TWI285797B - Method for designing an overlay mark - Google Patents
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- TWI285797B TWI285797B TW94141682A TW94141682A TWI285797B TW I285797 B TWI285797 B TW I285797B TW 94141682 A TW94141682 A TW 94141682A TW 94141682 A TW94141682 A TW 94141682A TW I285797 B TWI285797 B TW I285797B
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000005259 measurement Methods 0.000 claims abstract description 23
- 230000035945 sensitivity Effects 0.000 claims abstract description 14
- 238000005457 optimization Methods 0.000 claims abstract description 9
- 238000013461 design Methods 0.000 claims description 14
- 238000005070 sampling Methods 0.000 claims description 6
- 238000005295 random walk Methods 0.000 claims description 3
- 230000010287 polarization Effects 0.000 claims 1
- 239000000523 sample Substances 0.000 abstract 2
- 230000003993 interaction Effects 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 description 7
- 239000011295 pitch Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013433 optimization analysis Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
Description
1285797 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種對位標記之設計方法,特別係關於一 種具有最佳化光柵週期與光柵線寬週期比之對位標記的設 、 計方法。 【先前技術】 製程檢測技術的優劣一直是攸關著半導體製程良率好壞 的重要因素,隨著半導體製程技術對於疊對量測的要求日 _ 趨嚴苛’根據ITRS(International Technology R〇admap for1285797 IX. Description of the Invention: [Technical Field] The present invention relates to a method for designing a registration mark, and more particularly to a method for designing and aligning an alignment mark having an optimized grating period and a grating line width period ratio . [Prior Art] The pros and cons of process detection technology have always been an important factor in the yield of semiconductor processes. With the requirements of semiconductor process technology for stack-to-measurement measurement, it is becoming more and more stringent according to ITRS (International Technology R〇admap). For
Semiconductor)對於半導體相關技術發展的報告,;奈米 線寬製程的疊對量測精確度的要求是3·5奈米,90奈米線寬 . 製程的疊對量測精確度的要求則是3.2奈米,隨著製程線寬 • 愈來愈小,65奈米線寬次世代半導體製程的疊對量測精確 度的要求將達2·3奈米,傳統光學影像式(bright_field microscope)疊對量測機台由於受限於繞射極限與本身量測 精確度等問題將不易達成此一量測精確度的要求。新近被 鲁 提出以嚴格耦合波理論(rigorous coupled wave theory ; RCWT)為基礎的散射術量測方法,由於散射儀機台本身具 較好的重複性與再現性,被視為將是下一次世代半導體疊 對量測的利器,所以如何提高此散射術量測方法的精確度 以符合日趨嚴苛的要求,便成為一個相當重要的課題。 【發明内容】 本發明之^目㈣提供_種具㈣佳化絲週期與光 柵線寬週期比對位標記之設計方法。 PD0086.doc 100210 PDoo86 004965308-1 1285797 為達成上述目的,本發明揭示一種具有最佳化光柵週期 與光柵線寬週期比對位標記之設計方法。本發明之對位標 記之設計方法首先以一光束照射一對位標記,再以一光偵 測器量測該光束經該對位標記後所產生之一繞射光。接 著,選擇該對位標記之複數個參數,並最佳化該複數個參 數用以增加疊對量測的靈敏度。最後,選用具有最大靈敏 度之對位標記設計晶圓之對位標記。 【實施方式】Semiconductor) report on the development of semiconductor-related technologies; the stack-to-measure accuracy requirement for nanowire-line processing is 3.5 nm, 90 nm linewidth. The stack-to-measure accuracy requirement for the process is 3.2 nm, as the process line width is smaller and smaller, the 65 nm line width next generation semiconductor process stacking measurement accuracy requirements will reach 2.3 nm, the traditional optical image type (bright_field microscope) stack It is difficult for the measuring machine to meet the requirements of this measurement accuracy due to problems such as limitation of the diffraction limit and its own measurement accuracy. Recently, Lu was proposed to use the rigorous coupled wave theory (RCWT)-based scattering measurement method. Because the scatterometer machine itself has good repeatability and reproducibility, it is considered to be the next generation. The semiconductor stack is a powerful tool for measuring, so how to improve the accuracy of this scattering measurement method to meet the increasingly stringent requirements has become a very important topic. SUMMARY OF THE INVENTION The object of the present invention is to provide a design method for the quaternary (4) compliant filament period and the grating line width period ratio alignment mark. PD0086.doc 100210 PDoo86 004965308-1 1285797 To achieve the above object, the present invention discloses a method of designing an alignment mark with optimized grating period and grating line width period ratio. The design method of the alignment mark of the present invention firstly irradiates a pair of bit marks with a light beam, and then measures a diffracted light generated by the light beam passing through the alignment mark by a light detector. Next, a plurality of parameters of the alignment mark are selected, and the plurality of parameters are optimized to increase the sensitivity of the overlay measurement. Finally, the alignment mark of the wafer is designed using the alignment mark with the greatest sensitivity. [Embodiment]
圖1係一對位標記10之示意圖。該對位標記10係由一第一 光柵14及一第二光柵16組成,且該第一光柵14及該第二光 柵16之週期(pitch)相同。該第一光柵14係由光阻 (photoresist)構成,第二光柵16則是由二氧化矽(silic〇n dioxide)構成,中間層18是一層均勻的多晶矽 (polysilicon),底層 12是矽基板(silic〇n substme)。各層材 料的厚度、折射率(refractive index)與消光係數(extincti的 coefficient)整理如表一。 表一Figure 1 is a schematic illustration of a pair of bit marks 10. The alignment mark 10 is composed of a first grating 14 and a second grating 16, and the pitches of the first grating 14 and the second grating 16 are the same. The first grating 14 is composed of photoresist, the second grating 16 is composed of silicium oxide, the intermediate layer 18 is a uniform polysilicon, and the bottom layer 12 is a germanium substrate ( Silic〇n substme). The thickness, refractive index and extinction coefficient of each layer are summarized in Table 1. Table I
t/響對位標記10疊對誤差之量測靈敏度的因素除了機 本身的特1±、機構設計、後端彳貞測器優劣與訊號處理技— PD0086.doc 1285797 等因素之外,待測樣品的結構參數差異亦改變反射光之特 徵圖譜的形狀且影響特徵圖譜彼此之離散程度。例如,不 同的材料之折射率(refractive index)與消光係數(extincti〇n coefficient)、厚度、幾何形狀與蝕刻後樣品的侧壁角度 (sidewall angle)等結構參數均會影響對位標記疊對誤差之 量測靈敏度。材料與厚度係由元件特性決定,而侧壁角度 大小則與敍刻機台有關。因此,可供設計人員調整的參數 就是待測樣品的幾何形狀。就散射儀機台使用的光柵對位 標記而言’其幾何形狀包括光柵週期(phch)與光栅線寬週 期比(line-to-pitch ratio,LS ratio)兩個參數。 圖2係一角度散射儀20之系統架構示意圖。雖然下文係以 角度散射儀為實施例,但本發明亦可應用於反射儀 (spectroscopic reflect〇rmeter)、多波長單角度入射的橢偏儀 (specular spectroscopic ellipsometer)。角度散射儀 2〇為單一 波長雷射光入射且多角度掃描的(2 —幻光學系統架構,雷射 光源30產生之入射光22與法線26的夾角和反射光24與法線 26的夾角相同,且光偵測器32僅接收零階的反射光。入射 光源可選用目前常用的雷射光,包括氬離子雷射(波長為 488奈米與514奈米);氦鎘雷射(波長為442奈米);氦氖雷射 (波長為612奈米與633奈米);鈥-釔鋁柘榴雷射(波長為532 奈米)。藉由改變入射角度0可以得到一入射光角度與反射 光角度的特徵圖譜(signature),亦即此特徵圖譜為入射角0 之函數。上述入射光源係一雷射光源,然亦可採用一寬頻 光源(broadband source),此時所得到的特徵圖譜為為該寬 PD0086.doc 100210 PDo〇86 004965308-1 1285797 頻光源波長之函數。 復參圖1 ’其中該第-光柵14及該第二光柵16均為一具光 栅週期之、维結構。為了能夠偵測水平方向(χ方向)與垂 直方向(Υ方向)的疊對誤差量,使Ρ組共兩個具一維光 . 栅結構的對位標記,其光柵的方向向量(grating vector) 刀別在水平方向與垂直方向上,再利用如圖2中之雷射光源 3〇分別進行掃描。若第—光栅14,及第二光栅16,均採二維結 構(參圖3),則雷射光源3()只需掃描此對位標記即可同時得 •:丨水平與垂直方向的疊對誤差量,而本發明之對位標記之 设计方法亦可適用於此二維之對位標記。 圖4顯不不同疊對誤差量的反射光特徵圖譜,其中橫軸為 • 掃描角度(即入射光角度),縱軸為反射光強度,且疊對誤差 量)係界於0至400奈米,間距為2〇〇奈米。對於不同幾 何形狀的對位標記,雖然特徵圖譜之疊對誤差量之間距相 同,但特徵圖譜彼此之離散程度將因此而不相同。換言之, φ 如果可以找出特徵圖譜的離散程度為最大時之對位標記幾 何^/狀,則量測系統愈容易分辨不同的疊對誤差量,也就 是疊對量測的靈敏度愈高。 特徵圖譜中的反射光強度可表示為·· R^\u{z2) X u(z2y\The t/reposition mark 10 stack-to-error measurement sensitivity factor is measured in addition to the machine's unique 1±, mechanism design, back-end detector quality and signal processing technology—PD0086.doc 1285797 The difference in structural parameters of the sample also changes the shape of the characteristic map of the reflected light and affects the degree of dispersion of the characteristic maps. For example, the refractive index and extinct〇n coefficient of different materials, thickness, geometry, and sidewall parameters of the sample after etching will affect the alignment mark overlap error. The measurement sensitivity. The material and thickness are determined by the characteristics of the component, while the angle of the sidewall is related to the sizing machine. Therefore, the parameters that can be adjusted by the designer are the geometry of the sample to be tested. As far as the grating alignment mark used by the scatterometer machine is concerned, its geometry includes two parameters of a grating period (phch) and a line-to-pitch ratio (LS ratio). 2 is a schematic diagram of the system architecture of an angle scatterometer 20. Although an angle scatterometer is exemplified below, the present invention is also applicable to a spectroscopic reflect 〇rmeter, a multi-wavelength spectroscopic ellipsometer. The angle scatterometer 2 is a single-wavelength laser light incident and multi-angle scanning (2 - phantom optical system architecture, the angle between the incident light 22 generated by the laser source 30 and the normal 26 and the angle between the reflected light 24 and the normal 26 The photodetector 32 only receives the zero-order reflected light. The incident light source can be selected from the currently used laser light, including an argon ion laser (wavelength of 488 nm and 514 nm); and a cadmium-doped laser (wavelength of 442) Nano); 氦氖 laser (wavelength 612 nm and 633 nm); 鈥-钇 aluminum 柘 laser (wavelength 532 nm). By changing the incident angle 0, an incident light angle and reflected light can be obtained. The characteristic map of the angle, that is, the characteristic map is a function of the incident angle 0. The incident light source is a laser light source, but a broadband source can also be used, and the obtained characteristic map is The wide PD0086.doc 100210 PDo〇86 004965308-1 1285797 is a function of the wavelength of the frequency source. The reference Fig. 1 'where the first grating 14 and the second grating 16 are both a grating period and a dimensional structure. Measure horizontal direction ) The amount of error in the vertical direction (Υ direction), so that the Ρ group has two one-dimensional light. The alignment mark of the grating structure, the grating vector vector (grating vector) is in the horizontal direction and the vertical direction. Then, scanning is performed separately by using the laser light source 3〇 as shown in Fig. 2. If the first grating 14 and the second grating 16 are both in a two-dimensional structure (refer to Fig. 3), the laser light source 3() only needs to be scanned. The alignment mark can simultaneously obtain the amount of overlap error in the horizontal and vertical directions, and the design method of the alignment mark of the present invention can also be applied to the two-dimensional alignment mark. The reflected light characteristic map of the error amount, wherein the horizontal axis is • the scanning angle (ie, the incident light angle), the vertical axis is the reflected light intensity, and the overlap error amount is bounded by 0 to 400 nm, and the pitch is 2 Meter. For the alignment marks of different geometric shapes, although the overlap of the feature maps is the same as the error amount, the degree of dispersion of the feature maps from each other will be different. In other words, φ If it is possible to find the alignment mark geometry of the feature map with the largest degree of dispersion, the easier the measurement system can distinguish the different stack error amounts, that is, the higher the sensitivity of the stack pair measurement. The intensity of reflected light in the feature map can be expressed as ··· R^\u{z2) X u(z2y\
t/W = exp[-(z2—Zi)M]t/(22) 「〇 VIt/W = exp[-(z2—Zi)M]t/(22) ”〇 VI
及6分別是光入射光柵的入射位置與出射位置座標;M PD0086.doc 100210 PD0086 004965308-1 1285797 為轉換矩陣(transformation matrix); A:。是入射光在入射光間 ()的波數(wave number);夂是入射光在光栅區域 (A < z < a)光軸上(z軸)的波數;(i-v)是光柵繞射級數;丨是單位 矩陣(identity matrix)。 就角度散射儀而言,Ar2(/-V)為光柵週期、光栅線寬週期比、 疊對誤差量及入射光角度之函數。因此,其反射光強度可 表不為· i? = |ί7(ζ2) x JJ(z2 )* = R(pitch, LSratio, Θ., A0L ) 如果固定光栅週期及光栅線寬週期比,則可定義一平均 標準差(average standard deviation,ASD)公式為: 其中A為入射雷射光束的起始角度,心為入射雷射光束 的最終角度,Μ是掃描角度取樣點的總數,及⑷,△%)是在疊 對誤差量為Δ〜.時的反射光特徵圖譜幻即是在雷射光束 入射角為Θ時,以不同疊對誤差量的反射光強度 及⑷,Δ〜)|>12 /求得的一標準差值。因此,ASD值代表不同疊 對誤差量的反射光特徵圖譜間的離散程度,ASD值愈大則 表示特徵圖譜間的離散程度愈大。如前所述,離散程度愈 大’量測系統愈容易分辨不同的疊對誤差量,也就是疊對 量測的靈敏度愈高。反之,則疊對量測的靈敏度愈低。 就反射儀而言,#-ν)2為光柵週期、光柵線寬週期比、疊 對誤差量及入射光波長之函數。因此,其反射光強度可表 PD0086.doc 100210 PDoo86 004965308-1 -10- 1285797 示為: ^ U^y^Ripitch.LSratio,^,^) 如果固定光柵週期及光栅線寬週期比,則其平均標準差 (ASD)為: ASDj|w,And 6 are respectively the incident position and the exit position coordinate of the light incident grating; M PD0086.doc 100210 PD0086 004965308-1 1285797 is a transformation matrix; A:. Is the wave number of the incident light between the incident light; 夂 is the wave number of the incident light on the optical axis of the grating region (A < z < a) (z axis); (iv) is the grating winding The number of shots; 丨 is the identity matrix. In the case of an angle scatterometer, Ar2(/-V) is a function of the grating period, the grating line width period ratio, the stacking error amount, and the incident light angle. Therefore, the reflected light intensity can be expressed as · i? = |ί7(ζ2) x JJ(z2 )* = R(pitch, LSratio, Θ., A0L ) If the grating period and the grating line width period ratio are fixed, Define an average standard deviation (ASD) formula as: where A is the starting angle of the incident laser beam, the heart is the final angle of the incident laser beam, Μ is the total number of sampling points of the scanning angle, and (4), △ %) is the reflected light characteristic map when the stacking error amount is Δ~. The phantom is the reflected light intensity with different stacking error amounts when the incident angle of the laser beam is Θ and (4), Δ~)| 12 / A standard deviation obtained. Therefore, the ASD value represents the degree of dispersion between the reflected light characteristic maps of different overlapping error amounts, and the larger the ASD value, the greater the degree of dispersion between the characteristic maps. As mentioned earlier, the greater the degree of dispersion, the easier it is for the measurement system to resolve the different amount of overlap error, that is, the higher the sensitivity of the overlay measurement. Conversely, the lower the sensitivity of the overlay measurement. For the reflectometer, #-ν)2 is a function of the grating period, the grating linewidth period ratio, the amount of overlap error, and the wavelength of the incident light. Therefore, the reflected light intensity can be expressed as PD0086.doc 100210 PDoo86 004965308-1 -10- 1285797 as: ^ U^y^Ripitch.LSratio,^,^) If the fixed grating period and the grating line width period ratio, then the average The standard deviation (ASD) is: ASDj|w,
咐)' t (4认lJ - 似,v))2 A VAOL / 其中4為入射雷射光束的起始波長,;1〃為入射雷射光束 的最終波長,Μ是入射波長取樣點的總數。 就橢偏儀而言,#-ν)2為光柵週期、光柵線寬週期比、疊 對誤差量及入射光波長之函數,其反射光之強度可表示為:咐)'t (4 recognizes lJ - like, v)) 2 A VAOL / where 4 is the starting wavelength of the incident laser beam; 1 〃 is the final wavelength of the incident laser beam, Μ is the total number of incident wavelength sampling points . For the ellipsometer, #-ν)2 is a function of the grating period, the grating linewidth period ratio, the overlapping error amount, and the wavelength of the incident light. The intensity of the reflected light can be expressed as:
R^U(z2) X U(z2y^Rp X RR^U(z2) X U(z2y^Rp X R
R. x R 其中\及足係分別為反射光之p-偏極光與s_偏極光之振 幅,且為光柵週期、光柵線寬週期比、疊對誤差量及入射 光波長之函數。R. x R where \ and the foot are respectively the amplitude of the p-polarized light and the s_polarized light of the reflected light, and are a function of the grating period, the grating linewidth period ratio, the stacking error amount, and the incident light wavelength.
RR
~ = tan(^)eiA R 其中V及A為橢偏儀之參數,亦為光柵週期、光栅線寬週 期比、疊對誤差量及入射光波長之函數。 ψ = y/(pitch, LSratio, λ., A0L) Δ = A(pitch, LSratio, λί, A0L) 如果固定光栅週期及光栅線寬週期比,則其平均標準差 (ASD)為: PD0086.doc -11 - 1285797 湖厂去frw, ^(Λ) = J)-ΚΛ,Δ-))2 Ν AOL, ο 咐)=Ji>“·,ν) - /ν U〇L: 其中;^為入射雷射光束的起始波長,4為入射雷射光束 的最終波長,Μ是入射波長取樣點的總數。~ = tan(^)eiA R where V and A are the parameters of the ellipsometer, which are also a function of the grating period, the grating linewidth period ratio, the stacking error amount, and the incident light wavelength. ψ = y/(pitch, LSratio, λ., A0L) Δ = A(pitch, LSratio, λί, A0L) If the grating period and the grating line width period ratio are fixed, the average standard deviation (ASD) is: PD0086.doc -11 - 1285797 Lake factory to frw, ^(Λ) = J)-ΚΛ, Δ-))2 Ν AOL, ο 咐)=Ji> "·, ν) - /ν U〇L: where; ^ is incident The starting wavelength of the laser beam, 4 is the final wavelength of the incident laser beam, and Μ is the total number of sampling points of the incident wavelength.
圖5(a)及圖5(b)係本發明之對位標記之設計方法之最佳 化步驟流程圖,其中p、r分別代表光柵週期及光栅線寬週 期比;X表示在p-r平面的位置向量(position vector) ; m、u 分別代表級距(step size)及方向向量(direction vector) ; Ν、 e分別代表最大疊代次number of iteration)及 最小級距(minimum step size)。參考圖5(a),其流程係根據 特定之結構參數(在此以光柵週期p及光柵線寬週期比r為 例),先計算一平均標準差ADS(步驟S41)。之後再利用一最 佳化演算法(步驟S42)決定出一平均標準差最大值,其中步 驟S42中所包含之步驟S42丨係計算ASD之詳細流程(參圖 5(b)),最後利用發生平均標準差最大值時之結構參數來設 計對位標記。本發明係利用數值演算法對光柵的週期與線 寬週期比做最佳化模擬。此外,由於入射光的波長或入射 光的入射角度也會影響量測靈敏度,本發明亦可以數值模 擬分析的方式選擇最佳的入射光波長或入射光角度。另,' 最佳化演算法係一隨機漫步方法 PD0086.doc 100210 PD〇〇86 0〇49653〇8-i -12- 12857975(a) and 5(b) are flowcharts showing an optimization procedure of the design method of the alignment mark of the present invention, wherein p and r respectively represent the grating period and the grating line width period ratio; and X represents the pr plane. Position vector; m, u represent the step size and direction vector respectively; Ν, e represent the maximum number of iterations and the minimum step size, respectively. Referring to Fig. 5(a), the flow is based on a specific structural parameter (here, the grating period p and the grating line width period ratio r are taken as an example), and an average standard deviation ADS is first calculated (step S41). Then, an optimization algorithm (step S42) is used to determine an average standard deviation maximum value, wherein the step S42 included in step S42 is to calculate the detailed process of the ASD (refer to FIG. 5(b)), and finally the utilization occurs. The structural parameters of the mean standard deviation maximum are used to design the alignment mark. The present invention utilizes a numerical algorithm to optimize the period of the grating and the line width period. In addition, since the wavelength of the incident light or the incident angle of the incident light also affects the measurement sensitivity, the present invention can also select the optimum incident light wavelength or incident light angle in a numerical simulation manner. In addition, 'optimal algorithm is a random walk method PD0086.doc 100210 PD〇〇86 0〇49653〇8-i -12- 1285797
(random walk method)^ - ^ ^ ^ ^(simplex method) 〇 T 詳細說明本發明之對位標記之設計方法運用在—角度散射 儀之-樣本之量測時之流程。步驟⑷、選取—對位標記之 至少一參數,該參數係使用於-對位標記最佳化程序。盆 中該參數包含該樣本之材料、該樣本之厚度及該樣本上; 圖案之側壁角度(sidewall angle)。豸參數可由一對照表(例 如:表一)中之常數決定。步驟(b)、選擇一第一光栅,其具 -第-光栅特徵。該第一光柵可選擇為一標準對位標記(a known standard target)或一最佳經驗猜測對位標記。該第一 光栅特徵於本實施例中可為光柵週期或光柵線寬週期比。 步驟(c)、根據該第一光柵特徵,執行該對位標記最佳化程 序,其係決定一繞射光在一特定入射角度範圍之一最大平 均標準差。纟中該繞射光係M由一具該第一光拇特徵之數 學模式對位標記所繞射。在執行該對位標記最佳化程序 時,其包含增加一特定級距(例:5奈米)至該第一光柵特徵 中之該參數(光柵週期或光栅線寬週期比)之步驛。將該參數 增加該特定級距後,重新計算平均標準差直到到達最大疊 代次數,而決定出該最大平均標準差。上述步驟(a)、0)及 (c)係利用一數值模擬分析軟體執行,不需在實際的對位標 §己上進行量測。步驟(d)、設計一具第一光柵特徵之對位標 記’係相應於該最大平均標準差。 圖6與圖7分別為不同光柵週期與線寬週期比模擬結果的 ASD值之三維圖與其等高線圖,使用之入射雷射波長為633 奈米時,其中X軸是光栅週期(範圍界於〇1微米至2微米), PD0086.doc -13- 100210 PDoo86 004965308-1 1285797 Y軸是線寬週期比(範圍界於1:9至9:1),Z軸則是ASD值。 表二是使用前述6個不同雷射入射光源時的模擬結果。以 此待測樣品的結構參數而言’在入射雷射光波長為612奈 米,光柵週期與線寬週期比分別是0.4微米與48:52時,量測 系統具有ASD最大值為0.015581,其為總平均值0.000726的 21.47 倍。 表二 波長(奈米) ASD 最小值 ASD 中間值 ASD 最大值 ASD最大值發生時之結構參數 光柵週期(微米) 光柵線寬週期比 442 1.02 xl(T05 0.000144 0.002481 0.24 54:46 488 1·36χ10·05 0.000786 0.007731 0.28 44:56 514 1.77 xl〇·06 0.000866 0.010951 0.26 48:52 532 7‘43 xl(T07 0.000933 0.010542 0.28 58:42 612 2.55 xlO-08 0.001998 0.015581 0.40 48:52 633 L42xl〇·08 0.001853 0.010765 0.46 48:52 ASD總平均值0.000726(於光柵週期0.1至2微米,光栅線寬週期比1:9至9:1之範圍) 由此可知,藉由本發明之最佳化模擬分析後,可大幅地 增加不同疊對誤差量之特徵圖譜間的離散程度,進而有效 地提高疊對量測的靈敏度。 # 本發明之技術内容及技術特點已揭示如上,然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 背離本發明精神之替換及修飾。因此,本發明之保護範圍 應不限於實施例所揭示者,而應包括各種不背離本發明之 替換及修飾,並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1係——維對位標記之示意圖; 圖2係一角度散射儀之系統架構示意圖; PD0086.doc -14- 100210 PDoo86 004965308-1 1285797 圖3係一二維對位標記之俯視示意圖; 圖4顯示不同疊對誤差量的反射光特徵圖譜; 圖5(a)及圖5(b)係本發明之對位標記之設計方法之最佳 化步驟流程圖; 圖6與圖7分別為不同光栅週期與線寬週期比模擬結果的 ASD值之三維圖與其等高線圖。 【主要元件符號說明】 10 對位標記 12 底層 14、 IV第一光柵 16、 16’第二光柵 18 中間層 20 角度散射儀 22 入射光 24 反射光 26 法線 30 雷射光源 32 光偵測器 S41 ' S42 - S421 步驟 PD0086.doc -15- 100210 PD〇〇86 004965308-1(random walk method)^ - ^ ^ ^ ^(simplex method) 〇 T Describe in detail the design method of the alignment mark of the present invention, which is applied to the process of measuring the sample by the angle scatterometer. Step (4), selecting - at least one parameter of the alignment mark, the parameter is used in the - alignment mark optimization process. The parameter in the basin contains the material of the sample, the thickness of the sample, and the sidewall angle of the pattern; The 豸 parameter can be determined by a constant in a comparison table (for example, Table 1). Step (b), selecting a first grating having a -th-raster feature. The first grating can be selected as a known standard target or a best empirical guess alignment mark. The first grating feature may be a grating period or a raster line width period ratio in this embodiment. Step (c), performing the alignment mark optimization process based on the first grating feature, which determines a maximum average standard deviation of one of the diffracted lights at a particular range of incident angles. The diffracted light system M is diffracted by a mathematical mode alignment mark of the first optical thumb feature. In performing the alignment mark optimization process, it includes the step of increasing a particular step (e.g., 5 nm) to the parameter (raster period or raster line width period ratio) in the first grating feature. After the parameter is increased by the specific level, the average standard deviation is recalculated until the maximum number of iterations is reached, and the maximum average standard deviation is determined. The above steps (a), 0) and (c) use a numerical simulation to analyze the software execution without measuring the actual alignment mark. Step (d), designing an alignment mark of the first grating feature corresponds to the maximum average standard deviation. Figure 6 and Figure 7 are three-dimensional plots of ASD values and their contour plots for different grating period and linewidth period ratio simulation results. When the incident laser wavelength is 633 nm, the X-axis is the grating period (the range is bounded by 〇 1 micron to 2 micron), PD0086.doc -13- 100210 PDoo86 004965308-1 1285797 The Y axis is the line width period ratio (range 1:9 to 9:1), and the Z axis is the ASD value. Table 2 shows the simulation results when using the six different laser incident light sources described above. According to the structural parameters of the sample to be tested, when the incident laser light wavelength is 612 nm, and the grating period to the line width period ratio are 0.4 μm and 48:52, respectively, the measurement system has an ASD maximum value of 0.015581, which is The total average value is 21.47 times that of 0.000726. Table 2 Wavelength (nano) ASD Minimum ASD Intermediate value ASD Maximum ASD maximum value of the structure parameter grating period (micron) grating line width period ratio 442 1.02 xl (T05 0.000144 0.002481 0.24 54:46 488 1·36χ10· 05 0.000786 0.007731 0.28 44:56 514 1.77 xl〇·06 0.000866 0.010951 0.26 48:52 532 7'43 xl(T07 0.000933 0.010542 0.28 58:42 612 2.55 xlO-08 0.001998 0.015581 0.40 48:52 633 L42xl〇·08 0.001853 0.010765 0.46 48:52 ASD total average value 0.000726 (in the grating period 0.1 to 2 microns, grating line width period ratio 1:9 to 9:1 range) It can be seen that after the optimization analysis of the present invention, it can be greatly The degree of dispersion between the characteristic maps of different stacking error amounts is increased, thereby effectively improving the sensitivity of the stacking measurement. # The technical content and technical features of the present invention have been disclosed above, but those familiar with the technology may still be based on this The invention is not limited to the embodiment of the invention, and the scope of protection of the present invention should not be limited to those disclosed in the embodiments. The replacement and modification of the present invention are covered by the following patent application. [Simplified Schematic] FIG. 1 is a schematic diagram of a dimensional alignment mark; FIG. 2 is a schematic diagram of a system architecture of an angle scatterometer; PD0086. Doc -14- 100210 PDoo86 004965308-1 1285797 Figure 3 is a top view of a two-dimensional alignment mark; Figure 4 shows a reflected light characteristic map of different stacking error amounts; Figure 5 (a) and Figure 5 (b) are FIG. 6 and FIG. 7 are respectively a three-dimensional diagram and a contour map of ASD values of different grating period and line width period ratio simulation results. [Main component symbol description] 10 Alignment mark 12 Bottom layer 14, IV First grating 16, 16' Second grating 18 Intermediate layer 20 Angle scatterer 22 Incident light 24 Reflected light 26 Normal line 30 Laser source 32 Light detector S41 ' S42 - S421 Step PD0086 .doc -15- 100210 PD〇〇86 004965308-1
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