TWI295219B - The device and method of lapping and polishing with multi composite controlled by magnetic controlled - Google Patents
The device and method of lapping and polishing with multi composite controlled by magnetic controlled Download PDFInfo
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- TWI295219B TWI295219B TW094138327A TW94138327A TWI295219B TW I295219 B TWI295219 B TW I295219B TW 094138327 A TW094138327 A TW 094138327A TW 94138327 A TW94138327 A TW 94138327A TW I295219 B TWI295219 B TW I295219B
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- Prior art keywords
- composite
- polishing
- magnetic
- magnetron
- magnetic pole
- Prior art date
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- 238000005498 polishing Methods 0.000 title claims description 96
- 239000002131 composite material Substances 0.000 title claims description 93
- 238000000034 method Methods 0.000 title claims description 20
- 239000000696 magnetic material Substances 0.000 claims description 40
- 239000006061 abrasive grain Substances 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000007517 polishing process Methods 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 4
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 4
- 238000011160 research Methods 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 1
- 238000000227 grinding Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 16
- 239000002245 particle Substances 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 229910003468 tantalcarbide Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 235000011437 Amygdalus communis Nutrition 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 241000220304 Prunus dulcis Species 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 235000020224 almond Nutrition 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 241000255925 Diptera Species 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- ZKEYULQFFYBZBG-UHFFFAOYSA-N lanthanum carbide Chemical compound [La].[C-]#[C] ZKEYULQFFYBZBG-UHFFFAOYSA-N 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- -1 oxidized hammer Chemical compound 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000009885 systemic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
1295219 九、發明說明: 【發明所屬之技術領域】 種磁控複合] 本案係指一種表面處理裝置與方法,尤指一 研拋裝置與方法。 θ 【先前技術】 叶之乃在於產生—真正符合幾何圖形設 i ^ ,如刺孔㈣、刮傷 進尺寸的精確度或者與配合面_合接觸等。研磨可 用於=坦面、圓柱面、球面或特殊形狀面等的精密加工 加工% ’ _器的研磨面會接觸工件的加卫面,兩者作相= 動^稍地魅_翻面。科細細面之間 :油、油脂或水細粒,明產生磨擦侧,完成研 拋光是指在布輪或皮帶上塗敷磨料顆粒,以磨絲面的一 種=:此财絲财胁精鶴金屬赠加工== 擦痕和其他的缺點。由 ==量及表面的光度視工件材料的』^^^ ,、〜立的大小而定。拋光輪由棉布、帆布、皮革、毛 轉合或縫綴而成,具有適#的表面寬度。且 以^南丨以金屬側板來加強。在輪子周圍面上,塗以膠 7 ^肖1 m即在含有雜 黏結-層顧粒。等乾燥後,重複上項却= 磨料粒。乾燥後,輪表面就會有—層頗為堅硬的磨 1295219 小不同的氧化鋁和碳化矽顆粒,均可作為磨料。通常在作最後 拋光之刖,工件需經過數種不同粒度的拋光輪,由粗而細,依 序操作。 常見的拋光裝置或方法有: 一、滾筒磨光(barrel finishing or tumbling): 滾筒磨光乃是將料表面之毛邊、、尖做及氧化物 等磨除,並改進表面光度的—種加卫法。滾聽光可得到均句 =表面光度^以手工方式很難達到此―目的,故廣泛地用於 磨光數量較多的零件。滚筒磨光是將加工件和磨光用的磨料-旋轉滾筒或振魅之中’必要時,須加人適量的水或油 二=助於操作的化學化合物f。當圓驗慢轉動,上層之加 II動’磨料就在其表面產生摩擦和拋光的作用。至於 頗高。义疋"、有上層加工件才有磨擦的作用,故加工速度 二、皮帶抛光(belt polishing) ·· 的加2光姆上錄磨料輸,以磨光表面 可磨去相當數旦不適用於精密的金柄除加工,但 缺點。由^輪^布二且^消除加工件表面的擦痕和其他的 圓形。寬布帶常用:^板大的形狀和 々大、而疋。抛光輪由棉布、to 士 * 氈或類似材料等 ^帆布、皮革、毛 輪的兩側面,以金屬側板加強之。在輪子周圍ς上, 1295219 Ί膠水或/々黏劑’並且立即在含有磨料粒的槽中滚過,表面 上即黏結一層磨料粒。等乾燥後,再重複上述之工作,加上第 =層膠和磨料粒。乾驗,輪表面就會有—層頗為堅硬的磨 料。此外,各種大小不同的氧化鋁和碳化矽顆粒,均可作為磨 料^通常在作最後的拋光之前,加工件需經過數種不同粒度的 抛光輪,由粗而細,依次地操作。 由於一般之滾筒研拋設備在製程上不易控制加工物的幾 何外形;且皮帶研脸個受限於設_機構,故無法對不同 曲率的表面進行加工。另—方面,在研拋的過程中,常因磁性 磨料本麵導雜材料與純粒的域方式而造絲面 刮痕或損傷。 一此外,傳統的研磨與拋光多數仰賴技術經驗豐富的人員進 仃加工’在加工㈣先行壓製磨具,而磨具製作又包含著許多 相關技術,如不同外型的刻痕槽、磨具尺寸、表面平坦度··等 諸多因素。而在加工過程中,欲精修成形後之鏡片形狀誤差, 亦^定機構偏擺角度及速度、工件轉速、磨具轉速及接觸壓 力等减’因此,傳統加工技術不但須仰賴人員的技術經驗, 同時耗費許多時間及成本。1295219 IX. Description of the invention: [Technical field of invention] Magnetic control composite] This case refers to a surface treatment apparatus and method, and more particularly to a polishing apparatus and method. θ [Prior Art] The result of the leaf is that it is produced—true to match the geometrical design i ^ , such as puncture (4), the accuracy of scratching the size or the contact with the mating surface. Grinding can be used for precision machining of plain, cylindrical, spherical or special-shaped surfaces. The grinding surface of the workpiece is in contact with the framing surface of the workpiece, and the two sides are phased. Between the fine surface: oil, grease or water fine particles, the friction side is produced, and the finished polishing refers to the application of abrasive particles on the cloth wheel or belt to grind the surface of the wire =: Gift processing == scratches and other shortcomings. The amount of == and the luminosity of the surface depend on the size of the workpiece material "^^^,". The polishing wheel is made of cotton, canvas, leather, wool, or stitched with a surface width of #. And with the south side of the metal to strengthen the metal side panels. On the surface around the wheel, apply the glue 7 ^ Xiao 1 m that contains the hetero-adhesive layer. After drying, repeat the above item = abrasive grain. After drying, there will be a layer of hard grinding on the surface of the wheel. 1295219 Smaller different alumina and tantalum carbide particles can be used as abrasive. Usually after the final polishing, the workpiece is subjected to several different sizes of polishing wheels, which are operated in a coarse, thin and sequential manner. Common polishing devices or methods are as follows: 1. Barrel polishing or tumbling: The roller polishing is to remove the burrs, tips and oxides on the surface of the material, and improve the surface luminosity. law. Rolling the light to get the average sentence = surface luminosity ^ is difficult to achieve this by hand, so it is widely used to polish a large number of parts. Roller polishing is the processing of parts and polishing abrasives - rotating drums or vibrating. If necessary, add an appropriate amount of water or oil. When the circle is rotated slowly, the upper layer is added with the action of the abrasive, which causes friction and polishing on the surface. As for the high.疋 疋 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 In addition to precision metal handles, but the disadvantages. The scratches and other circles on the surface of the workpiece are eliminated by the ^ wheel ^ cloth 2 and ^. Wide tapes are commonly used: ^ The shape of the board is large and large. The polishing wheel is made of cotton cloth, toshi* felt or the like. The canvas, leather and the two sides of the wheel are reinforced with metal side plates. Around the wheel, 1295219 Ί glue or / 々 adhesive ' and immediately roll in the groove containing abrasive grains, the surface is bonded with a layer of abrasive particles. After drying, repeat the above work, plus the layer of rubber and abrasive grains. After the dry test, there will be a layer of hard abrasive on the surface of the wheel. In addition, various sizes of alumina and tantalum carbide particles can be used as abrasives. Usually before the final polishing, the workpieces are subjected to several different particle size polishing wheels, which are operated in a coarse and fine manner. Since the general drum polishing and polishing equipment is difficult to control the geometric shape of the workpiece in the manufacturing process; and the belt grinding surface is limited by the setting mechanism, the surface of different curvature cannot be processed. On the other hand, in the process of grinding and polishing, the surface of the magnetic abrasive is often scratched or damaged due to the domain of the impurity-conducting material and the pure particle. In addition, the traditional grinding and polishing relies on the experienced technicians to process the grinding tools. In the processing (4), the grinding tools are firstly pressed, and the grinding tools contain many related technologies, such as the groove and the size of the different shapes. , surface flatness · · and many other factors. In the process of processing, the shape error of the lens after finishing the molding is also determined by the mechanism yaw angle and speed, workpiece rotation speed, grinding speed and contact pressure. Therefore, traditional processing technology depends not only on the technical experience of personnel. At the same time, it takes a lot of time and cost.
Pic著工業發達,像统拋光研磨技術已無法滿足新的衝擊, 各種加工技#咖絲馳紐、彈繼紐(EEM)、機械/化學 (化學/機械)拋光法、滾筒磨光法、磁流體研磨法(MRF〉不斷 地在突破更新,但運壯贿其諸纽制,如儀器設備及加工 具成本昂貴、加工區域範圍限制、加工表面精度、污染等問題。 —故鑑於習知技術之缺失,發明人乃經悉心試驗與研究,並 本鍥而不捨之精神,終於研發出此一磁控複合體研拖裝置與 1295219 方法。 【發明内容】 本案之主要構想為提供一種磁控複合體研拋裝置,其包含: 一磁性材料,其位於該磁控複合體研拋裝置的一旋轉主輪,用 以產生一磁力;一感應線圈,其纏繞於該磁性材料,用以施加 電k,與该磁性材料感應產生一磁場;一磁極,其位於該磁 控衩合體研拋裝置的一端,與該磁性材料相接合,其利用該磁 %吸附一磁性物質;一承載台,其位於該磁控複合體研抛裝置 的一端,用以放置一待處理物,利用該磁極吸附該磁性物質, 同時加入一磨料液,該磨料液因毛細現象而包覆該磁性物質, 利用泫磁性物質對放置於該承載台上的該待處理物表面進行 研拋;以及一阻隔裝置,位於該磁性材料與該磁極之間,用以 阻絕該磁極所吸附之該磁性物質在研拋過程中旋出或脫移該 磁控複合體研拋裝置。 根據上述構想,其中該旋轉主軸可作一升降的運動。 根據上述構想,其中該旋轉主軸以該磁極表面的中心為一 固定點,作一任意角度偏擺的運動。 根據上述構想,其中該旋轉主軸的轉速為可調式。 根據上述構想,其中該旋轉主軸的偏擺速度為可調式。 根據上述想,其中該磁極可為平面。 根據上述構想,其中該磁極可為凹面。 根據上述構想,其中該磁極可為凸面。 根據上述構想,其中該磁極的軸心為實心。 根據上述構想,其中該磁極的軸心為非實心。Pic is developed in the industry, and the polishing technology can not meet the new impact. Various processing techniques #咖丝驰纽,弹继纽(EEM), mechanical/chemical (chemical/mechanical) polishing method, roller polishing method, magnetic The fluid grinding method (MRF) is constantly changing and renewing, but it has to pay for its various systems, such as expensive equipment and tools, limited processing area, surface precision, pollution, etc. In the absence of the inventor, the inventor has carefully developed the magnetron composite wefting device and the 1295219 method. The main idea of the case is to provide a magnetic control composite polishing. The device comprises: a magnetic material located in a rotating main wheel of the magnetron composite polishing device for generating a magnetic force; and an induction coil wound around the magnetic material for applying electricity k, The magnetic material induces a magnetic field; a magnetic pole is located at one end of the magnetron coupling polishing device, and is engaged with the magnetic material, and the magnetic material is used to adsorb a magnetic substance; The table is located at one end of the magnetron composite polishing device for placing a material to be treated, and the magnetic material is adsorbed by the magnetic pole, and an abrasive liquid is added at the same time, and the abrasive liquid coats the magnetic substance due to capillary phenomenon. Using a bismuth magnetic substance to perform polishing on the surface of the object to be treated placed on the stage; and a barrier device between the magnetic material and the magnetic pole for blocking the magnetic substance adsorbed by the magnetic pole from being ground In the process, the magnetron composite polishing device is unscrewed or removed. According to the above concept, the rotating main shaft can be moved up and down. According to the above concept, the rotating main shaft has a fixed point with the center of the magnetic pole surface. According to the above concept, the rotational speed of the rotating main shaft is adjustable. According to the above concept, the yaw speed of the rotating main shaft is adjustable. According to the above, the magnetic pole may be a flat surface. According to the above concept, wherein the magnetic pole can be a concave surface. According to the above concept, wherein the magnetic pole can be a convex surface. According to the above concept, wherein Solid pole axis. According to the above-described concept, wherein the non-solid pole axis.
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根據上述構想,其中該磁極的表面具有一 根據上述構想,其中該承載台的轉速為可調^。 根據上述構想,其中該磁極與該承载台間可工容納—加工 根據上述構想’其中該加轉靠近該磁極的表面為研抛 上述構想’其中該磁極與該承载台間可容納一和人 肢,遠磁極吸附該複合體對該研拋面進行研抛。 ϋ 根據上述構想,其中該磁極與該承载㈣可容納—趣 粒。該磨料粒包覆該複合體對該研拋面進行研拋。 4 根據上述構想,其中該阻隔裝置乃—阻絕複合體或 粒在研拋過程中,脫離研拋面。 本案之另一構想為提供一種複合體,其包含:至少一磁性 材料;-親以及-結合劑;射,該結合劑乃用於結合該 磨料與該雜㈣,且制性材料為該純無結合劑所包 覆。 根據上述構想,其中該磁性材料包含鐵、鈷、鎳等材料中 件0 面 的其 -Ο 根據上述構想,其中該磁性材料包含鐵、鈷、鎳等材料的 合金化合物。 根據上述構想,其中該磨料包含碳化矽、氧化鐵、氧化鈽、 氧化錘、三氧化二鋁及鑽石等材料中的其一。 根據上述構想,其中該磨料包含碳化矽、氧化鐵、氧化鈽、 氧化鍅、三氧化二鋁及鑽石等材料的化合物。 根據上述構想,其應用於一研拋裝置,以對一加工件的一 10 1295219 研拋面進行研拋,其中該研拋裝置包含一磁極。 根據上賴想,其在該雜與該研拋蚊間作—固 動。 < 根據上賴想,其在該雜無研拋面之财—移動的運 動 根據上述構想,其在該磁極與該研拋面之間作 I轉動的運According to the above concept, wherein the surface of the magnetic pole has a shape according to the above concept, wherein the rotational speed of the stage is adjustable. According to the above concept, wherein the magnetic pole and the carrying table are storable-processed according to the above concept, wherein the surface of the magnetic pole is turned into the above-mentioned concept, wherein the magnetic pole and the carrying platform can accommodate a human limb The far magnetic pole adsorbs the composite body to cast the polishing surface. ϋ According to the above concept, the magnetic pole and the bearing (4) can accommodate – interesting particles. The abrasive grains are coated with the composite body to grind the polishing surface. 4 According to the above concept, wherein the barrier device is used to prevent the composite or the particles from separating from the polishing surface during the polishing process. Another concept of the present invention is to provide a composite comprising: at least one magnetic material; a pro-and a binding agent; the bonding agent is used to bond the abrasive with the impurity (4), and the material is pure. Coated with a binder. According to the above concept, the magnetic material contains -0 of the material of iron, cobalt, nickel, etc. According to the above concept, the magnetic material contains an alloy compound of a material such as iron, cobalt, nickel or the like. According to the above concept, the abrasive comprises one of materials such as tantalum carbide, iron oxide, cerium oxide, oxidized hammer, aluminum oxide, and diamond. According to the above concept, the abrasive comprises a compound of a material such as lanthanum carbide, iron oxide, cerium oxide, cerium oxide, aluminum oxide, and diamond. According to the above concept, it is applied to a polishing device for polishing a 10 1295219 polishing surface of a workpiece, wherein the polishing device comprises a magnetic pole. According to Shang Lai, it is fixed between the miscellaneous and the mosquito. < According to Shang Lai, the movement of the no-study paradise-moving movement according to the above concept, the I-rotation between the magnetic pole and the polishing surface
移 根據上述構想,其在該磁極與該研拋面之間作固定 動、轉動的混合的運動。 6人本案之又—構想為提供—種磁控複合體研抛方法,其步驟 W提供—磁控複合體研職置、-磨料液所包覆之1複人 體^加工件;對該磁控複合體研拋裝置m 稷讀研拋裝置感應產生一磁場;利用該磁場吸附該複合體 以及利用為該磨料液所包覆的該複合體對該加讀 面 進行研拋。According to the above concept, a motion of mixing and rotating is performed between the magnetic pole and the polishing surface. 6 people in this case - the idea is to provide a kind of magnetic control composite research and polishing method, the step W provides - the magnetic control composite research and development, - abrasive liquid coated 1 complex body ^ processing parts; the magnetic control The composite grinding and polishing device m inducing a polishing field induces a magnetic field; the magnetic field is adsorbed by the magnetic field and the read surface is ground by the composite coated with the abrasive liquid.
根據上述構想’其中該磁控複合體研_置為-電磁結 構。 ' 料與一結合劑包覆至 根據上述構想,其中該複合體為一磨 少一磁性材料的結構。 【實施方式】 本案將可由以下的實施例說明而得到充分的瞭解,使得孰 習本裝巧找之人士可以_完成之,穌案之實施並柯 由下列貫施例而被限制其實施型態。 請參閱第-«,其係核之複合體研滅置之較佳實 11 1295219 施例之磁控确加工轉圖,該雜複合购鎌置為一電磁 結構’其包含-磁性材料主軸n、__線圈12、一According to the above concept, the magnetron composite is placed in an electromagnetic configuration. The material is coated with a binder to the above concept, wherein the composite is a structure in which a magnetic material is worn. [Embodiment] The present case will be fully understood by the following examples, so that the person who is accustomed to finding this book can be completed, and the implementation of the case is restricted by the following embodiments. . Please refer to the -«, the composite of the nucleus of the nucleus. The magnetic control is processed. The hybrid composite is an electromagnetic structure. __coil 12, one
置B、-磨裝喷嘴14、一凸面磁極15、一複合體16、一凹^ 加工件17及承載σ ι8,插作方式是將該感應線圈裝置^ 附加於該研難置上;糾,_羯裝置13安置於該磁極 15,再將其與該磁性材料主軸^連結驅動,雜轉主轴^可 作-升降的運動,並可以該磁極15表面的中心為一固定點, 作-任意角度Ω或Θ偏擺的運動,且該旋轉錄η的轉速叫 與偏擺速度為可調式。而該加工件17則置於該承載台ΐ8,★亥 承載台18的轉速叱為可調式。 ^ 該線圈12外加-可調式供電系統,在通電後感應產生— 磁場Μ,Μ之大小與通過的電流I及線圈圈數η成正比,藉以 控制該磁極15吸_複合體16之顧力量,故藉由電流大小 調整,可控繼磁極15磁場的強弱,在本實施例中該磁極b 吸附該複合體16之磁獅賴為〇〜3躺树她)。在執 加工H除表面不良點、修正加卫面形狀精度,弊 調高線_流量I促使制極具較強磁顧度M _該^The B, the grinding nozzle 14, the convex magnetic pole 15, the composite 16, the concave processing member 17, and the bearing σ ι8 are inserted in the manner of attaching the induction coil device to the grinding device; The 羯 device 13 is disposed on the magnetic pole 15 and is coupled to the main shaft of the magnetic material. The miscellaneous spindle can be used for lifting movement, and the center of the surface of the magnetic pole 15 can be a fixed point. The movement of Ω or Θ yaw, and the rotational speed of the rotation record η is adjustable with the yaw rate. The workpiece 17 is placed on the carrier table 8, and the rotational speed of the platform 18 is adjustable. ^ The coil 12 is externally-adjustable power supply system, which is induced after being energized - the magnetic field is Μ, and the size of the Μ is proportional to the current I passing through and the number of turns η, thereby controlling the magnetic force of the magnetic pole 15 to absorb the composite 16 Therefore, by adjusting the current, the strength of the magnetic field of the magnetic pole 15 can be controlled. In this embodiment, the magnetic pole b adsorbs the magnetic lion of the composite body 16 as a 〇3 tree. In addition to the processing of H in addition to the surface defects, correct the shape accuracy of the garrison, the high line _ flow I urging the system has a strong magnetic degree M _ ^
體’讓該複合體間較難產生相對運動,進行研磨加工;而S 地’撤光過程中,為降低表面粗糙度值(p_v值),透過減少 該線圈的電流量1,使該雜磁場強度Μ _,致使該複合 車乂易產生姆勒,亦即產生雜撓刷,加工表 所 欲獲得之加工面。 逆简 在加工過程中,可由磨襞喷嘴14加入磨料液以輔助加 工、冷卻或帶走切屑等。依據研撤複合體的選用,加入合適σ 磨料液,該磨料液乃由不同號數之磨料粒如碳化石夕、氧化= 之 12 ‘1295219 氧化錦、氧化锆、三氧化二鋁及鑽石等以及混合油與水所組成。 請參閱第二圖⑻⑻⑻,其係本案之磁控複合體研拋裝置 之磁極幾何形狀示意圖,該磁極的軸心為實心或非實心且需具 有導磁性。在第二圖⑻中,該磁極21為凹面,其適用於凸面 之加工件22;在第二圖(b)中,該磁極15為凸面,其適用於凹 面之加工件17;而在第二圖(c)中,該磁極23為平面,其適用於 平面之加工件24。The body 'is difficult to produce relative motion between the composites, and the grinding process is performed; and in the S-ground 'removal process, to reduce the surface roughness value (p_v value), the magnetic field is reduced by reducing the current amount 1 of the coil. The strength Μ _, so that the composite car is easy to produce Müller, that is, the production of miscellaneous brush, processing surface to obtain the processing surface. Reverse Simplification During processing, abrasive fluid can be added to the burr nozzle 14 to aid in processing, cooling, or taking away chips. According to the selection of the research and withdrawal complex, a suitable σ abrasive liquid is added, which is composed of different numbers of abrasive grains such as carbon carbide, oxidation = 12 '1295219 oxidized bromine, zirconia, alumina and diamonds, etc. Mixed oil and water. Please refer to the second figure (8)(8)(8), which is a schematic diagram of the magnetic pole geometry of the magnetron composite polishing device of the present invention. The axis of the magnetic pole is solid or non-solid and needs to be magnetically conductive. In the second figure (8), the magnetic pole 21 is a concave surface, which is suitable for the convex workpiece 22; in the second diagram (b), the magnetic pole 15 is a convex surface, which is suitable for the concave workpiece 17; In the figure (c), the magnetic pole 23 is a flat surface which is suitable for the planar workpiece 24.
请苓閱第三圖,其係本案之磁控複合體研拋裝置之磁極表 面/、有4數個溝槽之立體圖,該磁極的轴心為實心或非實 〜,於其表面具有複數個溝槽19,該等溝槽19可控制一磁力 線之分佈。 請麥閱第四圖,其係本案之磁控複合體研拋裝置之磁極表 面具有減個溝槽之舰示意圖,該磁極15表面具有複數個 溝槽19。Please refer to the third figure, which is the magnetic pole surface of the magnetron composite polishing device of the present invention, and has a perspective view of four grooves. The axis of the magnetic pole is solid or non-solid~, and has a plurality of surfaces on the surface thereof. Grooves 19, which control the distribution of a line of magnetic force. Please refer to the fourth figure, which is a schematic view of the magnetic pole surface of the magnetron composite polishing device of the present invention having a reduced groove, and the surface of the magnetic pole 15 has a plurality of grooves 19.
=參閱第五圖__剛’其係本案之複合體基礎結 在第五圖⑻中,該複合體結構為—球型磁性材料 被-“做磨料粒32所包覆;第五圖⑻中該複合構 為-子彈義性材料33被—結合淑賴粒32所包覆第五 圖⑹中該複合體結構為—橢球型磁性㈣及 料粒32所包覆;第五晴該複 皮 35被-結合劑及磨料粒32戶斤 的柱型磁性材料 為-杏仁_崎料36被—結合#邮==體= ___ 被-結^ 該爾料31、33、34、35、36與37包含鐵1_ 13 1295219 材料中的其-或其合金化合物;而該磨料粒%包含碳化石夕、 氧化鐵、氧化錦、氧化锆、三氧化二銘及鑽石等材料中的盆一 =其合金化合物。該複合體可利用磁吸力量的強弱來調整控制 ’、運動方式,使5驗合體在該雜與該砸^面間產生固定 動、轉動或混合式的運動。 請參閱第六圖⑻⑻⑻⑷⑻,其係本案之複合體磁性材料 偏心結構示意圖,在第六圖⑻中,該複合體結構為一球型磁性 材料3!被-結合劑及磨料粒32所偏心包覆;第六剛中該複 合體結構為至少-子彈型磁性材料33被—結合劑及磨料粒32 所偏心包㈣六_中該複合體結構為—杏仁派型磁性材料 36被-結合劑及磨料粒32所偏心包覆;第六圖⑷中該複合體 、=為-橢球型磁性材料34被一結合劑及磨料粒32所偏心包 覆;第六圖⑻中該複合體結構為一角錐型磁性 έ士人 劑及磨料粒32所偏心包覆。 反…口 =苓閱第七圖,其係本案所述複合體密合示意圖,在研磨 與拋光加工丽,欲使該磁極15表面吸附之該複合體16與該加 工件Π表贿合,賴降低外加電流1,使該複合體%可產 生相=移δ達到密合效果,如此方得執行後續之研拋加工。 一:翏閱第八圖,其係本案之磁控複合體研抛裝置之阻隔裝 置不意、圖,該阻隔裝置13可避免該複合體16由八位置脫移 至Α’位置,或於方走轉時由Α位置脫移至Β,位置,而進入主軸 造成該裝置或該加工件損傷。 ^明苓閱第九圖,其係本案所述磨料液包覆複合體示意圖, 该磨料液61中之磨料粒因毛細作用附著於該複合體16的表面 層’當该複合體Ιό因磁控及機構驅動後,便引導該磨料液61 14 1295219 =研拋區域,透過該複合體本身外層的磨料及磨料液 中的磨粒,進行研拋加工之動作,修 形狀精度。 ”、不上所述’本案不僅能纽—般雖研拋的缺點,並降低 對技術人員的侧、驗冗模具製作並減少物力的花費, 提供;種_紐高的製触力、、纟靖縣義研拋裝置。 —縱使本I明已由上述之實施例詳細敘述而可由熟悉本技 藝之人士任思而為諸般修飾,然皆不脫如附申請專利範圍 所欲保護者。 【圖式簡單說明】 第一圖:其係本案之磁控複合體研拋裝置之較佳實施例 之磁控研拋加工示意圖; 第一圖⑻(b)(c)·其係本案之磁控複合體研拋裝置之磁極 幾何形狀示意圖; 第二圖·_其係本案之磁控複合體研拋裝置之磁極表面具 有複數個溝槽之立體示意圖 …^ ' 第四圖:其係本案之磁控複合體研拋裝置之磁極表面具 有複數個溝槽之剖視示意圖; 第五圖(a)(b)(cXd)(e)(f):其係本案之複合體基礎結構示意 圖; 第六圖⑻(bXc)(d)(e):其係本案之複合體磁性材料偏心結 構示意圖; 第七圖:其係本案所述複合球體密合示意圖; 第八圖··其係本案之磁控複合體研拋裝置之阻隔裝置示 15 1295219 意圖;以及 第九圖:其係本案所述磨料液包覆複合體示意圖。 【主要元件符號說明】 11:磁性材料主轴 12:感應線圈 13:阻隔裝置 14:磨漿喷嘴 15:凸面磁極 16:複合體 17:凹面加工件 18:承載台 19:溝槽 21:凹面磁極 22:凸面加工件 23:平面磁極 24:平面加工件 31:球型磁性材料 32:結合劑及磨料粒 33:子彈型磁性材料 34:橢球型磁性材料 35:柱型磁性材料 36:杏仁派型磁性材料 37:角錐型磁性材料 61:磨料液 16= Refer to the fifth figure __刚's composite foundation foundation in this case in the fifth figure (8), the composite structure is - spherical magnetic material is - "coated with abrasive particles 32; fifth figure (8) The composite structure is a bullet-like material 33 which is coated with a combination of Shu Lai particles 32. In the fifth diagram (6), the composite structure is covered by an ellipsoidal magnetic (four) and a pellet 32; 35-bonding agent and abrasive grain 32 jin of columnar magnetic material - almond _ _ _ _ 36 - _ # = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = 37 comprises - or an alloy compound thereof in the material of iron 1_ 13 1295219; and the abrasive grain % comprises a pot of carbon stone, iron oxide, bromine, zirconia, bismuth oxide and diamond; Compound. The composite can use the strength of the magnetic force to adjust the control 'and the movement mode, so that the 5 complex produces a fixed motion, rotation or hybrid motion between the impurity and the surface. See Figure 6 (8) (8) (8) (4) (8) , which is a schematic diagram of the eccentric structure of the composite magnetic material in the present case, in the sixth figure (8), the composite structure is The spherical magnetic material 3! is eccentrically coated by the binder and the abrasive grains 32; in the sixth rigid layer, the composite structure is at least the - bullet type magnetic material 33 is bounded by the binder and the abrasive grains 32 (4) The composite structure is that the amygdaloid magnetic material 36 is eccentrically coated by the binder and the abrasive grains 32; in the sixth diagram (4), the composite, the ellipsoidal magnetic material 34 is bonded by a binder and abrasive grains. 32 eccentric coating; in the sixth figure (8), the composite structure is eccentrically wrapped by a pyramidal magnetic gentleman agent and abrasive grains 32. The reverse mouth is the seventh embodiment, which is the complex described in the present case. The close-up schematic diagram, in the grinding and polishing process, the composite body 16 to be adsorbed on the surface of the magnetic pole 15 is smashed with the workpiece, and the applied current is reduced, so that the composite body can produce phase=shift δ The sealing effect is such that the subsequent grinding and polishing processing can be performed. I: Referring to the eighth figure, the blocking device of the magnetron composite polishing device of the present invention is not intended to be, and the blocking device 13 can avoid the composite 16 From the eight position to the Α' position, or from the Α position to the Β when the square is moving Position, and entering the main shaft causes damage to the device or the workpiece. ^Ming 苓9, which is a schematic diagram of the abrasive liquid coating composite in the present case, the abrasive grains in the abrasive liquid 61 are attached to the composite by capillary action The surface layer of the body 16 is guided by the magnetron and mechanism to guide the abrasive liquid 61 14 1295219 = grinding and polishing area, and the abrasive grains in the outer layer of the composite itself and the abrasive grains in the abrasive liquid are ground. The operation of throwing the machining, repairing the shape accuracy. ", not the above" This case can not only be used as a general-purpose, but also reduces the cost of the technicians' side, the inspection of the mold and the reduction of material resources. Niigao's systemic touch, and Yijing County Yiyan throwing device. The present invention has been described in detail by the above-described embodiments and can be modified by those skilled in the art without departing from the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a magnetron polishing process of a preferred embodiment of a magnetron composite polishing device of the present invention; FIG. 1(b)(b)(c)· Schematic diagram of the magnetic pole geometry of the controlled composite grinding and polishing device; The second figure· _ is the stereoscopic schematic diagram of the magnetic pole surface of the magnetic control composite polishing and polishing device of the present invention having a plurality of grooves... ^ 'The fourth picture: A schematic cross-sectional view of a plurality of grooves on a magnetic pole surface of a magnetron composite polishing device; a fifth diagram (a)(b)(cXd)(e)(f): a schematic diagram of a composite foundation structure of the present invention; Figure 6 (8) (bXc) (d) (e): It is a schematic diagram of the eccentric structure of the composite magnetic material in this case; Figure 7: It is a schematic diagram of the composite sphere in the present case; Figure 8 is the magnetic of the case The barrier device of the controlled composite polishing device shows 15 1295219 intent; and the ninth diagram: it is a schematic diagram of the abrasive liquid coating composite in the present case. [Main component symbol description] 11: Magnetic material spindle 12: Induction coil 13: Barrier device 14: Refining nozzle 15: Convex magnetic pole 16: Composite 17: Concave workpiece 18: Carrier 19: Groove 21: Concave magnetic pole 22 : convex surface processing member 23: planar magnetic pole 24: planar processing member 31: spherical magnetic material 32: bonding agent and abrasive grains 33: bullet type magnetic material 34: ellipsoid type magnetic material 35: cylindrical magnetic material 36: almond type Magnetic material 37: pyramid type magnetic material 61: abrasive liquid 16
Claims (1)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094138327A TWI295219B (en) | 2005-11-01 | 2005-11-01 | The device and method of lapping and polishing with multi composite controlled by magnetic controlled |
| US11/536,503 US20070099547A1 (en) | 2005-11-01 | 2006-09-28 | Polishing Device And Method With Multi Composite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094138327A TWI295219B (en) | 2005-11-01 | 2005-11-01 | The device and method of lapping and polishing with multi composite controlled by magnetic controlled |
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| TW200718508A TW200718508A (en) | 2007-05-16 |
| TWI295219B true TWI295219B (en) | 2008-04-01 |
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| TW094138327A TWI295219B (en) | 2005-11-01 | 2005-11-01 | The device and method of lapping and polishing with multi composite controlled by magnetic controlled |
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| US (1) | US20070099547A1 (en) |
| TW (1) | TWI295219B (en) |
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| US8974268B2 (en) * | 2010-06-25 | 2015-03-10 | Corning Incorporated | Method of preparing an edge-strengthened article |
| CN103111917B (en) * | 2013-01-28 | 2015-11-18 | 嘉兴纳美精密机械有限公司 | The efficient magnetorheological grinding and polishing device that a kind of magnetic circuit break-make is controlled |
| CN112222987B (en) * | 2020-10-19 | 2023-01-10 | 湖南南华乐器有限公司 | Magnetic control formula plank line grinding device that carves patterns |
| CN112658809B (en) * | 2020-12-04 | 2022-08-12 | 陕西科技大学 | A kind of workpiece forming and surface polishing device and processing method based on magnetorheological fluid |
| CN112975581B (en) * | 2021-02-09 | 2022-08-09 | 华东理工大学 | Jet flow reinforced polishing integrated device and process |
| CN118800880B (en) * | 2024-09-10 | 2025-01-24 | 浙江天能新能源有限公司 | In-situ carbon-coated vanadium oxide positive electrode sheet coating device and method for battery pack |
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| US5855790A (en) * | 1994-02-07 | 1999-01-05 | Selective Environmental Technologies, Inc. | Magnetic particles, a method for the preparation thereof and their use in the purification of solutions |
| KR100562446B1 (en) * | 1998-02-19 | 2006-03-20 | 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 | Abrasive Supplies and Glass Polishing Methods |
| US6227942B1 (en) * | 1999-04-21 | 2001-05-08 | H-Semitran Llc | Ferrofluidic finishing |
| US6413441B1 (en) * | 1999-05-06 | 2002-07-02 | Mpm Ltd. | Magnetic polishing fluids |
| US6231426B1 (en) * | 2000-06-16 | 2001-05-15 | Lu-Jung Liao | Magnetic polishing machine |
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| TW200718508A (en) | 2007-05-16 |
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