裝置6以電氣相接連,而可從插槽裝卸之ic元件,能透過 測試頭5以及纜線7和測試用主裝置6以電氣相接連。被裝 設於插槽之I C元件,從測試用主裝置6被施于測試用電氣 信號後,從I C元件所被讀出之應答信號,透過纜線7被傳 回到測試用主裝置6,由此可以測試出I C元件的性能和機 能等。 在移搬機1的下部,内藏主要用以控制移搬機1之控制 裝置’在這其中一部分設置空間部分8。在此空間部分8, 測試頭5被配置成可以自由交換,通過被形成於移搬機1之 貫穿孔可以將I C元件於被設置於測試頭5上側之連接部9的 插槽上裝卸。2192-5760-PF (Nl) .ptd Page 30 1238257 V. Description of the invention (27) and 'Figure 3 is used to understand the processing method of the tested 1C component of the C component testing device related to this embodiment. In the drawing, some components are actually arranged in the up-down direction, but are shown in a planar manner here. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG. 2. First, the overall configuration of the c-component tester according to this embodiment will be described. As shown in FIG. 1, the c-component test device related to this embodiment includes: a transfer machine 1, a test head 5, and a test main device 6. Transfer machine i, sequentially transfer the 1C components of the electronic components to be tested to the slots provided at the upper connection portion 9 of the test head 5 ', and store the I c components that have completed the test in a predetermined tray according to the test results. . IC device test device 10 IC components to be tested include: B G A, L G A, P G A, C S P, and other surface array type IC devices. The slot of the connecting portion 9 is electrically connected through the test head 5 and the cable 7 and the test main device 6. The ic component that can be detached from the slot can pass through the test head 5 and the cable 7 and the test main device. 6 Electrically connected. After the IC device installed in the slot is applied with the test electrical signal from the test main device 6, the response signal read from the IC device is transmitted back to the test main device 6 through the cable 7, This can test the performance and function of IC components. In the lower portion of the transfer machine 1, a control device, which is mainly used to control the transfer machine 1, is built. A space portion 8 is provided in this portion. In this space portion 8, the test head 5 is configured to be freely exchangeable, and an IC component can be attached to and detached from the slot of the connection portion 9 provided on the upper side of the test head 5 through a through hole formed in the transfer machine 1.
2192-576〇.PF(Nl)iPtd 第31頁 12382572192-576〇.PF (Nl) iPtd Page 31 1238257
於較1C裝置10 ’為將需測試之電子元件之1c元件 狀離度狀.態(高溫)或是較常溫為低之溫度 第Γ圖J J 測試之裝置,移搬機1,如第2圖以及 所構::於上括由恒溫槽101、測試搶室102和除熱槽1〇3 構成之艙至郤1 00。如第i圖所示被設置於測試頭5之 貝 $連接部9 ’被插入測試艙室1〇2的内部, 兀件之測試。 处退订i l 如第2圖以及第3圖所示,IC元件測試裝置1〇中之移搬 之構成包括:I C收納部2〇 〇,收納即將進行測 件或是將完成測試之Ic元件分類收納;褒載部3〇〇”,將由 C收肩邛2 〇 0所送來之被測試丨c元件送入艙室部1㈣;搶室 〜包含測試頭5 ;卸载部400,將在艙室部1〇〇完成測 /之IC元件分類取出。又,丨c元件於移搬機}的内部,被 測試托盤所收納及搬送。 1C元件被收納於移搬機1之前,如第5圖所示被大量收 納於客製托盤KST内,於該狀態下,如第2圖及第3圖所示 被供給至移搬機1之1C收納部2〇〇,因此,IC元件在移搬機 1内被搬送,從客製托盤KST被載換至測試托盤TST (參照 第6圖)。於移搬機1的内部,如第3圖所示,I c元件在被 乘載於測試托盤T S T之狀態下移動,被施以高溫或是低溫 應力,測試(檢查)是否正常作動,按照該測試結果來加 以分類。以下’關於移搬機1的内部,個別地詳加說明。The device 1 'is 10c below the 1C device, which is the 1c component-like separation state of the electronic component to be tested. The state (high temperature) or a temperature lower than normal temperature. Figure Γ JJ testing device, transfer machine 1, as shown in Figure 2 And structure: In the above, the cabin composed of the constant temperature tank 101, the test grab room 102, and the heat removal tank 103 is up to 100. As shown in FIG. I, the connection part 9 ′ provided in the test head 5 is inserted into the interior of the test chamber 102 to test the components. Unsubscribe il As shown in Figure 2 and Figure 3, the components of the IC component test device 10 for relocation include: IC storage section 200, which stores the test pieces that are about to be performed or classifies the IC components that have completed the test. Storage; load section 300 ”, will send the tested component sent by C to shoulder 2,000 丨 c component into the cabin section 1㈣; grab the room ~ contains the test head 5; unloading section 400, will be in the cabin section 1 〇〇Complete the sorting and removal of IC components. In addition, 丨 c components are stored and transported by the test tray inside the transfer machine}. 1C components are stored before the transfer machine 1, as shown in Figure 5 A large amount is stored in the custom tray KST, and in this state, it is supplied to the 1C storage section 200 of the transfer machine 1 as shown in FIG. 2 and FIG. 3. Therefore, the IC components are stored in the transfer machine 1. During transportation, the custom tray KST is transferred to the test tray TST (refer to Figure 6). Inside the transfer machine 1, as shown in Figure 3, the I c element is loaded on the test tray TST. Move, apply high or low temperature stress, test (check) whether it works normally, and classify according to the test result. Next, the inside of the transfer machine 1 will be described in detail individually.
第1,說明和I C收納部2 〇 〇相關連之部分。First, the parts related to the IC storage unit 2000 will be described.
2192-5760-PF(Nl).ptd 第32頁 1238257 五、發明說明(29) ίΓ如f 2圖所示,於IC收納部200設置:用來收納測試前 控昭測試前IC儲存器201,以及將測試後之1C元件 、::二二果來分類收納之測試後IC儲存器202。 測=前ic儲存器201及測試後1(:儲存器2〇2,如第4圖 括:框狀之托盤支持框20 3、及從此托盤支持框 ί入後可以往上部昇降之昇降台204。於托盤支 可以口蔣//複數疊合之客製托盤KST,透過昇降台204 了以”將客製托盤KST朝上下移動。 夕ΤΓ如f 2圖所示於測試前1C儲存器201,用來收納測試前 =1C疋件的客製托盤KST被堆疊支持在此, KST被堆疊支持在此。 忏的各衣托盤 ”二;”前1C儲存器201和測試後1c儲存器202,因為 同或疋略相同之構造,所以測試前Ic儲存器201可以 乂測试後1C儲存器202來使用’反之也可以。因此,測 试則1C儲存器201之數量及測試後1(:儲存器2〇2之數 以按,日、?、需要容易地加以變更。 存二第第3圖所示’於本實施例,設置2個的儲 存益STK-Β來作為測試前IC儲存器2〇1。於 相鄰,設置2個可以被搬送至卸載部4〇〇之空丄哭 ^2192-5760-PF (Nl) .ptd Page 32 1238257 V. Description of the Invention (29) As shown in Figure 2, Γ is set in the IC storage section 200: it is used to store the pre-test IC memory 201 before the test, And the post-test IC memory 202 which classifies and stores the 1C components and :: 2 two fruits after the test. Test = front ic storage 201 and post-test 1 (: storage 2 002, as shown in Figure 4): frame-shaped tray support frame 20 3, and the lifting platform 204 that can be raised and lowered from the tray support frame . On the tray support, the custom tray KST can be overlapped with one another. // Through the lifting platform 204, the custom tray KST is moved upward and downward. As shown in the figure 2 in the figure 1, the tester 1C storage 201, The custom tray KST, which is used to store the 1C parts before the test, is stacked and supported here, and the KST is stacked and supported here. The clothing racks of the "2"; "front 1C storage 201 and post-test 1c storage 202, because The structure is the same or slightly the same, so the IC memory 201 before the test can be used with the 1C memory 202 after the test, and vice versa. Therefore, the number of the 1C memory 201 and the 1 (: memory) after the test The number of 002 can be easily changed according to the date, day, date, and time. As shown in Figure 3, “two” STK-B is set as the pre-test IC memory 2 in this example. 1. Adjacent to each other, there are 2 empty spaces that can be transported to the unloading department 400. ^
來當作測試後1C儲存器2〇2。又,於該相鄰之〆,ro ~E 來當作測試後1C儲存器202,設置8個的儲存^ ’’、] I用 STK — 2.....STK — 8,構成可以按照測試之奸:田夕叮、 8類來加以收納。也就是說,在良品及取夕β分成 Κ σσ以外,可以Let's treat it as 1C storage 202 after the test. In addition, in this adjacent area, ro ~ E is used as the 1C storage 202 after the test, and 8 storages are set ^ ",] STK — 2 ..... STK — 8 is used. The composition can be tested according to the test. Rape: Tian Xiding, 8 types to be contained. In other words, in addition to the good product and the β-split κ σσ, you can
2192-5760-I^(Nl).ptd 第33頁 12382572192-5760-I ^ (Nl) .ptd Page 33 1238257
再分類成·良品中有高速作動速度之元件、中速之元件、 低速之元件、或是不良品之中須進行再測試之元件等。 第2 ’針對裝載部30〇相關連之部分加以說明。Reclassified into high-quality components with high-speed operating speed, medium-speed components, low-speed components, or defective components that require retesting. The second part is related to the loading section 30o.
在第4圖所示被收納於測試前丨c儲存器2 〇 1之托盤支持 框203的客製托盤KST,如第2圖所示,透過被設置於iC收 納部2 0 0和裝置基板1 〇 5之間的托盤移送臂2 〇 5,被搬送至 裝载部300的窗部306之裝置基板1〇5的下側。而且,於此 裝载部300,將被安放在客製托盤KST之被測試1(:元件經 由X-Y搬送裝置3 04暫送至調整器3〇5 (preciser),於此 修正被測試I C元件之相互位置後,隨即將被移送至調整器 305之被測試1C元件再度以χ_γ搬送裝置3〇4,載換至 於裝載部300之測試托盤TST。 用來將被測試I c元件從客製托盤KST載換至測試托盤 tst之X-γ搬送裝置304,如第2圖所示,包括:2根轨道 301,被架設於裝置基板1〇5之上部;可動臂3〇2,透過此 =之軌道3G1可在測試托盤TST和客製托盤KST之間往復移 30? /^ I 2頭3〇3 ’被此可動臂3〇2所支撐可沿著可動1 在X方向移動。As shown in FIG. 4, the custom tray KST stored in the tray support frame 203 of the c storage 2 〇1 before testing is transmitted through the iC storage unit 2 0 0 and the device substrate 1 as shown in FIG. 2. The tray transfer arm 2 05 between 0 and 5 is carried to the lower side of the device substrate 105 of the window portion 306 of the loading unit 300. In addition, in the loading section 300, the tested part 1 (the component is temporarily placed on the custom tray KST through the XY transfer device 3 04 to the adjuster 3 05 (preciser), and the IC component under test is corrected here. After the mutual position, the 1C component to be tested that is to be transferred to the adjuster 305 is transferred to the test tray TST of the loading section 300 again by the χ_γ transfer device 304. It is used to transfer the tested I c component from the custom tray KST The X-γ conveying device 304 transferred to the test tray tst, as shown in FIG. 2, includes: two rails 301, which are mounted on the upper part of the device substrate 105, and a movable arm 302, which passes through the track The 3G1 can move back and forth between the test tray TST and the custom tray KST by 30 ° / ^ I 2 heads 303 'Supported by this movable arm 302 can move along the movable 1 in the X direction.
於X Y搬达裝置304之可動頭303,吸附頭被朝下安 哀,吸附頭在吸引空氣的同時At the movable head 303 of the X Y conveying device 304, the suction head is faced down, and the suction head is attracting air at the same time
KST將被測試IC元件吸料,將寸1砂功 攸各衣托I 杯般τςτ mu件及附將戎破測試1C元件載換至測 托盤T S Τ。像运樣之吸附頭,例 ^ L ^ Π7 ^ 例如裝置8個之可動頭3 0 3 便一二人可將8個被測讀、y ρ分杜脊4么 做列4 1 L兀件载換於測試托盤TST。KST will be sucked by the test IC components, and will transfer 1 inch sand and various I-cup-like cups to τςτ mu pieces and attach the test 1C components to the test tray TS. Such as the suction head, for example, ^ L ^ Π7 ^ For example, 8 mobile heads 3 0 3 can be read by one or two people, and y ρ can be divided into 4 rows and 4 1 L pieces. Change to test tray TST.
1238257 五、發明說明(31) 第3,針對艙室部100關連之部分加以說明。 上述之測試托盤TST,在裝栽部3〇〇將被測試1(:元件穿 載後,送入艙室部100,於被搭栽於測試托盤TST之狀態4 對各被測試I C元件進行測試。 k 如第2圖以及第3圖所示,艙室部ι〇〇是由下列單元所 構成··恒溫槽101,對被裝載於測試托盤TST之被測試1(:元 件施加目標之高溫或是低溫之熱應力;測試艙室丨〇 2,於 此恒溫槽1 0 1將被施加熱應力的狀態之被測試丨c元件裝設 於測試頭5上之插槽以進行測試;以及除熱槽丨〇3 ,將^0測 试搶室】0 2被進行測試之被測試I c元件,所被加諸之熱應 力去除。 於除熱槽1 0 3 ’在恒溫槽1 〇 1被施加高溫的情況下,對 被測試IC元件送風加以冷卻至室溫,又於恒溫槽1 〇 1施加 低溫的情況下,對被測試I C元件以暖風或是加熱器等加以 加熱回復至不產生結露的溫度之程度。之後,將此被除熱 之被測試I C元件搬出至卸載部4 0 〇。 如第2圖所示,艙室部1 〇 〇之恒溫槽1 〇 1以及除熱槽 1 0 3,被配置成比測試艙室1 〇 2更突出於上方。又,恒溫槽 101,如第3圖所概念性地表示,設置有垂直搬送裝置,在 測試艙室1 02清空之前,複數枚的測試托盤被此垂直搬 送裝置支持以進行待機。在此待機的期間,主要是對被測 試I C元件施加高溫或是低溫的熱應力。 於測試艙室1 0 2,在該中央下部配置測試頭5,測試托1238257 V. Description of the Invention (31) Third, the relevant part of the cabin section 100 will be described. The test tray TST mentioned above will be tested in the loading section 300 (1: After the component is worn, it will be sent to the cabin section 100, and each test IC component will be tested in the state 4 of being mounted on the test tray TST. As shown in Fig. 2 and Fig. 3, the compartment section ι〇〇 is composed of the following units. The thermostatic bath 101 is applied to the test tray 1 loaded on the test tray TST. Thermal stress; test chamber 丨 〇2, where the thermostatic bath 101 is to be tested in a state where thermal stress is applied 丨 c component is installed in the slot on the test head 5 for testing; and heat removal tank 丨 〇 3, ^ 0 test to grab the room] 0 2 the tested I c component to be tested, the added thermal stress is removed. In the heat removal tank 1 0 3 ′ in the constant temperature tank 1 〇1 high temperature situation Then, the IC device under test is cooled down to room temperature by supplying air to it, and when a low temperature is applied to the constant temperature bath 101, the IC device under test is heated to a temperature where no condensation occurs by heating with a heater or a heater. After that, the IC device under test whose heat has been removed is carried out to the unloading section 40 〇 As shown in FIG. 2, the constant temperature tank 1 0 and the heat removal tank 103 of the cabin section 100 are arranged to protrude above the test chamber 1 102. Further, the constant temperature tank 101, as shown in FIG. The figure conceptually shows that a vertical transfer device is provided. Before the test chamber 102 is emptied, a plurality of test trays are supported by the vertical transfer device for standby. During this standby period, the IC components under test are mainly applied. High temperature or low temperature thermal stress. Test chamber 102 is located in the test chamber, and a test head 5 is arranged at the lower part of the center to test the support.
1238257 一 丨丨 五、發明說明(32) = = = :式頭5上。於此,如第6圖所示由測試托 盤TST所保持之全.P的! c元件順次和測試頭5電氣性地 觸,對測試托盤TST内所有之1(:元件進行測試。另外— 成測試之測試托盤TST,於除熱槽103被除熱,將IC元件70 溫度回復至室溫,隨即如第2 Μ α Μ 載部4 Ο 0。 ,,攸饼出至卸 立β ί白t Ϊ I圖所不,於恒溫槽1 〇 1及除熱槽1 0 3的上 =,各自形成為從裳置基板1〇5送入測試托盤tst之進入 知口部,及測試托盤TST送山$ _ ¥ a: ! nc; 用 部。於裝置基板1〇5,裝置;;^出口用開口 :=盤搬送装置108。此等測試托盤搬送 ^置某板1 上之^迴轉滾輪等所構成。經由被設置於此 排出之測試托盤m,透==08,被從除熱槽103 回恒溫槽ΗΠ。 透過卸載部wo以及裝載部3〇〇被送 測試托盤TST,如第R m _ 形框12以平行且等間二:所7,具有矩形框12,於此矩 的兩側,及和此等緣框=硬數的緣框13。於此等緣框13 側,複數的安褒片^自矩形框12的邊123的内 成。被設置於此等緣框邊方向被以等間隔地突出形 複數之安裝片14之中透以及緣框13和邊12a之間的 接套件收納部15。 相對之2個的安裝片14,構成插 於插接套件收納部i 5, 件16的方式被構成。於奸垃=各自可以收納1個之插接套 ; 接套件16的兩端部,各自形成用 2192-5760-PF(Nl).ptd 第36頁 1238257 1—_____________ 五、發明說明(33) 來安裝於安裝片1 4之安裝用孔2 1,插接套件1 6使用結件 (fastener )安裝於2個的安裝片η形成浮動狀態(可在 二次元微動之狀態)。如此之插接套件1 6,例如在1個之 測試托盤TST安裝4 X 1 6個左右,由於將被測試I c元件收納 於插接套件1 6,所以可將被測試丨c元件積入測試托盤 TST 〇 被測試I C元件,如第6圖所示被配置成4行X 1 6列的情 况’例如於各行隔4列被配置之被測試IC元件可以同時被 ^試。也就是說,在第1回之測試,於各行被配置在第1、 5、9及1 3列之1 6個被測試I c元件同時被測試,於第2回之 。式’使測試托盤TST移動一列的距離使被配置於第2、 3 1 0及1 4列之被測试I c元件同時被測試,重複此一動作 對^部的被測試IC元件進行測試(也就是所謂的16個同時 j減)。此測試的結果,由測試托盤TST被賦予之例如是 =編號,及測試托盤TST的内部所分配被測試1(:元件的 、’扁號所決定的位址來記憶。 散叹谷於插接套件16之被測試1C元件的一例,如% ^ ^ Γ、。第1 8 ( a )圖是被測試1 C元件的側視圖,第1 8 - :9疋被測试1C兀件的下視圖。如第1 8圖所示,被測言 =2,於封裝本體21的下面23作為外部端子22之焊球 陣列狀配置於此,為r G A刑τ Γ ; μ 封裝太麟件。於配列外部端子Μ 封裝,21的下面23 ’相當於Ic元件2的外部端子面。 括姐Ϊ關本實施例之插接套件16,如第7圖所示,包括 插接套件本體17、導芯18和拉桿片19。1238257 A 丨 丨 V. Description of the invention (32) = = =: On the head 5. At this point, as shown in Figure 6, the test tray TST holds all the .P! c The components are in electrical contact with the test head 5 in sequence, and all 1 (: components in the test tray TST are tested. In addition, the test tray TST that has been tested is removed from the heat removal tank 103 and the temperature of the IC component 70 is restored. At room temperature, then as the second Μ α Μ loading section 4 〇 0., the pie is out to the stand β ί white t Ϊ I as shown in the figure, on the thermostatic bath 10 and the heat removal tank 103 =, Each formed to enter the test mouth tst from the base plate 105 into the test tray tst, and the test tray TST to send to the mountain $ _ ¥ a:! Nc; user. On the device substrate 105, the device; ^ Opening for exit: = tray transfer device 108. These test trays are transported ^ set by ^ rotary rollers, etc. on a certain plate 1. Through the test tray m which is set to be discharged here, the penetration == 08 is removed from the heat The tank 103 returns to the constant temperature tank ΗΠ. The test tray TST is sent through the unloading part wo and the loading part 300, such as the R m _ shaped frame 12 in parallel and equal two: so 7, with a rectangular frame 12, Both sides, and these edge frames = hard number edge frame 13. On the side of these edge frames 13, a plurality of security tabs ^ are formed from the inside of the side 123 of the rectangular frame 12. They are arranged here The frame edge direction is projected through the plurality of mounting pieces 14 at equal intervals, and the socket receiving portion 15 between the edge frame 13 and the side 12a. The two mounting pieces 14 are configured to be inserted into the socket receiving portion. Parts i 5, 16 are constructed. Yu rape = each can be inserted into a socket; the two ends of the socket 16 are formed 2192-5760-PF (Nl) .ptd page 36 1238257 1 —_____________ 5. Description of the invention (33) Mounting holes for mounting on the mounting plate 1 4 2 1 and the plug-in kit 16 6 Fasteners are used to mount on 2 mounting pieces η to form a floating state (can be The state of the micro-movement). In this way, the plug-in kit 16 is installed in one test tray TST, for example, 4 X 16 or so. Since the IC components to be tested are stored in the plug-in kit 16, it can be tested.丨 c components are accumulated in the test tray TST 〇The IC components under test are arranged in 4 rows X 1 6 columns as shown in FIG. 6 'for example, the IC components under test arranged in 4 columns in each row can be tested simultaneously In other words, in the first test, each row is arranged in 16 of the 1, 5, 9, and 13 columns. The test I c element is tested at the same time, in the second round. The formula 'moves the test tray TST by a distance of one row so that the test I c elements arranged in the second, third, tenth, and fourteenth rows are tested simultaneously and repeated This action tests the IC components under test (the so-called 16 simultaneous j minus). The result of this test is given by the test tray TST, such as = number, and the internal allocation of the test tray TST. Tested by 1 (: component, the address determined by the 'flat number' to be memorized. An example of the tested 1C component in the plug-in kit 16, such as% ^^^. Figure 18 (a) is a side view of the 1C component being tested, and Figures 18-: 9 疋 are the bottom views of the 1C component being tested. As shown in FIG. 18, the measured word = 2 is arranged on the lower surface 23 of the package body 21 as an array of solder balls of the external terminals 22, which is r G A penalty τ Γ; In the case where the external terminal M package is arranged, the lower surface 23 'of 21 corresponds to the external terminal surface of the Ic element 2. As shown in FIG. 7, the plug-in kit 16 of the present embodiment includes a plug-in kit body 17, a guide core 18, and a tie bar piece 19.
1238257 五、發明說明(34) 插接套件本體17,如第7圖所示’包括:本體部171、 掛釣機構F和閃鎖機構L。於插接套件本體17的本體部171 的約略中央,如第7圖及第8圖所示,設置在上下方向開口 之元件導引部1 7 1 a。元件導引部1 7 1 a,如第8圖所示,於 上端部包括元件進入口 171b,在下端部包括導芯裝置口 1 7 1 c。元件進入口丨7丨b和導芯裝置口〗7丨c為相連通,構成 可以將從元件進入口 171b所進入之1(:元件導向被安裝於導 芯裝置口 171c之導芯18。由此,經由χ-γ搬送裝置3〇4由客 製托盤KST搬送至測試托盤TST之被測試1(:元件,被元件導 引部171a所導引,被搬入安裝於導芯裝置口 17lc之導芯 H又,被測試1(:元件於測試後,完成測試之】c元件,經 由兀件導引部171a加以導引,形成可以從元件進入口 搬出的構成。 ;插接套件本體17的本體部1 7 1的上側,如第7圖所 示,拉桿片1 9隔著壓力强势]a —壯士人,如乐(圖所 經由墨力彈菩H在W 94被安裝於此。拉桿片19, m分離之方向)從插接套件本體17的本體部 體17的本體部171樓近二古*文到往下方(往插接套件本 動,當該擠壓力解除時的Λ壓力時則往下方移 移動。當拉桿片19往上;堊力彈黃194的擠壓力往上方 之凸部191,盥开彡占认4移動之際,由於形成於拉桿片Π 1 71 d的卡合/限制;#接套件本體17的本體部171之凹旬 在拉桿片往上方之移動量。 1 92,使插接套件太 、处,如第7圖所不,設置開口部 套件本體17的本體部171之元件進入口 17。可 1238257 五、發明說明(35) 以珞出。拉桿片19之開口部192,為了不妨害通過元件進 入口 171b 1C元件之搬入及搬出,又,如後述不妨害閂鎖 175的迴轉,被形成比元件進入口稍大。又,於拉桿 片19 ,如第7圖所示,貫穿孔193被設置於和插接套件本體 17之本體部171的芯鉗收容部nie相連通,如第15圖所示 夾具G的軸GF,可通過拉桿片19的貫穿孔193進入芯鉗收容 部1 7 1 e之内。 一於插接套件本體1 7的本體部1 7 1的下側,如第7圖所 =,導芯1S被裳設於此。導芯18,如第7圖及第9圖所示, 包括·元件支持部181 5由底板部和從底板部豎立設置之 側板邛所構成;以及突緣部丨83,被設置於元件支持部m =側板部,上蠕周緣部ϋ於元件支持部181的底板部的略 如第?圖及第9圖所示,設置開口部182,而元件支 持部18i之底板部,藉由開口部182的周緣部188以支持ic 儿件的外部端子面。而且,被元件支持部1 8 1所支持之I c 凡件的外部端子,通過開口部1 8 2露出於插槽的連接端子 於導芯18的上端,如第7圖及第9圖所示,設1238257 V. Description of the invention (34) The plug-in kit body 17, as shown in FIG. 7, includes: a body portion 171, a fishing mechanism F, and a flash lock mechanism L. At approximately the center of the main body portion 171 of the plug kit body 17, as shown in FIGS. 7 and 8, a component guide portion 1 7 1 a opened in the vertical direction is provided. The component guide 17 1 a, as shown in FIG. 8, includes a component inlet 171 b at an upper end portion, and a guide hole 1 7 1 c at a lower end portion. The component access port 丨 7 丨 b and the guide core device port 〖7 丨 c are in communication, constituting 1 (: component guide is installed at the guide core 18 of the core guide device port 171c.) Therefore, the test 1 (: component, which is guided by the component guide 171a, is transported by the custom tray KST to the test tray TST via the χ-γ transfer device 304, and is carried into the guide installed at the guide core port 17lc. The core H is tested 1 (the component is tested after the test is completed). The component c is guided by the component guide 171a to form a structure that can be carried out from the component inlet. The body of the plug-in kit body 17 On the upper side of the section 1 7 1, as shown in FIG. 7, the lever piece 19 is strong across the pressure] a — a strong man, such as Le (the figure is installed here through W Mo Po H H 94. Tie piece 19 , M direction of separation) from the body part 171 of the body 17 of the plug-in kit body 17 near the second part of the body of the body 17 to the bottom (toward the main body of the plug-in kit, when the Λ pressure when the pressing force is released is Move down. When the lever piece 19 goes up; the squeezing force of the chalky elastic yellow 194 moves upward to the convex portion 191, and the toilet opens. During the movement of the recognition 4, due to the engagement / restriction formed on the lever piece Π 1 71 d; the amount of movement of the concave portion of the body portion 171 of the #connector kit body 17 upwards on the lever piece. 1 92, making the plug-in kit To the place, as shown in Fig. 7, the component inlet 171 of the body part 171 of the opening part kit body 17 is provided. May 1238257 V. Description of the invention (35) to be pulled out. The opening part 192 of the tie rod 19 is not Impeding the entry and exit of the component through the component entry port 171b 1C, and as described later, the rotation of the latch 175 is not hindered, and is formed slightly larger than the component entry port. Furthermore, as shown in FIG. 193 is provided to communicate with the core clamp receiving portion nie of the main body portion 171 of the plug kit body 17. As shown in FIG. 15, the axis GF of the clamp G can enter the core clamp receiving portion 1 through the through hole 193 of the tie rod piece 19. Within 7 1 e. As for the lower side of the main body part 1 7 1 of the plug-in kit body 17, as shown in FIG. 7, the guide core 1S is provided here. The guide core 18 is shown in FIG. 7 and FIG. As shown in FIG. 9, the component support portion 1815 is composed of a bottom plate portion and a side plate 设置 erected from the bottom plate portion; and a flange. The section 丨 83 is provided in the component support section m = side plate section, and the upper perimeter edge portion is placed on the bottom plate section of the component support section 181 as shown in Figs. 9 and 9. An opening section 182 is provided, and the component support section The bottom plate portion of 18i supports the external terminal surface of the IC device through the peripheral edge portion 188 of the opening portion 182. Moreover, the external terminals of I c supported by the component support portion 1 8 1 pass through the opening portion 1 8 2 The connection terminal exposed at the slot is on the upper end of the guide core 18, as shown in Figs. 7 and 9.
ΓΓ套相件連太通< 元件導引部連通孔184,當_8被裝設 182套體17之導忍裝置口17卜時,導芯18之開口部 ,迗過兀件導引部連通孔184和插接套件本體 =部1::相連通。由此,可以將IC元件從插接套件本 部171a導引至導芯18的元件支持部⑻。^ ♦邻183之内側面,如第7圖及第9圖所示,形成錐面狀,ΓΓ The cover piece is connected to the Taitong < element guide part communication hole 184. When _8 is installed with the 182 sleeve body 17 guide device opening 17b, the opening of the guide core 18 passes through the element guide The communication hole 184 is in communication with the body of the plug-in kit = part 1 ::. Thereby, the IC component can be guided from the plug-in kit main portion 171a to the component support portion ⑻ of the guide core 18. ^ ♦ The inner surface of the adjacent 183, as shown in Figures 7 and 9, forms a tapered surface.
2192-5760-PF(Nl).Ptd2192-5760-PF (Nl) .Ptd
1238257 五、發明說明(36) 以能將1C元件確實地往元件支持部181導引。 於突緣部183,如第7圖及筮Q国α 一 口久第9圖所不,於對向位置 (於第9圖為左右)各自設詈?桐μ川& _ 又置Ζ個的掛鈎進入孔186。於掛 鈎進入孔186,如第9圖所示,枞物石◊ aiti〇c、丄 ^ 掛鈎承受部1 8 5被設置成能 和掛鈎進入孔186的内側面相連續,構成插接套件本體! 7 之掛鈎部1723,在已進入掛鈎進入孔186之狀態下以能和 掛鈎承受部185相卡合,同時被解除和掛鈎承受部185相卡 合之掛鈎部172a,也能從掛鈎進入孔186退出。又,於突 緣部183,如第7圖及第9圖所示,設置用耒嵌插插槽導件 41的導軸413 (參照第13圖及第14圖)之軸嵌插孔187,經 由將導轴413嵌插於轴嵌插孔187,可以決定導芯18相對於 插槽4 0之正確的位置。 於插接套件本體17的本體部171,如第7圖所示,設置 包括有芯鉗172、扭力彈簧173和軸174之掛鈎機構F。芯鉗 172,如第7圖所示,包括2個朝同一方向之掛鈎部】72a和 連、纟。於2個掛鈎部1 7 2 a之間平板狀的炎具承受部1 7 2 b。於 芯鉗172,如第7圖所示,在2處掛鈎部丨72a各自的上方設 置貫穿孔1 72c,因軸1 74嵌插於插接套件本體1 7的本體部 1 71之貫穿孔1 71 m (參照第8圖)以及芯鉗1 72的貫穿孔 1 7 2 c ’使得芯鉗1 7 2被支持成可在插接套件本體1 7的本體 部1 7 1迴轉運動。 軸174,相對於掛鈎部丨72a和掛鈎承受部185之卡合方 向呈略垂直被設置於插接套件本體17的本體部171,而掛 钩部172a ’在和掛鈎承受部185之卡合方向以及和掛鈎承1238257 V. Description of the invention (36) In order to reliably guide the 1C component to the component support portion 181. In the flange portion 183, as shown in Fig. 7 and Fig. 9 of the Q state α, each of them is set at the opposite position (left and right in Fig. 9). Kirikawa & _ set another Z hook access hole 186. At the hook access hole 186, as shown in FIG. 9, the shovel stone ◊ aiti〇c, 丄 ^ The hook receiving part 1 8 5 is arranged to be continuous with the inner side of the hook access hole 186, constituting the plug kit body! The hook portion 1723 of 7 can be engaged with the hook receiving portion 185 in the state that the hook receiving hole 186 has been entered, and at the same time, the hook portion 172a engaged with the hook receiving portion 185 can be released from the hook entering hole 186. drop out. Further, as shown in FIG. 7 and FIG. 9, the flange portion 183 is provided with a shaft fitting insertion hole 187 for the guide shaft 413 (see FIGS. 13 and 14) of the socket insertion guide 41. By inserting the guide shaft 413 into the shaft insertion hole 187, the correct position of the guide core 18 relative to the slot 40 can be determined. A hook mechanism F including a core clamp 172, a torsion spring 173, and a shaft 174 is provided on the main body portion 171 of the plug kit body 17 as shown in FIG. The core pliers 172, as shown in FIG. 7, include two hook portions 72a and 纟, 纟 in the same direction. A flat-shaped inflammation tool receiving portion 1 7 2 b between the 2 hook portions 1 7 2 a. In the core clamp 172, as shown in FIG. 7, a through hole 1 72c is provided above each of the two hook portions 72a, and the shaft 1 74 is inserted into the through hole 1 of the body portion 1 71 of the plug kit body 17 71 m (refer to FIG. 8) and the through-hole 1 7 2 c ′ of the core clamp 1 72 allow the core clamp 1 7 2 to be swiveled around the body portion 17 of the plug-in kit body 17. The shaft 174 is slightly perpendicular to the engaging direction of the hook portion 72a and the hook receiving portion 185, and is provided on the main body portion 171 of the plug kit body 17, and the hook portion 172a 'is in the engaging direction of the hook receiving portion 185. And linked
1238257 五、發明說明(37) 受部185之解除卡合方向可以迴轉運動。又,軸174被設置 之位置掛鈎部172a被調節成位於比貫穿孔1了2(:更下方的 位置(參照第1 〇圖)’掛釣部i 72a,構成可以進入被裝設 於導芯裝置口171c之導芯18的掛鈎進入孔186。 一於插接套件本體17的本體部171,如第7圖和第8圖所 不,在兀件導引部1 7 1 a的兩側,設置在上下方向開口之芯 鉗=今。卩1 7 1 e,芯鉗1 7 2被收容於芯鉗收容部丨7丨e。芯鉗 收合41 71 e,如第8圖所示,包括:被設置成與掛钩部 1 72a和掛鈎承受部185之卡合方向略垂直之限制面171〖, 和與限制面1 7 1 f對向之扭力彈簧裝置面丨7丨g。於被收容於 芯姐收容部_l7le之芯鉗17:2的貫穿觀72d,如第7圖和第 圖所示,被扭力彈簧173的一端部i73a所嵌插,又, f f S ^ 圖所示,扭力彈簧的他端部1 73b,被裝設於 Π、置面171g。此時,因扭力彈簧173是處於扭曲 過扭力彈菁173的作用掛钩部172a被往與掛鈎 ί文ΐϋ卡合的方向擠壓,而往與掛鈎承受部185卡合方 =之=鈎部172a的迴轉運動,如第1〇 ( 制面171f所限制。 "下极限 1插接套件本體17裝設於導怎18之際, =目之卡掛入鈎部I以以下之順序和導芯18之掛鈎承ΐ :18相卡合。首先,從芯封收容部me的上端開口又 弟圖所示之夹具G的軸GF進入芯鉗收容部1716内。 二ΓΛ桿片19,因設置和芯鉗收容部171e相連通之貫穿 p使在插接套件本體17的本體部171之上側安裝了1238257 V. Description of the invention (37) The releasing direction of the receiving part 185 can be rotated. In addition, the position where the shaft 174 is provided is adjusted so that the hook portion 172a is positioned 2 (lower than the through hole 1 (: Fig. 10)) (the fishing portion i 72a) so that it can be inserted into the guide core. The hook of the guide core 18 of the device port 171c enters the hole 186. As shown in FIG. 7 and FIG. 8, the body portion 171 of the plug kit body 17 is on both sides of the element guide portion 17 1 a. The core clamp set to open in the up and down direction = today. 卩 1 7 1 e, core clamp 1 7 2 is housed in the core clamp housing section 丨 7 丨 e. The core clamp is folded 41 71 e, as shown in Figure 8, including : A restricting surface 171 which is set to be slightly perpendicular to the engaging direction of the hook portion 1 72a and the hook receiving portion 185, and a torsion spring device surface 丨 7 丨 g opposite to the restricting surface 1 7 1 f. As shown in Figures 7 and 7, the core pincer 17: 2 penetration view 72d of Yuxin Sister Containment Department_17 is inserted by one end portion i73a of the torsion spring 173, and, as shown in ff S ^ The other end portion of the spring 1 73b is installed on the Π and the mounting surface 171g. At this time, the torsion spring 173 is twisted due to the action of the torsion spring 173. The hook portion 172a is hooked to the hook. Squeeze in the direction of engagement, and engage with the hook receiving portion 185. == The rotation of the hook portion 172a, as restricted by No. 10 (the surface 171f. &Quot; Lower limit 1 plug kit body 17 is installed on In the case of guide 18, the hook of the card I is engaged with the hook of the guide core 18 in the following order: 18-phase engagement. First, the upper end of the core seal receiving section me is shown in the figure below. The shaft GF of the clamp G enters the core clamp receiving portion 1716. The two ΓΛ lever pieces 19 are provided on the upper side of the body portion 171 of the plug kit body 17 because of a through hole p communicating with the core clamp receiving portion 171e.
2192-5760-PF(Nl).Ptd2192-5760-PF (Nl) .Ptd
1238257 五、發明說明(38) 拉桿片1 9的狀態下,也可以使夾具G的軸G F進入芯钳收容 部1 71 e。當掛鈎部1 72a被保持於限制面1 71 f時,平板狀之 夾具承受部172b ’如第1〇 (a)圖所示,朝向掛鈎部172a 和掛鈎承受部185的卡合方向(也就是,從扭力彈簧裝置 面1 7 1 g朝限制面1 71 f的方向)向下傾斜,位於遮住夾具G 之軸GF的進入位置,從芯鉗收容部丨7丨e的上端開口部所進 入之夾具G的軸GF,和夾具承受部1 72b相接,透過可在炎 具承受部172b上滑動將夾具承受部172b往下擠壓。由此, 夾具承受部1 7 2 b ’如第1 〇 ( b )圖所示,朝扭力彈簧裝置 面171g迴轉運動。伴隨著夾具承受部172b的迴轉運動,掛 鈎部172a,朝可以和掛鈎承受部185卡合解除的方向迴轉 運動,使得和掛鈎承受部85可以卡合(繫脫)的狀=。 於此狀態下,使掛鈎部172a進入導芯18的掛鈎進入孔^86 之後,當使夾具G的轴GF從芯鉗收容部171e退出後,加諸 於夾具承受部1 7 2 b的擠壓力將被解除,如第1 〇 ( c )圖所 示,因扭力彈簧173的擠壓力使掛鈎部172&往和掛钩ς受 部185的卡合方向迴轉運動。由此,掛鈎和㈣掛钩承 受部185產生卡合,導芯18被裝設於插接套件本體丨?上。 上知ΪΪΓΪ插接套件本體17之導芯18從插接套件本體17 上卸下%也遵循和上述同樣之程序。4就是說,使失別 的軸G:,甘收容部171e的上端開口部進入芯钳收容部 e内::隨著夾具承受部172b的迴轉運動掛鈎部 172a,往和掛鈎承受部185之卡合解除之方向迴轉運動, 成為可以和掛鈎承受部丨8 5繫脫的狀態。 — a此爿尺怒’經由1238257 V. Description of the invention (38) In the state of the tie bar 19, the shaft G F of the clamp G can also enter the core clamp receiving portion 1 71e. When the hook portion 1 72a is held on the restricting surface 1 71 f, the flat plate-shaped jig receiving portion 172b 'faces the engaging direction of the hook portion 172a and the hook receiving portion 185 as shown in FIG. 10 (a) (that is, , Downward from the torsion spring device surface 1 7 1 g toward the restricting surface 1 71 f), located at the entry position covering the axis GF of the clamp G, and entering from the upper opening of the core clamp receiving section 丨 7 丨 e The shaft GF of the jig G is in contact with the jig receiving part 172b, and the jig receiving part 172b can be pressed downward by sliding on the inflammation jig receiving part 172b. Thereby, as shown in Fig. 10 (b), the jig receiving portion 17 2b 'rotates toward the torsion spring device surface 171g. Along with the pivoting movement of the clamp receiving portion 172b, the hooking portion 172a pivots in a direction in which the hook receiving portion 185 can be disengaged, so that the hook receiving portion 85 can be engaged (disengaged). In this state, after the hook portion 172a is inserted into the hook entry hole ^ 86 of the guide core 18, after the shaft GF of the clamp G is withdrawn from the core clamp receiving portion 171e, it is applied to the clamp receiving portion 1 7 2b. As shown in FIG. 10 (c), the force of the torsion spring 173 causes the hook portion 172 & to rotate in the engaging direction of the hook receiving portion 185 as shown in FIG. 10 (c). Thereby, the hook and the hook receiving part 185 are engaged, and the guide core 18 is installed in the plug kit body. on. The removal of the guide core 18 of the plug kit body 17 from the plug kit body 17 above also follows the same procedure as described above. 4 means to make the missing axis G: the upper opening of the accommodating portion 171e enter the core clamp accommodating portion e: the hook portion 172a to the hook receiving portion 185 as the clamp receiving portion 172b rotates The revolving movement in the direction of closing can be separated from the hook receiving section 8-5. — Athis 爿 尺 anger ’via
第42頁 1238257 五、發明說明(39) 使掛鈎部172a從導芯18的掛鈎進入孔186退出,可解除掛 鈎部1 7 2 a和掛鈎承受部1 8 5的卡合,導芯1 8即可從插接套 件本體1 7脫離。 於插接套件本體17的本體部171,如第7圖及第11圖所 示,設置包括閂鎖1 7 5和扭力彈簧1 7 6以及軸1 7 7之閂鎖機 構L。 閂鎖1 7 5,如第7圖和第1丨圖所示,包括:施力點 175a、閂鎖部175b、以及連結施力點丨75a和閂鎖部175b之 臂部175c 。 臂部1 75c ’知第7圖及第丨丨圖所示,是由第二臂部 175e和被對向設置於第二臂部175e兩端之對向之2個的第 一臂部1 7 5 d所構成,如第1 1圖所示,當第二臂部1 7 5 e沿著 元件V引部1 a的長邊方向的内側面被收容於元件導引部 171a内時’第一臂_175d,便沿著元件導引部171a的短邊 方向的内側面被收容於元件導引部1 7 1 a内。 於對向之2個的第一臂部1 7 5 d的邊緣部,各自如第7圖 及第1 1圖所示’施力點175a被設置成和第二臂部175e的展 出方向反向延=而出。又,於對向的2個的第一臂部 175d ’各自如圖及第11圖所示,於和第二臂部175e相 較位於較接近施力點175a之處,設置貫穿孔175f讓軸177 來嵌插。又’於第二臂部17 5e的略中央,如第7圖及第11 圖所示’設置問鎖部175b,以能向第一臂部175d的展出方 向成銳角的方向%展而出。 於對向的2處之第一臂部175d的貫穿孔175f,各自如Page 42 1238257 V. Description of the invention (39) Withdrawing the hook portion 172a from the hook entry hole 186 of the guide core 18, the engagement of the hook portion 17 2 a and the hook receiving portion 1 8 5 can be released, and the guide core 18 is Detachable from the plug-in kit body 17. As shown in FIGS. 7 and 11, the main body portion 171 of the plug kit body 17 is provided with a latch mechanism L including a latch 175, a torsion spring 176, and a shaft 177. The latch 175, as shown in FIGS. 7 and 1 丨, includes a force application point 175a, a latch portion 175b, and an arm portion 175c connecting the force application point 75a and the latch portion 175b. As shown in FIG. 7 and FIG. 丨 丨, the arm portion 1 75c is a second arm portion 175e and two first arm portions 1 7 disposed opposite to each other at both ends of the second arm portion 175e. 5 d, as shown in FIG. 11, when the second arm portion 1 7 5 e is accommodated in the component guide portion 171 a along the long side inner side surface of the component V lead portion 1 a 'the first The arm _175d is housed in the component guide 17 1 a along the inner side surface of the component guide 171 a in the short side direction. As shown in FIG. 7 and FIG. 11, the edge portions of the two first arm portions 1 7 5 d facing each other are provided with a force applying point 175a opposite to the display direction of the second arm portion 175e. Xiangyan = come out. In addition, as shown in FIG. 11 and FIG. 11, the two opposing first arm portions 175 d ′ are located closer to the force application point 175 a than the second arm portion 175 e, and a through hole 175 f is provided to allow the shaft 177 to insert. The interlocking portion 175b is provided at the slightly center of the second arm portion 17 5e as shown in FIG. 7 and FIG. 11 so that the interlocking portion 175b can be projected in a direction that can form an acute angle toward the display direction of the first arm portion 175d. . The through-holes 175f of the first arm portions 175d at the two opposite sides are as follows
2192-5760-PF(Nl).ptd 第43頁 1238257 五、發明說明(40) 第7圖所示,被軸177的一端部所嵌插,由於軸177的他端 部被支持於插接套件本體丨7的本體部丨7丨之轴固定部 171i,使得閂鎖175被支持成可於插接套件本體17的本體 部171處迴轉。於插接套件本體17的本體部171,像這樣被 支持之2處的閂鎖1 75,如第7圖及第11圖所示被以對向嗖 置。 。 軸固定部171 i,如第7圖及第8圖所示,於元件進入口 171b的短邊方向的邊緣部,設置可以收容軸177的端部之 凹部。各自之軸177,被位於元件進入口171b的附近之轴 固定部171 !所支持。又,被嵌插於對向之第一臂部p5d的 貫穿孔1 7 5 f之2根的軸177,被軸固定部171]支持成:迴 :=線呈一致^或是迴轉中心線和拉桿片19的接近遠離方 向(上下方向)呈略垂直。以如此被支持之軸177為迴方 轴,閂鎖1?5被構成可以迴轉運動。也就是說,施力點 175a及閃鎖部175b可以將軸177當成迴轉軸來迴轉移動, 施力點175a的迴轉移動及閂鎖部17讣的迴 部175c成為連動的構成。 勃透過臂 於元件導引部1 71 a的長邊方向的内側面,如、 第8圖及第11圖所示,於該下部設置平台部171k,因;二 臂部175e被平台部1711^支挤使得往第二臂部η。下一 Π = 因此’當閃鎖175沒有受到拉桿片19的、 :士例如’拉桿片19位於離插接套件本體17最遠之狀 悲打^,閂鎖1 75,被保持於如第1 1圖所示的狀態。 *門鎖1 7 5被保持於如第丨丨圖所示之狀態時施力點2192-5760-PF (Nl) .ptd Page 43 1238257 V. Description of the Invention (40) As shown in Figure 7, it is inserted by one end of the shaft 177, because the other end of the shaft 177 is supported by the plug kit The shaft fixing portion 171i of the body portion 7 of the body 丨 7 allows the latch 175 to be supported to be rotatable at the body portion 171 of the plug kit body 17. As shown in Figs. 7 and 11, the two latches 1 75 supported at the two positions of the main body portion 171 of the plug kit body 17 are arranged facing each other. . As shown in FIGS. 7 and 8, the shaft fixing portion 171 i is provided with a recessed portion that can receive the end portion of the shaft 177 at the edge portion in the short-side direction of the component inlet 171 b. The respective shafts 177 are supported by a shaft fixing portion 171! Located near the component inlet 171b. In addition, the two shafts 177 inserted into the through-holes 1 7 5 f of the opposing first arm portion p5d are supported by the shaft fixing portion 171] to: return: the line is consistent ^ or the rotation center line and The approaching and detaching direction (up and down direction) of the tie bar piece 19 is slightly vertical. Taking the thus-supported shaft 177 as a return shaft, the latches 1 to 5 are configured to be capable of rotating motion. In other words, the urging point 175a and the flash lock portion 175b can rotate and move the shaft 177 as a rotary shaft, and the rotational movement of the urging point 175a and the return portion 175c of the latch portion 17 部 are linked. As shown in Figs. 8 and 11, the platform portion 171k is provided on the lower side of the inner side surface of the component guide portion 1 71a through the transmission arm. The two arm portion 175e is replaced by the platform portion 1711 ^. The squeezing causes the second arm portion η. Next Π = Therefore, when the flash lock 175 has not been received by the lever piece 19: For example, 'The lever piece 19 is located at the farthest position from the plug kit body 17 ^, the latch 1 75 is maintained as the first Figure 1 shows the state. * When the door lock 1 7 5 is held in the state shown in Figure 丨 丨
2192-5760-PF(Nl).ptd 第44頁 1238257 五、發明說明(41) "" -- 175a ’包含轴177之迴轉中心線’相對於拉桿片19的接近 遠離方向(上下方向)垂直之平面H1 (參照第12圖)相比 位於更接近拉桿片19的位置(也就是,施力點丨了“位於比 轴177更上方之位置)。因此’受到從拉桿片19往拉桿片 19的接近方向(下方)之作用的施力點丨?。,朝平面们迴 轉移動(也就是,閂鎖1 7 5朝向下方迴轉移動)。 又’當閃鎖175被保持於如第n圖所示之狀態時施 力點175a ’包含軸177的迴轉中心線’位於相對於拉桿片 1 圖9 Γϊ ί ΐ離:上下方向)平行之平面H2 (參照第1 2 田 、/就疋’如第1 2圖所示,施力點1 75a和平面 H2的距離X變的較短)。因此 办 H1迴轉移動,迴轉角度也變得較大。…a ’可朝向平面 力點二s Γ 被保持於如第11圖所示之狀態時’施 之狀心)〜拉才干片1 9的附近。因此, 點175a的同時向下方移 拉柃片19作用於靶力 移動之距離變長,受到加埋y 1 Q女 的施力點175a可迴轉移 ;^拉柃片η作用 又,去問錯、轉角度也變得較大。 田 5保持於如第1 1圖所干之狀# 士 部175b,位於元件導引卹】71 厅不之狀悲日守,閂鎖 )。 向的内側面朝導芯穿置;^ 2件導引部1 7 1 a的長邊方 171a的位置:因此1C元…通過元件= IC 7L件無法從儿件導?丨部丨7〗a搬入 益 法從導芯1 8搬出之狀熊。 j V〜1 8之狀態,也無 1238257 五、發明說明(42) 又田門鎖175被保持於如第11圖所示之狀態時,施 力點175a和問鎖部1755,位 當施力點175a向下方迴韓之:反側的位置。因此, 迴轉移動(即是,問;=1 夺二,鎖部1755變成向上方 )。 门鎖邛l75b由閉位置向開位置迴轉移動 又,s閂鎖1 75被保持於如第11圖所示之狀態時,門 於接近平-的位置的同二 =匕裂置口川C的附近的位置。因閉位置之問鎖部i75b =二知。卩位於像這樣之位置,使得問鎖部175b的前端部之 )。距離變付較長(也就是’閃鎖部i 75b的開閉量變大 切雜H办點175a受到拉桿片19的作用時,處於閉位置之 $ ° 5b (參照第12 (a)圖),依照以下之順序移動 B至開參照第12(b)圖)。當拉桿片19往下= 妓P t片19與施力點175a相接觸,將施力點175a往下方 广=。X到拉桿片19往下方擠壓力之施力點175&,朝下 ^移動。%力點1 7 5 a,繼續迴轉移動至被設置於元件進 =口1711)的周緣部之凹部1711)收容為止。施力點175& 二收二於凹部171p所以可以不與插接套件本體17的本體; 传干涉地進行迴轉移動。因施力點175a的迴轉移動 一=苐一臂部175d迴轉,·又因第一臂部175d的迴轉使 二臂部175e在施力點175a的逆方向(上方) =伴隨著.第二臂部175e的迴轉移動,問鎖 圮轉移動。此時,閂鎖部1751)的前端部,從導芯裝^ 12382572192-5760-PF (Nl) .ptd Page 44 1238257 V. Description of the invention (41) " "-175a The approaching and distancing direction (up and down direction) of the 'rotation centerline including the shaft 177' relative to the tie rod 19 The vertical plane H1 (refer to FIG. 12) is located closer to the lever piece 19 than the lever piece 19 (that is, the force application point is “positioned higher than the axis 177). Therefore, it is subjected to the movement from the lever piece 19 to the lever piece 19 The application point of the action in the approaching direction (below) of 19 丨?, Rotating toward the planes (that is, the latch 1 75 moves downwards). Also, when the flash lock 175 is held as shown in the nth figure In the state shown, the force application point 175a 'the rotation centerline including the axis 177' is located relative to the lever piece 1 FIG. 9 Γϊ ί ΐ away from: up and down direction parallel to the plane H2 (refer to the first 2 Tian, / 就 疋 'such as As shown in Fig. 12, the distance X between the application point 1 75a and the plane H2 becomes shorter). Therefore, when H1 is rotated, the rotation angle also becomes larger .... a 'can be directed toward the plane force point s Γ. Keep in the state as shown in Figure 11 ('Shi's heart shape) ~ pull near the cauldron 19. Because Therefore, at the same time as the point 175a is moved downward, the distance between the cymbal 19 acting on the target force becomes longer, and the point 175a of the force applied by the female y 1 Q can be transferred back; The turning angle also becomes larger. Tian 5 remains in the shape as it does in Figure 11 # 士 部 175b, located in the component guide shirt] 71 Hall is not like the sun, guarding and latching). Toward the inner side Place it towards the guide core; ^ The position of the long side 171a of the two-piece guide 1 7 1 a: So 1C yuan ... Can't be guided from the children by the component = IC 7L? 丨 丨 7〗 a The guide core 1 is a bear that has been carried out. The state of V ~ 18 is also 1238257. V. Description of the invention (42) When the Tiantian lock 175 is maintained in the state shown in FIG. 11, the force application point 175a and Ask the lock part 1755, when the force application point 175a goes back to the Korean side: the position on the opposite side. Therefore, the rotary movement (that is, ask; = 1 wins, the lock part 1755 becomes upward). The door lock 75l75b is changed from When the closed position is turned to the open position and the s latch 1 75 is maintained in the state shown in FIG. 11, the door is close to the flat position, the same second position = the position near the mouth of the mouth of the mouth C Due to the closed position, the lock portion i75b = Erzhi. 卩 is located at a position like this, so that the front end portion of the lock portion 175b). The distance becomes longer (that is, the opening and closing amount of the flash lock portion i 75b becomes large and the H When the handle 175a receives the action of the lever piece 19, it is in the closed position of $ ° 5b (refer to FIG. 12 (a)), and moves B to the opening in the following order (refer to FIG. 12 (b)). When the lever piece 19 is down = the prostitute P t piece 19 is in contact with the force application point 175a, and the force application point 175a is wide downward. X to the application point 175 & of the pressing force downward by the lever piece 19, move downwards ^. The% force point is 1 7 5 a, and continues to rotate until it is accommodated in the recessed portion 1711) provided at the peripheral edge portion of the component inlet = the opening 1711). The force application point 175 & two is closed at the recess 171p, so that it can be rotated without interference with the body of the plug kit body 17; Due to the rotation of the application point 175a, first arm portion 175d rotates, and the second arm portion 175e is in the opposite direction (upward) of the application point 175a due to the rotation of the first arm portion 175d. The turning movement of the part 175e asks the turning movement. At this time, the front end portion of the latch portion 1751) is attached from the guide core ^ 1238257
五、發明說明(43) 口 1 7 1 c的略中央部朝元件導引部丨7丨a的長邊方向的内側面 迴轉移動,被設置於該内側面之下部的平台部1 71 k形成之 閂鎖部收容部1 7 1 r所收容。如此一來,如第1 2 ( b )圖所 示,閂鎖部1 75b,移動至元件導引部丨7丨a呈開啟狀態之位 置(開位置)。也就是說,I c元件可以通過元件導引部 1 7 1 a,形成IC元件可以由元件導引部丨7丨a搬入導芯][8的狀 態以及可以從導芯1 8搬出的狀態。第丨2圖所示之例,往拉 桿片1 9的下方移動量1 · 5咖可變換為閂鎖部丨7 5 b的開閉量 4 · 7 mm 〇 閃鎖1 7 5被保持於如第丨丨圖所示之狀況時〜 第一臂部175d以及第二臂部175e,相對於軸1?7的 心線為垂直,因位於與拉桿片19的接近遠離方向平 面H3 (蒼照第U圖)的相反側之位置,伴隨拉桿片 ί H旦出之^力點1753的轨道和第一臂部175d以 • f。卩175e的軌道,相對於平面H3位於相反側的 拉桿片19,透過被形成比元件進入口 17ι_ 4192的周緣部,可以不對閂鎖175產生作用 力點175a發生作用。因此,伴隨著拉 可以 ’臂部175c ’從元件導引:i7ia; = Ϊ: f凡件導引部心外(元件進入口 = 移動’而拉桿片19並不會干涉到 ”b的 過臂部175c可以使施力點175a的迴轉移動%。也就是 迴轉移動確實地產生連動。 轉㈣和閂鎖部 几件導引部1713的短邊方向的内側面如&圖、 第47頁 2192-5760-PF(Nl).ptd 1238257 發明說明(44) 第8圖以及第11圖所示,在該下部設置彈簧固定部, 施力點175a,透過被固定於彈簧固定部171j之扭力彈簧 176往上方推擠。因此,拉桿片19移動至上方,當拉桿片 1 9施於施力點1 75a往下方之擠壓力解除時,因杻力彈簧 1 7 6的作用施力點1 7 5 a被往上方擠壓,向上方迴轉移動。 由此,閂鎖部從開位置向閉位置迴轉移動。 透過X _ Y搬送裝置3 0 4的吸附頭將被測試I c元件從客製 托盤KST移搬至測試托盤TST之際,該吸附頭,將拉桿片19 往下方(接近插接套件本體丨7的方向)壓擠。由此拉桿片 19向下方移動,將施力點]75a往下方擠壓。受到拉桿片19 _ 作用之施力點17 5a向卞方迴轉移動,伴隨於此問鎖部丨7 &b 由閉位置往開位置迴轉移動。由此,被測試代元件透過元 件導引部171a之導引成為可以搬入導公18之狀態,被吸附 於X-Y搬送裝置304之吸附頭之被測試IC元件,被搬入導芯 18。當被測試1C元件往導芯18搬入後,χ-γ搬送裝置3〇4的 吸附頭從插接套件本體1 7離開。由此拉桿片1 9受到從該吸 附頭而來之擠壓力將被解除,拉桿片丨9往離開插接套件本 體1 7的方向移動。由此,施力點丨7 5a受到由拉桿片丨g而來 之播壓力將被解除。施力點丨7 5 a,受到由扭力彈簣丨7 6往 上方之擠壓力而向上方迴轉移動,伴隨於此閃鎖部丨75b從 開位置移動至閉位置。由此,可以防土由導芯18所支持之 被測試I C元件往插接套件外掉出。又,處於閉位置之閃鎖 部1 7 5 b的前端部,擠壓被支持於導芯丨8之被測試丨c元件的 上面,由此可以防止被測試丨c元件的位置之錯離。V. Description of the invention (43) The slightly central part of the port 1 7 1 c is pivotally moved toward the inner side surface in the long side direction of the component guide part 丨 7 丨 a, and is formed by a platform part 1 71 k provided below the inner side surface. The latch portion receiving portion 17 1 r is accommodated. In this way, as shown in FIG. 12 (b), the latch portion 175b is moved to a position (open position) where the component guide 丨 7 丨 a is in an open state. That is, the I c component can pass through the component guide 1 7 1 a to form an IC component that can be moved into the guide core by the component guide 丨 7 丨 a] and a state where it can be removed from the guide core 18. In the example shown in FIG. 2, the amount of movement 1 · 5 down the lever piece 19 can be converted to the latching portion 丨 7 5 b opening and closing amount 4 · 7 mm 〇 The flash lock 1 7 5 is held as丨 丨 In the situation shown in the figure ~ The first arm portion 175d and the second arm portion 175e are perpendicular to the center line of the shaft 1 to 7 because they are located close to and away from the direction plate H3 of the lever piece 19 (Cang Zhao Uth (Picture) The position on the opposite side of the lever, the orbit with the force point 1753 and the first arm 175d with f. The orbit of 卩 175e can prevent the force point 175a from acting on the latch 175 through the peripheral edge portion of the element entry opening 17ι_4192 formed on the opposite side from the plane H3. Therefore, with the pull, the arm 175c can be guided from the component: i7ia; = Ϊ: f out of the heart of the guide (component entry port = movement), and the lever piece 19 does not interfere with the overarm of "b" The portion 175c can make the rotational movement% of the urging point 175a. That is, the rotational movement surely generates an interlocking movement. The turning and latching portions are the inner sides of the short side direction of the guide portion 1713 such as & Figure, page 2192 on page 47. -5760-PF (Nl) .ptd 1238257 Description of the invention (44) As shown in Fig. 8 and Fig. 11, a spring fixing portion is provided at the lower portion, the urging point 175a is transmitted through the torsion spring 176 fixed to the spring fixing portion 171j. Push upward. Therefore, the lever piece 19 moves to the top. When the pressing force applied by the lever piece 19 to the downward force point 1 75a is released, the force point 1 7 5 is applied due to the action of the pressure spring 1 7 6 a is squeezed upward and moves upward. As a result, the latch moves from the open position to the closed position. The suction head of the X_Y transfer device 3 0 4 will test the I c component from the custom tray KST When moving to the test tray TST, the suction head moves the lever piece 19 downward (close to the plug kit body) 7)). As a result, the lever piece 19 is moved downward, and the force application point] 75a is squeezed downward. The force application point 17 5a, which is affected by the lever piece 19 _, is rotated to the side, and the lock is accompanied by this部 7 & b swivel from the closed position to the open position. As a result, the component under test is guided by the component guide 171a to a state where it can be carried into the guide 18, and is sucked onto the suction head of the XY transfer device 304 The IC component under test is moved into the guide core 18. When the 1C component under test is moved into the guide core 18, the adsorption head of the χ-γ transfer device 30 is separated from the plug-in kit body 17 by the pull rod piece 19 The pressing force from the suction head will be released, and the lever piece 丨 9 moves away from the plug kit body 17. Thus, the application point 丨 7 5a is broadcast from the lever piece 丨 g. The pressure will be relieved. The application point 丨 7 5 a will be moved upward by the pressing force from the torsion spring 丨 7 6 upward, and the flash lock 丨 75b will move from the open position to the closed position. Therefore, it is possible to prevent the tested IC components supported by the guide core 18 from falling out of the plug-in kit. Flash portion in the closed position of the lock 1 7 5 b of the distal portion, is pressed to the guide core support upper tested Shu Shu c of element 8, whereby the wrong position can be prevented from being Shu c of the test element.
2192-5760-PF(Nl).ptd2192-5760-PF (Nl) .ptd
12382571238257
=第13圖以及第14圖所示,於插接套件 成固定器3〇的導銷32以及插槽導件41之導麼器411各丨形 從上下插入之導孔2〇 ’在插接套件! 6的兩側 : 測試托盤m之安裝片14的安裝用孔21 成 14圖所不之插接套件16是將該構造簡略化表示。 如第13圖以及第14圖所示,插接套件16之導孔2〇 定位置之孔。❹’將圖中左側之導孔2G當成決定位、 孔,在比右側之導孔20的内徑還小的場合,於左側的導 20,在該上半部被固定器3〇的導銷32所插入進行定位,= As shown in Fig. 13 and Fig. 14, the guide pin 32 of the holder 30 and the guide 411 of the slot guide 41 in the plug-in kit are each inserted into the guide hole 2 ′ inserted from above and below. 6 on both sides of the kit! 6: The mounting holes 21 of the mounting piece 14 of the test tray m are inserted into the plug kit 16 shown in FIG. 14 to simplify the structure. As shown in Fig. 13 and Fig. 14, the guide hole 20 of the plug-in kit 16 is a hole at a predetermined position. ❹'Take the left guide hole 2G in the figure as the position and hole. When the inner diameter of the right guide hole 20 is smaller than the right guide hole 20, the left guide 20 is fixed with the guide pin 30 in the upper part. 32 inserted for positioning,
該下半部,被插槽導件41的導壓器411所插入進行定位/ 在另=方面,圖中右侧之導孔2〇、固定器3〇的導銷32以及 插槽導件4〗的導壓器4 11,呈鬆弛的後合狀態。 如第13圖所示,於測試頭5的上面,配置插槽板5〇。 插槽板50,如第6圖所示於測試托盤TST中,例如雖可以配 置成對應在行的方向隔著3個合計4列的被測試ic元件2的 數量(4行X 4列),但如果可將每一個的插槽板50的大小 縮小的話,如第6圖所示被保持於測試托盤TS丁之所有的! c 元件2可以同時進行測試,在測試頭5之上,配置4行χ 1 6 列的插槽板50也可以。The lower half is inserted and positioned by the pressure guide 411 of the slot guide 41. In another aspect, the guide hole 20 on the right side of the figure, the guide pin 32 of the holder 30 and the slot guide 4 The pressure guides 4 and 11 are in a loosely closed state. As shown in FIG. 13, a slot board 50 is arranged on the test head 5. The slot board 50 is shown in the test tray TST as shown in FIG. 6. For example, the slot board 50 may be arranged to correspond to the number of the IC elements 2 under test (4 rows x 4 columns) with a total of 3 columns and 4 columns in the row direction. However, if the size of each slot plate 50 can be reduced, as shown in FIG. 6, it is held on the test tray TS Ding! c Component 2 can be tested at the same time. On the test head 5, it is also possible to arrange slot plates 50 of 4 rows x 1 6 columns.
如第13圖所示,插槽40被設置於插槽板50之上,如第 13圖及第14圖所示’為了使插槽40的連接端子44可以露 出’將插槽導件41固定於插槽4〇。插槽40之連接端子44為 探針,對應1C元件2之外部端子22的個數以及位置被設 置,經由圖外之彈簧被往上方彈性擠壓。於插槽導件4 1的As shown in FIG. 13, the slot 40 is provided on the slot plate 50. As shown in FIGS. 13 and 14, “so that the connection terminal 44 of the slot 40 can be exposed”, the slot guide 41 is fixed. In slot 40. The connection terminal 44 of the socket 40 is a probe, and the number and position of the external terminals 22 corresponding to the 1C component 2 are set, and are elastically pressed upward by a spring outside the figure. For slot guide 4 1
2192-576〇.PF(Nl).ptd 第49頁 12382572192-576〇.PF (Nl) .ptd Page 49 1238257
兩側,在固定器30所形成2個的導銷32被插入,為了在這2 個的導銷3 2之間來進行定位而設置導壓器411。 如第13圖以及第14圖所示之固定器30,對應於插槽4〇 之數量,被設置於測試頭5的上側,透過沒有顯示於圖上 之Z軸驅動裝置(例如液壓紅)可以在z轴方向上下移動。 如弟8圖及第9圖所示’於固定器3〇的略中央,形成壓子31 來壓住被測試IC元件2,於該兩側設置導銷3 2用來插入插 接套件16的導孔20以及插槽40的導壓器411。又,如第13 圖及第14圖所示,在壓子31和導錆32之間,固定器30透過 Z軸驅動裝置來下降之際,為了限制下降下限所以設置限参 制器導件34 5限制器導件34與插槽4〇之制動面412相接 觸,以不破壞被收納於插接套件16之被測試1C元件2以適 當的壓力擠壓決定固定器3 0的下限位置。 第4點,對於卸載部40 0相關聯之部分加以說明。On both sides, two guide pins 32 formed in the holder 30 are inserted, and a pressure guide 411 is provided for positioning between the two guide pins 32. As shown in FIG. 13 and FIG. 14, the holders 30 are provided on the upper side of the test head 5 corresponding to the number of slots 40. The Z-axis driving device (for example, hydraulic red) not shown in the drawing can be used. Move up and down in the z-axis direction. As shown in Fig. 8 and Fig. 9, 'on the slightly center of the holder 30, a presser 31 is formed to press the IC component 2 under test, and guide pins 32 are provided on both sides for inserting the connector 16 The guide hole 20 and the pressure guide 411 of the slot 40. As shown in FIG. 13 and FIG. 14, when the holder 30 is lowered by the Z-axis driving device between the presser 31 and the guide pin 32, a reference limiter guide 34 is provided to limit the lower limit of the lowering. 5 The limiter guide 34 is in contact with the braking surface 412 of the slot 40 so as not to damage the tested 1C component 2 housed in the plug-in kit 16 and press the appropriate position to determine the lower limit position of the fixture 30. The fourth point is about the part associated with the unloading unit 400.
如第2圖及第3圖所示之卸載部4 〇〇,也設置和被設置 於裝載部30 0之X-Y搬送裝置304相同構造之χ-γ搬送裝置 404,經由此乂—丫搬送裝置404,測試完成之1(:元件從被搬 運至卸載部4〇〇之測試托盤TST換裝到客製托盤KST。 如第2圖所示,於卸載部400的裝置基板1〇5,可使被 搬至卸載部400之客製托盤KST面臨裝置基板1〇5的方式配 置一對之窗部406、406,共設置兩對。 又,雖在圖示上加以省略,但於各自之窗部4〇6的下 側,設置用來使客製托盤KST昇降之昇降台,在此承載換As shown in FIG. 2 and FIG. 3, the unloading section 400 is also provided with a χ-γ transporting device 404 having the same structure as the XY transporting device 304 installed in the loading section 300, and via this 乂 -yah transporting device 404 1 after the test is completed (: The component is transferred from the test tray TST which is transported to the unloading section 400 to the custom tray KST. As shown in FIG. 2, the device substrate 105 in the unloading section 400 can be removed. The custom tray KST carried to the unloading unit 400 is provided with a pair of window portions 406 and 406 so that the device substrate 105 faces the device substrate 105, and two pairs are provided in total. Although omitted in the figure, the window portions 4 〇6 The lower side is provided with a lifting platform for lifting and lowering the custom tray KST.
1238257 五、發明說明(47) 裝完成測试之被測試I C元件將滿載之客製托盤u τ降下, 將此滿載托盤以父給托盤移送臂2 〇 5。 以上所說明之實施例,是為了容易理解本發明而加以 έ己載之貫施例’而不是用來限定本發明之内容。因此,於 上述貫施例所提出之各要素,該要旨也含括本發明之技術 範圍所屬之設計變更和相等技術。 於上述實施例中,可以做如以下之變更。 例如,第7圖所示之掛鈎機構ρ之扭力彈簧丨73,可以 使用如第16圖所示,以連結設置於芯鉗172之板片彈菩 (leaf spring) 173’。又,第7圖所示之問鎖機携L之扭 力彈簧176,可以使用如第i7圖所示之板片彈菁176,… 又·掛銳機‘構F中之掛鈎部1?2a和掛鈎承受部185之卡合方 向可以變更成任意之方向。又,丨c元件測試裝置丨〇…並不 只限定於上述實施例所說明之艙室型之裝置,例如,盔 室型、熱板型之裝置也可以。…^ 產業上之可利性: 〇依據本發明,第一:提供可於插接套件本體上裝卸之 i Ξ太二’依據本發明,第二提供可讓導芯裝卸之插接 i件本體。又,依據本發明’第1:提供-插接套件本 曰::讓導芯裝卸的同肖’包括閃鎖機構,閃鎖 置車父^,可對應多種尺寸之IC元件。又,依據本發明ί ^提供:插接套件’包括上述導这及上述插接套件本 歧,並且提供一電子元件移搬裝置,包括該插接套件。1238257 V. Description of the invention (47) The IC component under test after the test is completed will lower the fully-loaded custom tray u τ and transfer the fully-loaded tray to the tray transfer arm 2 05. The embodiments described above are conventional examples' for easy understanding of the present invention, and are not intended to limit the content of the present invention. Therefore, the elements proposed in the above-mentioned embodiments also include design changes and equivalent technologies that belong to the technical scope of the present invention. In the above embodiment, the following changes can be made. For example, the torsion spring 73 of the hook mechanism ρ shown in FIG. 7 may be connected to a leaf spring 173 ′ provided in the core clamp 172 as shown in FIG. 16. In addition, the interlocking machine shown in FIG. 7 carries the torsion spring 176 of L, and the plate spring 176 shown in FIG. I7 can be used. The engaging direction of the hook receiving portion 185 can be changed to an arbitrary direction. The c-component test device is not limited to the cabin-type device described in the above embodiment, and for example, a helmet-type device and a hot-plate type device may be used. … ^ Industrial advantage: 〇 According to the present invention, the first: providing i can be attached and detached to the body of the plug-in kit; according to the present invention, the second is to provide the plug-in i main body that can be attached to and removed from the guide core. . In addition, according to the present invention, "the first: providing-plugging kit": "Same way for loading and unloading of the guide core" includes a flash lock mechanism, and the flash lock is placed on the car seat ^, and can correspond to IC components of various sizes. In addition, according to the present invention, a plug-in kit is provided including the above-mentioned guide and the plug-in kit, and an electronic component transfer device is provided, including the plug-in kit.
2192-5760-PF(Nl).ptd 第51頁 12382572192-5760-PF (Nl) .ptd Page 51 1238257
第1圖是表示關於本發明 — 施例的IC測試裝置之全體側視圖電子-件測試裳置之-實 示:於此1(:測試裝置之移搬機的立體圖。 穴處理被測㈣的方法 立體:4不關於此IC測試裝置之1c收納器之構造的 體圖 第5圖是表示被使用於此I c測試裝 置之客製托盤的立 置之測試托盤之部 第6圖是表示被使用於此丨c測試裝 分分解立體圖。 、 第7圖是表示被使用於此ic測試裝置與本發明相關之 插接套件的分解立體圖。 第8 ( a )圖是表示構成此插接套件之插接套件本體之 本體部的上視圖。 第8 ( b )圖是第8 ( a )圖之A-A剖面圖。 弟9 ( a )圖是表示構成此插接套件之導芯的上視圖。 第9 (b)圖是第9 (a)圖之a-A剖面圖。 第1 0 ( a )〜((:)圖為說明經由被設置於此插接套件 本體之掛鈎機構,將此導芯裝設於此插接套件本體之順序 的部分剖面圖。 第11 (a)圖是此插接套件本體之上視圖。 第11 (b)圖是第11 U)圖之A-A剖面圖。 第12 (a)圖是表示關於被設置於此插接套件本體之 閂鎖機構,當閂鎖部處於閉位置時的剖面圖(相當於第11FIG. 1 is a perspective view of the entire electronic test device of the IC test device according to the embodiment of the present invention. The electronic test piece is placed in a perspective view. Here is a perspective view of the transfer device of the test device. Method three-dimensional: 4 is not about the structure of the 1c container of the IC test device. FIG. 5 is a part of the test tray showing the standing position of a custom tray used in this IC test device. Used in this 丨 c test equipment exploded perspective view. Figure 7 is an exploded perspective view showing a plug kit used in this IC test device and the present invention. Figure 8 (a) is a diagram showing the composition of this plug kit The top view of the main body of the plug-in kit. Figure 8 (b) is a cross-sectional view taken along the line AA of Figure 8 (a). Figure 9 (a) is a top view showing the guide core constituting the plug-in kit. 9 (b) is a cross-sectional view of aA of FIG. 9 (a). 10 (a) ~ ((:) are illustrations for explaining the installation of the guide core via the hook mechanism provided in the body of the plug-in kit. Here is a partial cross-sectional view of the sequence of the plug-in kit body. Figure 11 (a) is a top view of the plug-in kit body. Fig. 11 (b) is a cross-sectional view taken along the line AA of Fig. 11 U. Fig. 12 (a) is a cross-sectional view showing the latch mechanism provided in the body of the plug-in kit when the latch portion is in the closed position. (Equivalent to 11th
2192-5760-PF(Nl).ptd 第52頁 1238257 圖式簡單說明 (b )圖)。 第 12 (b 圖0 圖是表示此閂鎖機構處於開伋置時的别面 第1 3圖是表示此I C元件測試裝置之測試頭插槽附近的 構造之分解立體圖。 第1 4圖是表示此I C元件測試裝置之測試頭插槽附近的 構造之部分剖面圖。 第1 5圖是經由被設置於此插接套件本體之掛鈎機構來 安裝此導芯於此插接套件本體時,以及經由被設置於此插 接套件本體之掛鈎機構來將此導芯從此插接套件本體卸下φ 時所使用之夾具之側視圖。 第1 6圖是表示關於此掛钩機構之彈簧之其他的實施 之立體圖。 汽也5 第17圖是表示此閃鎖機構之彈簧之其他的實施 體圖〇 第18 (a )圖為用來當作此1C元件測試裝置之 象之I C元件的側視圖。 、〜河 第18 (b )圖是此1C元件測試 第1 9 ( a )圖是表示習知拖接 啟狀態時之部分立體圖。 裝置之下視圖。 套件之閃鎖裝置處於開2192-5760-PF (Nl) .ptd Page 52 1238257 Brief description of the drawing (b). Fig. 12 (b Fig. 0 is an exploded perspective view showing the structure when the latch mechanism is in an open position. Fig. 13 is an exploded perspective view showing a structure near a test head slot of the IC component test device. Fig. 14 is a view showing Partial cross-sectional view of the structure near the test head slot of this IC component test device. Figures 15 and 15 show how the guide core is mounted on the plug kit body via a hook mechanism provided on the plug kit body, and via A side view of a clamp used when a hook mechanism provided in the body of the plug-in kit is used to remove the guide core from the body of the plug-in kit. Figure 16 shows other implementations of the spring of the hook mechanism. Fig. 17 is a diagram showing another embodiment of the spring of the flash lock mechanism. Fig. 18 (a) is a side view of an IC component used as an image of the 1C component test device. ~ Figure 18 (b) is the 1C component test Figure 19 (a) is a partial perspective view showing the state of the conventional dragging start. The lower view of the device. The flash lock device of the kit is on
第 19 (b ) 分立體圖。 圖是表示此閃鎖裝 置處於閉合狀態時之部 符號說明:Section 19 (b). The figure shows the parts when this flash lock device is in the closed state.
:192-5760-PF(Nl).ptd: 192-5760-PF (Nl) .ptd
1238257 圖式簡單說明 1〜移搬機; 2〜I C元件; 5〜測試頭; 6〜測試用主裝置; 7〜纜線; 8〜空間部分; 9〜連接部; 10〜 I C元件測試裝置; 12〜 矩形框; 1 2 a〜邊; 1 3〜 緣框; 14〜 安裝片; 15〜 插接套件收納部 ;16〜 插接套件; 17〜 插接套件本體; 18〜 導芯; 1 9 ~ 拉桿片: 20〜 導孔; 21〜 安裝用孔; 22〜 外部端子; 23〜 下面; 30〜 固定器; 31〜 壓子; 32〜 導銷; 3 4〜 限制器導件; 4 0〜 插槽; 41〜 插槽導件; 4 4〜 連接端子; 5 0〜 插槽板; 100 - -艙室部; 101 - -恒溫槽; 102 - -測試餘室; 103 - “除熱槽; 105 - -裝置基板; 108 - ^測試托盤搬送裝置; 171 - -本體部; 171a 〜元件導引部; 171b 〜元件進入口; 171c 〜導芯裝置口; 171d 〜凹部; 171e 〜芯鉗收容部; 171 f 〜限制面; 171g 〜扭力彈簧裝置面 171 i 〜軸固定部; 171 j 〜彈簧固定部; 171k 〜平台部; 171m 〜貫穿孔;1238257 Schematic description of 1 ~ removing machine; 2 ~ IC components; 5 ~ test heads; 6 ~ test main device; 7 ~ cables; 8 ~ space parts; 9 ~ connecting parts; 10 ~ IC component test device; 12 ~ rectangular frame; 1 2 a ~ side; 1 3 ~ edge frame; 14 ~ mounting piece; 15 ~ plug-in kit storage section; 16 ~ plug-in kit; 17 ~ plug-in kit body; 18 ~ guide core; 1 9 ~ Tie bar: 20 ~ Guide hole; 21 ~ Mounting hole; 22 ~ External terminal; 23 ~ Below; 30 ~ Fixer; 31 ~ Presser; 32 ~ Guide pin; 3 4 ~ Limiter guide; 4 0 ~ Slot; 41 ~ Slot guide; 4 4 ~ Connection terminal; 50 ~ Slot plate; 100--compartment section; 101--constant temperature tank; 102--test room; 103-"heat removal tank; 105 --Device substrate; 108-^ Test tray conveying device; 171--Main body; 171a ~ component guide; 171b ~ component entry port; 171c ~ core guide device port; 171d ~ recessed part; 171e ~ core clamp receiving part; 171 f ~ limit surface; 171g ~ torsion spring device surface 171 i ~ shaft fixing portion; 171 j ~ Spring fixing part; 171k ~ Platform part; 171m ~ Through hole;
2192-5760-PF(M).ptd 第54頁 1238257 圖式簡單說明 171r— 〜閂鎖部收容部; 172〜 芯鉗; 172a 产 〜掛鈎部; 172b〜炎具承受部; 1 7 2 c〜貫穿孔; 172d ' 〜貫穿孔; 173〜 扭力彈簧; 173a, 〜一端部; 1 7 3 b〜他端部; 174〜 軸; 175〜 閂鎖; 175a, 〜施力點; 175b, -閂鎖部; 175c〜臂部; 175d〜第一臂部; 175e, 〜第二臂部; 1 75f〜貫穿孔; 17 6〜 扭力彈簧; 177〜 軸; 181〜 兀件支持部, 1 8 2〜 開口部; 1 8 3〜 突緣部; 184〜 元件導引部連通孔; 1 8 5〜 掛鈎承受部; 186〜 掛鈎進入孔; 1 8 7〜 袖鼓插孔; 18 8 ~ 周緣部; 1 9 i〜 凸部; 192〜 開口部; 193〜 貫穿孔; 194〜 壓力彈簣; 20 0〜 I C收納部; 201〜 測試前I C儲存器; 202〜 測試後I C儲存器 , 20 3〜 托盤支持框; 204〜 昇降台; 205〜 托盤移送臂; 30 0〜 裝載部; 301〜 軌道; 30 2〜 可動臂; 303〜 可動頭; 304〜 X-Y搬送裝置; 30 5〜 調整器; 30 6〜 窗部; 4 0 0〜 卸載部; 4 0 4〜 X-Y搬送裝置;2192-5760-PF (M) .ptd Page 54 1238257 Brief description of the drawings 171r— ~ Latching part receiving part; 172 ~ Core pliers; 172a production ~ Hook part; 172b ~ Inflammation tool receiving part; 1 7 2 c ~ Through-hole; 172d '~ through-hole; 173 ~ torsion spring; 173a, ~ one end; 1 7 3b ~ other end; 174 ~ shaft; 175 ~ latch; 175a, ~ force point; 175b, -latch 175c ~ arm part; 175d ~ first arm part; 175e ~~ second arm part; 1 75f ~ through hole; 17 6 ~ torsion spring; 177 ~ shaft; 181 ~ element support part, 1 8 2 ~ opening 1 8 3 ~ flange part; 184 ~ component guide communication hole; 1 8 5 ~ hook receiving part; 186 ~ hook access hole; 1 8 7 ~ cuff drum socket; 18 8 ~ peripheral part; 1 9 i ~ convex part; 192 ~ opening part; 193 ~ penetrating hole; 194 ~ pressure spring; 20 ~ IC storage part; 201 ~ IC memory before test; 202 ~ IC memory after test, 20 ~ 3 tray support frame 204 ~ lifting table; 205 ~ pallet transfer arm; 300 ~ loading section; 301 ~ rail; 30 ~ movable ; 303~ movable head; 304~ X-Y transport device; adjuster -5 to 30; 6 ~ 30 window portion; 0~ unloading unit 40; 4 0 4~ X-Y transport device;
2192-5760-PF(Nl).ptd 第55頁 12382572192-5760-PF (Nl) .ptd Page 55 1238257
2192-5760-PF(Nl).pid 第56頁2192-5760-PF (Nl) .pid Page 56
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92118823A TWI238257B (en) | 2003-07-10 | 2003-07-10 | Insert kit and electronic device handling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92118823A TWI238257B (en) | 2003-07-10 | 2003-07-10 | Insert kit and electronic device handling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200502557A TW200502557A (en) | 2005-01-16 |
| TWI238257B true TWI238257B (en) | 2005-08-21 |
Family
ID=37000237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92118823A TWI238257B (en) | 2003-07-10 | 2003-07-10 | Insert kit and electronic device handling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI238257B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI385863B (en) * | 2007-11-26 | 2013-02-11 | Advantest Corp | Embedded devices, trays and electronic parts test equipment |
-
2003
- 2003-07-10 TW TW92118823A patent/TWI238257B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI385863B (en) * | 2007-11-26 | 2013-02-11 | Advantest Corp | Embedded devices, trays and electronic parts test equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200502557A (en) | 2005-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3711283B2 (en) | INSERT AND ELECTRONIC COMPONENT HANDLING DEVICE INCLUDING THE SAME | |
| TWI264549B (en) | Pusher with heater, electronic component handling device, and method of controlling temperature of the electronic component | |
| CN100520426C (en) | Insert, tray, and electronic component handling device for electronic component-handling device | |
| TWI276815B (en) | Apparatus for handling electronic components and method for controlling temperature of electronic components | |
| JP5291632B2 (en) | Insert, tray and electronic component testing equipment | |
| CN103369941B (en) | Apparatus and method for manufacturing substrate | |
| TW200940998A (en) | Unit for opening insert for test tray and method of mounting semiconductor device using the same | |
| US10534017B2 (en) | Quick change small footprint testing system and method of use | |
| GB2101819A (en) | Integrated circuit carrier connector | |
| TW200409925A (en) | Pressing member and electronic component handling device | |
| JP2002236140A (en) | Electronic part testing socket and electronic part testing device using it | |
| TW201018916A (en) | Interface member, test section unit, and electronic component testing device | |
| CN101366109A (en) | test sorter | |
| TWI284740B (en) | Insert and electronic component handling apparatus comprising the same | |
| JP2002257900A (en) | Conveyance medium for electronic component to be tested, electronic component testing device, and method of testing | |
| TWI296143B (en) | Method and apparatus for alignment of carriers, carrier handlers and semiconductor handling equipment | |
| TWI238257B (en) | Insert kit and electronic device handling apparatus | |
| TWI317022B (en) | ||
| TWI283300B (en) | Pusher and electronic component handling apparatus | |
| TWI294157B (en) | Test tray for handler for testing semiconductor devices | |
| TW201133688A (en) | Device handler | |
| CN113524064A (en) | Clamping device of electronic equipment | |
| KR101206430B1 (en) | Test handler and method for transferring carrier boards in test handler | |
| TW200846679A (en) | Testing and classifying machine capable of initially using and further reading and writing test card | |
| TWI581095B (en) | Fixture for accommodating an electronic device during test |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |